DESIGNED & DIMENSIONED
IN MILLIMETERS[INCHES]
DO NOT
SCALE FROM
THIS PRINT
BEC5-XXX-XX-X-X-V-A-XX-TR
No OF POSITIONS
-060, -080, -100, -120, -140,
-160, -180, -200
(SEE NOTE 6)
VERTICAL
CARD THICKNESS
-02 (1.57mm [.062] PCB)
(USE SUB-IM-C-270-02-X-X)
-03 (2.36 mm [0.93] PCB)
(USE SUB-IM-C-270-03-X-X)
PLATING SPECIFICATION
-L: 10 µ" SELECTIVE GOLD, MATTE TIN ON TAIL
(USE SUB-IM-C-270-XX-L-X)
-S: 30 µ" SELECTIVE GOLD, MATTE TIN ON TAILS
(USE SUB-IM-C-270-XX-S-X)
PACKAGING
-TR: TAPE & REEL
ALIGNMENT PINS
-A: ALIGMENT PINS
OPTIONS
-K: POLYIMIDE FILM
(SEE FIG. 2, SHT 2)
SOLDER COMPOSTION & STYLE
-1: 63% TIN / 37% LEAD CHARGE TAIL
(USE SUB-IM-C-270-XX-X-1)
-2: 96.5% TIN / 3.5% SILVER
LEAD FREE CHARGE TAIL
(USE SUB-IM-C-270-XX-X-2)
1.86 .073
(2 PLCS)
2.43 .096
REF
1.18 .046
13.00 .512
REF
"F"
(SEE NOTE 9)
BEC5-XXX-XX-V-XX
WT-16-04-T
SUB-IM-C-270-XX-X-X
(SEE NOTE 11)
SEE NOTE 5
C
"B" REF
"A" REF
REF
"D"
1.00 .039
REF
9.00 .354
REF
"E"
(SEE NOTE 8)
"C" REF
10.76
REF
.424
"A"
"A"
'B'
PIN 01
PIN 02
C
C
1.32 .052
REF
0.64 .025
REF (TYP)
1.10
REF
.043
1.000 .039
(TYP) NON ACCUM
6.00 .236
"J"
±0.20
1.32
REF
.052
"H"
REF
C
L
C
C
"C" "C"
DETAIL 'B'
SCALE 4 : 1
PIN 01
(TOP)
PIN 04
(TOP)
PIN 03
(BOTTOM)
PIN 02
(BOTTOM)
0.51
(TYP)
.020
TOL NON-ACCUM
SECTION "C"-"C"
SCALE 4 : 1
PIN 04
(TOP)
PIN 03
(BOTTOM)
C
BEC5-140-02-X-X-V-A SHOWN
FIG. 1
C
SHEET OF
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN MILLIMETERS [INCHS]
TOLERANCES ARE:
DECIMALS ANGLES
X.X:
0.3 [.01] 2
X.XX:
0.13 [.005]
X.XXX:
0.051 [.0020]
MATERIAL:
BI-LEVEL EDGE CARD ASSEMBLY
BY:
BEC5-XXX-XX-X-X-V-A-XX-TR
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
M MURILLO
1/16/2009
2
1
SHEET SCALE: 2:1
INSULATOR: LCP
, COLOR BLACK
CONTACT: BeCu
F:\DWG\MISC\MKTG\BEC5-XXX-XX-X-X-V-A-XX-TR-MKT.SLDDRW
NOTES:
1. REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM PUSHOUT FORCE: 2.22N[.5 LB].
3. PARTS TO BE PACKAGED IN TAPE AND REEL AS STANDARD
4. FOR QUANTITIES UP TO 49 PIECES, NO LEADER, TRAILER OR REEL WILL BE SUPPLIED
FOR QUANTITIES OF 50-124, NO LEADER OR TRAILER WILL BE SUPPLIED
5. SOLDER CRIMP VOLUME IS .20058 MM³ (0.000012691 IN³)
6. NUMBER OF POSITIONS EQUALS TOTAL NUMBER OF CIRCUITS.
7. THESE INSIDE EDGES ARE NOT TO APPEAR IN THE WINDOW WHEN VIEWED FROM DIRECTLY ABOVE.
8. DIMENSION TAKEN BETWEEN TOP AND BOTTOM PINS.
9. CHECK TO THE LEAD AND NOT THE SOLDER CRIMP.
10. SEE DOCUMENT CO-OP-WI-3001-M FOR ADDITIONAL INSTRUCTION.
11. TO CALCULATE NUMBER OF SUBS NEEDED TAKE THE NUMBER OF POSITIONS AND DIVIDE BY 4.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail info@SAMTEC.com code 55322
REVISION E
2.29 .090
REF
7.14 .281
2.41 .095
REF
1.27 .050
1.25 .049
0.05
-
0.05
+
0.08 .002
-
.002
+
.003
9.55 .376
REF
"G"
±0.10
"L"
±0.10
SECTION "A"-"A"
SCALE 7 : 1
WT-16-04-T
SUB-IM-C-270-XX-X-X
BEC5-XXX-XX-V-XX
C
C
C
SEE NOTE 7
0.15 .006
"K"
±0.50
[.020]
0.38
±0.50
.015
±.020
8.25 .325
"A"
REF
C
L
C
L
C
C
13.18 .519
C
-K: POLYIMIDE PAD
(USE K-DOT-.325-.450-.005)
(BEC5-140-02-X-X-V-A-K SHOWN)
FIG. 2
C
SHEET OF
BI-LEVEL EDGE CARD ASSEMBLY
BY:
BEC5-XXX-XX-X-X-V-A-XX-TR
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
M MURILLO
1/16/2009
2
2
SHEET SCALE: 2:1
REVISION E
F:\DWG\MISC\MKTG\BEC5-XXX-XX-X-X-V-A-XX-TR-MKT.SLDDRW
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail info@SAMTEC.com code 55322