Processor-Based MCM
for
Mobile Applications
Processor-Based MCM for Mobile
Applications
Fujitsu has released a pair of new Pentium®
processor-based MCMs for mobile computing
applications. Both new MCMs combine Intel’s
Mobil Pentium processor with MMX™
technology and the 430TX PCIset with 256K
L2 cache memory, and discrete devices in a
powerful MCM. The MCM integrates
frequencies from 150-166 MHz with future
upgrades to 233 MHz. Interface to the
motherboard is through a 280-pin standard
surface-mount connector that facilitates
frequency upgrades.
The MCM design has been validated by Intel
Corporation in cooperation with Fujitsu. The
MCMs are available in two versions, ceramic
and laminate substrate technology. Unlike other
module-based architectures, MCMs do not
require replacement of the computer ’s
motherboard, and provide optimal thermal
solutions for lighter, thinner mobile system
designs. Intel Corporation worked closely with
Fujitsu on the design and layout of both
implementations. Fujitsu implemented both
MCMs based on an Intel reference design of a
Pentium processor/PCI-based subsystem for
current-generation, mobile computing
applications. The MCMs take full advantage of
today’s MCM technology and Intel’s SmartDie®
products to achieve a cost-effective MPU
subsystem within an area which is slightly
larger than a single chip TAB package.
Pentium Processor-Based MCM (Ceramic)
Pentium Processor-Based MCM (Laminate)
CPU Core in the Industry’s Smallest Footprint
Both the ceramic and laminate versions achieve the industry’s
highest level of packing density, enabled by using double-
sided mounting assembly technique. The top side contains
PBSRAMs and passive components, and the bottom side has
P55C, 430TX and tag RAM. The ceramic version applies
existing wire bonding technology in twelve-layers built on
alumina ceramic substrate. Chips are mounted using Fujitsu’s
chip-on-board (COB) and regular solder reflow process for
SMT components. The ceramic version measures 42mm x
40mm. The laminate version is an eight-layer MCM using a
state-of-the-art thin-film “build-up” substrate technology (FR-
4 laminate). Chips are mounted using flip-chip technique, so
the MCMs combine the cost and performance advantages of
laminate substrate with the latest flip-chip technology. The
laminate version measures 44mm x 32mm.
The new MCMs address the rapidly-changing performance
objectives of OEMs for new generations of mobile computing
products, including small form factor, optimal heat
dissipation, and high reliability. The reduced size of the
MCMs allows OEMs to develop lighter and thinner mobile
products with system motherboards that are smaller, and less
expensive than current implementation.
Full-featured mobile computing products are the fastest-
growing segment of today's mobile computing markets.
Designers and OEMs require versatile, modular
solutions that optimize system
performance for a wide range of
frequencies, and cache sizes. These
MCMs enable OEMs to develop
motherboard designs to achieve quicker
time-to-market. The MCM architecture
‘decouples’ the high-speed interfaces
from the system motherboard, simplifying
the OEM design task by reducing
complexity and eliminating the need for
system redesign.
These MCMs represent the third generation
products and demonstrate Fujitsu’s continuing
excellence in developing cost effective mobile
computing solutions.
Electrical Specifications
The MCM requires four different power supplies, as shown
below:
• +V_CPUCORE: 2.5 V, for CPU CORE
• +V_CPUIO: 3.3 V, for CPU IO
• 3VS: 3.3 V, for 430TX and PBSRAM
• 3V: 3.3 V, for 430TX
When the processor is in “suspended mode”, +V_CPUCORE,
+V_CPUIO and 3VS go down to 0 V, while 3V power supply
remains at 3.3 V.
The MCM has ceramic multilayer capacitors, which along
with internal power plane structure, offer a very low power
supply impedance in high frequency range. However, the
MCM does not include “bulk capacitors”. Fujitsu
recommends using low ESR bulk capacitors, such as
Tantalum capacitors or “organic semiconductor capacitors”,
externally and placing them as close to the MCM IO
connector as possible, and connecting them using thick
copper traces. Placement of these bulk capacitors, though the
actual values of these capacitors depends on the specific
motherboard design requirements.
Supply voltage for CPU CORE and CPU IO may change for
future generations of processors. The MCM provides a set of
pins that indicate the +V_CPUCORE and +V_CPUIO power
supply voltages. Fujitsu recommends motherboard
designers to recognize these voltage levels and
change the voltage externally, if upgradeability
and compatibility are considerations factors in
the design.
Signal integrity analysis was performed. The
signals on the longest (89.5mm) and
shortest (12.5mm) traces were simulated.
The simulations were done using
SPICE models for SRAMs and
IBIS models for P55C
and 430TX. The
input signal had a
frequency of 66 MHz,
with a rise time of 1.5 ns.
Photograph courtesy of
Fujitsu PC Corporation.
Japan
Fujitsu Limited
Electronics Devices International
Sales & Engineering Support Division
1-1 Kamikodanaka, 4-Chome
Nakahara-ku, Kawasaki 211-88
Japan
Tel: 044-754-3753
Fax: 044-754-3332
North and South America
Fujitsu Microelectonics, Inc.
Advanced Packaging Technology
3545 North First Street
San Jose, CA 95134-1804
USA
Tel: 408-922-9679
Fax: 408-954-9462
Europe
Fujitsu Mikroelektronik GmbH
Am Siebenstein 6-10
63303 Dreieich-Buchschlag
Germany
Tel: 06103-690-0
Fax: 06103-690-122
Asia
Fujitsu Microelectronics
Asia PTE Ltd.
51 Bras Basah Rd.
Plaza by the Park
#06-04/07 Singapore 0719
Tel: 336-1600
Fax: 336-1609
Pentium Processor-Based MCM Block Diagram Pentium Processor-Based MCM System Diagram
Power Mgmt.
System Clock Main Memory
Graphics Serial
COM
Port(s)
Parallel
Port(s) PCMCIA
Port(s)
MPIIX
Peripheral
Controller
Audio
HDD
PCI
Expansion
Bridge
PCI
Docking
Pentium Processor-Based
MCM
Pentium
Processor
(P55C)
Host Bus
82439Tx
PCI set
System Controller
280-Pin Connector
L2 Tag
256K PBSRAM
L2 Cache
CACHE CNTL
TAG
CNTL
TIO[7:0]
PCI
Bus MEM
ADDR MEM
CNTL MEM
DATA
MPIX
CNTL
®
®
®
CLK
PCI
CNTL
PCI
ADDR/
DATA DADDR
DCNTL
DDATA
®
ISA Bus
Fujitsu World Offices
Fujitsu is a world leader in Advanced Packaging Technology. We provide “turnkey” post silicon solutions from initial design to high
volume production for many leading companies. As the demand for complex solutions increases, Fujitsu will be there with
innovative technologies. www.fujitsumicro.com
Pentium processor is a registered trademark of Intel Corporation. SmartDie is a registered trademark of Intel Corporation. MMX is a trademark of Intel Corporation.
Component QTY
Pentium®Processor 1
430TX PCIset Northbridge 1
PBSRAM* 2
Tag RAM* 1
Connector Plug (on MCM) 1
System Receptacle (on motherboard) 1
* These parts may be replaced by equivalent parts from other vendors
Bill of MaterialsMCM Test
After assembly, the MCM undergoes a testing process.
•Mini-temperature cycle test for screening assembly
defects
•Interconnect open/short and basic functionality tests
•On board module testing
The MCM uses a highly reliable tag RAM die and highly
reliable P55C and 430TX die in SmartDie form. Hence a
MCM burn-in test is not required. The mini-temperature
cycle test is performed to screen assembly defects. A VLSI
tester based test ensures the basic functionality of the MCM,
in addition to checking for interconnect open/short tests. The
on board module testing is performed by mounting the
module on Intel’s evaluation board and running DOS based
software tests to ensure module functionality. Fujitsu reserves
the right to modify the above test sequence without prior
notice.
Each MCM integrates a total of 93 components, including a
Pentium processor and supporting the 430TX PCIset, with
256K L2 cache memory. The PCI and system memory
interfaces are supported using a standard 280-pin connector.
The thermal management is facilitated through the attached
heat spreader.
APT-PMCMTB-20377-2.00
