Intel® NUC Kit D54250WYK
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Specifications
Essentials
Memory Specifications
Graphics Specifications
Expansion Options
I/O Specifications
Package Specifications
Advanced Technologies
Intel® Data Protection
Technology
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Ordering / sSpecs /
Steppings
Specifications
-Essentials
Status End of Interactive Support
Launch Date Q4'13
Expected Discontinuance See Roadmap
Board Form Factor UCFF (4" x 4")
Socket Soldered-down BGA
Internal Drive Form Factor mSATA SSD
# of Internal Drives Supported 1
Embedded Options Available No
Lithography 22 nm
TDP 15 W
DC Input Voltage Supported 12-19 VDC
Recommended Customer Price N/A
Datasheet Link
Processor Included Intel® Core™ i5-4250U Processor
(3M Cache, up to 2.60 GHz)
Product Brief Link
Warranty Period 3 yrs
-Memory Specifications
Max Memory Size (dependent on memory type) 16 GB
Memory Types DDR3L-1333/1600 1.35V SO-
DIMM
Max # of Memory Channels 2
Max Memory Bandwidth 25.6 GB/s
Max # of DIMMs 2
ECC Memory Supported ‡No
-Graphics Specifications
Integrated Graphics ‡Yes
Graphics Output Mini-DP 1.2; Mini-HDMI 1.4a
Intel® Clear Video Technology Yes
# of Displays Supported ‡3
-Expansion Options
PCI Express Revision Gen2
PCI Express Configurations ‡Half-length MiniPCI card with
PCIe x1 lane
PCIe Mini Card Slot (Half Length) 1
PCIe Mini Card Slot (Full Length) 1
-I/O Specifications
USB Revision 2.0, 3.0
# of USB Ports 6
Related Products
Intel® NUC Boards and Kits
Intel® NUC Kits
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PCN/MDDS Information
931577: PCN
931578: PCN
931823: PCN
931824: PCN
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information
herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of
the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be
construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of
any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please
contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard,
processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality,
performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten
and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to
suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not
confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any
additional included accessories, such as heatsinks/coolers.
The Recommended Customer -unit purchase quantities, and are subject to change without
notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit.
Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709
requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
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USB 2.0 Configuration (External + Internal) 0 + 2
USB 3.0 Configuration (External + Internal) 2B 2F + 0
Total # of SATA Ports 2
Max # of SATA 6.0 Gb/s Ports 2
Audio (back channel + front channel) 7.1 digital + analog stereo
headset
Integrated LAN 10/100/1000
Integrated Wifi No
Integrated Bluetooth No
Consumer Infrared Rx Sensor Yes
Additional Headers FRONT_PANEL, 2x USB2.0, DC_IN,
CUST_SOL (CEC, WDT, DMIC)
-Package Specifications
Low Halogen Options Available See MDDS
-Advanced Technologies
Intel® Virtualization Technology for Directed I/O
(VT-d) ‡Yes
Intel® vPro Technology ‡No
TPM No
Intel® HD Audio Technology Yes
Intel® Rapid Storage Technology Yes
Intel® Virtualization Technology (VT-x) ‡Yes
-Intel® Data Protection Technology
Intel® AES New Instructions Yes
