LMC6082
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LMC6082 Precision CMOS Dual Operational Amplifier
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1FEATURES DESCRIPTION
The LMC6082 is a precision dual low offset voltage
2• (Typical Unless Otherwise Stated) operational amplifier, capable of single supply
• Low Offset Voltage: 150 μVoperation. Performance characteristics include ultra
• Operates from 4.5V to 15V Single Supply low input bias current, high voltage gain, rail-to-rail
output swing, and an input common mode voltage
• Ultra Low Input Bias Current: 10 fA range that includes ground. These features, plus its
• Output Swing to Within 20 mV of Supply Rail, low offset voltage, make the LMC6082 ideally suited
100k Load for precision circuit applications.
• Input Common-Mode Range Includes V−Other applications using the LMC6082 include
• High Voltage Gain: 130 dB precision full-wave rectifiers, integrators, references,
• Improved Latchup Immunity and sample-and-hold circuits.
This device is built with TI's advanced Double-Poly
APPLICATIONS Silicon-Gate CMOS process.
• Instrumentation Amplifier For designs with more critical power demands, see
• Photodiode and Infrared Detector Preamplifier the LMC6062 precision dual micropower operational
amplifier.
• Transducer Amplifiers
• Medical Instrumentation PATENT PENDING
• D/A Converter
• Charge Amplifier for Piezoelectric Transducers
Connection Diagram
Figure 1. 8-Pin PDIP/SOIC Figure 2. Input Bias Current vs Temperature
Top View
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMC6082
SNOS630D –AUGUST 2000–REVISED MARCH 2013
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Absolute Maximum Ratings (1)(2)
Differential Input Voltage ±Supply Voltage
Voltage at Input/Output Pin (V+) +0.3V,
(V−)−0.3V
Supply Voltage (V+−V−) 16V
Output Short Circuit to V+See (3)
Output Short Circuit to V−See (4)
Lead Temperature (Soldering, 10 Sec.) 260°C
Storage Temp. Range −65°C to +150°C
Junction Temperature 150°C
ESD Tolerance (5) 2 kV
Current at Input Pin ±10 mA
Current at Output Pin ±30 mA
Current at Power Supply Pin 40 mA
Power Dissipation See (6)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Do not connect output to V+, when V+is greater than 13V or reliability will be adversely affected.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely
affect reliability.
(5) Human body model, 1.5 kΩin series with 100 pF.
(6) The maximum power dissipation is a function of TJ(Max),θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(Max) −TA) /θJA.
Operating Ratings (1)
Temperature Range LMC6082AM −55°C ≤TJ≤+125°C
LMC6082AI, LMC6082I −40°C ≤TJ≤+85°C
Supply Voltage 4.5V ≤V+≤15.5V
Thermal Resistance (θJA)(2) 8-Pin PDIP 115°C/W
8-Pin SOIC 193°C/W
Power Dissipation See (3)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
(2) All numbers apply for packages soldered directly into a PC board.
(3) For operating at elevated temperatures the device must be derated based on the thermal resistance θJA with PD= (TJ−TA)/θJA. All
numbers apply for packages soldered directly into a PC board.
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DC Electrical Characteristics
Unless otherwise specified, all limits specified for TJ= 25°C. Boldface limits apply at the temperature extremes. V+= 5V, V−=
0V, VCM = 1.5V, VO= 2.5V and RL> 1M unless otherwise specified. LMC6082AM LMC6082AI LMC6082I
Symbol Parameter Conditions Typ(1) Units
Limit(2) Limit(2) Limit(2)
VOS Input Offset Voltage 150 350 350 800 μV
1000 800 1300 Max
TCVOS Input Offset Voltage 1.0 μV/°C
Average Drift
IBInput Bias Current 0.010 pA
100 4 4 Max
IOS Input Offset Current 0.005 pA
100 2 2 Max
RIN Input Resistance >10 Tera Ω
CMRR Common Mode Rejection 0V ≤VCM ≤12.0V 85 75 75 66 dB
Ratio V+= 15V 72 72 63 Min
+PSRR Positive Power Supply 5V ≤V+≤15V 85 75 75 66 dB
Rejection Ratio VO= 2.5V 72 72 63 Min
−PSRR Negative Power Supply 0V ≤V−≤ −10V 94 84 84 74 dB
Rejection Ratio 81 81 71 Min
VCM Input Common-Mode V+= 5V and 15V −0.4 −0.1 −0.1 −0.1 V
Voltage Range for CMRR ≥60 dB 0 0 0 Max
V+−1.9 V+−2.3 V+−2.3 V+−2.3 V
V+−2.6 V+−2.5 V+−2.5 Min
AVLarge Signal Voltage Gain RL= 2 kΩ(3) Sourcing 1400 400 400 300 V/mV
300 300 200 Min
Sinking 350 180 180 90 V/mV
70 100 60 Min
RL= 600Ω(3) Sourcing 1200 400 400 200 V/mV
150 150 80 Min
Sinking 150 100 100 70 V/mV
35 50 35 Min
(1) Typical values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
(3) V+= 15V, VCM = 7.5V and RLconnected to 7.5V. For Sourcing tests, 7.5V ≤VO≤11.5V. For Sinking tests, 2.5V ≤VO≤7.5V.
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DC Electrical Characteristics (continued)
Unless otherwise specified, all limits specified for TJ= 25°C. Boldface limits apply at the temperature extremes. V+= 5V, V−=
0V, VCM = 1.5V, VO= 2.5V and RL> 1M unless otherwise specified. LMC6082AM LMC6082AI LMC6082I
Symbol Parameter Conditions Typ(1) Units
Limit(2) Limit(2) Limit(2)
VOOutput Swing V+= 5V 4.87 4.80 4.80 4.75 V
RL= 2 kΩto 2.5V 4.70 4.73 4.67 Min
0.10 0.13 0.13 0.20 V
0.19 0.17 0.24 Max
V+= 5V 4.61 4.50 4.50 4.40 V
RL= 600Ωto 2.5V 4.24 4.31 4.21 Min
0.30 0.40 0.40 0.50 V
0.63 0.50 0.63 Max
V+= 15V 14.63 14.50 14.50 14.37 V
RL= 2 kΩto 7.5V 14.30 14.34 14.25 Min
0.26 0.35 0.35 0.44 V
0.48 0.45 0.56 Max
V+= 15V 13.90 13.35 13.35 12.92 V
RL= 600Ωto 7.5V 12.80 12.86 12.44 Min
0.79 1.16 1.16 1.33 V
1.42 1.32 1.58 Max
IOOutput Current Sourcing, VO= 0V 22 16 16 13 mA
V+= 5V 8 10 8 Min
Sinking, VO= 5V 21 16 16 13 mA
11 13 10 Min
IOOutput Current Sourcing, VO= 0V 30 28 28 23 mA
V+= 15V 18 22 18 Min
Sinking, VO= 13V(4) 34 28 28 23 mA
19 22 18 Min
ISSupply Current Both Amplifiers 0.9 1.5 1.5 1.5 mA
V+= +5V, VO= 1.5V 1.8 1.8 1.8 Max
Both Amplifiers 1.1 1.7 1.7 1.7 mA
V+= +15V, VO= 7.5V 2 2 2 Max
(4) Do not connect output to V+, when V+is greater than 13V or reliability will be adversely affected.
AC Electrical Characteristics
Unless otherwise specified, all limits specified for TJ= 25°C, Boldface limits apply at the temperature extremes. V+= 5V, V−=
0V, VCM = 1.5V, VO= 2.5V and RL> 1M unless otherwise specified. LMC6082AM LMC6082AI LMC6082I
Symbol Parameter Conditions Typ(1) Units
Limit(2) Limit(2) Limit(2)
SR Slew Rate See (3) 1.5 0.8 0.8 0.8 V/μs
0.5 0.6 0.6 Min
GBW Gain-Bandwidth Product 1.3 MHz
φmPhase Margin 50 Deg
Amp-to-Amp Isolation See (4) 140 dB
enInput-Referred Voltage F = 1 kHz 22 nV/√Hz
Noise
(1) Typical values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
(3) V+= 15V. Connected as Voltage Follower with 10V step input. Number specified is the slower of the positive and negative slew rates.
(4) Input referred V+= 15V and RL= 100 kΩconnected to 7.5V. Each amp excited in turm with 1 kHz to produce VO= 12 VPP.
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AC Electrical Characteristics (continued)
Unless otherwise specified, all limits specified for TJ= 25°C, Boldface limits apply at the temperature extremes. V+= 5V, V−=
0V, VCM = 1.5V, VO= 2.5V and RL> 1M unless otherwise specified. LMC6082AM LMC6082AI LMC6082I
Symbol Parameter Conditions Typ(1) Units
Limit(2) Limit(2) Limit(2)
inInput-Referred Current F = 1 kHz 0.0002 pA/√Hz
Noise
T.H.D. Total Harmonic Distortion F = 10 kHz, AV=−10
RL= 2 kΩ, VO= 8 VPP 0.01 %
±5V Supply
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Typical Performance Characteristics
VS= ±7.5V, TA= 25°C, Unless otherwise specified
Distribution of LMC6082 Distribution of LMC6082
Input Offset Voltage Input Offset Voltage
(TA= +25°C) (TA=−55°C)
Figure 3. Figure 4.
Distribution of LMC6082
Input Offset Voltage Input Bias Current
(TA= +125°C) vs Temperature
Figure 5. Figure 6.
Supply Current Input Voltage
vs Supply Voltage vs Output Voltage
Figure 7. Figure 8.
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Typical Performance Characteristics (continued)
VS= ±7.5V, TA= 25°C, Unless otherwise specified Power Supply Rejection
Common Mode Ratio
Rejection Ratio vs
vs Frequency Frequency
Figure 9. Figure 10.
Input Voltage Noise Output Characteristics
vs Frequency Sourcing Current
Figure 11. Figure 12.
Gain and Phase Response
Output Characteristics vs Temperature
Sinking Current (−55°C to +125°C)
Figure 13. Figure 14.
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Typical Performance Characteristics (continued)
VS= ±7.5V, TA= 25°C, Unless otherwise specified
Gain and Phase Gain and Phase
Response Response
vs vs
Capacitive Load Capacitive Load
with RL= 600Ωwith RL= 500 kΩ
Figure 15. Figure 16.
Open Loop Inverting Small Signal
Frequency Response Pulse Response
Figure 17. Figure 18.
Inverting Large Signal Non-Inverting Small
Pulse Response Signal Pulse Response
Figure 19. Figure 20.
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Typical Performance Characteristics (continued)
VS= ±7.5V, TA= 25°C, Unless otherwise specified
Non-Inverting Large Crosstalk Rejection
Signal Pulse Response vs Frequency
Figure 21. Figure 22.
Stability Stability
vs vs
Capacitive Capacitive
Load, RL= 600ΩLoad RL= 1 MΩ
Figure 23. Figure 24.
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APPLICATIONS HINTS
AMPLIFIER TOPOLOGY
The LMC6082 incorporates a novel op-amp design topology that enables it to maintain rail to rail output swing
even when driving a large load. Instead of relying on a push-pull unity gain output buffer stage, the output stage
is taken directly from the internal integrator, which provides both low output impedance and large gain. Special
feed-forward compensation design techniques are incorporated to maintain stability over a wider range of
operating conditions than traditional micropower op-amps. These features make the LMC6082 both easier to
design with, and provide higher speed than products typically found in this ultra-low power class.
COMPENSATING FOR INPUT CAPACITANCE
It is quite common to use large values of feedback resistance for amplifiers with ultra-low input current, like the
LMC6082.
Although the LMC6082 is highly stable over a wide range of operating conditions, certain precautions must be
met to achieve the desired pulse response when a large feedback resistor is used. Large feedback resistors and
even small values of input capacitance, due to transducers, photodiodes, and circuit board parasitics, reduce
phase margins.
When high input impedances are demanded, guarding of the LMC6082 is suggested. Guarding input lines will
not only reduce leakage, but lowers stray input capacitance as well. (See Printed-Circuit-Board Layout for High
Impedance Work)
The effect of input capacitance can be compensated for by adding a capacitor, Cf, around the feedback resistors
(as in Figure 25 ) such that:
(1)
or R1CIN ≤R2Cf(2)
Since it is often difficult to know the exact value of CIN, Cfcan be experimentally adjusted so that the desired
pulse response is achieved. Refer to the LMC660 and LMC662 for a more detailed discussion on compensating
for input capacitance.
Figure 25. Cancelling the Effect of Input Capacitance
CAPACITIVE LOAD TOLERANCE
All rail-to-rail output swing operational amplifiers have voltage gain in the output stage. A compensation capacitor
is normally included in this integrator stage. The frequency location of the dominant pole is affected by the
resistive load on the amplifier. Capacitive load driving capability can be optimized by using an appropriate
resistive load in parallel with the capacitive load (see typical curves).
Direct capacitive loading will reduce the phase margin of many op-amps. A pole in the feedback loop is created
by the combination of the op-amp's output impedance and the capacitive load. This pole induces phase lag at the
unity-gain crossover frequency of the amplifier resulting in either an oscillatory or underdamped pulse response.
With a few external components, op amps can easily indirectly drive capacitive loads, as shown in Figure 26.
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Figure 26. LMC6082 Noninverting Gain of 10 Amplifier, Compensated to Handle Capacitive Loads
In the circuit of Figure 26, R1 and C1 serve to counteract the loss of phase margin by feeding the high frequency
component of the output signal back to the amplifier's inverting input, thereby preserving phase margin in the
overall feedback loop.
Capacitive load driving capability is enhanced by using a pull up resistor to V+Figure 27. Typically a pull up
resistor conducting 500 μA or more will significantly improve capacitive load responses. The value of the pull up
resistor must be determined based on the current sinking capability of the amplifier with respect to the desired
output swing. Open loop gain of the amplifier can also be affected by the pull up resistor (see Electrical
Characteristics).
Figure 27. Compensating for Large Capacitive Loads with a Pull Up Resistor
PRINTED-CIRCUIT-BOARD LAYOUT FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate with less than 1000 pA of leakage current requires
special layout of the PC board. When one wishes to take advantage of the ultra-low bias current of the
LMC6082, typically less than 10 fA, it is essential to have an excellent layout. Fortunately, the techniques of
obtaining low leakages are quite simple. First, the user must not ignore the surface leakage of the PC board,
even though it may sometimes appear acceptably low, because under conditions of high humidity or dust or
contamination, the surface leakage will be appreciable.
To minimize the effect of any surface leakage, lay out a ring of foil completely surrounding the LMC6082's inputs
and the terminals of capacitors, diodes, conductors, resistors, relay terminals, etc. connected to the op-amp's
inputs, as in Figure 28. To have a significant effect, guard rings should be placed on both the top and bottom of
the PC board. This PC foil must then be connected to a voltage which is at the same voltage as the amplifier
inputs, since no leakage current can flow between two points at the same potential. For example, a PC board
trace-to-pad resistance of 1012Ω, which is normally considered a very large resistance, could leak 5 pA if the
trace were a 5V bus adjacent to the pad of the input. This would cause a 100 times degradation from the
LMC6082's actual performance. However, if a guard ring is held within 5 mV of the inputs, then even a
resistance of 1011Ωwould cause only 0.05 pA of leakage current. See Figure 29 for typical connections of guard
rings for standard op-amp configurations.
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Figure 28. Example of Guard Ring in P.C. Board Layout
Inverting Amplifier
Non-Inverting Amplifier
Follower
Figure 29. Typical Connections of Guard Rings
The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few
circuits, there is another technique which is even better than a guard ring on a PC board: Don't insert the
amplifier's input pin into the board at all, but bend it up in the air and use only air as an insulator. Air is an
excellent insulator. In this case you may have to forego some of the advantages of PC board construction, but
the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring. See Figure 30.
Latchup
CMOS devices tend to be susceptible to latchup due to their internal parasitic SCR effects. The (I/O) input and
output pins look similar to the gate of the SCR. There is a minimum current required to trigger the SCR gate
lead. The LMC6062 and LMC6082 are designed to withstand 100 mA surge current on the I/O pins. Some
resistive method should be used to isolate any capacitance from supplying excess current to the I/O pins. In
addition, like an SCR, there is a minimum holding current for any latchup mode. Limiting current to the supply
pins will also inhibit latchup susceptibility.
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(Input pins are lifted out of PC board and soldered directly to components. All other pins connected to PC board).
Figure 30. Air Wiring
Typical Single-Supply Applications
(V+= 5.0 VDC)
The extremely high input impedance, and low power consumption, of the LMC6082 make it ideal for applications
that require battery-powered instrumentation amplifiers. Examples of these types of applications are hand-held
pH probes, analytic medical instruments, magnetic field detectors, gas detectors, and silicon based pressure
transducers.
Figure 31 shows an instrumentation amplifier that features high differential and common mode input resistance
(>1014Ω), 0.01% gain accuracy at AV= 1000, excellent CMRR with 1 kΩimbalance in bridge source resistance.
Input current is less than 100 fA and offset drift is less than 2.5 μV/°C. R2provides a simple means of adjusting
gain over a wide range without degrading CMRR. R7is an initial trim used to maximize CMRR without using
super precision matched resistors. For good CMRR over temperature, low drift resistors should be used.
If R1= R5, R3= R6, and R4= R7; then
∴AV≈100 for circuit shown (R2= 9.822k).
Figure 31. Instrumentation Amplifier
Figure 32. Low-Leakage Sample and Hold
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REVISION HISTORY
Changes from Revision C (March 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 14
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMC6082AIM NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 85 LMC60
82AIM
LMC6082AIM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LMC60
82AIM
LMC6082AIMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LMC60
82AIM
LMC6082AIN/NOPB ACTIVE PDIP P 8 40 RoHS & Green Call TI | SN Level-1-NA-UNLIM -40 to 85 LMC6082
AIN
LMC6082IM NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 85 LMC60
82IM
LMC6082IM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LMC60
82IM
LMC6082IMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LMC60
82IM
LMC6082IN/NOPB ACTIVE PDIP P 8 40 RoHS & Green Call TI | SN Level-1-NA-UNLIM -40 to 85 LMC6082
IN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMC6082AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC6082IMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Sep-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMC6082AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMC6082IMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Sep-2018
Pack Materials-Page 2
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PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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