Processor-Based MCM for Mobile Applications Processor-Based MCM for Mobile Applications Fujitsu has released a pair of new Pentium(R) processor-based MCMs for mobile computing applications. Both new MCMs combine Intel's Mobil Pentium processor with MMXTM technology and the 430TX PCIset with 256K L2 cache memory, and discrete devices in a powerful MCM. The MCM integrates frequencies from 150-166 MHz with future upgrades to 233 MHz. Interface to the motherboard is through a 280-pin standard surface-mount connector that facilitates frequency upgrades. The MCM design has been validated by Intel Corporation in cooperation with Fujitsu. The MCMs are available in two versions, ceramic Pentium Processor-Based MCM (Ceramic) and laminate substrate technology. Unlike other module-based architectures, MCMs do not require replacement of the computer's motherboard, and provide optimal thermal solutions for lighter, thinner mobile system designs. Intel Corporation worked closely with Fujitsu on the design and layout of both implementations. Fujitsu implemented both MCMs based on an Intel reference design of a Pentium processor/PCI-based subsystem for current-generation, mobile computing applications. The MCMs take full advantage of today's MCM technology and Intel's SmartDie(R) products to achieve a cost-effective MPU subsystem within an area which is slightly larger than a single chip TAB package. Pentium Processor-Based MCM (Laminate) CPU Core in the Industry's Smallest Footprint Electrical Specifications Both the ceramic and laminate versions achieve the industry's highest level of packing density, enabled by using doublesided mounting assembly technique. The top side contains PBSRAMs and passive components, and the bottom side has P55C, 430TX and tag RAM. The ceramic version applies existing wire bonding technology in twelve-layers built on alumina ceramic substrate. Chips are mounted using Fujitsu's chip-on-board (COB) and regular solder reflow process for SMT components. The ceramic version measures 42mm x 40mm. The laminate version is an eight-layer MCM using a state-of-the-art thin-film "build-up" substrate technology (FR4 laminate). Chips are mounted using flip-chip technique, so the MCMs combine the cost and performance advantages of laminate substrate with the latest flip-chip technology. The laminate version measures 44mm x 32mm. The MCM requires four different power supplies, as shown below: The new MCMs address the rapidly-changing performance objectives of OEMs for new generations of mobile computing products, including small form factor, optimal heat dissipation, and high reliability. The reduced size of the MCMs allows OEMs to develop lighter and thinner mobile products with system motherboards that are smaller, and less expensive than current implementation. Full-featured mobile computing products are the fastestgrowing segment of today's mobile computing markets. Designers and OEMs require versatile, modular solutions that optimize system performance for a wide range of frequencies, and cache sizes. These MCMs enable OEMs to develop motherboard designs to achieve quicker time-to-market. The MCM architecture `decouples' the high-speed interfaces from the system motherboard, simplifying the OEM design task by reducing complexity and eliminating the need for system redesign. These MCMs represent the third generation products and demonstrate Fujitsu's continuing excellence in developing cost effective mobile computing solutions. * * * * +V_CPUCORE: +V_CPUIO: 3VS: 3V: 2.5 V, for CPU CORE 3.3 V, for CPU IO 3.3 V, for 430TX and PBSRAM 3.3 V, for 430TX When the processor is in "suspended mode", +V_CPUCORE, +V_CPUIO and 3VS go down to 0 V, while 3V power supply remains at 3.3 V. The MCM has ceramic multilayer capacitors, which along with internal power plane structure, offer a very low power supply impedance in high frequency range. However, the MCM does not include "bulk capacitors". Fujitsu recommends using low ESR bulk capacitors, such as Tantalum capacitors or "organic semiconductor capacitors", externally and placing them as close to the MCM IO connector as possible, and connecting them using thick copper traces. Placement of these bulk capacitors, though the actual values of these capacitors depends on the specific motherboard design requirements. Supply voltage for CPU CORE and CPU IO may change for future generations of processors. The MCM provides a set of pins that indicate the +V_CPUCORE and +V_CPUIO power supply voltages. Fujitsu recommends motherboard designers to recognize these voltage levels and change the voltage externally, if upgradeability and compatibility are considerations factors in the design. Signal integrity analysis was performed. The signals on the longest (89.5mm) and shortest (12.5mm) traces were simulated. The simulations were done using SPICE models for SRAMs and IBIS models for P55C and 430TX. The input signal had a frequency of 66 MHz, with a rise time of 1.5 ns. Photograph courtesy of Fujitsu PC Corporation. MCM Test Bill of Materials After assembly, the MCM undergoes a testing process. * * * Mini-temperature cycle test for screening assembly defects Interconnect open/short and basic functionality tests On board module testing The MCM uses a highly reliable tag RAM die and highly reliable P55C and 430TX die in SmartDie form. Hence a MCM burn-in test is not required. The mini-temperature cycle test is performed to screen assembly defects. A VLSI tester based test ensures the basic functionality of the MCM, in addition to checking for interconnect open/short tests. The on board module testing is performed by mounting the module on Intel's evaluation board and running DOS based software tests to ensure module functionality. Fujitsu reserves the right to modify the above test sequence without prior notice. Component QTY Pentium(R) Processor 430TX PCIset Northbridge PBSRAM* Tag RAM* Connector Plug (on MCM) System Receptacle (on motherboard) 1 1 2 1 1 1 * These parts may be replaced by equivalent parts from other vendors Each MCM integrates a total of 93 components, including a Pentium processor and supporting the 430TX PCIset, with 256K L2 cache memory. The PCI and system memory interfaces are supported using a standard 280-pin connector. The thermal management is facilitated through the attached heat spreader. Pentium(R) Processor (P55C) (R) Pentium Processor-Based MCM Host Bus CLK PCI PCI ADDR/ CNTL DATA TAG CNTL L2 Tag 256K PBSRAM L2 Cache TIO[7:0] 82439Tx PCI set System Controller DCNTL DADDR DDATA PCI Docking Power Mgmt. System Clock Main Memory CACHE CNTL PCI Expansion Bridge MPIX CNTL PCI Bus MEM MEM MEM ADDR CNTL DATA 280-Pin Connector HDD MPIIX Peripheral Controller Graphics Serial COM Port(s) Parallel Port(s) PCMCIA Port(s) Audio ISA Bus (R) Pentium Processor-Based MCM Block Diagram Pentium(R) Processor-Based MCM System Diagram Fujitsu is a world leader in Advanced Packaging Technology. We provide "turnkey" post silicon solutions from initial design to high volume production for many leading companies. As the demand for complex solutions increases, Fujitsu will be there with innovative technologies. www.fujitsumicro.com Pentium processor is a registered trademark of Intel Corporation. SmartDie is a registered trademark of Intel Corporation. MMX is a trademark of Intel Corporation. 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