DigiConnectME®
DigiConnect®Wi‐ME&
DigiConnectME®9210
HardwareReference
90000897_K
8/5/2011
© 2011 Digi International Inc.
All rights reserved .
Digi, Digi International, the Digi logo, a Digi International Company, Digi Connect, Digi Connect ME, Digi Connect
Wi-ME, ConnectCore, Digi JumpStart Kit, Net +, NET + OS, NS7520, and NS9210 are trademarks or registered
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About This Document
Scope of the Reference Manual
The purpose of this do cumen t is to en able dev e lop ers to in teg rat e th e Digi Connect ME,
Digi Connect ME 9210 , or Digi Connect Wi -ME embedded modules with other devices,
enabling these devices to make use of the module’s rich networking features.
Note:
Unless mentioned specific ally by na me, the prod ucts wil l be referred to as the
embedded modules or modul es. Individual naming is used to dif f ere ntia te
product specific features.
Note:
Unless noted otherwise, all Digi Connect ME related technical
information pr o vided in this document also applies to the Digi Connect
ME 9210 module.
Related Documentation
See the NS7520 Hardware Reference for information on the NS7520 chip.
See the NS9210 Hardware Reference for information on the NS9210 chip.
See the Digi Connect Wi -ME 921 0 Hardware Reference.
Support Information
To get help with a question o r technical prob lem or make comments an d recommendations
about Digi produ c ts and do cumen tati on, use the following contact information.
General Customer Service and Support
Digi International
11001 Bren Road East
Minnetonka, MN 55343
U.S.A.
United S tat es: 1 8 77 -9 12-34 44
Other Locations: 1 952-912-3444
www.digiembedded.com
www.digi.com/support
www.digi.com/support/eservice
4
Contents
About This Document ................................................................................................................3
Related Documentation..................... ...............................................................................3
Support Information.........................................................................................................3
Chapter 1: About the Digi Connect ME Family of Embedded Modules.........................6
Overview..........................................................................................................................6
Types of Modules.............................................................................................................7
Connectors: Power and Device Interface.......................................................................10
Connectors: Module JTAG Interface .............................................................................12
Connectors: Ethernet Interface.......................................................................................14
Connectors: Antenna......................................................................................................16
Module LEDs.................................................................................................................17
Chapter 2: About the Development Board ................ ................................................... ....18
Overview........................................................................................................................18
Basic Description ...........................................................................................................18
Port Descriptions......................... ...................................................................................21
Connectors and Blocks...................................................................................................24
Switches and Push Buttons.............................................................................................30
Development Board LEDs .............................................................................................31
Power Jack P15 ..............................................................................................................33
Test Points..................... ............................................................................ .....................33
Chapter 3: Programming Considerations.........................................................................35
Overview........................................................................................................................35
Module Pinout................................................................................................................36
LEDs...............................................................................................................................39
Reset...............................................................................................................................39
Memory..........................................................................................................................40
Appendix A: Module Specifications....................................................................................41
Network Interface........................ ...................................................................................41
Serial Interface ...............................................................................................................42
Data Rates (bps) .............................................................................................................42
Flow Control Options.....................................................................................................42
DC Characteristics..........................................................................................................43
5
Power Management (Digi Connect ME 9210 only) ...................................................... 45
Thermal Specifications .................................................................................................. 46
Mechanical..................................................................................................................... 47
Bar Code ........................................................................................................................47
Dimensions..................................................................................................................... 48
Recommended PCB Layout........................................................................................... 54
Antenna Information...................................................................................................... 56
RF Exposure Statement.............. .................................................................................... 58
Safety Statements........................................................................................................... 59
Appendix B: Certifications.................................................................................................. 60
FCC Part 15 Class B ............... ....................................................................................... 60
Industry Canada ............................................................................................................. 61
Declaration of Conformity............................................................................................. 62
International EMC Standards......................................................................................... 64
Appendix C: Sample Application: PoE Power Supply ..................................................... 66
Appendix D: Sample Application: TTL Signals to EIA-232 ............................................ 69
Appendix E: Change Log .................................................................................................... 71
Revision K......................................................................................................................71
Revision J....................................................................................................................... 71
Revision I....................................................................................................................... 72
Revision H......................................................................................................................72
Revision G......................................................................................................................72
Revision F......................................................................................................................72
Revision E......................................................................................................................72
Revision D......................................................................................................................73
Revision C......................................................................................................................73
Revision B......................................................................................................................73
Revision 90000631_G >90000897_A ............................................................................ 73
Revision G......................................................................................................................73
Revision F......................................................................................................................74
Revision E......................................................................................................................74
6
About the Digi Connect ME
Family of Embedded
Modules
CHAPTER 1
Overview
The embedded modules provide fu lly transp a rent device connectivity over industry-
standard Ethernet connections and allows both equipment manufacturers and systems
integrators to network-enable pr oducts at a fraction of the time and cost required to develop
a custom solution. It is a hi ghly flexible and compact single component solutio n with a
serial port, GPIO, and a robust on-board TCP/IP stack and 10/100 BASE-T Ethernet
support or wireless interface.
Built on Digi's leadin g 3 2-bit NET+ARM p ro cessor tec hno log y, the Digi Connect ME
family of embedded modules offer serial-to-Ethernet functionality th ro ug h Digi ’s Plug-
and-Play Firmware firmware, or the freedom an d flexibility of professional embedded
software development provided by the easy-to-use, cost-effective and complete Dig i
JumpStart Kits™ for NET+OS and Microsoft.NET Micro Framework.
The Digi Connect M E and Di gi C onnect Wi-ME mo dul es are utilizing the powerful Digi
NS7520 processor with an ARM 7TDMI core ru n nin g at 55 MHz. They provide integrated
wired or wireless networking an d serial d evi ce co nne ctiv ity in a compact connector -sty le
form factor. The Digi Connect ME 9210 module is the latest, fully form factor and pin
compatible, members of the Digi Connect ME family prov idi ng 7 5 M Hz ARM 9 co re
performance based on the Dig i NS9 210 processor. In addition to higher pe rforma nce with
integrated Ethernet connectivi ty, the Digi Connect ME 9210 offers higher serial data rat es,
SPI functionality, as well as the unique option of app lication specific interfaces using the
programmable FIMs on the NS92 10.
From medical systems to bu ildi ng control and industrial automatio n, in virtually any
application where embedded device connectiv ity over Eth ernet or wireless connectivity is
needed, embedded modules are the ideal choice, delivering high-performance functional ity.
Note:
Unless mentioned specifically by n ame, th e prod uct s will be referred to as the
embedded modules or modu les. Individu al naming is used to dif ferenti ate product
7
spec ific fea tures . Si mila rly, information about the Digi C onnect ME applie s to the
Digi Connect ME 9210.
This chapter provides informa tion ab out the modules hardware and contains the following
topics:
"Types of Modules" on page 7
"Connectors: Antenna" on page 16
"Connectors: Ethernet Interface" on page 14
"Module LEDs" on page 17
Types of Modules
There are two ty pes o f mod ule s. One module utilizes Digi Plug-and-Play Fi rmwa re, while
the second is customizable wi th the option to develop a firmware appl ication in.NET MF or
NET+OS. If you are developing your firmware ap plication in NET+OS, you will be using a
module with a JTAG interface.
Note:
JTAG is a commonly used term that is also referred to as IEEE 1 149.1, an industry
standard test protocol. JTAG is an abbreviation for the European Joint Test Action
Group, which invented the first versions of the IEEE 1149.1 interface. The JTAG
interface, along wi th the other development tools, enables yo u to do wn load, run
and debug progra ms o n th e module.
The following figures sh ow th e two ty pes o f modul es.
Digi Connect ME Modules
Model Description Figure
Digi Connect ME
DC-ME-01T-JT
DC-ME4-01T-JT
Digi Connect ME 9210
DC-ME-Y401-JT
DC-ME-Y402-JT
DC-ME-Y402-LX-JT
Used for development
purposes only
JTAG interface
8
Note:
DC-ME-01T-CLI (2/8 CLI version - has the CLI enabled by default on the serial
port)
DC-ME4-01T-CLI (4/8 CLI version - has the CLI enabled by default on the seri al
port)
DC-ME-01T-PC (2/8 802.3af compliant -C module)
DC-ME-01T-PS (2/8 802.3af compliant -S module)
DC-ME-Y402-LX (Digi Connect ME 9210 4/8 Linux - production)
DC-ME-Y402-LX-JT (Digi Connect ME 9210 4/8 Linux JTAG - dev only)
Digi Connect ME
DC-ME-01T-S
DC-ME4-01T-S
DC-ME-01T-C
DC-ME4-01T-C
DC-ME-01T-CLI
DC-ME4-01T-CLI
DC-ME-01T-MF
DC-ME-01T-PC
DC-ME-01T-PS Digi
Digi Connect ME 9210
DC-ME-Y401-C
DC-ME-Y402-C
DC-ME-Y402-LX
No JTAG interface
Ordered
independently for use
in your
implementation
Digi Connect ME Modules
Model Description Figure
Digi Connect Wi-ME Modules
Model Description Figure
Digi Connect Wi-ME
DC-WME-01T-JT
Used for development
purposes only
JTAG interface
9
Note:
-S: No JTAG for us e w ith D igi Plug-and-Play Firmware
-C: No JTAG for use with custom NET+OS applications
-JT: With JTAG for use with custom firmware deve lop ment-
-MF: No JTAG for use with Microsoft.NET Micro Framework
Digi Connect Wi-ME
DC-WME-01T-S
DC-WME-01T-C
No JTAG interface
Ordered
independently for use
in your
implementation.
Digi Connect Wi-ME Modules
Model Description Figure
10
Connectors: Power and Device Interface
The module has a 20-p in ma le co nnector that supports a serial interface with data rates up
to 230,400 (Digi Connect ME and Digi Connect Wi-ME)/ 921,600 bps (Digi Co nnect ME
9210) and fu ll-modem control, and GPIO ports. See the fol lowing figure for pin orientation
and the table for pin assignments.
Difference in pin assignments/availability
Pin assignments/availabilit y for pins 1 and 2 depend on which mod ule you are using. Pins 1
through 6 are availa ble for Digi Co nnect ME; t hese pins are re mo ved fo r Digi Conn ect Wi-
ME. The pin assignmen t tab le sh ows t he a ppropriate values.
Power and Device Interface Connector
Viewed from bott om of th e modu le:
Pin 1
Module
Front
Pin 2
Pin 19 Pin 20
(Bottom View)
Wi-ME Pin 2Wi-ME Pin 1
11
Note:
The development board provides connectors for an optional PoE application kit.
Note:
Any pins not used can be left floating.
Note:
See "Module Pinou t" on page 36 for detailed IO con fi gurati on information.
Power and Device Interface Connector Pin Assignments
Signal
Description
ME Wi-ME
Pin # Function Pin # Function
1 VETH+ — ME: Power Pass-Thru+
Wi-ME: Position Removed
2 VETH- — ME: Power Pass-Thru-
Wi-ME: Position removed
3-6 — — Position removed
7 RXD 1 RXD Receive Data (Input)
8 TXD 2 TXD Transmit Data (Output)
9 RTS 3 RTS Request to Send (Output)
10 DTR 4 DTR
Data Terminal Ready (Output)
11 CTS 5 CTS Clear to Send (Input)
12 DSR 6 DSR Data Set Ready (Input)
13 DCD 7 DCD
Data Carrier Detect (Input)
14 /RESET 8 /RESET Reset
15 +3.3V 9 +3.3V Power
16 GND 10 GND Ground
17, 18 11, 12 —
Not accessible with Digi Plug-and-Play
Firmware. If using a development kit, see
"Module Pinout" on page 36 for detailed IO
configuration information.
19 — 13 — Reserved. Do not connect.
20 /INIT 14 /INIT Software Reset
12
Connectors: Module JTAG Interface
The Module’s JTAG Interface Conn ector is a 14-pin female vertical header that is labeled
P11 on the development board . The con nect or mates with the JTAG conn ecto r o n t he
embedded module. The Mod ule’s JTAG Connector pins are t ied to the debu gger conne ctor
(see “JTAG Debugger Connector, P12”).
JTAG Interface Connectors
Since the modules' JTAG connectors are mount ed o n th e bo tto m side of the modules, the
pin 1 location is mirrored from that of th e Development board's mating JTAG connector
(P1 1). The resulting pin mapping is indicated in the Module JTAG Interface Connector Pin
Assignments table below.
Pin 1
Bottom side of module (left) and development board from top (right)
ME JTAG Connector
Development Board
JTAG Connector (P11)
Pin 2
Pin 13
Pin 14
Pin 2
Pin 1
Pin 14
Pin 13
(Bottom View) (Top View)
Module JTAG Interface Connector
Pin Assignments
JTAG Signal ME JTAG pin # JTAG Connector (P11)
pin #
+3.3V 1 2
GND 2 1
TRST# 3 4
13
GND 4 3
TDI 5 6
GND 6 5
TMS 7 8
GND 8 7
TCK 9 10
RXD 10 9
TDO 11 12
SRST 12 11
+3.3V 13 14
TXD 14 13
Module JTAG Interface Connector
Pin Assignments
JTAG Signal ME JTAG pin # JTAG Connector (P11)
pin #
14
Connectors: Ethernet Interface
The Ethernet connector is an 8-wire RJ-45 jack t hat mee ts the ISO 887 7 requ irements for
10/100BASE-T. See the following figure and table for pin orientation and pin assignments.
Note:
Pin orientation and a ssignments are the same for modules with or witho ut a JTAG
connector.
Ethernet Interface Pin Orientation
JTAG Jumper
The J1 controls the way in which the Digi Connect ME 9210 JTAG device responds to pin
14 being pulled low.
Ethernet Interface Pin Assignments
Pin
1Pin
2Pin
3Pin
4Pin
5Pin
6Pin
7Pin
8
TXD+ TXD- RXD+ EPWR+ EPWR+ RXD- EPWR- EPWR-
Transmit
Data + Transmit
Data - Receive
Data +
Power
from
Switch +
Power
from
Switch +
Receive
Data -
Power
from
Switch -
Power
from
Switch -
Jumper Result
None No reset
1-2 Hard reset
2-3 Soft reset
15
Hard Reset
The embedded modules support a hardware reset on pin 14 of the 20-pin header. Pulling
pin 14 low with an ope n drain driver wil l fo rce the module i nto a hard re se t state . The
module will remain in the reset state as long and pin 14 is held low and will leave this reset
state ~250mS after pin 14 go es high. Do not activel y drive pin 14 high and do not allow the
rise time of the pin 14 to b e lo ng er than 100uS. When used with the development b oard,
this pin is wired to reset button SW4, which means it acts as a hard reset butto n.
Jumper Pin 1
16
Connectors: Antenna
The Digi Connect Wi-ME is available wi th 1 RP-SMA connector. The antenna is
connected to the module with a reverse polarity SMA connector (sub-miniature size A).
The antenna only fits o n the module one way to ensure a proper connection. Another option
for both signal recept ion and desig n flex ibi lity is to use an antenna extension cord to
separate the antenna fro m the module. This allows the module to fit inside your prod uct but
the antenna to be placed outside the device .
Antenna Specifications
Type Desktop Dipole 30 cm
Antenna Extension Cord
Part number DC-ANT-24DT DG-ANT-20DP-BG DG-EXT-300-RR
Gain 1.8 dBi 2 dBi -.5dB
Caution: This Part 15 radio device operates on a non-interference basis
with other devices operating at this frequency when using the antennae
listed in the Antenna Specification table. Any changes or modification to
user’s authority to operate the device.
the product not expressly approved by Digi International could void the
17
Module LEDs
The module has two LEDs that are located near the upper corners of the Ethernet port (see
the following fig ure). The fo llowin g table d escribes t he LEDs.
Note:
The LEDs are the same for a module with o r withou t a JTAG connecto r.
LED Locations
LED Behaviors
LED Digi Plug and Play Firmware
Digi Connect ME Digi Plug and Play Firm ware
Digi Connect Wi-ME Customizable
Modules
Top left
(yellow)
Network link status:
Off - no link has been detected.
On - a link has been detected.
Network link status:
On - unit is associated with an access
point.
Blinking slowly - unit is in ad hoc
mode.
Blinking quickly - unit is scanning
for a network.
Same as Digi Plug-
and Play Firmware
(Network link
status).
Top
right
(green)
Network activity:
Blinking -network data is transmitted or received.
This LED is
software
programmable.
18
About the Development
Board
CHAPTER 2
Overview
The development boa rd is a h ard ware p latform fro m which y ou can determine how to
integrate the embe dded modules into your d esign. The board consists of the following main
features:
Socket for connecting the embedded modules
JTAG connection (for use with the development kit only)
GPIO switches
Serial and GPIO ports
Power input
This chapter provides informa tion on dev elo pment board components and contains the
topics listed below. For more detailed information on t he d evel opmen t b oard, see the
schematic and mec han ical drawin gs o n th e CD tha t accompanies your kit. Once y o u’ve
installed the software that comes with your kit, you can access the schematic from the S tart
menu.
"Basic Description" on page 18
"Placement of Module" on page 21
"Connectors and Blocks" on page 24
"Switches and Push Buttons" on page 30
"Development Bo ard LEDs" on page 31
"Power Jack P15" on page 33
"Test Points" on page 33
Basic Description
The development board contains connectors, switches, and LEDs for use while in tegrating
the embedded module into yo ur desig n. See t he fol lowing figu re for th e lo cati on o f the
20
"Port Descriptions" on page 21
"Connectors and Blocks" on page 24
"Switches and Push Buttons" on page 30
"Development Bo ard LEDs" on page 31
"Power Jack P15" on page 33
See the following figures for placement of eith er mo du le o nto the development board.
Connectors, Switches and LEDs
Board Description Markers 1-5
12345
Secondary
Serial Port, P2
Primary Port
LEDs, CR5 -
CR18
GPIO Switch
Bank, SW3 Prototyping
Area, P4 JTAG
Header, P12
Connectors, Switches and LEDs
Board Description (continued) Markers 6-10
678910
232 Enable
Jumper
Block, P5
Embedded
Module
Connector,
P10
JTAG
Connector,
P11
Primary
Serial Port, P1 GPIO Port, P7
Connectors, Switches and LEDs
Board Description (continued) Markers 11-15
11 12 13 14 15
Digital I/O
LEDs, CR19 -
CR23
Logic
Analyzer
header, P3
POE Source
LED, CR24 Reset Switch,
SW4
User
Pushbuttons,
SW1 & SW2
Connectors, Switches and LEDs
Board Description (continued) Markers 16-21
16 17 18 19 20 21
Power Jack,
P15 On/Off
switch, SW5
Secondary
Port LEDs
CR1-CR4
-48V DC
output from
module P13
12V output
from PoE
module P14
Current
Measurement
Option P8
21
Placement of Module
Port Descriptions
The development boa rd provi des th e foll owing ports:
Primary Seri al Po r t, P1
Secondary Serial Port, P2
GPIO Port, P7
See the figure titled "Boa rd Layo ut and Connector Locations:" on page 19 for the location
of the ports. The following sections describe the ports.
Primary Serial Po rt, P1
The Primary Serial Port is a DB-9 male connector that is labeled as P1 on the deve lopment
board. See the following figure for pin o ri enta tion ; see t he fol lowing tab le for pi n
assignments.
Caution: When handling the development board, wear a grounding wrist
strap to avoid ESD damage to the board.
22
Primary Serial Port Pin Orientation
Secondary Serial Port, P2
The Secondary Serial Port is a DB-9 male connector that is labeled as P2 on the
development board. Th e po rt is used only with the Digi Connect ME modules wi th JTAG
interfaces for debugging pu rp oses. See th e foll owi ng figure for pin orientation; see the
following table for pin assign me nts.
Secondary Serial Port Pin Orientation
Pin 1 Pin 5
Pin 6 Pin 9
Primary Serial Port Pin Assignments
Pin
1Pin
2Pin
3Pin
4Pin
5Pin
6Pin
7Pin
8Pin
9
DCD RXD TXD DTR GND DSR RTS CTS —
Data
Carrier
Detect
Receive
Data Transmit
Data Data
Terminal
Ready
Signal/
Chassis
Ground
Data Set
Ready Request
To Send Clear To
Send —
Pin 1 Pin 5
Pin 6 Pin 9
23
RS232-Enable Pin Header, P5
P5 is used to enable or disab le serial port RS232s t ransceiver. Shorting P5 pins 1 and 2 will
enable the RS232 transcei ver. Shorting P5 pins 2 and 3 will disable the RS232 transceiver.
GPIO Port , P7
The GPIO port is a 9-pin ma le righ t-angl e co nnector that is labeled as P7 on the
development board. See the foll owing figure for pin orientation; see the following tabl es
for pin assignments. Fo r input and output threshold specific ations, see "DC Characteristics"
on page 43. Note that eac h sign al h as a 2 20 ohm series resistor between the P7 pin and the
module (except GND).
Note:
The development boa rd is shipped with a 9-pin screw-flange plug attach ed t o
the GPIO port.
GPIO Port Pin Orientation
Secondary Serial Port Pin Assignments
Pin
1Pin
2Pin
3Pin
4Pin
5Pin
6Pin
7Pin
8Pin
9
—RXD TXD —GND ————
—Receive
Data Transmit
Data —Signal/
Chassis
Ground
————
Pin 1 Pin 9
24
Connectors and Blocks
The development boa rd provi des th e following connectors and blocks:
Embedded Module Connector, P10
The Digi Connect Wi-ME module does not provide pins 1-6.
JTAG Debugger Connector, P12.
-48V DC input to PoE module (Digi Connect ME must be connected to a
Powering Device for this feature.), P13
12V DC output from PoE module into Dev Board Power Supply, P14
Logic Analyzer Header, P3
See the figure titled "Boa rd Layo ut and Connector Locations:" on page 19 for the location
of the connectors and b lock s . The fol lowing secti ons d escribe t he c onnectors and blocks.
Embedded Module Connector, P10
The Digi Connect ME embe dded module Co nnector is a 20-pin femal e vertical header that
is labeled P10 on the development board. See the following figure for pin orientation; see
the following tabl e for pin assign ments.
Note:
The figure shows the co nn ecto r u s ing the sa me orientation as shown in the
figure titled "Board Layout and Connector Locations:" on page 19.
GPIO Port Pin Assignments
Pin
1Pin
2Pin
3Pin
4Pin
5Pin
6Pin
7Pin
8Pin
9
Signal GPIO-1 GND GPIO-2 GND GPIO-3 TXD_TTL GPIO-4 RXD_TTL GPIO-5
25
Embedded Module Connector Pin Orientation
1
19
1
141320
2
2
Connect ME Connect Wi-ME &
Wi-ME 9210
Power and Device Interface Connector Pin Assignments
Signal
Description
ME Wi-ME
Pin # Function Pin # Function
1 VETH+ — ME: Power Pass-Thru+
Wi-ME: Position Removed
2VETH- — ME: Power Pass-Thru-
Wi-ME: Position removed
3-6 — — Position removed
7RXD 1RXD Receive Data (Input)
8TXD 2TXD Transmit Data (Output)
9RTS 3RTS Request to Send (Output)
10 DTR 4DTR
Data Terminal Ready (Output)
11 CTS 5CTS Clear to Send (Input)
12 DSR 6DSR Data Set Ready (Input)
13 DCD 7DCD
Data Carrier Detect (Input)
14 /RESET 8/RESET Reset
15 +3.3V 9+3.3V Power
16 GND 10 GND Ground
17, 18 11, 12 —
Not accessible with Digi Plug-and-Play
Firmware. If using a development kit, see
"Module Pinout" on page 36 for detailed IO
configuration information.
26
Note:
The Digi Connect Wi-ME module do es not provide pins 1-6.
Note:
The GPIO's mentioned above are used to reference the silkscreen label on the
development board, no t the actual GPIO number of the Digi Connect M odule.
See "Module Pinou t" on page 36 for detailed IO configuration information.
Module JTAG Interface Connector, P11
The Module’s JTAG Interface Conn ector is a 14-pin female vertical header that is labeled
P11 on the development board . The con nect or mates with the JTAG conn ecto r o n t he
embedded module. The Mod ule’s JTAG Connector pins are t ied to the debu gger conne ctor
(see “JTAG Debugger Connector, P12”).
Since the modules' JTAG connectors are mount ed o n th e bo tto m side of the modules, the
pin 1 location is mirrored from that of th e Development board's mating JTAG connector
(P1 1). The resulting pin mapping is indicated in the Module JTAG Interface Connector Pin
Assignments table below.
19 — 13 — Reserved. Do not connect.
20 /INIT 14 /INIT Software Reset
Power and Device Interface Connector Pin Assignments
Signal
Description
ME Wi-ME
Pin # Function Pin # Function
Pin 1
Bottom side of module (left) and development board from top (right)
ME JTAG Connector
Development Board
JTAG Connector (P11)
Pin 2
Pin 13
Pin 14
Pin 2
Pin 1
Pin 14
Pin 13
(Bottom View) (Top View)
27
Module JTAG Interface Connector
Pin Assignments
JTAG Signal ME JTAG pin # JTAG Connector (P11)
pin #
+3.3V 1 2
GND 2 1
TRST# 3 4
GND 4 3
TDI 5 6
GND 6 5
TMS 7 8
GND 8 7
TCK 9 10
RXD 10 9
TDO 11 12
SRST 12 11
+3.3V 13 14
TXD 14 13
28
JTAG Debugger Connector, P12
The JTAG debugger connector is a 20-pin male vertical header that is labele d P12 on the
development board . The conn ector mate s with a JTAG debugger plu g (for example, a Digi
JTAG Link). The connector is used with the development kit only. See the following figure
for pin orientation. See the following table for pin assignmen ts.
Note:
The figure shows the co nn ecto r u s ing the sa me orientation as shown in the
figure titled "Board Layout and Connector Locations:" on page 19.
JTAG Debugger Connector Pin Orientation
Note:
Pin assignments are shown for the connector o n th e de velo pmen t bo ard .
JTAG Debugger Connector Pin Assignments
Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10
VCC+ VCC+ /TRST GND TDI GND TMS GND TCK GND
Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20
RTCK GNO TDO GND /SRST GNO N/A GND N/A GND
29
Logic Analyzer Header, P3
The Logic Analyzer Header is a 20-pin male vertical header that is labeled P3 on the
development board. The header is for connecting a digital signal analyzer (for example, a
logic analyzer) to the d evelopment board. See the following figure fo r p in o ri enta tion; see
the following tabl e for pin assign ments.
Note:
The figure shows the co nn ecto r u s ing the sa me orientation as shown in the
figure titled "Board Layo ut an d Connector Locations:" on page 19.
Logic Analyzer Header Pin Orientation
Logic Analyzer Header Pin Assignments
Pin
1Pin
2Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin
9Pin
10
V_Ether+ V_Ether- Not
Connected Not Connected Not
Connected Not
Connected RXD TXD GPIO-4 GPIO-5
Pin
11 Pin
12 Pin
13 Pin
14 Pin
15 Pin
16 Pin
17 Pin
18 Pin
19 Pin
20
GPIO-2 GPIO-3 GPIO-1 /RST 3.3v GND
See "Power and
Device Interface
Connector Pin
Assignments" on
page 11 for details.
Reserved /INIT
30
Switches and Push Buttons
The development boa rd provi des th e foll owing switches:
User PB1
User PB2
GPIO Switch Bank 1, SW3
Reset, SW4
Power On/Off SW5
See the figure titled "Boa rd Layo ut and Connector Locations:" on page 19 for the location
of the switches. The followin g sections describe the switches.
GPIO Switch Bank 1, SW3
GPIO Switch Bank 1 , labeled SW3, is a set of five slide switches that allo ws the embedded
module to use either serial signals or GPIO signal s to communicate with a devi ce. W ith the
switch to the left po si tion , th e modu le’s signal is connected to the Serial Port1 RS232
transceiver. In the right position, the module signal is conn ected to the app ro priate p in of
the GPIO Port P7.
GPIO Switch Bank 1 Settings
User Push Button 1, SW1
When switch number 1 is set to GPIO-1, pushing User Push Bu tto n 1 , SW1, will drive
GPIO-1 (module pin 13) low.
Switch
Number
Left Position Right Position
1DCD GPIO-1
2CTS GPIO-2
3DSR GPIO-3
4RTS GPIO-4
5DTR GPIO-5
31
User Push Button 2, SW2
Pushing User Push Button 2, SW2, wil l drive module pin 18 low.
Reset, SW4
The Reset switch is a push button swit ch labele d SW4 on the dev elopment board . Pressing
the switch holds the embedded modu le i n reset. Whe n the push button is released, the
module reboots.
Power On/O ff Switch, SW5
The left position means that power is on. The right position means that power is off.
Development Board LEDs
The development boa rd con tain s 25 LEDs that are labeled CR1 through CR25. The
following table lists and describes the LEDs.
Development Board LED Descriptions
Board
Label Description
State
Indication
CR1
CR2
TXD, Secondary Serial Port Yellow
TXD, Secondary Serial Port Yellow
On Logic 1 on TTL, mark, -V on line side
On Logic 1 on TTL, mark, -V on line side
CR3
CR4
RXD, Secondary Serial Port Yellow
RXD, Secondary Serial Port Green
On Logic 1 on TTL, mark, -V on line side
On Logic 0 on TTL, space, +V on line side
CR5
CR6
DCD, Primary Serial Port Yellow
DCD, Primary Serial Port Green
On Logic 1 on TTL, mark, -V on line side
On Logic 0 on TTL, space, +V on line side
CR7
CR8
DSR, Primary Serial Port Yellow
DSR, Primary Serial Port Green
On Logic 1 on TTL, mark, -V on line side
On Logic 0 on TTL, space, +V on line side
CR9
CR10
CTS, Primary Serial Port Yellow
CTS, Primary Serial Port Green
On Logic 1 on TTL, mark, -V on line side
On Logic 0 on TTL, space, +V on line side
32
CR11
CR12
RXD, Primary Seri al Port
RXD, Primary Seri al Port
On Logic 1 on TTL, mark, -V on line side
On Logic 1 on TTL, mark, -V on line side
CR13
CR14
DTR, Primary Serial P ort Yellow
DTR, Primary Serial Port Green
On Logic 1 on TTL, mark, -V on line side
On Logic 0 on TTL, space, +V on line side
CR15
CR16
RTS, Primary Serial Port Yellow
RTS, Primary Serial Port Green
On Logic 1 on TTL, mark, -V on line side
On Logic 0 on TTL, space, +V on line side
CR17
CR18
TXD, Primary Serial Port Yellow
TXD, Primary Serial Port Green
On Logic 1 on TTL, mark, -V on line side
On Logic 0 on TTL, space, +V on line side
CR19 GPIO 1 Green On Logic 1
Off Logic 0
CR20 GPIO 2Green On Logic 1
Off Logic 0
CR21 GPIO 3Green On Logic 1
Off Logic 0
CR22 GPIO 4Green On Logic 1
Off Logic 0
CR23 GPIO 5Green On Logic 1
Off Logic 0
CR24 POE Active LED Green On +12V present from POE
Off No POE present
CR25 3.3V LED Green On Power On
Off Power Off
Development Board LED Descriptions
Board
Label Description
State
Indication
33
Power Jack P15
The Power Jack P15 is a ba rrel connector t hat a ccepts 9 t o 30 VDC + /- 5%. The followi ng
table shows the polarity of the power jack.
The following figure schematically represents the polarity of the power jack.
Power Jack Polarity, Schematic
Test Points
The development boa rd provides 13 test points that can be identi fied by a board label. The
test point numbe rs are in th e dev elo pment board schematic drawings. The following table
lists the test p oint number, board label, and a brief description of ea ch test point.
Power Jack Polarity
Contact Polarity
Center +9 to +30 VDC
Outer Ground
Ground +9 to +30 VDC
Test Point Descriptions
Test
Point Board Label Description
TP2 TXD TXD-2, Transmit,
Secondary Serial Port
TP3 RXD RXD-2, Receive,
Secondary Serial Port
34
TP4 CTS CTS, Primary Serial Port
TP5 DTR DTR, Primary Serial Port
TP6 TXD TXD, Primary Serial Port
TP7 RXD RXD, Primary Serial Port
TP8 RTS RTS, Primary Serial Port
TP9 DCD DCD, Primary Serial Port
TP10 DSR DSR, Primary Serial Port
TP12 Reset Reset
TP13 POE 12v POE 12v
TP14 3.3v 3.3v Supply
TP15 GND Ground
Test Point Descriptions
Test
Point Board Label Description
35
Programming
Considerations
CHAPTER 3
Overview
This chapter provides informa tion prog ra mmers may requ ire to ma ke u se of some
embedded module hardware re so urces. It p ro vid es programming informatio n o n th e
following topics for the Dig i Co nn ect M E , the Di gi Co nn ect ME 9210, and the Digi
Connect Wi-ME:
"Module Pi no ut " on page 36
"LEDs" on page 39
"Reset" on page 39
"Memory" on page 40
"SDRAM" on page 40
36 36
Module Pinout
General Information
The NS7520/NS9210 processors supp ort 1 6 General Purpose I/O (GPIO) lines, some of
which are reserved for specific functio ns an d some o f whi ch c an be customized. For Digi
Plug and Play Firmware users, see the Digi Connect Family Users Guide for details on
what Pin configurations are availabl e to you.
Module Pinout
The following table provides signal header pinout information for the Digi Connect ME,
Digi Connect ME 9210, and Digi Connect Wi-ME modules. P lease refer t o the color key
below.
Key
Applies to Digi Connect ME/Wi-ME modules.
Applies to Digi Connect ME 9210/Wi-ME 9210
modules.
Applies to Digi Connect ME/Wi-ME and ME
9210/Wi-ME 9210 modules.
37
Note:
The CAN Bus interface is available on the 8/ 16 Digi Connec t ME 9210, Wi-
ME 9210 variants.
Note:
When using the 8/16 ME 9210 / W i-ME 9210 CAN Bus, the DTR (9210 signal
GPIO 6) line must be tri -stated. When the DTR signal (9210 GPO/I 6) is used,
9210 GPO/I 15 must be t ri-state d. Th ese two 9 210 sign als are wired to get her
on the 9210 mo du les.
Note:
The Digi Connect W i-ME 9210 module does not provide pins 1-6.
Note:
When using I2C, make sure t o p ut a 10k pu ll u p o n th e SDA and SC L lin es.
Pin
[Wi-ME/
Wi-ME
9210]
Pin
[ME/ME
9210]
UART
[All] GPIO
[ME/
Wi-ME]
GPIO
[ME 9210] Ext
IRQ
[ME/
Wi-ME]
Ext
IRQ
[ME 9210/
Wi-ME
9210]
I2C
[ME 9210/
Wi-ME
9210]
SPI
[ME 9210/
Wi-ME
9210]
FIM
[ME 9210/Wi-
ME 9210]
CAN BUS
[ME 9210/Wi-
ME 9210]
Timer
[ME 9210/
Wi-ME
9210]
Other
[All]
1VETH+
2VETH-
3-6 Positions Removed
1 7 RXD A3 GPIO[3] DATA
IN PIC_0_GEN
_IO[3]
2 8 TXD A7 GPIO[7] DATA
OUT Timer
Out 7
Timer In
8
3 9 RTS A5 GPIO[5] 3CLK Timer
Out 6
410 DTR A6 GPIO[6] PIC_CAN
_TXD Timer In
7
511 CTS A1 GPIO[1] 0PIC_0_GEN
_IO[1]
612 DSR A2 GPIO[2] 1PIC_0_GEN
_IO[2] PIC_CAN
_RXD
713 DCD A0 GPIO[0] EN PIC_0_GEN
_IO[0]
814 /RST
915 3.3V
10 16 GND
11 17 C4 GPIO[12] SDA CLK RESET_
DONE
12 18 C1 GPIO[9] 1 0 SCL
13 19 Reserved
14 20 C5 GPIO [13] CLK Timer
Out 9 /INIT
38 38
Module JTAG Interface Pinout
The following table provides signal header pinout information for the Digi Connect ME
JTAG pin and the Development Board JTAG Connector (P11) pin.
Module JTAG Interface Connector
Pin Assignments
JTAG Signal ME JTAG pin # JTAG Connector (P11)
pin #
+3.3V 1 2
GND 2 1
TRST# 3 4
GND 4 3
TDI 5 6
GND 6 5
TMS 7 8
GND 8 7
TCK 9 10
RXD 10 9
TDO 11 12
SRST 12 11
+3.3V 13 14
TXD 14 13
39
LEDs
General Information
The embedded modules have t wo typ es of LEDs:
An LED connected directly to GPIO pins on the processor and controlled
directly in software
An LED connected to other hardw are components (normally the Ethernet
hardware) and not directl y programmable by the operating system
The development kit, by default, correctly configures the GPIO connected to the LED as an
output and then uses th is LED t o represent Ethe rnet ac tivi ty.
Reset
Hard Reset
The Connect ME and M E 92 10 mo dules support a hardware reset via pin 14 of the 20-pin
header. The Conn ect Wi-ME and W i-ME 9 210 modules support a hardware reset via pin 8
of the 14-pin h ead er. The unit is forced into a hard reset when pulling the pin to ground, or
less than 0.8v, for one microsecond (Min). Whe n p lug ged into a development board, this
pin is wired to the push b utt on a t SW4 . As a re sult, this switch acts as a hard reset button.
LED Description
Yellow This is wired directly to Ethernet hardware and provides an indication of link.
Green This software-programmable LED is wired to processor GPIO register bit C6/
GPIO[14] and is wired to be lit when low. The default behavior is to blink on
Ethernet activity.
Reset Characteristics
Characteristic Specification
Delay 250 milliseconds (typical)
Low ActiveThreshold 0.8 V
High Inactive Threshold 2.4V
Minimum Hold Time 1 microsecond pulse
Rise Time 100 microseconds max
40 40
Memory
Flash
The Digi Connect ME has 2 or 4 MB of flash memory. The Digi Connect W i-ME has 4 MB
or 8 MB of flash memory.
On the Digi Connect ME/ARM7 fa mi ly, the flash memory is controlled by chip select 0,
located at 0x020 00000.
On the Digi Conne ct ME 9210/ARM9 family, the flash memory is contro lled by chip select
2 (default=st_cs1) and is located at 0x50000000 .
SDRAM
The Digi Connect ME and the Digi Connect Wi-ME’s SDRAM is controlled by chip
select 1 and is located at 0x00000000.
The Digi Connect ME 9210’s SDRAM is controlled by chip select 1 (def ault = dy_cs0)
and is mapped to 0x00000000.
The embedded modules have 8 MB o f SDRAM memory.
The following table illustrates ty pical power c onsumptions us ing these po wer manageme nt
mechanisms. These measurements were taken with all Digi NS9210 p rocessor’s I/O clocks
disabled except UART A, UART C, Ethernet MAC , I/O Hub and Memo ry Clock0 with the
ethernet connected to a 100Mb network, usin g a standard module plugged into a Digi
JumpSta rt Kit development board, with nomina l vo ltage applied:
Note 1: This measurement was taken from the R6 current sense resistor using a 0.025 ohm shunt on the
JumpStart Kit development board.
Note 2: This is the default power consumption mode when entering applicationStart() , as measured with the
napsave sample application. The value of the NS9210 Clock Configuration register (A090017C) is 0001200B
hexadecimal.
Note 3: This measurement was produced by selecting the “Clock Scale” menu option in the napsave sample
application.
Note 4: This measurement was produced by selecting the “Deep Sleep/Wakeup with an External IRA” menu
option in the napsave sample application.
Mode Power Consumption1
Normal Operational Mode21.14W (346mA)
Full Clock Scaling Mode3.613W (186mA)
Sleep Mode4.113W (34mA)
41
Module Specifications
APPENDIX A
Network Interface
Digi Connect ME/ME 9210 Digi Connect Wi-ME
Standard: IEEE 802.3
Physical Layer: 10/100Base-T
Data Rate: 10 /100Mbps (auto-sensing)
Mode: Half-duplex and full-duplex
support (auto-sen sing )
Connector: RJ-45
Standard: IEEE 802.11b/Standard: IEEE 802.11b/g/n
Frequency: 2.4 GHz
Data Rate: Up to 11 Mbps with automatic fallback
Modulation: CCK (11/5 Mbps), DQPSK (2 Mbps),
DBPSK (1 Mbps)
Transmit Power: 16 dBm typical
Receive sensitivity:
– 1Mbps: -92 dBm
– 2Mbps: -89 dBm
– 5.5Mbps: -87 dBm
– 11Mbps: -82 dBm
Antenna Connector: 1 x RP-SMA
Caution: The Digi Connect ME and Digi Connect Wi-ME embedded
modules were designed for use in no clean flux wave soldering processes.
The product is not designed to support draining after a water-wash
process, which can lead to water residue inside the enclosure resulting
from direct entry or condensation af ter the wash process.
42
Serial Interface
One TTL serial interface (CMOS 3.3v) with full modem control signals (DTR, DSR, DCD,
RTS, CTS). The Digi Connect ME 9210 also supports SPI and FIM-based application
specific interfaces.
Data Rates (bps)
50, 75, 110, 134, 150, 20 0, 3 00 , 60 0, 1200, 1800, 2400, 4800, 9600, 1 440 0,1 920 0, 2 88 00,
38400, 57600, 1152 00, 230 400, 460800 (Digi Connect ME 9210 only), 921600 (Digi
Connect ME 9210 only)
Flow Control Options
RTS/CTS, XO N/XO FF, None
43
DC Characteristics
The following table s p rovid e DC ch ara cteristics for o peratin g co nd itio ns, inputs, and
outputs.
W ar ning: The ri se time of the 3.3v power su pply must be between 700 S and 140ms
and the inrush current must be limited to less than 2 A. A rise time outside of these
limits may cause the device to malfunction and give a 3-1-3 diagnostic error.
Operating Conditions
Symbol Description Min Typ Max Unit
VCC Supply Voltage 3.14 3.3 3.45 V
n/a Power Supply Ripple 40 mVpp
ICC Supply Current ——
Digi
Connect
ME 270
mA
Digi
Connect
ME
9210
450
Digi
Connect
Wi-ME 650
IIL
Input Current as “0”
(57K pull-up resistor) — — 57 A
9210
(16K pull up resistor) -10 — 200 A
IIH
Input Current “1”
(57K pull-up resistor) -10 — 10 A
9210
(16K pull up resistor) -10 — 10 A
IOZ HighZ Leakage
Current -10 — 10 A
IOD Output Drive Strength — — 2 mA
CIO Pin Capacitance
(VO=0) — — 4 pF
Inputs
Symbol Description Min Typ Max Unit
VIH Input High Voltage 2 — VCC+0.3 V
44
Note:
The embedded modules provide an on board supervisor circuit with a 2.93 V
(nominal) reset threshold. When VCC falls to the threshold volt age, a reset pu lse is
issued, holding th e output in active state. When power rises abov e 2.88V, the reset
remains for approximately 25 0 ms to allo w th e syste m c lock an d ot her circu its to
stabilize.
Grounding Recommendation
It is recommended that you connect the tabs on the chassis of the Digi Connec t ME / Wi-
ME, and the ground pins directly to the logic grou nd plane. It is also recommended th at you
connect the Digi Connect ME / Wi-ME to the metal chassis of your e nclosure. The idea is
to provide the sh ortest p ath or a path away from circuitry for ESD to travel to grou nd.
VIL Input Low Voltage VSS-0.3 — .8 V
Outputs
Symbol Description Min Typ Max Unit
VOH Output High Voltage 2.4 —3.45 V
VOL Output Low Voltage 0 — 0.4 V
Digi Connect ME Digi Connect Wi-ME
Storage
Temperature -40° F to 257° F
(-40° C to 125° C)
Relative Humidity 5% to 90%, not to exceed 95 % non- cond ensing (4° C to 45 ° C),
constant abso lute humi dity ab ove 4 5° C
Altitude 12,000 feet
(3657.60 meters)
Inputs
Symbol Description Min Typ Max Unit
45
Power Management (Digi Connect ME 9210 only)
Using the Di gi NET+OS dev elopment envi ronment, appl ications on th e Digi Connec t ME
9210 are capable of operating the module in several reduced power consumption modes.
These reduced power operating modes utilize the power management mechanisms for the
NS9210 processor for CPU clock scaling and sleep.
In the Clock Scalin g mod e, th e system it self continues to execute instructions, but at a
dif ferent clock rate, wh ich can be change d on-the-fly, using Digi’s paten ted circuitry insid e
the NS9210 processor. The clock speed is changed programmatically to lower or raise the
system clock speed, thus reducing or increasing the modul e’s power footprint, respectively.
Additionally, a Sleep mode is available in which the sy st em stop s executing instructions.
Based on the app lication needs, wake-up triggers can be set up p ro gramma tically to
activate the processor back to whereve r it left off. In this mode, a drastic power red uction is
realized by reducing the p ower c onsu mp tio n of th e NS9 210 proce sso r a nd the o n-modu le
PHY.
For sample power consumption fi gures for normal (typical) and power management related
operation of the Digi Connect ME 9210, see below:
3.3VDC @ 346 mA typical (1.14W)
UART and Ethernet activated
Low Speed Id le Mode (approxima te)
3.3VDC @ 186 mA (613 mW)
/16 clock scaling, Ethernet activated
Sleep Mode (approximate)
3.3VDC @ 34 mA (113 mW)
Wake-up on EIRQ, Ethernet PHY off
Measure Temperature Here
46
Thermal Specifications
The table below shows the standard operating temperature ranges for the entire Di gi
Connect ME family of embedded modules.
The lower standard operating temperature ranges are specified wit hout restrictions, except
condensation must no t occur.
The upper operatin g temp erature limit depends on the host PCB layout and surrounding
environmental condition s. To simplify the customer’s design process, a maximum case
temperature has been specified.
The maximum case temperature must remain below the maximum, measured at the
location shown in th e figure on the previous page.
Additional Design Recommendations
The following list provid es additio nal design guidance with respect to thermal management
in applications wi th operating temperatures at the high en d or beyond the specified standard
ambient temperature range.
Providing air movement wi ll improve heat dissipation.
The host PCB plays a large part in dissipating the heat gene rated by the module .
A large copper plane located under the Digi Connect ME 9210 is soldered to
the module’s mounting tabs will improv e the heat dissipat ion capabiliti es of the
PCB.
If the design allows, added buried PCB planes will also improve heat
dissipation. The copper planes create a lar g er surface to spread the heat into the
surrounding environmen t.
Standard Operating Temperature Range s
Product Operating Temperature Range
Digi Connect ME -40°C to +85°C
Digi Connect ME 9210 -40°C to +80°C
Digi Connect W i-ME -30°C to +75°C
Maximum Case Temperature
Product Maximum Case Temperature
Digi Connect ME 96°C
Digi Connect ME 9210 93°C
Digi Connect Wi-ME 85°C
47
Adding a thermal pad or t hermal compound, such as Sil-Pad®, Gap Pad® or
Gap Filler products made by the Bergquist Company
(www.bergquistcompany.com), between the host PCB and the unde rsi de o f th e
module will significantly increase the thermal transfer between the module’s
enclosure and the host PCB. Limit the fill area to the folded metal portion of the
module’s underside.
Mechanical
Bar Code
The 50m PN is code 3 of 9 (39) and the MAC i s code 128. All scan ners are set up so if they
read code 3 of 9 they will automatically read 128. The reason for the two different code
types is to maximize th e size of the bars within a given space to improved readabili ty.
Dimensions Digi Connect
ME Digi Connect
Wi-ME
Length 1.445 in.
(36.703 mm) 1.85 in
(46.99 mm)
Width 0.75 in. (19.0 5 mm)
Height 0.854 in. (21.69 mm)
Weight .616oz.
17.463g
.696 oz.
19.731 g.
Antenna- .408 oz.
11.567 g
Total - 1.104 oz.
31.298 g
Device/serial
interface connector 20-pin micro header (10-pin double row) with .05-inch (1.27-mm) pitch (Samtec
P/N FTS-110-01-F-DV-TR or similar). Posit ions 3 th rough 6 are r emoved.
48
Dimensions
The following figure s show the dimensions of Digi C onnect Wi-ME and Digi Connect ME
embedded modules.
Note:
These are the tolerances for the drawings shown o n th is and the following pages:
Digi Connect Wi-ME Module
Front Wi-ME
Measure Tolerance
.XX ± .02
.XXX ± .010
Angles ± 3°
49
Side Wi-ME
50
Bottom Wi -M E
51
Digi Connect ME Module
Front View
52
Side View
53
Bottom View
54
Recommended PCB Layout
The following figure shows th e re commended PCB (printed circuit board) layout of the
Digi Connect Wi-ME and Digi Connect ME. It is strongly recommended that you con sider
using the Digi Connec t Wi-ME footprint for future flexibility.
Digi Connect ME and Wi-ME
55
Tap Dimen sions
56
Antenna Information
Antenna Strength
The following diagram demonstrates the strength of the signal received by the whi p
antenna on both a horizontal and vertical pla ne. Th e di agram shows th e magn etic fie ld
when the antenna is in a verti cal positi on. The outside line represents the horizontal plane
and the inside dot ted line represents the vertical plane.
Radiation Patterns
Antenna Specifications
Any antenna ma tchi ng the in-band and out-of-band signal pattern s and strengths of the
antenna, whose characteristics are given in th e Antenna Description table and the Radiation
Pattern graphic may be used with the Digi Connect Wi-ME.
Antenna
Description Dipole Desktop
Frequency 2.4~2.5 GHz 2.4~2.5 GHz
Power Output 2 W 1 W
DB Gain 2 dBi 1.8 dBi
VSWR < or = 2.0 1.92 max.
Nominal
Impedance 50 ohm 50 ohm
Dimension 108.5 x 10.0 mm 105 x4.5 mm
Weight 10.5g 11 g
Connector RP-SMA
Part Number DG-ANT-20DP-BG DC-ANT-24DT
57
Desktop Antenna Dimensions
Units: mm
58
Dipole Antenna Dimensions
RF Exposure Statement
The Digi Connect Wi-ME module complies with the RF exposure limits for humans as
called out in RSS-102. It is exempt from RF evaluati on based on its ope rating frequency of
bOBITRON
SCALE 3.000
UNITS: mm
90.0
(9.1)
.360
(88.9)
3.500
(30.5)
1.200
(25.4)
1.010
(83.8)
3.300
(10.1)
.399
R
(3.2)
.125
59
2.4 GHz, and ef fective radiated power l ess than th e 3 wat t require ment for a mobil e de vice
(>20 cm separation) operating a t 2.4 GHz.
Safety Statements
To avoid contact with electrical current:
Never install electrical wiring during an electrical storm.
Never install an ethernet connection in wet locations unless that connector is
specifically designed for wet locations.
Use caution when installing or modifying ethernet lines.
Use a screwdriver and other tools with insulated handles.
You and those around you should wear safety glasses or goggles.
Do not place ethernet wiring or connections in any conduit, outlet or junction
box containing elect rical wiring.
Installation of insid e wire may bring you close to electrical wire, conduit,
terminals and other electrical facilities. Extreme caution must be used to avoid
electrical shock from such facilities. You must avoid contact with all such
facilities.
Ethernet wiring must be at least 6 feet from bare powe r wiring or li ghtning rods
and associated wires, and at least 6 inches from other wire (antenna wires,
doorbell wires, wires from transformers to neon signs), steam or hot water
pipes, and heating ducts.
Do not place an ethernet connection where it would allow a person to use an
ethernet device while in a bathtub, shower, swimming pool, or similar
hazardous location.
Protectors and grounding wire placed by the service provider must not be
connected to, removed, or modified by the customer.
Do not touch un-insulated ethernet wiring if ligh tning is likely!
Do not touch o r move t he anten na(s) while th e unit is t ransmitting or receivin g.
Do not hold any component containing a radio such that the antenna is very
close to or touching any exposed parts of the body, especial ly the face or eyes,
while transmitting .
Do not operate a portable transmitter near unshielded blasting caps or in an
explosive environment unless it is a type especially qualified for such use
Any external communic atio ns wi ri ng y ou may install needs to be constructed to all
relevant electrical codes. In the United States this is the Natio nal Electrical Code Article
800. Contact a licensed elect ric ian for detail s.
60
Certifications
APPENDIX B
These products comply with t he foll owing stand ards.
FCC Part 15 Class B
Radio Frequency Interference (RFI) (FCC 15.105)
The Digi Connect M E and Di gi Connect W i-ME embedded mo dules have been tested and
found to comply wit h th e li mits for Class B digital devices pursuan t to Pa rt 15 Subpart B,
of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a resi dential en vironment. Thi s equipme nt generates, uses, and can
radiate radio frequency energy, and if not installed and used in accorda nce wit h the
instruction manual, ma y cause harmful interference to radio communication s . Ho wev er,
there is no guarantee tha t in terferen ce will n ot occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception , wh ich can be
determined by turning t he equipment off and on, the user is encouraged to try and correc t
the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation betw een the equipment and the receiver.
Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected.
Consult the dealer or an experienced radio/TV techni cia n fo r he lp.
Labeling Requirements (FCC 15.19)
This device complies with Part 15 of FCC rules. Ope rat ion is subj ect t o th e foll owi ng two
conditions: (1) this dev ice may no t cau se harmful interference, and (2) this device must
accept any interference re ceived, i ncluding i nterfere nce t hat ma y cause undesired
operation.
If the FCC ID is not visible wh en installed inside another device, then the outsid e of th e
device into which th e module is installed must al so display a lab el referring to the en closed
61
module FCC ID. This ext eri or labe l can use wordi ng su ch as the following : “Co nta ins
Transmitter Module FCC ID: MCQ-50M880/ IC: 1846A-50M880”.
Modifications (FCC 15.21)
Changes or modificatio ns to thi s equ ipment not expressly approved by Digi may void t he
user's authority to o perate this equipment.
Industry Canada
This digital apparatus does not exceed the Class B limits for ra dio noi se emissions from
digital apparatus set out in the Radio Int erference Regulation s of the Canadia n Department
of Communications.
Le present apparei l nu me riq ue n'emet pas de bruits radioelectriques depassant les l imites
applicables aux appareils numeriques de la class B pre scrit es dans le Re glement sur le
brouillage radioelectrique edicte par le ministere des Communications du Canada.
62
Declaration of Conformity
Digi Connect ME and Digi Connect Wi-ME Conformity
(In accordance with FCC Dockets 96-208 and 95-19)
Digi International de cl ares, that the produc t:
to which this declaration relates, meets the re qui remen ts specified by the Federal
Communications Commission as det ailed in the following specifications:
Part 15, Subpart B, for Class B Equipment
FCC Docket 96-208 as it applies to Class B personal
Computers and Peri pherals
The product listed above h as bee n te st ed at an External Test Laboratory certified per FCC
rules and has been fou nd to meet the FCC, Part 15, Class B, Emission Limits.
Documentation is on fi le and available from the Digi International Ho mologation
Department.
Manufacturer's Name: Digi International
Corporate Headquarters: 11001 Bren Road East
Minnetonka MN 55343
Manufacturing Headquarters: 10000 West 76th Street
Eden Prairie MN 55344
Product Name: Digi Connect ME embedded module
Model Number: 50001528-XX
Product Name: Digi Connect Wi-ME embedded module
Model Number: 50000880-XX
63
Digi Connect ME 9210 Con formity
Digi International de cl ares, that the produc t:
to which this declaratio n relates are in conformity with t he essential requirements and other
relevant requirements of the Directive 2004/108/EC (EMC), and Directive 2006/95 /EC
(LVD).
Safety: (article 3.1a) EN60950-1:2001
Manufacturer's Name: Digi International
Corporate Headquarters: 11001 Bren Road East
Minnetonka MN 55343
Manufacturing Headquarters: 10000 West 76th Street
Eden Prairie MN 55344
Product Name: Digi Connect ME 9210 module
Model Number: 50001528-XX, where -XX can be any alphanumeric character
EMC :( article 3.1b) EN55022: 2006 (Class B)
EN55024:2003 +A1 :20 01 +A2:2003
EN61000-3-2:2006
EN61000-3-3:1995 +A1 (2001) +A2 (200 5)
64
International EMC Standards
The Digi Connect M E and Di gi Connect W i-ME embedded mo dules meet the following
standards:
Digi Connect ME Digi Connect Wi-ME
Storage
Temperature -40°F to 257°F
(-40°C to 125°C)
Humidity 5% to 90%
Altitude 12000 feet
(3657.60 meters)
Standards Digi Connect
ME Digi Connect
Wi-ME
Emissions
AS/NZS 3548
AS/NZS 3548 CISPR 22
Japan IOH
003NY04115 0000
003GZ04064 0000
FCC Part 15 Subpart C
(FCC ID: MCQ-50M880)
IC RSS 210 (IC:1846A-50M880)
FCC Part 15 Subpart B
ICES-003
EN 55022
EN 61000-4-2
EN 61000-4-3
EN 61000-4-6
EN 301 489-3
EN 300 328
VCCI
Immunity EN 55024
Safety UL 60950-1
CSA 22.2 No. 60950--1
EN 60950
65
Antenna configurations
This device has been designed to operate with the antennas listed bel ow, and having a
maximum gain of [10] dBi. Antennas not included in this list or h avi ng a gai n g rea ter than
[10] dBi are strictly prohibite d for use with this d evice. Th e required antenna impedan ce is
[50] ohms
The following a ntenna configurations that were tested with the Conn ect Wi-ME 802.11 b
module.
Digi 29000095, Bobbintron SA-006-1, +2 dBi dipole antenna (NP-SMA)
PCTEL, MLPV2400NGP, 2.4 GHz, 3dBi gain, no ground place, low profile antenna
MAXRAD, MFB24010, 2.4 GHz, 10 dBi Fiberglass OMNI antenna
To reduce potential radio interference to other users, the antenna type and its gain should be
so chosen that the eq uiv alen t isotropically radiated power (e.i.r.p.) is not more than that
permitted for successful communication.
66
Sample Application: PoE
Power Supply
APPENDIX C
The following schematics are examples of Po E Powe r Sup pli es:
67
2/8 Digi Connect ME
5
5
B
A
1234
1234
C
D
D
C
B
A
MB2S
D1
3
4
2
1
ACAC
POS NEG
MB2S
D2
3
4
2
1
ACAC
POS NEG
LM5070SD
U1
12
13
11
9
3
6
2
14
15
4
5
1
7
10
17
8
16
SMAJ60A-13-F
D3
100n/100V
C2
24K9
R1
1K
R2
220n/100V
C3
33K2
R3
590K
R4
15K
R5
47n/100V
C4
100K
R6
53R6
R7
1K
R8
47n/100V
C5
FOD2741ASDV
4
18
5
7
36
2
U2
47R
R9
100R
R10
1u/10V
C7
18R
R11 LL4148
D4
1n/50V
C6
0R33
R12
3.3u
C9
1n/50V
C10
47n/100V
C11
1u/10V
C12
100n/100V
C15
100n/100V
C16
33R
R17
100n/100V
C20
RED
CR1
10u/10V
C27
10u/10V
C28
10u/10V
C29
1K
R21
1K
R16
10K
R14
0R
R24
56V
D11
D12
3
21
100n/100V
C30
1n/100V
C32
1K
R27
1u/10V
C33
D14
1u/10V
C34
2u2/100V
C36
2u2/100V
C37
2u2/100V
C38
3K3
R28
1K8
R29
4K7
R30
220P/50V
C39
330u/35V
C40
+
4p_R/A_TSM
4
3
2
1
P1
6p_R/A_TSM
6
5
4
3
2
1
P2
4,7uH
L5
4,7uH
L6 SS26
D15
FDC2512
56
21
4
3
U3
T1
C1586-ALD
1
2
3
74
8
9
10
NOT POP
Dual 100V
NC
NC
NC
12V/200mW
60V/2A
68
4/8 Digi Connect ME modules and Digi Connect ME 9210 modules
A
B
C
DD
C
1234
4321
A
B
5
5
TP14
1
TEST POINT
+3. 3V
CR25
3.3V LE D
R13
2
1
220
GND
VR1
26
8
71
4
5
LM3485
R10
2
1
15k
R9
2
1
100mohms
R7
2
1
45.3k
U7
1
2
6
5
3
4
FDC5614P
R8
1
2
47
L1
1
2
21000122
22uH
C31
1
2
270pF
GND
+3. 3V
R11
2
1
24.9k
+3. 3V _ S W
L2
1
2
D8
2
1
C28
1
2
100uF
C23
100uF
2
1
C26
1uF
1
2
C29
0.1uF
1
2
C30
2
1
1uF
P13
4
3
2
1
18000335
P14
6
5
4
3
2
1
18000336
D9
21
TP15
TEST POINT
1
TP13
TEST POINT
1
CR24
3.3V LE D
R12
220
1
2
GND
P15
3
2
1
JACK 3P LOCKING
18000302
2
1
D10
R19
2
1
100mohms
GND
3000XXX1-XX
SCHEMATIC
1
30006001-04 R evA
PCB1
3000XXX2-XX
PCB
1
30006002-04 R evA
PCB2
AS E E MBLY S HT 1 & 2
3000XXX 4-XX
AS S E MBLY
1
30006004-04 R evA
12
3
SW5
SW_SLIDE_SPDT
Vout = 3.29V
Vripp = 26.5mV
69
Sample Application:
TTL Signals to EIA-232
APPENDIX D
The following schematic is an example of how to convert the modules’s TTL signals to
EIA-232.
70
71
Change Log
APPENDIX E
The following changes have been made since the last revision of this document.
Note: As of September 2007, the document num ber cha nged from 90000631 to
90000897.
Revision K
Added additional sig nal d escript ion informatio n to the Module Connector Pin Assignment
table in Chapter 2.
Updated the Digi Connect ME and Wi-ME PCB layout image in Appendix A.
Updated the Power and Device Interface Connector image and table in Chapter 1.
Updated the Embedd ed Module Connector Pin Orientation image in Ch apter 2.
Updated the Power and Device Interface Connector Pin Assignment table in Chapter 2.
Updated the Development Board LED Description table in Chapter 2.
Updated the Module Pinout key and table in Chapter 3.
Added Connect Wi-ME and Wi-ME 9210 hard re set information to Chapter 3.
Added the “Tap Dimensions” figure to Appendix A.
Revision J
Updated the recommended PCB layout image.
Changed all mention s of “JTag” to “JTAG.”
Corrected the VIL Max value within the Inputs tabl e of the DC Characteri stics sect ion in
Appendix A.
Improved the quality of the PoE Power Supply schematic in Appendix C.
Added Digi Connect ME 9 210 De claratio n of Conformity information to Appendix B.
72
Added revised front view and sid e view i mages of the Digi Connect ME and Digi Connec t
Wi-ME modules to Appendix A.
Revision I
This revision letter i s not used in order to avoid confusion wi th other letters/numbers which
it resemb les.
Revision H
Corrected book mark s for pdf file.
Correct pin numb eri ng on the JTAG Debugger Connector Pin Orientation image.
Added missing Digi Conn ect M E part numbers.
Added section describing the JTAG Jumper and new accompanying i mage.
Made several correction s and clarifications to the guide per a red lined prin t copy from BIll
Kumpf.
Revision G
Added CAN Bus informati on.
Revision F
Added Digi Connect ME sketch t o Thermal Specificat ions.
Added antenna configu rations.
Revision E
Changed schematics in appendix A to reflect corre ct measurements.
73
Revision D
Added a new section labeled “Thermal Specifications” to the book. This section outl ines
the temperature rang es at whi ch the devices specified can still function prope rly.
Revision C
Updates to schematics in Chap ter 2.
Added/revised Module Pin-out table in Chapter 3.
Updated GPIO tables thro ug hout book.
Revision B
Fixed page numbers to make them correspond in PDF form.
Added components t o Devel opmen t Bo ard schematics. (#19 and 20)
Revision 90000631_G>90000897_A
Added Digi Connect ME 9210 related information.
Updated schematics in d evelopment board chapter to reflect 9210 chan ges.
Revision G
Updated the Connectors: power and device i nterface sec tion to sa y that pins 1 and 2 on the
connector are available if using Digi Connect ME, not available if using Di gi Connect W i-
ME. Updated the Embed ded Mo dul e Connector table in Chapter 2 similarly.
Added tolerance informatio n for d ime nsion drawing s
Updated Hard Reset section to c larify forcing the unit into hard reset
Updated the ambient (operati ng) te mperature for Digi Connect Wi-ME
Added information reg ardin g read ing the bar code
Added P12 Factory reset pin
74
Revision F
Updated Antenna drawing
Added product we ights
Updated UL labeling description
Updated dimension drawings
Revision E
Added Japan certifi catio n
Improve dipole antenna drawing
Corrected imperial pitch measurement
Reformatted tables for easier reading
Added antenna extension cord informat ion
Added more receive sensitivity information
Added Caution for soldering process
Added reset hold times
Added VCC *absolute max* rati ngs
Combined PCB layou ts wi th improvements
