For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
General Description
The MAX11359A smart data-acquisition systems (DAS) is
based on a 16-bit, sigma-delta analog-to-digital converter
(ADC) and system-support functionality for a micro-
processor (µP)-based system. The device integrates an
ADC, DAC, operational amplifiers, internal selectable-
voltage reference, temperature sensors, analog switch-
es, a 32kHz oscillator, a real-time clock (RTC) with
alarm, a high-frequency-locked loop (FLL) clock, four
user-programmable I/Os, an interrupt generator, and
1.8V and 2.7V voltage monitors in a single chip.
The MAX11359A has dual 10:1 differential input multiplex-
ers (muxes) that accept signal levels from 0 to AVDD. An
on-chip 1x to 8x programmable-gain amplifier (PGA)
allows measuring low-level signals and reduces external
circuitry required.
The MAX11358B operates from a single +1.8V to +3.6V
supply and consumes only 1.4mA in normal mode and
only 6.1µA in sleep mode. The MAX11385B has one
DACs with two uncommitted op amp.
The serial interface is compatible with either SPI/QSPI™
or MICROWIRE®, and is used to power up, configure,
and check the status of all functional blocks.
The MAX11359A is available in a space-saving, 40-pin
TQFN package and is specified over the commercial
(0°C to +70°C) and the extended (-40°C to +85°C) tem-
perature ranges.
Applications
Battery-Powered and Portable Devices
Electrochemical and Optical Sensors
Medical Instruments
Industrial Control
Data-Acquisition Systems
Features
o+1.8V to +3.6V Single-Supply Operation
oMultichannel 16-Bit Sigma-Delta ADC
10sps to 512sps Programmable Conversion Rate
Self and System Offset and Gain Calibration
PGA with Gains of 1, 2, 4, or 8
Unipolar and Bipolar Modes
10-Input Differential Multiplexer
o10-Bit Force-Sense DACs
oUncommitted Op Amps
oDual SPDT Analog Switches
oSelectable References
1.25V, 1.996V and 2.422V
oInternal Charge Pump
oSystem Support
Real-Time Clock and Alarm Register
Internal/External Temperature Sensor
Internal Oscillator with Clock Output
User-Programmable I/O and Interrupt Generator
VDD Monitors
oSPI/QSPI/MICROWIRE, 4-Wire Serial Interface
oSpace-Saving (6mm x 6mm x 0.75mm), 40-Pin TQFN
Package
19-4594; Rev 1; 1/12
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National Semiconductor Corp.
40
39
38
37
36
35
34
33
32
31
21 22 23 24 25 26 27 28 29 30
CPOUT
IN1+
IN1-
OUT2
IN2+
SWA
FBA
OUTA
AGND
IN2-
AIN2
TOP VIEW
AIN1
REF
REG
AVDD
CF-
CF+
DVDD
DGND
UPIO1
*CONNECT EP TO AGND OR LEAVE UNCONNECTED.
11
*EP
12
13
14
15
16
17
18
19
20
10 9 8 7 6 5 4 3 2 1
CLK
UPIO2
UPIO3
UPIO4
DOUT
SCLK
DIN
INT
CLK32K
32KOUT
32KIN
SNO1
SCM1
SNC1
OUT1
SNC2
SCM2
SNO2
MAX11359A
CS
RESET
TQFN
+
Pin Configuration
Ordering Information
PART TEMP RANGE PIN-PACKAGE
MAX11359AETL+ -40°C to +85°C 40 TQFN-EP**
MAX11359ACTL+* 0°C to +70°C 40 TQFN-EP**
+
Denotes a lead(Pb)-free/RoHS–compliant package.
*
Future product—contact factory for availability.
**
EP = Exposed pad.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
2Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VAVDD = VDVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10µF, CCPOUT =
10µF, 10µF between CF+ and CF-, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND ........................................................-0.3V to +4V
DVDD to DGND ........................................................-0.3V to +4V
AVDD to DVDD ...........................................................-4V to +4V
AGND to DGND.....................................................-0.3V to +0.3V
CLK32K to DGND ..................................-0.3V to (VDVDD + 0.3V)
UPIO_ to DGND........................................................-0.3V to +4V
Digital Inputs to DGND ............................................-0.3V to +4V
Analog Inputs to AGND..........................-0.3V to (VAVDD + 0.3V)
Digital Output to DGND… ......................-0.3V to (VDVDD + 0.3V)
Analog Outputs to AGND .......................-0.3V to (VAVDD + 0.3V)
Continuous Current Into Any Pin.........................................50mA
Continuous Power Dissipation (TA= +70°C)
40-Pin TQFN (derate 25.6mW/°C above +70°C) ....2051.3mW
Operating Temperature Range
MAX11358_ _CTL+.............................................0°C to +70°C
MAX11358_ _ETL+ ..........................................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ADC DC ACCURACY
Noise-Free Resolution
Data rate = 10sps, PGA gain = 2;
data rate = 10sps to 60sps, PGA gain = 1;
no missing codes, Table 1 (Note 2)
16 Bits
Conversion Rate No missing codes, Table 1 10 512 sps
Output Noise No missing codes Table 1 µVRMS
Integral Nonlinearity INL Unipolar mode, VAVDD = 3V, PGA gain = 1,
TA = +25°C, data rate = 50sps ±0.004 %FSR
Uncalibrated ±1.0
Unipolar Offset Error or Bipolar
Zero Error (Note 3) PGA gain = 1, calibrated,
TA = +25°C, data rate = 50sps ±0.003 %FSR
Bipolar ±2.0Unipolar Offset-Error or Bipolar
Zero-Error Temperature Drift
(Note 4) Unipolar ±10 µV/°C
Uncalibrated ±0.6
Gain Error (Notes 3, 5) PGA = 1, calibrated, data rate = 50sps ±0.003 %FSR
Gain-Error Temperature
Coefficient (Notes 4, 6) ±1.0 ppm/ °C
DC Positive Power-Supply
Rejection Ratio PSRR PGA gain = 1, unipolar mode, measured by
full-scale error with VAVDD = 1.8V to 3.6V 73 dB
ADC ANALOG INPUTS (AIN1, AIN2)
DC Input Common-Mode
Rejection Ratio CMRR PGA gain = 1, unipolar mode 85 dB
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
3
Maxim Integrated
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD = VDVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10µF, CCPOUT =
10µF, 10µF between CF+ and CF-, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Normal-Mode 60Hz Rejection
Ratio
PGA gain = 1, unipolar mode, data rate =
50sps (Note 2) 100 dB
Normal-Mode 50Hz Rejection
Ratio
Data rate = 10sps or 50sps, PGA gain = 1,
unipolar mode (Note 2) 100 dB
Absolute Input Range Inter nal tem p er atur e sensor d i sab l ed
( Fi g ur e 26) VAGND VAVDD V
Unipolar mode -0.05/
Gain
VREF/
Gain
Differential Input Range
Bipolar mode -VREF/
Gain
VREF/
Gain
V
ADC not in measurement mode, mux
enabled, TA ≤ +55°C, inputs = +0.1V to
(VAVDD - 0.1V)
±1
DC Input Current (Note 7)
TA = +85°C±5
nA
Input Sampling Capacitance CIN 5pF
Input Sampling Rate fSAMPLE 21.84 kHz
E xter nal S our ce Im ped ance at Inp ut (Table 3) Table 3 kΩ
FORCE-SENSE DAC (RL = 10kΩ and CL = 200pF, FBA = OUTA, unless otherwise noted)
Resolution Guaranteed monotonic 10 Bits
Differential Nonlinearity DNL Code 3Dhex to 3FF hex ±1 LSB
Integral Nonlinearity INL Code 3Dhex to 3FF hex ±4 LSB
Offset Error Reference to code 52 hex ±20 mV
Offset-Error Tempco ±4.4 µV/°C
Gain Error Excludes offset and voltage reference error ±5 LSB
Gain-Error Tempco Excludes offset and reference drift ±1 ppm/°C
Input Leakage Current at SWA/B SWA switches open (Notes 7, 8) ±1nA
TA = -40°C to +85°C±1nA
TA = 0°C to +70°C±600Input Leakage Current at FBA/B
VFBA = +0.3V to
(VAVDD - 0.3V)
(Note 7) TA = 0°C to +50°C±400 pA
DAC Output Buffer Leakage
Current DAC buffer disabled (Note 7) ±75 nA
Input Common-Mode Voltage At FBA 0 VAVDD
- 0.35 V
Line Regulation VAVDD = +1.8V to +3.6V, TA = +25°C 40 175 µV/V
Load Regulation IOUT = ±2mA, CL = 1000pF (Note 2) 0.5 µV/µA
Output Voltage Range VAGND VAVDD V
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
4Maxim Integrated
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD = VDVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10µF, CCPOUT =
10µF, 10µF between CF+ and CF-, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Output Slew Rate 52 hex to 3FF hex code swing rising or
falling, RL = 10kΩ, CL = 100pF 40 V/ms
Output-Voltage Settling Time 10% to 90% rising or falling to ±0.5 LSB 65 µs
f = 0.1Hz to
10Hz 80
Input Voltage Noise Referred to FBA,
excludes reference noise f = 10Hz to
10kHz 200
µVP-P
OUTA shorted to AGND 20
Output Short-Circuit Current OUTA shorted to AVDD 15 mA
Input-Output SWA/SWB
Switch Resistance Between SWA and OUTA, HFCK enabled 150 Ω
SWA/SWB Switch Turn-On/Off
Time HFCK enabled 100 ns
Power-On Time Excluding reference 18 µs
EXTERNAL REFERENCE (REF)
Input Voltage Range VAGND VAVDD V
Input Resistance DAC on, internal REF and ADC off 2.5 MΩ
DC Input Leakage Current Internal REF, DAC, and ADC off (Note 7) 100 nA
INTERNAL VOLTAGE REFERENCE (CREF = 4.7µF)
VAVDD ≥ +1.8V, TA = +25°C 1.238 1.251 1.264
VAVDD ≥ +2.2V, TA = +25°C 1.976 1.996 2.016
Reference Output Voltage VREF
VAVDD ≥ +2.7V, TA = +25°C 2.349 2.422 2.495
V
VREF = 1.251V 15 50
Output-Voltage Temperature
Coefficient (Note 7) TC VREF = 1.996V, 2.422V 65 ppm/oC
REF shorted to AGND 18 mA
Output Short-Circuit Current IRSC REF shorted to AVDD 90 µA
Line Regulation TA = +25°C 100 µV/V
ISOURCE = 0
to 500µA 1.2
Load Regulation TA = +25°C, VREF = 1.25V ISINK = 0 to
50µA 1.7
µV/µA
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
5
Maxim Integrated
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD = VDVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10µF, CCPOUT =
10µF, 10µF between CF+ and CF-, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Long-Term Stability (Note 9) 35 ppm/
1000hrs
f = 0.1Hz to 10Hz, VAVDD = 3V 50
Output Noise Voltage f = 10Hz to 10kHz, VAVDD = 3V 400 µVP-P
Turn-On Settling Time Buffer only, settle to 0.1% of final value 100 µs
TEMPERATURE SENSOR
Temperature Measurement
Resolution ADC resolution is 16-bit, 10sps 0.11 °C/LSB
TA = 0°C to +50°C±0.5
Internal Temperature-Sensor
Measurement Error
Internal voltage
reference, four-
current calibration,
and stored
calibration
coefficients
TA = -40oC to +85°C±1
°C
TA = +25°C±0.50
TA = 0°C to +50°C±0.5
External Temperature-Sensor
Measurement Error (Note 10) TA = -40°C to +85°C±1.0
°C
Temperature Measurement Noise 0.18 °CRMS
Temperature Measurement
Power-Supply Rejection Ratio 0.2 °C/V
OP AMP (RL = 10kΩ connected to VAVDD/2)
Input Offset Voltage VOS VCM = 0.5V ±15 mV
Offset-Error Tempco 3 µV/oC
TA = -40°C to +85°C 0.006 ±1nA
TA = 0°C to +70°C4±300IN1+, IN2+, IN3+
TA = 0°C to +50°C2±200 pA
TA = -40°C to +85°C 0.025 ±1nA
TA = 0°C to +70°C20±600
Input Bias Current (Note 7) IBIAS
IN1-, IN2-, IN3-
TA = 0°C to +50°C±400 pA
Input Offset Current IOS V
IN 1 _, V
IN 2 _ = + 0.3V to ( VAVDD - 0.3V ) ( N ote ±1nA
Input Common-Mode Voltage
Range CMVR 0 VAVDD
- 0.35 V
0 ≤ VC M
≤ 75mV 60
Common-Mode Rejection Ratio CMRR 75mV < VC M
≤ VAVDD - 0.35V, TA = +25°C 60 75 dB
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
6Maxim Integrated
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD = VDVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10µF, CCPOUT =
10µF, 10µF between CF+ and CF-, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Power-Supply Rejection Ratio PSRR VAVDD = +1.8V to +3.6V, TA = +25°C 76.5 100 dB
Large-Signal Voltage Gain AVOL 100mV ≤ VOUT_ ≤ VAVDD - 100mV (Note 11) 90 116 dB
ISOURCE = 10µA 0.005
ISOURCE = 50µA 0.025
ISOURCE = 100µA 0.05
ISOURCE = 500µA 0.25
Sourcing
ISOURCE = 2m A 0.5
ISINK = 10µA 0.005
ISINK = 50µA 0.025
ISINK = 100µA 0.05
ISINK = 500µA 0.25
Maximum Current Drive ∆VOUT
Sinking
ISINK = 2m A 0.5
V
Gain Bandwidth Product GBW Unity-gain configuration, CL = 1nF 80 kHz
Phase Margin Unity-gain configuration, CL = 1nF (Note 11) 60 Degrees
Output Slew Rate SR CL = 200pF 0.04 V/µs
f = 0.1Hz to 10Hz 80
Input Voltage Noise Unity-gain
configuration f = 10Hz to 10kHz 200 µVP-P
VOUT_ shorted to AGND 20
Output Short-Circuit Current VOUT_ shorted to AVDD 15 mA
Power-On Time 15 µs
SPDT SWITCHES (SNO_, SNC_, SCM_, HFCK enabled)
VSCM_ = 0V TA = 0°C to +50°C 45
VSCM_ = 0.5V TA = 0°C to +50°C 50
On-Resistance RON VSCM_ = 0.5V to
VAVDD 150
Ω
TA = -40°C to +85°C±1nA
TA = 0°C to +70°C±600
SNO_, SNC_ Off-Leakage
Current
ISNO_
(
OFF
)
ISNC_
(
OFF
)
V
S N O_
, V
S N C _
= + 0.5V ,
+ 1.5V ; V
S C M _ = + 1.5V ,
+ 0.5V ( N ote 7) TA = 0°C to +50°C±400 pA
TA = -40°C to +85°C±2
TA = 0°C to +70°C±1.2SCM_ Off-Leakage Current ISCM_
(
OFF
)
V
S N O_
, V
S N C _
= + 0.5V ,
+ 1.5V ; V
S C M _ = + 1.5V ,
+ 0.5V ( N ote 7) TA = 0°C to +50°C±0.8
nA
TA = -40°C to +85°C±2
TA = 0°C to +70°C±1.2SCM_ On-Leakage Current ISCM_
(
ON
)
V
S N O_
, V
S N C _
= + 0.5V ,
+ 1.5V , or unconnected ;
V
S C M _ = + 1.5V , + 0.5V
( N ote 7) TA = 0°C to +50°C±0.8
nA
Input Voltage Range VAGND VAVDD V
Turn-On/Off Time tON/tOFF Break-before-make 100 ns
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
7
Maxim Integrated
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD = VDVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10µF, CCPOUT =
10µF, 10µF between CF+ and CF-, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Capacitance SNO_, SNC_, or SCM_ = AVDD or AGND;
switch connected to enabled mux input 5pF
CHARGE PUMP (10µF at REG and 10µF external capacitor between CF+ and CF-)
Maximum Output Current IOUT 10 mA
No load 3.2 3.3 3.6
Output Voltage IOUT = 10mA 3.0 V
Output Voltage Ripple
10µF external capacitor between CPOUT
and DGND, IOUT = 10mA, excluding ESR of
external capacitor
50 mV
Load Regulation IOUT = 10mA, excluding ESR of external
capacitor 15 20 mV/mA
REG Input Voltage Range Internal linear regulator disabled 1.6 1.8 V
REG Input Current Linear regulator off, charge pump off 3 nA
CPOUT Input Voltage Range Charge pump disabled 1.8 3.6 V
CPOUT Input Leakage Current Charge pump disabled 2 nA
SIGNAL-DETECT COMPARATOR
TSEL[2:0] = 0 hex 0
TSEL[2:0] = 4 hex 50
TSEL[2:0] = 5 hex 100
TSEL[2:0] = 6 hex 150
Differential Input-Detection
Threshold Voltage
TSEL[2:0] = 7 hex 200
mV
Differential Input-Detection
Threshold Error ±10 mV
Common-Mode Input Voltage
Range VAGND VAVDD V
Turn-On Time 50 µs
VOLTAGE MONITORS
DVDD Monitor Supply Voltage
Range For valid reset 1.0 3.6 V
Trip Threshold (VDVDD Falling) 1.80 1.85 1.90 V
DVDD Monitor Timeout Reset
Period 1.5 s
HYSE bit set to logic 1 200
DVDD Monitor Hysteresis HYSE bit set to logic 0 35 mV
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
8Maxim Integrated
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD = VDVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10µF, CCPOUT =
10µF, 10µF between CF+ and CF-, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DVDD Monitor Turn-On Time 5ms
CPOUT Monitor Supply Voltage
Range 1.0 3.6 V
CPOUT Monitor Trip Threshold 2.7 2.8 2.9 V
CPOUT Monitor Hysteresis 35 mV
CPOUT Monitor Turn-On Time 5ms
Internal Power-On Reset Voltage 1.7 V
32kHz Oscillator (32KIN, 32KOUT)
Clock Frequency VDVDD = 2.7V 32.768 kHz
Stability VDVDD = 1.8V to 3.6V, excluding crystal 25 ppm
Oscillator Startup Time 1500 ms
Crystal Load Capacitance 6pF
LOW-FREQUENCY CLOCK INPUT/OUTPUT (CLK32K)
Output Clock Frequency 32.768 kHz
Absolute Input to Output Clock
Jitter Cycle to cycle 5 ns
Input to Output Rise/Fall Time 10% to 90%, 30pF load 5 ns
Input Duty Cycle 40 60 %
Output Duty Cycle 43 %
HIGH-FREQUENCY CLOCK OUTPUT (CLK)
fOUT = fFLL 4.8660 4.9152 4.9644
fOUT = fFLL/2, power-up default 2.4330 2.4576 2.4822
fOUT = fFLL/4 1.2165 1.2288 1.2411
MHz
FLL Output Clock Frequency
fOUT = fFLL/8 608.25 614.4 620.54 kHz
Cycle to cycle, FLL off 0.15
Absolute Clock Jitter Cycle to cycle, FLL on 1 ns
Rise and Fall Time tR/tF10% to 90%, 30pF load 10 ns
fOUT = 4.9152MHz 40 60
Duty Cycle fOUT = 2.4576MHz, 1.2288MHz, 614.4kHz 45 55 %
Uncalibrated CLK Frequency
Error FLL calibration not performed ±35 %
DIGITAL INPUTS (SCLK, DIN, CS, UPIO_, CLK32K)
Input High Voltage VIH 0.7 x
VDVDD V
Input Low Voltage VIL 0.3 x
VDVDD V
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
9
Maxim Integrated
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD = VDVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10µF, CCPOUT =
10µF, 10µF between CF+ and CF-, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DVDD supply voltage 0.7 x
VDVDD
UPIO_ Input High Voltage
CPOUT supply voltage 0.7 x
VCPOUT
V
DVDD supply voltage 0.3 x
VDVDD
UPIO_ Input Low Voltage
CPOUT supply voltage 0.3 x
VCPOUT
V
Input Hysteresis VHYS VDVDD = 3.0V 200 mV
Input Current IIN VIN = VDGND or DVDD (Note 7) ±0.01 ±100 nA
Input Capacitance VIN = VDGND or DVDD 10 pF
VIN = DVDD or VCPOUT, pullup enabled ±0.01 1
UPIO_ Input Current VIN = DVDD or VCPOUT or 0V,
pullup disabled 1µA
UPIO_ Pullup Current
VIN = 0, pullup enabled, unconnected UPIO
inputs are pulled up to DVDD or CPOUT
with pullup enabled
0.5 2 5 µA
DIGITAL OUTPUTS (DOUT, RESET, UPIO_, CLK32K, INT, CLK)
Output Low Voltage VOL ISINK = 1mA 0.4 V
Output High Voltage VOH ISOURCE = 500µA 0.8 x
VDVDD V
DOUT Three-State Leakage
Current IL±0.01 ±1µA
DOUT Three-State Output
Capacitance COUT 15 pF
RESET Output Low Voltage VOL ISINK = 1mA 0.4 V
RESET Output Leakage Current Open-drain output, RESET deasserted 0.1 µA
ISINK = 1mA, UPIO_ referenced to DVDD 0.4
UPIO_ Output Low Voltage VOL
ISINK = 4mA, UPIO_ referenced to CPOUT 0.4
V
ISOURCE = 500µA, UPIO_ referenced to
DVDD
0.8 x
VDVDD
UPIO_ Output High Voltage VOH ISOURCE = 4mA, UPIO_ referenced to
CPOUT
V
C P OU T
- 0.4
V
POWER REQUIREMENT
Analog Supply Voltage Range AVDD 1.8 3.6 V
Digital Supply Voltage Range DVDD 1.8 3.6 V
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
10 Maxim Integrated
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD = VDVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10µF, CCPOUT =
10µF, 10µF between CF+ and CF-, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
VAVDD = VDVDD =
3.6V 1.36 2.0
IMAX
E ver ythi ng on,
char g e p um p
unl oad ed , no d i g i tal
p i ns, si nki ng /sour ci ng
cur r ent, e.g ., RS T ,
U P IO, and C LK32K,
m ax i nter nal tem p -
sensor cur r ent, cl ock
outp ut b uffer s
unl oad ed , AD C at
512sp s
VAVDD = VDVDD =
3.3V 1.15 1.7
Total Supply Current
INORMAL
All on except charge pump and temp
sensor, ADC at 512sps, CLK output buffer
enabled, clock output buffers unloaded
1.17 1.3
mA
VAVDD = VDVDD =
3.0V 6.5
TA = -45°C to +85°C
VAVDD = VDVDD = 9
VAVDD = VDVDD =
3.0V 4.42
Sleep-Mode Supply Current ISLEEP
TA = +25°C VAVDD = VDVDD =
3.6V 5.56
µA
TA = -40°C to +85°C 4
Shutdown Supply Current ISHDN All off TA = +25°C 1.6 µA
Note 1: Devices are production tested at TA= +25°C and TA= +85°C. Specifications to TA= -40°C are guaranteed by design.
Note 2: Guaranteed by design or characterization.
Note 3: The offset and gain errors are corrected by self-calibration or system calibration. For accurate calibrations, perform cali-
bration at the lowest rate. The calibration error is therefore in the order of peak-to-peak noise for the selected rate.
Note 4: Eliminate drift errors by recalibration at the new temperature.
Note 5: The gain error excludes reference error, offset error (unipolar), and zero error (bipolar).
Note 6: Gain-error drift does not include unipolar offset drift or bipolar zero-error drift. It is effectively the drift of the part if zero-
scale error is removed.
Note 7: These specifications are obtained from characterization during design or from initial product evaluation. Not production
tested or guaranteed.
Note 8: VOUTA = +0.5V or +1.5V, VSWA = +1.5V or +0.5V, TA = 0°C to +50°C.
Note 9: Long-term stability is characterized using five to six parts. The bandgaps are turned on for 1000hrs at room temperature
with the parts running continuously. Daily measurements are taken and any obvious outlying data points are discarded.
Note 10: All of the stated temperature accuracies assume that 1) the external diode characteristic is precisely known (i.e., ideal)
and 2) the ADC reference voltage is exactly equal to 1.25V. Any variations to this known reference characteristic and volt-
age caused by temperature, loading, or power supply results in errors in the temperature measurement. The actual tem-
perature calculation is performed externally by the microcontroller (µC).
Note 11: Values based on simulation results and are not production tested or guaranteed.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
11
Maxim Integrated
OUTPUT NOISE (µVRMS)
RATE (sps) GAIN = 1 GAIN = 2 GAIN = 4 GAIN = 8
10 1.684 1.684 1.684 1.684
40 3.178 3.178 3.178 3.178
50 3.234 3.234 3.234 3.234
60 3.307 3.307 3.307 3.307
200 55.336 55.336 55.336 55.336
240 104.596 104.596 104.596 104.596
400 587.138 587.138 587.138 587.138
512 983.979 983.979 983.979 983.979
Table 1. Output Noise (Notes 12, 13, and 14)
Note 12: VREF = ±1.25V, bipolar mode, VIN = 1.24912V, PGA gain = 1, TA= +85°C.
Note 13: CIN = 5pF, op-amp noise is considered to be the same as the switching noise. The increase in the op amp’s noise contri-
bution is due to a large input swing (0 to 3.6V).
Note 14: Assume ±3 sigma peak-to-peak variation; noise-free resolution means no code flicker at given bits’ LSB.
PEAK-TO-PEAK RESOLUTION (Bits)
RATE (sps) GAIN = 1 GAIN = 2 GAIN = 4 GAIN = 8
10 17.49 17.49 17.49 17.49
40 16.57 16.57 16.57 16.57
50 16.55 16.55 16.55 16.55
60 16.51 16.51 16.51 16.51
200 12.45 12.45 12.45 12.45
240 11.53 11.53 11.53 11.53
400 9.04 9.04 9.04 9.04
512 8.30 8.30 8.30 8.30
Table 2. Peak-to-Peak Resolution
EXTERNAL CAPACITANCE (pF)
PARAMETER 0 (Note 15) 50 100 500 1000 5000
Resistance (kΩ) 350 60 30 10 4 1
Table 3. Maximum External Source Impedance Without 16-Bit Gain Error
Note 15: 2pF parasitic capacitance is assumed, which represents pad and any other parasitic capacitance.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
12 Maxim Integrated
TIMING CHARACTERISTICS (Figures 1 and 20)
(VAVDD = VAVDD = +1.8V to +3.6V, external VREF = +1.25V, CLK32K = 32.768kHz (external clock), CREG = 10µF, CCPOUT = 10µF,
10µF between CF+ and CF-, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SCLK Operating Frequency fSCLK 0 10 MHz
SCLK Cycle Time tCYC 100 ns
SCLK Pulse-Width High tCH 40 ns
SCLK Pulse-Width Low tCL 40 ns
DIN to SCLK Setup tDS 30 ns
DIN to SCLK Hold tDH 0ns
SCLK Fall to DOUT Valid tDO CL = 50pF, Figure 2 40 ns
CS Fall to Output Enable tDV CL = 50pF, Figure 2 48 ns
CS Rise to DOUT Disable tTR CL = 50pF, Figure 2 48 ns
CS to SCLK Rise Setup tCSS 20 ns
CS to SCLK Rise Hold tCSH 0ns
DVDD Monitor Timeout Period tDSLP (Note 16) 1.5 s
Wake-Up (WU) Pulse Width tWU Minimum pulse width required to detect a
wake-up event 1µs
Shutdown Delay tDPU The delay for SHDN to go high after a valid
wake-up event 1µs
The turn-on time for the high-frequency
clock and FLL (FLLE = 1) (Note 17) 10 ms
HFCK Turn-On Time tDFON If FLLE = 0, the turn-on time for the high-
frequency clock (Note 18) 10 µs
CRDY to INT Delay tDFI
The delay for CRDY to go low after the
HFCK clock output has been enabled
(Note 19)
7.82 ms
HFCK Disable Delay tDFOF
The delay after a shutdown command has
asserted and before HFCK is disabled
(Note 20)
1.95 ms
SHDN Assertion Delay tDPD (Note 21) 2.93 ms
Note 16: The delay for the sleep voltage monitor output, RESET, to go high after VDD rises above the reset threshold. This is largely
driven by the startup of the 32kHz oscillator.
Note 17: It is gated by an AND function with three inputs—the external RESET signal, the internal DVDD monitor output, and the
external SHDN signal. The time delay is timed from the internal LOVDD going high or the external RESET going high,
whichever happens later. HFCK always starts in the low state.
Note 18: If FLLE = 0, the internal signal CRDY is not generated by the FLL block and INT or INT are deasserted.
Note 19: CRDY is used as an interrupt signal to inform the µC that the high-frequency clock has started. Only valid if FLLE = 1.
Note 20: tDFOF gives the µC time to clean up and go into sleep-override mode properly.
Note 21: tDPD is greater than the HFCK delay for the MAX11358B/MAX11359A to clean up before losing power.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
13
Maxim Integrated
tDS
tCSS
tDH
tDV tDO tTR
CS
SCLK
DIN
DOUT
tCSH tCYC tCH
tCL
tCSH
Figure 1. Detailed Serial-Interface Timing
DVDD
CLOAD = 50pF
6kΩ
DOUT
a) FOR ENABLE, HIGH IMPEDANCE
TO VOH AND VOL TO VOH
FOR DISABLE, VOH TO HIGH IMPEDANCE
b) FOR ENABLE, HIGH IMPEDANCE
TO VOL AND VOH TO VOL
FOR DISABLE, VOL TO HIGH IMPEDANCE
DOUT
6kΩ
CLOAD = 50pF
Figure 2. DOUT Enable and Disable Time Load Circuits
Typical Operating Characteristics
(VDVDD = VAVDD = 1.8V, VREF = +1.25V, CCPOUT = 10µF, TA= +25°C, unless otherwise noted.)
200
300
500
400
600
700
1.8 2.42.1 2.7 3.0 3.3 3.6
DVDD SUPPLY CURRENT
vs. DVDD SUPPLY VOLTAGE
MAX11359A toc01
VDVDD (V)
SUPPLY CURRENT (µA)
NORMAL MODE
CLK BUFFER DISABLED
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1.8 2.42.1 2.7 3.0 3.3 3.6
MAX11359A toc02
VDVDD (V)
SUPPLY CURRENT (µA)
DVDD SUPPLY CURRENT
vs. DVDD SUPPLY VOLTAGE
SLEEP MODE, CLK BUFFER DISABLED
32kHz OSC, RTC, DVDD MONITOR ENABLED
0
0.2
0.6
0.4
0.8
1.0
1.8 2.42.1 2.7 3.0 3.3 3.6
MAX11359A toc03
VDVDD (V)
SUPPLY CURRENT (µA)
DVDD SUPPLY CURRENT
vs. DVDD SUPPLY VOLTAGE
SLEEP MODE,
ALL FUNCTIONS DISABLED
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
14 Maxim Integrated
Typical Operating Characteristics (continued)
(VDVDD = VAVDD = 1.8V, VREF = +1.25V, CCPOUT = 10µF, TA= +25°C, unless otherwise noted.)
DVDD SUPPLY CURRENT
vs. TEMPERATURE
MAX11359A toc04
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
603510-15
300
400
500
600
700
200
-40 85
VDVDD = 3.0V
NORMAL MODE
CLK BUFFER DISABLED
VDVDD = 1.8V
0
1.0
0.5
2.0
1.5
2.5
3.0
-40 10-15 35 60 85
MAX11359A toc05
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
DVDD SUPPLY CURRENT
vs. TEMPERATURE
SLEEP MODE, CLK BUFFER DISABLED
32kHz OSC, RTC, DVDD MONITOR ENABLED
VDVDD = 3.0V
VDVDD = 1.8V
DVDD SUPPLY CURRENT
vs. TEMPERATURE
MAX11359A toc06
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
603510-15
0.2
0.4
0.6
0.8
1.0
0
-40 85
VDVDD = 3.0V
SLEEP MODE, ALL
FUNCTIONS DISABLED
VDVDD = 1.8V
250
275
300
325
350
375
400
425
450
1.8 2.42.1 2.7 3.0 3.3 3.6
MAX11359A toc07
VAVDD (V)
SUPPLY CURRENT (µA)
AVDD SUPPLY CURRENT
vs. AVDD SUPPLY VOLTAGE
NORMAL MODE
1.5
2.0
3.0
2.5
3.5
4.0
1.8 2.42.1 2.7 3.0 3.3 3.6
AVDD SUPPLY CURRENT
vs. AVDD SUPPLY VOLTAGE
MAX11359A toc08
VAVDD (V)
SUPPLY CURRENT (µA)
SLEEP MODE,
32kHz OSC, RTC, DVDD MONITOR ENABLED
1.0
1.2
1.6
1.4
1.8
2.0
1.8 2.42.1 2.7 3.0 3.3 3.6
AVDD SUPPLY CURRENT
vs. AVDD SUPPLY VOLTAGE
MAX11359A toc09
VAVDD (V)
SUPPLY CURRENT (µA)
SLEEP MODE,
ALL FUNCTIONS DISABLED
200
225
250
275
300
325
350
375
400
-40 -15 10 35 60 85
MAX11359A toc10
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
NORMAL MODE
AVDD SUPPLY CURRENT
vs. TEMPERATURE
VAVDD = 3.0V
VAVDD = 1.8V
1.0
2.0
1.5
3.0
2.5
3.5
4.0
-40 10-15 35 60 85
MAX11359A toc11
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
AVDD SUPPLY CURRENT
vs. TEMPERATURE
VAVDD = 3.0V
VAVDD = 1.8V
SLEEP MODE,
32kHz OSC, RTC, DVDD MONITOR ENABLED
AVDD SUPPLY CURRENT
vs. TEMPERATURE
MAX11359A toc12
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
603510-15
1.2
1.4
1.6
1.8
2.0
1.0
-40 85
VAVDD = 3.0V
SLEEP MODE, ALL
FUNCTIONS DISABLED
VAVDD = 1.8V
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
15
Maxim Integrated
Typical Operating Characteristics (continued)
(VDVDD = VAVDD = 1.8V, VREF = +1.25V, CCPOUT = 10µF, TA= +25°C, unless otherwise noted.)
2.1
2.3
2.2
2.5
2.4
2.7
2.6
2.8
-40 10-15 35 60 85
INTERNAL OSCILLATOR FREQUENCY
vs. TEMPERATURE
MAX11359A toc13
TEMPERATURE (°C)
INTERNAL OSCILLATOR FREQUENCY (MHz)
C
A: FLL DISABLED; VAVDD, VDVDD = 1.8V
B: FLL ENABLED
C: FLL DISABLED; VAVDD, VAVDD = 3.0V
B
A
CLK = 2.4576MHz
2.20
2.25
2.30
2.35
2.40
2.45
2.50
2.55
2.60
1.8 2.42.1 2.7 3.0 3.3 3.6
INTERNAL OSCILLATOR FREQUENCY
vs. SUPPLY VOLTAGE
MAX11359A toc14
VAVDD, VDVDD(V)
INTERNAL OSCILLATOR FREQUENCY (MHz)
FLL ENABLED
CLK = 2.4576MHz
FLL DISABLED
3.0
2.5
2.0
1.5
1.0
1.8 2.72.1 2.4 3.0 3.3 3.6
REFERENCE OUTPUT VOLTAGE
vs. SUPPLY VOLTAGE
MAX11359A toc15
VAVDD (V)
REFERENCE OUTPUT VOLTAGE (V)
C
B
A
A: VREF = 1.25V
B: VREF = 2.048V
C: VREF = 2.5V
1.2510
1.2505
1.2500
1.2495
1.2490
-50 25050 150 350 450
REFERENCE OUTPUT VOLTAGE
vs. OUTPUT CURRENT
MAX11359A toc16
OUTPUT CURRENT (µA)
VREF (V)
VAVDD = 1.8V
VREF = 1.25V
2.0472
2.0476
2.0474
2.0480
2.0478
2.0484
2.0482
2.0486
REFERENCE OUTPUT VOLTAGE
vs. OUTPUT CURRENT
MAX11359A toc17
VREF (V)
VAVDD = 2.5V
VREF = 2.048V
-50 25050 150 350 450
OUTPUT CURRENT (µA)
2.5030
2.5036
2.5034
2.5032
2.5038
2.5040
2.5042
2.5044
2.5046
2.5048
2.5050
MAX11359A toc18
VREF (V)
-50 25050 150 350 450
OUTPUT CURRENT (µA)
VAVDD = 3.0V
VREF = 2.5V
REFERENCE OUTPUT VOLTAGE
vs. OUTPUT CURRENT
0.9970
0.9975
0.9980
0.9985
0.9990
0.9995
1.0000
1.0005
1.0010
-40 -15 10 35 60 85
NORMALIZED REFERENCE OUTPUT
VOLTAGE vs. TEMPERATURE
MAX11359A toc19
TEMPERATURE (°C)
NORMALIZED REFERENCE VOLTAGE (V)
VREF = 1.25V
0.9970
0.9975
0.9980
0.9985
0.9990
0.9995
1.0000
1.0005
1.0010
-40 -15 10 35 60 85
NORMALIZED REFERENCE OUTPUT
VOLTAGE vs. TEMPERATURE
MAX11359A toc20
TEMPERATURE (°C)
NORMALIZED REFERENCE VOLTAGE (V)
VREF = 2.048V
0.9970
0.9975
0.9980
0.9985
0.9990
0.9995
1.0000
1.0005
1.0010
-40 -15 10 35 60 85
NORMALIZED REFERENCE OUTPUT
VOLTAGE vs. TEMPERATURE
MAX11359A toc21
TEMPERATURE (°C)
NORMALIZED REFERENCE VOLTAGE (V)
VREF = 2.5V
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
16 Maxim Integrated
Typical Operating Characteristics (continued)
(VDVDD = VAVDD = 1.8V, VREF = +1.25V, CCPOUT = 10µF, TA= +25°C, unless otherwise noted.)
1s/div
REFERENCE VOLTAGE OUTPUT NOISE
(0.1Hz TO 10Hz)
50µV/div
MAX11359A toc22
VREF = +1.25V
VAVDD = +1.8V
REFERENCE VOLTAGE OUTPUT
NOISE vs. FREQUENCY
MAX11359A toc23
FREQUENCY (Hz)
1k10010
1000
110k
10,000
100
VREF = 1.25V
NOISE (nV/√Hz)
REFERENCE VOLTAGE OUTPUT
NOISE vs. FREQUENCY
MAX11359A toc24
FREQUENCY (Hz)
1k10010
1000
110k
10,000
100
VREF = 2.048V
NOISE (nV/√Hz)
REFERENCE VOLTAGE OUTPUT
NOISE vs. FREQUENCY
MAX11359A toc25
FREQUENCY (Hz)
1k10010
1000
110k
10,000
100
VREF = 2.5V
NOISE (nV/√Hz)
-12
-8
-10
-4
-6
0
-2
2
-40 10-15 35 60 85
ADC MUX INPUT DC CURRENT
vs. TEMPERATURE
MAX11359A toc26
TEMPERATURE (°C)
INPUT CURRENT (µA)
VAVDD = 1.8V
VAIN = 0.5V
-0.25
-0.15
0.05
-0.05
0.15
0.25
0 400200 600 800 1000
DAC INL vs. OUTPUT CODE
MAX11359A toc27
OUTPUT CODE
INL (LSB)
VAVDD = 1.8V
VREF = 1.25V
-0.25
-0.15
0.05
-0.05
0.15
0.25
0 400200 600 800 1000
DAC INL vs. OUTPUT CODE
MAX11359A toc28
OUTPUT CODE
INL (LSB)
VAVDD = 2.5V
VREF = 2.048V
-0.25
-0.15
0.05
-0.05
0.15
0.25
0 400200 600 800 1000
DAC INL vs. OUTPUT CODE
MAX11359A toc29
OUTPUT CODE
INL (LSB)
VAVDD = 3.0V
VREF = 2.5V
-0.20
-0.15
-0.10
-0.05
0
0.05
0.10
0.15
0.20
0 400200 600 800 1000
DAC DNL vs. OUTPUT CODE
MAX11359A toc30
OUTPUT CODE
DNL (LSB)
VAVDD = 1.8V
VREF = 1.25V
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
17
Maxim Integrated
Typical Operating Characteristics (continued)
(VDVDD = VAVDD = 1.8V, VREF = +1.25V, CCPOUT = 10µF, TA= +25°C, unless otherwise noted.)
-0.20
-0.15
-0.10
-0.05
0
0.05
0.10
0.15
0.20
0 400200 600 800 1000
DAC DNL vs. OUTPUT CODE
MAX11359A toc31
OUTPUT CODE
DNL (LSB)
VAVDD = 2.5V
VREF = 2.048V
-0.20
-0.15
-0.10
-0.05
0
0.05
0.10
0.15
0.20
0 400200 600 800 1000
DAC DNL vs. OUTPUT CODE
MAX11359A toc32
OUTPUT CODE
DNL (LSB)
VAVDD = 3.0V
VREF = 2.5V
1.240
1.242
1.244
1.246
1.248
0 0.50 1.00 1.500.25 0.75 1.25 1.75 2.00
DAC OUTPUT VOLTAGE
vs. OUTPUT SOURCE CURRENT
MAX11359A toc33
SOURCE CURRENT (mA)
DAC OUTPUT VOLTAGE (V)
CODE = 3FF hex
VAVDD = 1.8V, 3.0V
0
0.05
0.10
0.15
0.20
0.25
0.30
DAC OUTPUT VOLTAGE
vs. OUTPUT SINK CURRENT
MAX11359A toc34
DAC OUTPUT VOLTAGE (V)
0 0.50 1.00 1.500.25 0.75 1.25 1.75 2.00
SOURCE CURRENT (mA)
CODE = 020 hex
VAVDD = 1.8V
VAVDD = 3.0V
650
640
630
610
600
1.8 2.72.1 2.4 3.0 3.3 3.6
DAC OUTPUT VOLTAGE
vs. ANALOG SUPPLY VOLTAGE
MAX11359A toc35
VDVDD (V)
DAC OUTPUT VOLTAGE (mV)
CODE = 200 hex
620
620
622
626
624
628
630
-40 10-15 35 60 85
DAC OUTPUT VOLTAGE
vs. TEMPERATURE
MAX11359A toc36
TEMPERATURE (°C)
DAC OUTPUT VOLTAGE (mV)
VAVDD = 3.0V
VAVDD = 1.8V
VREF = 1.25V
CODE = 200 hex
-5
-3
-4
-1
-2
1
0
2
-40 10-15 35 60 85
DAC FBA/B INPUT BIAS CURRENT
vs. TEMPERATURE
MAX11359A toc37
TEMPERATURE (°C)
INPUT BIAS CURRENT (µA)
VAVDD = 1.8V
VAIN = 0.5V
1s/div
DAC OUTPUT NOISE
(0.1Hz TO 10Hz)
50µV/div
MAX11359A toc38
VAVDD = +1.8V
VREF = +1.25V
DAC CODE = 3FF hex
DAC OUTPUT
NOISE vs. FREQUENCY
MAX11359A toc39
FREQUENCY (Hz)
1k10010
1000
110k
10,000
100
DAC CODE = 3FF hex
VREF = 2.5V
NOISE (nV/√Hz)
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
18 Maxim Integrated
Typical Operating Characteristics (continued)
(VDVDD = VAVDD = 1.8V, VREF = +1.25V, CCPOUT = 10µF, TA= +25°C, unless otherwise noted.)
40µs/div
DAC LARGE-SIGNAL OUTPUT
STEP RESPONSE
MAX11359A toc40
VREF = +1.25V
VAVDD = +3.0V
CS
2V/div
OUT_
1V/div
OP-AMP INPUT OFFSET VOLTAGE
vs. TEMPERATURE
MAX11359A toc41
TEMPERATURE (°C)
INPUT OFFSET VOLTAGE (mV)
603510-15
6.3
6.6
6.9
7.2
7.5
6.0
-40 85
VAVDD = 1.8V
VCM = 0.5V
VAVDD = 3.0V
0
4
2
8
6
10
12
-40 10-15 35 60 85
MAX11359A toc42
TEMPERATURE (°C)
INPUT BIAS CURRENT (pA)
OP-AMP INPUT BIAS CURRENT
vs. TEMPERATURE
VAVDD = 1.8V
VCM = 0.5V
-2
0
2
4
6
8
10
12
14
-40 -15 10 35 60 85
MAX11359A toc43
TEMPERATURE (°C)
INPUT BIAS CURRENT (pA)
OP-AMP INPUT BIAS CURRENT
vs. TEMPERATURE
VAVDD = 3.0V
VCM = 0.5V
0
50
150
100
200
250
0 0.50 0.750.25 1.00 1.25 1.50 1.75 2.00
OP-AMP OUTPUT VOLTAGE
vs. OUTPUT SINK CURRENT
MAX11359A toc44
SINK CURRENT (mA)
OUTPUT VOLTAGE (mV)
UNITY GAIN, VIN_+ = 0V
VAVDD = 1.8V
VAVDD = 3.0V
2.80
2.84
2.92
2.88
2.96
3.00
0 0.50 0.750.25 1.00 1.25 1.50 1.75 2.00
OP-AMP OUTPUT VOLTAGE
vs. OUTPUT SOURCE CURRENT
MAX11359A toc45
SOURCE CURRENT (mA)
OUTPUT VOLTAGE (V)
VAVDD = 3.0V
UNITY GAIN, VIN_+ = VAVDD
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
19
Maxim Integrated
Typical Operating Characteristics (continued)
(VDVDD = VAVDD = 1.8V, VREF = +1.25V, CCPOUT = 10µF, TA= +25°C, unless otherwise noted.)
1.60
1.65
1.70
1.75
1.80
OP-AMP OUTPUT VOLTAGE
vs. OUTPUT SOURCE CURRENT
MAX11359A toc46
OUTPUT VOLTAGE (V)
UNITY GAIN, VIN_+ = VAVDD
VAVDD = 1.8V
0 0.50 0.750.25 1.00 1.25 1.50 1.75 2.00
SOURCE CURRENT (mA)
OP-AMP OUTPUT VOLTAGE
vs. TEMPERATURE
MAX11359A toc47
TEMPERATURE (°C)
OUTPUT VOLTAGE (mV)
603510-15
500.2
500.4
500.6
500.8
501.0
500.0
-40 85
VAVDD = 1.8V
VAVDD = 3.0V
UNITY GAIN, VIN_+ = 0.5V
RL = 10kΩ
1.8 2.72.1 2.4 3.0 3.3 3.6
OP-AMP OUTPUT VOLTAGE
vs. AVDD SUPPLY VOLTAGE
MAX11359A toc48
VAVDD (V)
OUTPUT VOLTAGE (mV)
500.2
500.4
500.6
500.8
501.0
500.0
UNITY GAIN, VIN_+ = 0.5V
RL = 10kΩ
MAX11359A toc49
FREQUENCY (Hz)
1k10010
1000
110k
10,000
100
NOISE (nV/√Hz)
OP-AMP OUTPUT NOISE
vs. FREQUENCY
UNITY GAIN, VIN_+ = 0.5V
25
35
55
45
65
75
0 1.00.5 1.5 2.0 2.5 3.0
SPDT ON-RESISTANCE
vs. VCOM VOLTAGE
MAX11359A toc50
VCOM (V)
RON (Ω)
VAVDD = 3.0V
VAVDD = 1.8V
50
70
110
90
130
150
01.00.5 1.5 2.0 2.5 3.0
SPST ON-RESISTANCE
vs. VCOM VOLTAGE
MAX11359A toc51
VCOM (V)
RON (Ω)
VAVDD = 3.0V
VAVDD = 1.8V
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
20 Maxim Integrated
Typical Operating Characteristics (continued)
(VDVDD = VAVDD = 1.8V, VREF = +1.25V, CCPOUT = 10µF, TA= +25°C, unless otherwise noted.)
SPDT ON-RESISTANCE
vs. TEMPERATURE
MAX11359A toc52
TEMPERATURE (°C)
RON (Ω)
603510-15
33
36
39
42
45
30
-40 85
VAVDD = 3.0V
ICOM = 1mA
VAVDD = 1.8V
82
88
85
94
91
97
100
-40 10-15 35 60 85
MAX11359A toc53
TEMPERATURE (°C)
RON (Ω)
SPST ON-RESISTANCE
vs. TEMPERATURE
VAVDD = 1.8V, 3.0V
ICOM = 1mA
SPDT/SPST ON-/OFF-LEAKAGE
CURRENT vs. TEMPERATURE
MAX11359A toc54
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)
603510-15
1
10
100
0.1
-40 85
ON-LEAKAGE
OFF-LEAKAGE
VAVDD = 1.8V
VCM = 0V
15
25
20
35
30
40
45
1.8 2.4 2.72.1 3.0 3.3 3.6
SPDT/SPST SWITCHING TIME
vs. AVDD SUPPLY VOLTAGE
MAX11359A toc55
VAVDD (V)
SWITCHING TIMES (ns)
tON
tOFF
SPDT/SPST SWITCHING TIME
vs. TEMPERATURE
MAX11359A toc56
TEMPERATURE (°C)
SWITCHING TIMES (ns)
603510-15
34
38
42
46
50
30
-40 85
VAVDD = 1.8V
tON
tOFF
SPDT/SPST SWITCHING TIME
vs. TEMPERATURE
MAX11359A toc57
TEMPERATURE (°C)
SWITCHING TIMES (ns)
603510-15
19
23
27
31
35
15
-40 85
VAVDD = 3.0V
tON
tOFF
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
21
Maxim Integrated
Typical Operating Characteristics (continued)
(VDVDD = VAVDD = 1.8V, VREF = +1.25V, CCPOUT = 10µF, TA= +25°C, unless otherwise noted.)
-0.20
-0.10
-0.15
0
-0.05
0.05
0.10
-40 10-15 35 60 85
MAX11359A toc58
TEMPERATURE (°C)
% DEVIATION
VOLTAGE SUPERVISOR THRESHOLD
vs. TEMPERATURE
DVDD SUPERVISOR
CPOUT SUPERVISOR
3.0
3.2
3.1
3.4
3.3
3.5
3.6
0426810
CHARGE-PUMP OUTPUT VOLTAGE
vs. OUTPUT CURRENT
MAX11359A toc59
OUTPUT CURRENT (mA)
CPOUT VOLTAGE (V)
VDVDD = 1.8V
3.10
3.14
3.22
3.18
3.26
3.30
-40 10-15 35 60 85
CHARGE-PUMP OUTPUT VOLTAGE
vs. TEMPERATURE
MAX11359A toc60
TEMPERATURE (°C)
CPOUT VOLTAGE (V)
VDVDD = 3.0V
VDVDD = 1.8V
IOUT = 10mA
0
20
60
40
80
100
084121620
CHARGE-PUMP OUTPUT RESISTANCE
vs. CAPACITANCE
MAX11359A toc61
CF (µF)
OUTPUT RESISTANCE (Ω)
VDVDD = 1.8V
IOUT = 10mA
0
10
30
20
40
50
0426810
CHARGE-PUMP OUTPUT VOLTAGE
RIPPLE vs. OUTPUT CURRENT
MAX11359A toc62
OUTPUT CURRENT (mA)
OUTPUT VOLTAGE RIPPLE (mV)
VDVDD = 1.8V
20µs/div
CHARGE-PUMP OUTPUT
VOLTAGE RIPPLE
MAX11359A toc63
VDVDD = +1.8V
ILOAD = 10mA
CPOUT
20mV/div
AC-COUPLED
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
22 Maxim Integrated
PIN NAME FUNCTION
1 CLK Clock Output. Default is 2.457MHz output clock for µC.
2 UPIO2 User-Programmable Input/Output 2. See the UPIO2_CTRL Register section for functionality.
3 UPIO3 User-Programmable Input/Output 3. See the UPIO3_CTRL Register section for functionality.
4 UPIO4 User-Programmable Input/Output 4. See the UPIO4_CTRL Register section for functionality.
5DOUT
Serial-Data Output. Data is clocked out on SCLK’s falling edge. High impedance when CS is high. When
UPIO/SPI passthrough mode is enabled, DOUT mirrors the state of UPIO1.
6 SCLK Serial-Clock Input. Clocks data in and out of the serial interface.
7 DIN Serial-Data Input. Data is clocked in on SCLK’s rising edge.
8CS
Active-Low Chip-Select Input. Data is not clocked into DIN unless CS is low. When CS is high, DOUT is
high impedance. High impedance when CS is high. When UPIO/SPI passthrough mode is enabled, DOUT
mirrors the state of UPIO1.
9 INT Programmable Active-High/Low Interrupt Output. ADC, UPIO wake-up, alarm, and voltage-monitor events.
10 CLK32K
32kHz Clock Input/Output. Outputs 32kHz clock for µC. Can be programmed as an input by enabling the
IO32E bit to accept an external 32kHz input clock. The RTC, PWM, and watchdog timer always use the
internal 32kHz clock derived from the 32kHz crystal.
11 RESET
Active-Low Open-Drain Reset Output. Remains low while DVDD is below the 1.8V voltage threshold, and
stays low for a timeout period (tDSLP) after DVDD rises above the 1.8V threshold. RESET also pulses low
when the watchdog timer times out and holds low during POR until the 32kHz oscillator stabilizes.
12 32KOUT 32kHz Crystal Output. Connect external 32kHz watch crystal between 32KIN and 32KOUT.
13 32KIN 32kHz Crystal Input. Connect external 32kHz watch crystal between 32KIN and 32KOUT or drive with
CMOS level as shown in Figure 25.
14 SNO1 Analog Switch 1 Normally Open Terminal. Analog input to mux.
15 SCM1 Analog Switch 1 Common Terminal. Analog input to mux.
16 SNC1 Analog Switch 1 Normally Closed Terminal. Analog input to mux (open on POR).
17 SNO2 Analog Switch 2 Normally Open Terminal. Analog input to mux.
18 SCM2 Analog Switch 2 Common Terminal. Analog input to mux (open on POR).
19 SNC2 Analog Switch 2 Normally Closed Terminal. Analog input to mux.
20 OUT1 Amplifier 1 Output. Analog input to mux.
21 IN1- Amplifier 1 Inverting Input. Analog input to mux.
22 IN1+ Amplifier 1 Noninverting Input
23 SWA DACA SPST Shunt Switch Input. Connects to OUTA through a SPST switch.
24 FBA DACA Force-Sense Feedback Input. Analog input to mux.
Pin Description
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
23
Maxim Integrated
PIN NAME FUNCTION
25 OUTA DACA Force-Sense Output. Analog input to mux.
26 AGND Analog Ground
27 AVDD Analog Supply Voltage. Also ADC reference voltage during AVDD measurement. Bypass to AGND with
10µF and 0.1µF capacitors in parallel as close to the pin as possible.
28 IN2+ Amplifier 2 Noninverting Input
29 IN2- Amplifier 2 Inverting Input. Analog input to mux.
30 OUT2 Amplifier 2 Output. Analog input to mux.
31 AIN2 Analog Input 2. Analog input to mux. Inputs have internal programmable current source for external
temperature measurement.
32 AIN1 Analog Input 1. Analog input to mux. Inputs have internal programmable current source for external
temperature measurement.
33 REF Reference Input/Output. Output of the reference buffer amplifier or external reference input. Disabled at
power-up to allow external reference. Reference voltage for ADC and DAC.
34 REG Linear Voltage-Regulator Output. Charge-pump-doubler input voltage. Bypass REG with a 10µF capacitor
to DGND for charge-pump regulation.
35 CF-
36 CF+ C har g e- P um p Fl yi ng C ap aci tor Ter m i nal s. C onnect an exter nal 10µF ( typ ) cap aci tor b etw een C F+ and C F- .
37 CPOUT
C har g e- P um p Outp ut. C onnect an exter nal 10µF ( typ ) r eser voi r cap aci tor b etw een C P O U T and D GN D . Ther e i s
a l ow thr eshol d d i od e b etw een DVDD and C P OU T. When the char g e p um p i s d i sab l ed , C P OU T i s p ul l ed up
w i thi n 300m V ( typ ) of DVDD.
38 DVDD Digital Supply Voltage. Bypass to DGND with 10µF and 0.1µF capacitors in parallel as close to the pin as
possible.
39 DGND Digital Ground. Also ground for cascaded linear voltage regulator and charge-pump doubler.
40 UPIO1 U ser - P r og r am m ab l e Inp ut/O utp ut 1. S ee the U P IO1_C TRL Reg i ster for functionality.
—EPE xp osed P ad . Leave unconnected or connect to AGN D .
Pin Description (continued)
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
24 Maxim Integrated
Detailed Description
The MAX11359A DAS features a multiplexed differential
16-bit ADC, 10-bit force-sense DACs, an RTC with an
alarm, a selectable bandgap voltage reference, a signal-
detect comparator, 1.8V and 2.7V voltage monitors, and
wake-up control circuitry, all controlled by a 4-wire serial
interface (See Figure 3 for the functional diagram).
The DAS directly interfaces to various sensor outputs and,
once configured, provides the stimulus, signal condition-
ing, and data conversion, as well as µP support. See the
Applications
section for sample MAX11359A applications.
The 16-bit ADC features programmable continuous con-
version rates as shown in Table 4, and gains of 1, 2, 4,
and 8 (Table 5) to suit applications with different power
TEMP
SENSOR
REF
AGND
OUTA
OUT2
SCM2
OUT1
AGND
REF
INM1
IN2-
SCM1
FBA
AIN1
SNO1
SNC1
TEMP+
TEMP-
SNO2
SNC2
AIN2
10:1
MUX
NEG
10:1
MUX
POS
Av = 1, 2, 4, 8 V/V
POLARITY
FLIPPER
PROG. Vos
PGA
Av = 1, 1.6384, 2 V/V
UPIO
DGND AGND
AVDD
DVDD
SERIAL
INTERFACE
DIN
CS
DOUT
SCLK
1.25V BANDGAP REF
16-BIT ADC
IN+
IN-
REF
OP1
10-BIT DAC
OUTA
REF
FBA
BUF
SWA
PGA
OUT1
SNO1
SNC1
SCM1
CMP
UPIO1
UPIO2
UPIO3
UPIO4
32.768kHz
OSCILLATOR
32KIN 32KOUT
WATCHDOG
TIMER
4.9152MHz HF
OSCILLATOR
AND FLL
CLK
CLK32K
AIN2
AIN1
INTERRUPT
INT
PWM
CLK32K
INPUT/OUTPUT
CONTROL
DVDD (1.8V)
VOLTAGE
MONITOR
RTC AND
ALARM
SNO2
SNC2
SCM2
CHARGE-
PUMP
DOUBLER
CF+
CF-
IN1-IN1+
PROG
CURRENT
SOURCE
TEMP+
TEMP-
32K
AIN2
AIN1
CPOUT (2.7V)
VOLTAGE
MONITOR
LINEAR 1.65V
VOLTAGE
REGULATOR
CPOUT
REG
STATUS
4
RESET
LDVD
ALD
CRDY
SDC
ADD
ADOU
UPR<4:1> 4
UPF<4:1>
LCPD
16
CONTROL
LOGIC
HFCLK
M32K
M32K
M32K
HFCLK
WDTO
DVDD
MAX11359A
OP2 OUT2
IN2-IN2+
SPDT1
SPDT2
Figure 3. MAX11358B Functional Diagram
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
25
Maxim Integrated
and dynamic range constraints. The force-sense DAC
provides 10-bit resolution for precise sensor applica-
tions. The ADC and DACs both utilize a low-drift 1.25V
internal bandgap reference for conversions and full-
scale range setting. The RTC has a 138-year range and
provides an alarm function that can be used to wake up
the system or cause an interrupt at a predefined time.
The power-supply voltage monitor detects when DVDD
falls below a trip threshold voltage of +1.8V and asserts
RESET. The MAX11359A uses a 4-wire serial interface
to communicate directly between SPI, QSPI, or
MICROWIRE devices for system configuration and
readback functions.
Analog-to-Digital Converter (ADC)
The MAX11359A includes a sigma-delta ADC with pro-
grammable conversion rate, a PGA, and a dual 10:1
input mux. When performing continuous conversions at
10sps or single conversions at the 40sps setting (effec-
tively 10sps due to four sample sigma-delta settling),
the ADC has 16-bit noise-free resolution. The noise-free
resolution drops to 10 bits at the maximum sampling
rate of 512sps. Differential inputs support unipolar
(between 0 and VREF) and bipolar (between ±VREF)
modes of operation. Note: Avoid combinations of input
signal and PGA gains that exceed the reference range
at the ADC input. The ADOU bit in the status register
indicates if the ADC has overranged or underranged.
Zero-scale and full-scale calibrations remove offset and
gain errors. Direct access to gain and zero-scale cali-
bration registers allows system-level offset and gain cal-
ibration. The zero-scale adjustment register allows
intentional positive offset skewing to preserve unipolar-
mode resolution for signals that have a slight negative
offset (i.e., unipolar clipping near zero can be removed).
Perform ADC calibration whenever the ADC configura-
tion, temperature, or AVDD changes. The ADC-done
status can be programmed to provide an interrupt on
INT or on any UPIO_.
PGA Gain
An integrated PGA provides four selectable gains: +1V/V,
+2V/V, +4V/V, and +8V/V to maximize the dynamic range
of the ADC. Bits GAIN1 and GAIN0 set the gain (see the
ADC Register
for more information). The PGA gain is
implemented in the digital filter of the ADC.
ADC Modulator
The MAX11359A performs analog-to-digital conversions
using a single-bit, 3rd-order, switched-capacitor sigma-
delta modulator. The sigma-delta modulation converts
the input signal into a digital pulse train whose average
duty cycle represents the digitized signal information.
The pulse train is then processed by a digital decimation
filter. The modulator provides 2nd-order frequency shap-
ing of the quantization noise resulting from the single-bit
quantizer. The modulator is fully differential for maximum
signal-to-noise ratio and minimum susceptibility to
power-supply noise.
Signal-Detect Comparator
INT asserts (and remains asserted) within 30µs when
the differential voltage on the selected analog inputs
exceeds the signal-detect comparator trip threshold.
The signal-detect comparator’s differential input trip
threshold (i.e., offset) is user selectable and can be pro-
grammed to the following values: 0mV, 50mV, 100mV,
150mV, or 200mV.
Analog Inputs
The ADC provides two external analog inputs: AIN1
and AIN2. The rail-to-rail inputs accept differential or
single-ended voltages, or external temperature-sensing
diodes. The unused op amps, switches, or DAC inputs
and output pins can also be used as rail-to-rail analog
inputs if the associated function is disabled.
Analog Input Protection
Internal protection diodes clamp the analog inputs to
AVDD and AGND, and allow the channel input to swing
from (VAVDD - 0.3V) to (VAVDD + 0.3V). For accurate
conversions near full scale, the inputs must not exceed
AVDD by more than 50mV or be lower than AGND by
50mV. If the inputs exceed (VAGND - 0.3V) to (VAVDD +
0.3V), limit the current to 50mA.
Analog Mux
The MAX11359A includes a dual 10:1 mux for the positive
and negative inputs of the ADC. Figure 3 illustrates which
signals are present at the inputs of each mux for the
MAX11359A. The MUXP[3:0] and MUXN[3:0] bits of the
mux register select the input to the ADC and the signal-
detect comparator (Tables 8 and 9). See the mux register
description in the
Register Definitions
section for multi-
plexer functionality. The POL bit of the ADC register
swaps the polarity of mux output signals to the ADC.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
26 Maxim Integrated
Digital Filtering
The MAX11359A contains an on-chip digital lowpass fil-
ter that processes the data stream from the modulator
using a SINC4(sinx/x)4response. The SINC4filter has a
settling time of four output data periods (4 x 200ms).
The MAX11359A has 25% overrange capability built into
the modulator and digital filter:
Figure 4 shows the filter frequency response. The
SINC4characteristic -3dB cutoff frequency is 0.228
times the first notch frequency.
The output data rate for the digital filter corresponds
with the positioning of the first notch of the filter’s fre-
quency response. The notches of the SINC4filter are
repeated at multiples of the first notch frequency. The
SINC4filter provides an attenuation of better than
100dB at these notches. For example, 50Hz is equal to
five times the first notch frequency and 60Hz is equal to
six times the first notch frequency.
Force-Sense DAC
The MAX11359A incorporates a 10-bit force-sensing
DAC. The DACs reference voltage sets the full-scale
range. Program the DACA_OP register using the serial
interface to set the output voltages of the DAC at OUTA.
Connecting resistors in a voltage-divider configuration
between OUTA, FBA, and GND sets a different closed-
loop gain for the output amplifier (see the
Applications
Information
section).
The DAC output amplifier typically settles to ±0.5 LSB
from a full-scale transition within 50µs (unity gain and
loaded with 10kΩin parallel with 200pF). Loads of less
than 1kΩmay degrade performance. See the
Typical
Operating Characteristics
for the source-and-sink
capability of the DAC output.
The MAX11359A features a software-programmable
shutdown mode for the DAC. Power down DACA by
clearing the DAE bits (see the
DACA_OP Register
sec-
tion). DAC output OUTA goes high impedance when
powered down. The DAC is normally powered down at
power-on reset.
Charge Pump
The charge pump provides > 3V at CPOUT with a maxi-
mum 10mA load. Enable the charge pump through the
PS_VMONS register. The charge pump is powered
from DVDD. See Figures 5 and 6 for block diagrams of
the charge pump and linear regulator. The charge
pump is disabled at power-on reset.
An internal clock drives the charge-pump clock and
ADC clock. The charge pump delivers a maximum
10mA of current to external devices. The droop and the
ripple depend on the clock frequency (fCLK =
32.768kHz/2), switch resistances (RSWITCH = 5Ω), and
the external capacitors (10µF) along with their respec-
tive ESRs, as shown below.
VIR
RfC R ESR ESR
VI
fC I ESR
DROOP OUT OUT
OUT CLK F SWITCH C C
RIPPLE OUT
CLK CPOUT OUT C
F CPOU
T
CPOUT
=
=+ ++
=+
124
2
Hf N
SIN N f
f
SIN f
f
m
m
()=
⎛
⎝
⎜⎞
⎠
⎟
⎛
⎝
⎜⎞
⎠
⎟
⎡
⎣
⎢
⎢
⎢
⎢
⎢
⎤
⎦
⎥
⎥
⎥
⎥
⎥
1
4
π
π
FREQUENCY (Hz)
GAIN (dB)
10080604020
-160
-120
-80
-40
0
-200
0 120
Figure 4. Filter Frequency Response
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
27
Maxim Integrated
Voltage Supervisors
The MAX11359A provides voltage supervisors to monitor
DVDD and CPOUT. The first supervisor monitors the
DVDD supply voltage. RESET asserts and sets the corre-
sponding LDVD status bit when DVDD falls below the
1.8V threshold voltage. When the DVDD supply voltage
rises above the threshold during power-up, RESET
deasserts after a nominal 1.5s timeout period to give the
crystal oscillator time to stabilize. Set the threshold hys-
teresis using the HYSE bit of the PS_VMONS register.
See the
PS_VMONS Register
section for configuring hys-
teresis. There is no separate voltage monitor for AVDD,
but the analog supply is covered by the DVDD monitor in
many applications where DVDD and AVDD are externally
connected together. Multiple supply applications where
AVDD and DVDD are not connected together require a
separate external voltage monitor for AVDD. See Figure 7
for a block diagram of the DVDD voltage supervisor.
The second voltage monitor tracks the charge-pump
output voltage, CPOUT. If CPOUT falls below the 2.7V
threshold, a corresponding register status bit (LCPD) is
set to flag the condition. The CPOUT monitor output
can also be mapped to the interrupt generator and out-
put on INT. The CPOUT monitor can be used as a 3V
AVDD monitor in applications where the charge pump
is disabled and CPOUT is connected to AVDD. AVDD
must be greater or equal to DVDD when CPOUT is
used to monitor AVDD. See Figure 8 for a block diagram
of the CPOUT voltage supervisor.
Interrupt Generator (INT)
The interrupt generator provides an interrupt to an
external µC. The source of the interrupt is generated by
the status register and can be masked and unmasked
through the IMSK register. CRDY is unmasked by
default, and INT is active-high at power-on reset. INT is
programmable as active-high and active-low. Possible
sources include a rising or falling edge of UPIO_, an
RTC alarm, an ADC conversion completion, or the volt-
age-supervisor outputs. The interrupt causes INT to
assert when configured as an interrupt output.
OP
1.22V
1.65V
LINEAR 1.65V VOLTAGE REGULATOR
DVDD
REG
LDOE
LDOE
Figure 5. Linear-Regulator Block Diagram
CF+
CF-
CPOUT
REG
M32K
CHARGE-PUMP DOUBLER
NONOVERLAP
CLOCK GENERATOR
CPE
Figure 6. Charge-Pump Block Diagram
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
28 Maxim Integrated
Crystal Oscillator
The on-chip oscillator requires an external crystal (or
resonator) connected between 32KIN and 32KOUT
with a 32.768kHz operating frequency. This oscillator is
used for the RTC, alarm, PWM, watchdog, charge
pump, and FLL. In any crystal-based oscillator circuit,
the oscillator frequency is sensitive to the capacitive
load (CL). CLis the capacitance that the crystal needs
from the oscillator circuit and not the capacitance of the
crystal. The input capacitance across 32KIN and
32KOUT is 6pF. Choose a crystal with a 32.768kHz
oscillation frequency and a 6pF capacitive load such
as the C-002RX32-E from Epson Crystal. Using a crys-
tal with a CLthat is larger than the load capacitance of
the oscillator circuit causes the oscillator to run faster
than the specified nominal frequency of the crystal or to
not start up. See Figures 9 and 10 for block diagrams
of the crystal oscillator and the CLK32K I/O.
Real-Time Clock (RTC)
The integrated RTC provides the current time information
from a 32-bit counter and subsecond counts from an 8-
bit ripple counter. An internally generated reference
clock of 256Hz (derived from the 32.768kHz crystal) dri-
ves the 8-bit subsecond counter. An overflow of the 8-bit
subsecond counter inputs a 1Hz clock to increment the
32-bit second counter. The RTC 32-bit second counter is
translatable to calendar format with firmware. All 40 bits
(32-bit second counter and 8-bit subsecond counter)
must be clocked in or out for valid data. The RTC and
the 32.768kHz crystal oscillator consume less than 1µA
when the rest of the device is powered down.
Time-of-Day Alarm
Program the AL_DAY register with a 20-bit value, which
corresponds to a time 1s to 12 days later than the cur-
rent time with a 1s resolution. The alarm status bit, ALD,
asserts when the 20 bits of the AL_DAY register match-
es the 20 LSBs of the 32-bit second counter. The ADE
bit automatically clears when the time-of-day alarm
trips. The time-of-day alarm causes the device to exit
sleep mode.
CMP
ANALOG
2:1 MUX CONTROL
LOGIC
RESET
DVDD
1.25V
1.8VTH
2.0VTH
LDVD
LSDE
LSDE
HYSE POR RSTE
DVDD (1.8V) VOLTAGE MONITOR
WDTO
Figure 7. DVDD Voltage-Supervisor Block Diagram
CMP
CPOUT
1.25V
2.7VTH
LCPD
CPDE
CPDE
CPOUT (2.7V) VOLTAGE MONITOR
Figure 8. CPOUT Voltage-Supervisor Block Diagram
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
29
Maxim Integrated
Watchdog
Enable the watchdog timer by writing a 1 to the WDE
bit in the CLK_CTRL register. After enabling the watch-
dog timer, the device asserts RESET for 250ms, if the
watchdog address register is not written every 500ms.
Due to the asynchronous nature of the watchdog timer,
the watchdog timeout period varies between 500ms
and 750ms. Write a 0 to the WDE bit to disable the
watchdog timer. See Figure 11 for a block diagram of
the watchdog timer.
High-Frequency Clock
An internal oscillator and a frequency-locked loop (FLL)
are used to generate a 4.9152MHz ±1% high-frequen-
cy clock. This clock and derivatives are used internally
by the ADC, analog switches, and PWM. This clock sig-
nal outputs to CLK. When the FLL is enabled, the high-
frequency clock is locked to the 32.768kHz reference.
If the FLL is disabled, the high-frequency clock is free-
running. At power-up, the CLK pin defaults to a
2.4576MHz clock output, which is compatible with most
µCs. See Figure 12 for a block diagram of the high-fre-
quency clock.
User-Programmable I/Os
The MAX11359A provides four digital programmable
I/Os (UPIO1–UPIO4). Configure UPIOs as logic inputs
or outputs using the UPIO control register. Configure
the internal pullups using the UPIO setup register, if
required. At power-up, the UPIOs are internally pulled
up to DVDD. UPIO_ outputs can be referenced to
DVDD or CPOUT. See the
UPIO__CTRL Register
and
UPIO_SPI Register
sections for more details on config-
uring the UPIO_ pins.
32KIN
32KOUT
32.768kHz OSCILLATOR
32kHz
OSCILLATOR
OSCE
32K
Figure 9. 32kHz Crystal-Oscillator Block Diagram
IO32E
CLK32K
CK32E
OSCE
CLK32K I/O CONTROL
2:1
MUX
1
0
IO32E
IO32E
32K
M32K
Figure 10. CLK32K I/O Block Diagram
DQ
Q
R
CK
DQ
Q
R
CK
DIVIDE-
BY-8192
32K
WDE
POR
WDW WATCHDOG TIMER
POR PULSES HIGH DURING POWER-UP.
WDW PULSES HIGH DURING WATCHDOG REGISTER WRITE.
4Hz
WDTO
Figure 11. Watchdog Timer Block Diagram
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
30 Maxim Integrated
Program each UPIO1–UPIO4 as one of the following:
• General-purpose input
• Power-mode control
• Analog switch (SPST) and SPDT control input
• ADC data-ready output
• General-purpose output
• PWM output
• Alarm output
• SPI passthrough
Temperature Sensors
The internal temperature sensor measures die tempera-
ture, and the external temperature sensor measures
remote temperatures. Use the internal temperature sen-
sor or external temperature sensor (remote transistor/
diode) with the ADC and internal current sources to
measure the temperature. For either method, two to four
currents are passed through a p-n junction and sense
resistor, and its temperature is calculated by a µC
using the diode equation and the forward-biased junc-
tion voltage drops measured by the ADC. The tempera-
ture offset between the internal p-n junction and
ambient is negligible. For the four and eight measure-
ment methods, the ratio of currents used in the diode
calculations is precisely known since the ADC mea-
sures the resulting voltage across the same sense
resistor. See Figure 13 for a block diagram of the tem-
perature sensor.
M32K TUNE<8:0>
HFCE
FLLE
CRDY
HFCLK
1, 2, 4, 8
DIVIDER
2:1
MUX CLK
CLKE
CKSEL<1:0>
CKSEL2
1
0
4.9152MHz HF OSCILLATOR AND FLL
4.9152MHz
32.768kHz
FREQUENCY
COMPARE
FREQ
ERROR DIGITALLY
CONTROLLED
OSCILLATOR
FREQUENCY
INTEGRATOR
Figure 12. High-Frequency Clock and FLL Block Diagram
Figure 13. Temperature-Sensor Measurement Block Diagram
CURRENT
SOURCE
1:3
DEMUX
IVAL<1:0>
IMUX<1:0>
AIN1
AIN2
AIN1
AIN2
TEMP+
TEMP-
PROGRAMMABLE CURRENT SOURCE
TEMP SENSOR
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
31
Maxim Integrated
Two-Current Method
For the two-current method, currents I1and I2are
passed through a p-n junction. This requires two VBE
measurements. Temperature measurements can be
performed using I1and I2.
where k is Boltzman’s constant and q is the absolute
value of the charge on electron. A four-measurement
procedure is adopted to improve accuracy by precisely
measuring the ratio of I1and I2:
1) Current I1is driven through the diode and the series
resistor R, and the voltage across the diode is mea-
sured as VBE1.
2) For the same current, the voltage across the diode
and R is measured as V1.
3) Repeat steps 1 and 2 with I2. I1is typically 4µA and
I2is typically 60µA (see Table 21).
Since only four integer numbers are accessible from the
ADC conversions at a certain voltage reference, the previ-
ous equation can be represented in the following manner:
where NV1, NV2, NVBE1, and NVBE2 are the measure-
ment results in integer format and VREF is the reference
voltage used in the ADC measurements.
Four-Current Method
The four-current method is used to account for the
diode series resistance and trace resistance. The four
currents are defined as follows; I1, I2, M1I1, and M2I2. If
the currents are selected so (M1- 1)I1= (M2- 1)I2, the
effect of the series resistance is eliminated from the
temperature measurements. For the currents I1= 4µA
and I2= 60µA, the factors are selected as M1= 16 and
M2= 2. This results in the currents I3= M1I1= 64µA
and I4= M2I2= 120µA (typ). As in the case of the two-
current method, two measurements per current are
used to improve accuracy by precisely measuring the
values of the currents.
1) Current I1is driven through the diode and the series
resistor R, and the voltage is measured across the
diode using the ADC as NVBE1.
2) For the same current, the voltage across the diode and
the series resistor is measured by the ADC as NV1.
3) Repeat steps 1 and 2 with I2, I3, and I4.
The measured temperature is defined as follows:
where VREF is the reference voltage used and:
External Temperature Sensor
For an external temperature sensor, either the two-cur-
rent or four-current method can be used. Connect an
external diode (such as 2N3904 or 2N3906) between
pins AIN1 and AGND (or AIN2 and AGND). Connect a
sense resistor R between AIN1 and AIN2. Maximize R
so the IR drop plus VBE of the p-n junction [(R x
IMAX)+VBE] is the smaller of the ADC reference voltage
or (AVDD - 400mV). The same procedure as the inter-
nal temperature sensor can be used for the external
temperature sensor, by routing the currents to AIN1 (or
AIN2) (see Table 20).
For the two-current method, if the external diode’s
series resistance (RS) is known, then the temperature
measurement can be corrected as shown below:
Temperature-Sensor Calibration
To account for various error sources during the temper-
ature measurement, the internal temperature sensor is
calibrated at the factory. The calibrated temperature
equation is:
TT
qN N qN N
nkIn NN
NN
VR
R
ACTUAL MEAS V VBE V VBE
V VBE
V VBE
REF S
=− −−−
−
−
⎛
⎝
⎜⎞
⎠
⎟
××
⎛
⎝
⎜
⎜
⎜
⎜
⎞
⎠
⎟
⎟
⎟
⎟
()()
2211
22
11
16
2
M
M
NN
NN
NN
NN
V VBE
V VBE
V VBE
V VBE
1
2
33
11
22
44
=−
−
⎛
⎝
⎜⎞
⎠
⎟−
−
⎛
⎝
⎜⎞
⎠
⎟
TqN N qN N
nkIn M
M
V
MEAS VBE VBE VBE VBE REF
=−
()
−−
()
⎛
⎝
⎜⎞
⎠
⎟
×
31 42
1
2
16
2
TqN N
nk NN
NN
V
MEAS VBE VBE
V VBE
V VBE
REF
()
ln
=−
−
−
⎛
⎝
⎜⎞
⎠
⎟
×
21
22
11
16
2
TqV V
nk I
I
MEAS BE BE
ln
=−
()
⎛
⎝
⎜⎞
⎠
⎟
21
2
1
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
32 Maxim Integrated
TA= g x TMEAS + b
where g and b are the gain and offset calibration val-
ues, respectively. These calibration values are avail-
able for reading from the TEMP_CAL register.
Voltage Reference and Buffer
An internal 1.25V bandgap reference has a buffer with a
selectable 1.0V/V, 1.638V/V, or 2.0V/V gain, resulting
in nominally 1.25V, 2.048V, or 2.5V reference voltage at
REF. The ADC and DAC use this reference voltage. The
state of the internal voltage reference output buffer at
POR is disabled so it can be driven, at REF, with an
external reference between AGND and AVDD. The
MAX11359A reference has an initial tolerance of ±1%.
Program the reference buffer through the serial inter-
face. Bypass REF with a 4.7µF capacitor to AGND.
Operational Amplifiers (Op Amps)
The MAX11359A includes two op amps. These op amps
feature rail-to-rail outputs, near rail-to-rail inputs, and have
an 80kHz (1nF load) input bandwidth. The DACA_OP
(DACB_OP) register controls the power state of the op
amps. When powered down, the outputs of the op amps
are high impedance.
Single-Pole/Double-Throw (SPDT) Switches
The MAX11359A provides two uncommitted SPDT switch-
es. Each switch has a typical on-resistance of 35Ω.
Control the switches through the SW_CTRL register, the
PWM output, and/or a UPIO port configured to control the
switches (UPIO1–UPIO4_CTRL register).
Pulse-Width Modulator (PWM)
A single 8-bit PWM is available for various system tasks
such as LCD bias control, sensor bias voltage trim,
buzzer drive, and duty-cycled sleep-mode power-con-
trol schemes. PWM input clock sources include the
4.9512MHz FLL output, the 32kHz clock, and frequen-
cy-divided versions of each. Although most µCs have
built-in PWM functions, the MAX11359A PWM is more
flexible by allowing the UPIO outputs to be driven to
DVDD or regulated CPOUT logic-high voltage levels.
For duty-cycled power-control schemes, use the
32kHz-derived input clock. The PWM output is avail-
able independent of µC power state. The FLL is typical-
ly disabled in sleep-override mode.
Serial Interface
The MAX11359A features a 4-wire serial interface consist-
ing of a chip select (CS), serial clock (SCLK), data in
(DIN), and data out (DOUT). CS must be low to allow data
to be clocked into or out of the device. DOUT is high
impedance while CS is high. The data is clocked in at
DIN on the rising edge of SCLK. Data is clocked out at
DOUT on the falling edge of SCLK. The serial interface is
compatible with SPI modes CPOL = 0, CPHA = 0 and
CPOL = 1, CPHA = 1. A write operation to the
MAX11359A takes effect on the last rising edge of SCLK.
If CS goes high before the complete transfer, the write is
ignored. Every data transfer is initiated by the command
byte. The command byte consists of a start bit (MSB),
R/Wbit, and 6 address bits. The start bit must be 1 to
perform data transfers to the device. Zeros clocked in are
ignored. For SPI passthrough mode, see the
UPIO_SPI
Register
section. An address byte identifies each register.
Table 4 shows the complete register address map for this
family of DAS. Figures 14, 15, and 16 provide timing dia-
grams for read and write commands.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
33
Maxim Integrated
CS
SCLK
DIN
DOUT
X = DON’T CARE.
1 0 A5 A4 A3 A2 A1 A0 DNDN -1 DN-2 DN-3 D2D1D0XX
Figure 14. Serial-Interface Register Write with 8-Bit Control Word, Followed by a Variable Length Data Write
CS
SCLK
DIN
DOUT
1 1 A5 A4 A3 A2 A1 A0 X X X X X X X XX
DNDN-1 DN-2 DN-3 D2D1D0
X = DON’T CARE.
Figure 15. Serial-Interface Register Read with 8-Bit Control Word Followed by a Variable Length Data Read
CS
SCLK
DIN
DOUT
1 0 A4 A3 A2 A1
DRDY
D0A0 D7 D6 D5 D4 D3 D2 D1X
D0D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1
1 1 A4 A3 A2 A1 A0 X
ADC
CONV
CHANGES
X = DON’T CARE.
Figure 16. Performing an ADC Conversion (DRDY Function can be Accessed at UPIO Pins)
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
34 Maxim Integrated
REGISTER
NAME START CTL
(R/W)
ADR<5:0>
(ADDRESS)
D<39:0>, D<23:0>, D<15:0> OR D<7:0>
(DATA)
ADCE STRT BIP POL CONT ADCREF GAIN<1:0>
ADC 1 R/W00000X RATE<2:0> MODE<2:0> X X
MUX 1 R/W00001S MUXP<3:0> MUXN<3:0>
DATA 1 R 00010X ADC<15:0>
OFFSET CAL 1 R/W00011X Offset<23:0>
GAIN CAL 1 R/W00100X Gain<23:0>
RESERVED 1 R/W00101X Reserved. Do not use.
DAE/
OP3E
DBE/
OP2E OP1E X X X DACA<9:8>
DACA_OP 1 R/W00110X
DACA<7:0>
DAE/
OP3E
DBE/
OP2E OP1E X X X DACB<9:8>
DACB_OP 1 R/W00111X
DACB<7:0>
REF_SDC 1 R/W01000X REFV<1:0> AOFF AON SDCE TSEL<2:0>
ASEC<19:4>
AL_DAY 1 R/W01001X ASEC<3:0> X X X X
AL_SYS 1 R/W01010X ASUB<7:0>
AWE ADE ASE RWE RTCE OSCE FLLE HFCE
CLK_CTRL 1 R/W01011X CKSEL<2:0> IO32E CK32E CLKE INTP WDE
SEC<31:0>
RTC 1 R/W01100X SUB<7:0>
PWME FSEL<2:0> SWAH SWAL SWBH SWB
L
PWM_CTRL 1 R/W01101XSPD1 SPD2 X X X X X X
PWMTH<7:0>
PWM_THTP 1 R/W01110X PWMTP<7:0>
WATCHDOG 1 W 01111X X X X X X X X X
ON MODE 1 W 10000X X X X X X X X X
SLEEP_OVRR 1 W 10001X X X X X X X X X
SLEEP_CFG 1 R/W10010SLPSOSCE S C K 32E S P W M E SHDN X X X X
UPIO4_CTRL 1 R/W10011X UP4MD<3:0> PUP4 SV4 ALH4 LL4
UPIO3_CTRL 1 R/W10100X UP3MD<3:0> PUP3 SV3 ALH3 LL3
UPIO2_CTRL 1 R/W10101X UP2MD<3:0> PUP2 SV2 ALH2 LL2
UPIO1_CTRL 1 R/W10110X UP1MD<3:0> PUP1 SV1 ALH1 LL1
UPIO_SPI 1 R/W10111XUP4S UP3S UP2S UP1S X X X X
SW_CTRL 1 R/W11000X SWASWBSPDT1<1:0> SPDT2<1:0> X X
TEMP_CTRL 1 R/W11001X IMUX<1:0> IVAL<1:0> X X X X
TEMP_CAL 1 R 11010X TGAIN<7:0> TOFFS<7:0>
MLDVD MLCP MADO MSDC MCRD MADD MALD MALS
IMSK 1 R/W11011X MUPR<4:1> MUPF<4:1>
RESERVED 1 R/W11100X Reserved. Do not use.
PS_VMONS 1 R/W11101XLDOE CPE LSDE CPDE HYSE RSTE X X
LDVD LCPD ADOU SDC CRDY ADD ALD ALS
STATUS 1 R 11111X UPR<4:1> UPF<4:1>
Register Definitions
Table 4. Register Address Map
X = Don’t care.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
35
Maxim Integrated
The ADC register configures the ADC and starts
a conversion.
ADCE: ADC power-enable bit. ADCE = 1 powers up
the ADC, and ADCE = 0 powers down the ADC.
STRT: ADC start bit. STRT = 1 resets the registers
inside the ADC filter and initiates a conversion or cali-
bration. The conversion begins immediately after the
16th ADC control bit is clocked by the rising edge of
SCLK. The initial conversion requires four conversion
cycles for valid output data. If CONT = 0 when STRT is
asserted, the ADC stops after a single conversion and
holds the result in the DATA register. If CONT = 1 when
STRT is asserted, the ADC performs continuous conver-
sions at the rate specified by the RATE<2:0> bits until
CONT is deasserted or ADCE is deasserted, powering
down the ADC. The STRT bit is automatically deasserted
after the initial conversion is complete (four conversion
cycles; the ADC status bit ADD in the STATUS register
asserts.) The current ADC configurations are not affect-
ed if the ADC register is written with STRT = 0. This
allows the ADC and mux configurations to be updated
simultaneously with the S bit in the MUX register.
BIP: Unipolar/bipolar bit. Set BIP = 0 for unipolar mode
and BIP = 1 for bipolar mode. Unipolar-mode data is
unsigned binary format and bipolar is two’s complement.
See the
ADC Transfer Functions
section for more details.
POL: Polarity flipper bit. POL = 1 flips the polarity of the
differential signal to the ADC and the input to the signal-
detect comparator (SDC). POL = 0 sets the positive mux
output to the positive ADC and SDC inputs, and the neg-
ative mux output to the negative ADC and SDC inputs.
POL = 1 sets the positive mux output to the negative
ADC and SDC inputs, and the negative mux output to
the positive ADC and SDC inputs.
CONT: Continuous conversion bit. CONT = 1 enables
continuous conversions following completion of the first
conversion or calibration(s) initiated by the STRT or S
bit. Set CONT = 0 while asserting the STRT bit, or prior
to asserting the S bit to perform a single conversion or to
prevent conversions following a calibration. Set CONT =
0 to abort continuous conversions already in progress.
When the ADC is stopped in this way, the last complete
conversion result remains in the DATA register and the
internal ADC state information is lost. Asserting the
CONT bit does not restart the ADC, but results in contin-
uous conversions once the ADC is restarted with the
STRT or S bit.
ADCREF: ADC reference source bit. Set ADCREF = 0
to select REF as the ADC reference. Set ADCREF = 1
to select AVDD as the ADC reference. To measure the
AVDD voltage without having to attenuate the supply
voltage, select REF and AGND as the differential inputs
to the ADC, with POL = 0 and while ADCREF = 1.
GAIN<1:0>: ADC gain-setting bits. These two bits
select the gain of the ADC as shown in Table 5.
MSB LSB
ADCE STRT BIP POL CONT ADCREF GAIN<1:0>
RATE<2:0> MODE<2:0> X X
ADC Register (Power-On State: 0000 0000 0000 00XX)
Register Bit Descriptions
GAIN SETTING (V/V) GAIN1 GAIN0
100
201
410
811
Table 5. Setting the Gain of the ADC
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
36 Maxim Integrated
RATE<2:0>: ADC conversion-rate-setting bits. These
three bits set the conversion rate of the ADC as shown
in Table 6. The initial conversion requires four conver-
sion cycles for valid data, and subsequent conversions
require only one cycle (if CONT = 1). A full-scale input
change can require up to five cycles for valid data if
the digital filter is not reset with the STRT or S bit.
MODE<2:0>: Conversion-mode bits. These three bits
determine the type of conversion for the ADC as shown
in Table 7. When the ADC finishes an offset calibration
and/or gain calibration, the MODE<2:0> bits clear to 0
hex, the ADD bit in the STATUS register asserts, and
an interrupt asserts on INT (or UPIO_ if programmed as
DRDY) if MADD is unmasked. Perform a gain calibra-
tion after achieving the desired offset (calibrated or
not). If an offset and gain calibration are performed
together (MODE<2:0> = 7 hex), the offset calibration is
performed first followed by the gain calibration, and the
µC is interrupted by INT (or UPIO_ if programmed as
DRDY) if MADD is unmasked only upon completion of
both offset and gain calibration. After power-on or cali-
bration, the ADC does not begin conversions until initi-
ated by the user (see the ADCE and STRT bit
descriptions in this section and see the S bit descrip-
tions in the
MUX Register
section). See the
GAIN CAL
Register
and
OFFSET CAL Register
sections for details
on system calibration.
CONVERSION MODE MODE2 MODE1 MODE0
Normal 0 0 0
System Offset Calibration 0 0 1
System Gain Calibration 0 1 0
Normal 0 1 1
Normal 1 0 0
Self Offset Calibration 1 0 1
Self Gain Calibration 1 1 0
Self Offset and Gain
Calibration 111
Table 7. Setting the ADC Conversion Mode
NOMINAL
CONTINUOUS
CONVERSION
RATE (sps)
DECIMATION
RATIO
ACTUAL
CONTINUOUS
CONVERSION
RATE (sps)
10 1096 10.01042142
40 274 40.04168568
50 220 49.87009943
60 183 59.953125
200 55 199.4803977
240 46 238.5091712
400 27 406.3489583
512 23 477.0183424
CONTINUOUS
CONVERSION
RATE (sps)
SINGLE
CONVERSION
RATE (sps)
RATE2 RATE1 RATE0
10 2.5 0 0 0
40 10 0 0 1
50 12.5 0 1 0
60 15 0 1 1
200 50 1 0 0
240 60 1 0 1
400 100 1 1 0
512 128 1 1 1
Table 6a. Setting the ADC Conversion Rate*
*Calculate the ADC sampling rate using the following
equation:
where fHFCLK = 4.9152MHz nominally.
ff
decimation ratio
SHFCLK
=×448
Table 6b. Actual ADC Conversion Rates
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
37
Maxim Integrated
The MUX register configures the positive and negative
mux inputs and can start an ADC conversion.
S (ADR0): Conversion start bit. The S bit is the LSB of
the MUX register address byte. S = 1 resets the regis-
ters inside the ADC filter and initiates a conversion or
calibration. The conversion begins immediately after
the eighth MUX register data bit, when S = 1 and when
writing to the MUX register. This allows the new MUX
and ADC register settings to take effect simultaneously
for a new conversion, if STRT = 0 during the last write
to the ADC register. If the S bit is asserted and the
command is a read from the MUX register, the conver-
sion starts immediately after the S bit (ADR0) is clocked
in by the rising edge of SCLK.
Read the MUX register with S = 1 for the fastest method
of initiating a conversion because only 8 bits are
required. The subsequent MUX register read is valid,
but can be aborted by raising CS with no harmful side
effects. The initial conversion requires four conversion
cycles for valid output data. If CONT = 0 and S = 1, the
ADC stops after a single conversion and holds the
result in the DATA register. If CONT = 1 and S = 1, the
ADC performs continuous conversions at the rate
specified by the RATE<2:0> bits until CONT deasserts
or ADCE deasserts, powering down the ADC. When a
conversion initiates using the S bit, the STRT bit asserts
and deasserts automatically after the initial conversion
completes. Writing to the MUX register with S = 0 caus-
es the MUX settings to change immediately and the
ADC continues in its prior state with its settings unaf-
fected. When the ADC is powered down, MUX inputs
are open.
MUXP<3:0>: MUX positive input bits. These four bits
select one of ten inputs from the positive MUX to go to the
positive output of the MUX as shown in Table 8. Any
writes to the MUX register take effect immediately once
the LSB (MUXN0) is clocked by the rising edge of SCLK.
MUXN<3:0> MUX negative input bits. These four bits
select one of ten inputs from the negative MUX to go to
the negative output of the MUX as shown in Table 9. Any
writes to the MUX register take effect immediately once
the LSB (MUXN0) is clocked by the rising edge of SCLK.
The DATA register contains the data from the most
recently completed conversion.
The OFFSET CAL register contains the 24-bit data of
the most recently completed offset calibration.
MSB LSB
S (ADR0) MUXP3 MUXP2 MUXP1 MUXP0 MUXN3 MUXN2 MUXN1 MUXN0
MUX Register (Power-On State: 0000 0000)
POSITIVE MUX
INPUT MUXP3 MUXP2 MUXP1 MUXP0
AIN1 0 0 0 0
SNO1 0 0 0 1
FBA 0 0 1 0
SCM1 0 0 1 1
IN2- 0 1 0 0
SNC1 0 1 0 1
IN1- 0 1 1 0
TEMP+ 0 1 1 1
REF 1 0 0 0
AGND 1 0 0 1
101X
Open 11XX
Table 8. Selecting the Positive MUX Inputs
X = Don’t care.
NEGATIVE MUX
INPUT MUXN3 MUXN2 MUXN1 MUXN0
TEMP- 0 0 0 0
SNO2 0 0 0 1
OUTA 0010
SCM2 0 0 1 1
OUT2 0 1 0 0
SNC2 0 1 0 1
OUT1 0 1 1 0
AIN2 0 1 1 1
REF 1000
AGND 1 0 0 1
101X
Open 11XX
Table 9. Selecting the Negative MUX Inputs
X = Don’t care.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
38 Maxim Integrated
OFFSET<23:0>: Offset-calibration bits. The data format
is two’s complement and is subtracted from the ADC
output before being written to the DATA register. The
offset calibration allows input offset errors between
VREF ±50% to be corrected in unipolar or bipolar mode.
The MAX11359A can perform system offset calibration
or self offset calibration. Self-calibration performs a cali-
bration for the entire signal path. See the
ADC
Calibration
section for more details.
The ADC input voltage range specifications must
always be obeyed, and the OFFSET CAL register effec-
tively offsets the ADC digital scale to a “zero” value
determined by the calibration.
MSB
ADC15 ADC14 ADC13 ADC12 ADC11 ADC10 ADC9 ADC8
LSB
ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0
DATA Register (Power-On State: 0000 0000 0000 0000)
ADC<15:0> Analog-to-digital conversion data bits.
These 16 bits are the results from the most recently
completed conversion. The data format is unsigned;
binary for unipolar mode, and two’s complement for
bipolar mode.
MSB
OFFSET23 OFFSET22 OFFSET21 OFFSET20 OFFSET19 OFFSET18 OFFSET17 OFFSET16
OFFSET15 OFFSET14 OFFSET13 OFFSET12 OFFSET11 OFFSET10 OFFSET9 OFFSET8
LSB
OFFSET7 OFFSET6 OFFSET5 OFFSET4 OFFSET3 OFFSET2 OFFSET1 OFFSET0
OFFSET CAL Register (Power-On State: 0000 0000 0000 0000 0000 0000)
MSB
GAIN23 GAIN22 GAIN21 GAIN20 GAIN19 GAIN18 GAIN17 GAIN16
GAIN15 GAIN14 GAIN13 GAIN12 GAIN11 GAIN10 GAIN9 GAIN8
LSB
GAIN7 GAIN6 GAIN5 GAIN4 GAIN3 GAIN2 GAIN1 GAIN0
GAIN CAL Register (Power-On State: 1000 0000 0000 0000 0000 0000)
GAIN<23:0>: Gain-calibration bits. The data format is
unsigned binary with 23 bits to the right of the decimal
point and scales the ADC output before being written to
the DATA register. The gain calibration allows full-scale
errors between -VREF/2 and +VREF/2 to be corrected in
unipolar mode, and full-scale errors between (+50% x
VREF) and (+200% x VREF) in unipolar or bipolar mode.
The MAX11359A can perform system gain calibration
or self gain calibration. Self-calibration performs a cali-
bration for offsets in the ADC, and system calibration
performs a calibration for the entire signal path. See the
ADC Calibration
section for more details.
The ADC input voltage range specifications must always
be obeyed, and the GAIN CAL register effectively scales
the ADC digital output to a full-scale value determined
by the calibration. The usable gain-calibration range is
limited to less than the full GAIN CAL register digital-
scaling range by the internal noise of the ADC.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
39
Maxim Integrated
DACA_OP Register
Writing to the DACA_OP output register updates DACA
on the rising SCLK edge of the LSB data bit. The output
voltage can be calculated as follows:
VOUTA = VREF x N/210
where:
VREF is the reference voltage for the DAC.
N is the integer value of the DACA<9:0> output regis-
ter. The output buffer is in unity gain.
The DACA data is 10 bits long and right justified.
DAE: DACA enable bit. Set DAE = 1 to power up the
DACA and the DACA output buffer in the MAX11359A.
OP2E: OP2 power-enable bit. Set OP2E = 1 to power
up OP2 in the MAX11359A.
OP1E: OP1 power-enable bit. Set OP1E = 1 to power
up OP1 in the MAX11359A. This bit is mirrored in the
DACB_OP register.
DACA<9:0>: DACA data bits.
DACA_OP Register (Power-On State: 000X XX00 0000 0000)
The REF_SDC register contains bits to control the refer-
ence voltage and signal-detect comparator.
REFV<1:0>: Reference buffer voltage gain and enable
bits. Enables the output buffer, sets the gain and the
voltage at the REF pin as shown in Table 10. Power-on
state is off to enable an external reference to drive the
REF pin without contention.
AOFF: ADC and DAC/op-amp power-off bit. This bit pro-
vides a method for turning off several analog functions
with a single write. Setting AOFF = 1 deasserts the
ADCE in the ADC register and DAE/OP3E, OP2E, and
OP1E bits in the DACA_OP registers, powering down
these analog blocks. Setting AOFF = 0 has no effect.
The AON bit has priority when both AON and AOFF bits
are asserted.
Most of the analog functions can be disabled with a
single write to the REF_SDC register by using AOFF,
REFV<1:0>, and SDCE.
MSB
DAE DBE OP1E X X X DACA9 DACA8
LSB
DACA7 DACA6 DACA5 DACA4 DACA3 DACA2 DACA1 DACA0
MSB LSB
REFV1 REFV0 AOFF AON SDCE TSEL2 TSEL1 TSEL0
REF_SDC Register (Power-On State: 0000 0000)
REFERENCE
BUFFER GAIN
(V/V)
REF OUTPUT
VOLTAGE (V) REFV1 REFV0
Disabled
Off (High
Impedance
at REF)
00
1.0 1.251 0 1
1.638 1.996 1 0
2.0 2.422 1 1
Table 10. Setting the Reference Output
Voltage
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
40 Maxim Integrated
AON: ADC and DAC/op-amp power-on bit. This bit pro-
vides a method of turning on several analog functions
with a single write. Setting AON = 1 asserts the ADCE
bit in the ADC register and DAE/OP3E, OP2E, and
OP1E bits in the DACA_OP register, powering up these
blocks. Setting AON = 0 has no effect. The AON bit has
priority when both AON and AOFF bits are asserted.
Most of the analog functions can be enabled with a sin-
gle write to the REF_SDC register using AON,
REFV<1:0>, and SDCE.
SDCE: Signal-detect comparator power-enable bit. Set
SDCE = 1 to power up the signal-detect comparator,
and set SDCE = 0 to power down the signal-detect
comparator. The ADCE bit in the ADC register must be
set to 1 to use the signal-detect comparator.
TSEL<2:0>: Threshold-select bits. These bits select the
threshold for the signal-detect comparator as shown in
Table 11.
MSB
ASEC19 ASEC18 ASEC17 ASEC16 ASEC15 ASEC14 ASEC13 ASEC12
ASEC11 ASEC10 ASEC9 ASEC8 ASEC7 ASEC6 ASEC5 ASEC4
LSB
ASEC3 ASEC2 ASEC1 ASEC0 X X X X
AL_DAY Register (Power-On State: 0000 0000 0000 0000 0000 XXXX)
NOMINAL
THRESHOLD (mV) TSEL2 TSEL1 TSEL0
00XX
50 100
100 1 0 1
150 1 1 0
200 1 1 1
Table 11. Setting the Signal-Detect
Comparator Threshold
X = Don’t care.
The AL_DAY register stores the second information of
the time-of-day alarm.
ASEC<19:0>: Alarm-second bits. These 20 bits store
the time-of-day alarm, which corresponds to the lower
20 bits of the RTC second counter or SEC<19:0>.
Program the time-of-day alarm trigger between 1s to
just over 12 days beyond the current RTC second
counter value in increments of 1s.
Assert the AWE bit in the CLK_CTRL register (see the
CLK_CTRL Register
section) to enable writing to the
AL_DAY register. Enabling the time-of-day alarm requires
two writes to the CLK_CTRL register. Write the 20 alarm-
second bits in 3 bytes, MSB first. If CS is raised before
the LSB is written, the alarm write is aborted, and the
existing value remains. When the lower 20 bits in the RTC
second counter match the contents of this register, the
alarm triggers and asserts ALD in the STATUS register. It
also asserts an interrupt on the INT pin unless masked by
the MALD bit in the IMSK register. The part enters normal
mode if an alarm triggers while in sleep mode. The time-
of-day alarm is intended to trigger single events.
Therefore, once it triggers, in the CLK_CTRL register, the
ADE bit is automatically cleared, disabling the time-of-
day alarm. Implement a recurring alarm with repeated
software writes over the serial interface each time the
time-of-day alarm triggers. The time-of-day alarm can
also be programmed to output at the UPIO pins.
When configured this way the MALD bit does not mask
the UPIO alarm output.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
41
Maxim Integrated
The CLK_CTR register contains the control bits for the
RTC alarms and clocks.
AWE: Alarm write-enable bit. Set AWE = 1 to write data
to the AL_DAY register as well as the ADE bit in this
register. When AWE = 0, all writes are prevented to the
AL_DAY register and the ADE bit in this register. A sec-
ond write to this register is required to change the value
of the ADE bit. The power-on default state is 0.
ADE: Alarm (time-of-day) enable bit. Set ADE = 1 to
enable the time-of-day alarm, and set ADE = 0 to dis-
able the time-of-day alarm. When enabled, the ALD bit
in the STATUS register asserts when the RTC second
counter time matches AL_DAY register. The device
wakes up from sleep to normal mode if not already
awake. The ADE bit can only be written if the AWE = 1
from a previous write. The power-on default state is 0.
RWE: RTC write-enable bit. Set RWE = 1 prior to writing
to the RTC register and the RTCE bit in this register. If
RWE = 0, all writes are prevented to the RTC register
as well as the RTCE bit in this register. The RWE signal
takes effect after the rising edge of the 16th clock;
therefore, a second write to this register is required to
change the value of the RTCE bit. The power-on default
state is 0.
RTCE: Real-time-clock enable bit. Set RTCE = 1 to
enable the RTC, and set RTCE = 0 to disable the RTC.
The RTC has a 32-bit second and an 8-bit subsecond
counter. The power-on default state is 1.
OSCE: 32kHz crystal-oscillator enable bit. Set OSCE =
1 to power up the 32kHz oscillator, and set OSCE = 0
to power down the oscillator. The power-on default
state is 1.
FLLE: Frequency-locked-loop enable bit. Set FLLE = 1
to enable the FLL, and set FLLE = 0 to disable the FLL.
If HFCE = 1 and FLLE = 0, the internal high-frequency
oscillator is enabled, but it is not frequency-locked to
the 32kHz clock. When FLLE is asserted, it typically
takes 3.5ms for the high-frequency clock to settle to
within 1% of the 32kHz reference clock frequency.
Switching the FLL on or off with this bit does not cause
high-frequency clock glitching. The power-on default
state is 1.
MSB
AWE ADE X RWE RTCE OSCE FLLE HFCE
LSB
CKSEL2 CKSEL1 CKSEL0 IO32E CK32E CLKE INTP WDE
CLK_CTRL Register (Power-On State: 00X0 1111 0010 1110)
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
42 Maxim Integrated
HFCE: High-frequency-clock enable bit. Set HFCE = 1
to enable the internal high-frequency clock source, and
set HFCE = 0 to disable the high-frequency clock
source.
If HFCE = 1 and CLKE = 1, the internal high-frequency
oscillator is enabled and is present at CLK. The power-
on default state is 1.
CKSEL<2:0>: Clock selection bits. These bits select
the FLL-based output clock frequency at the high-fre-
quency CLK pin as shown in Table 12. The power-on
default state is 001.
IO32E: Input/output 32kHz clock select bit. Set IO32E
= 0 to configure the CLK32K pin as an output, and set
IO32E = 1 to configure the CLK32K pin as an input,
regardless of the signal on the 32KIN pin as shown in
Table 13.
External clock frequencies applied to CLK32K are
clock sources to the FLL, charge pump, and the signal-
detect comparator. The default power-on state is 0.
CK32E: CLK32K output-buffer enable bit. Set CK32E =
1 to enable the CLK32K output buffer as long as OSCE
= 1 and IO32E = 0; otherwise the CK32E bit will not be
asserted. Set CK32E = 0 to disable the CLK32K output
buffer. The power-on default state is 1.
CLKE: CLK output-buffer enable bit. Set CLKE = 1 to
enable the CLK output buffer. Set CLKE = 0 to disable
the buffer. Disabling the buffer is useful for saving
power in cases where the high-frequency clock is used
internally but is not needed externally. If HFCE = 0, or if
CLKE = 0, CLK remains low. The power-on default
state is 1.
INTP: Interrupt pin polarity bit. Set INTP = 1 to make
INT an active-high output when asserted, and set INTP
= 0 to make INT an active-low output when asserted.
The power-on default state is 1.
WDE: Watchdog-enable bit. Set WDE = 1 to enable the
watchdog timer, which asserts RESET low within 500ms
if the WATCHDOG register is not written. Set WDE = 0
to disable the watchdog timer. The power-on default
state is 0.
CLK32K CLK32K IO32E 32KIN, 32KOUT RTC, PWM, WDT
CLOCK SOURCE
FLL, C/P, SDC INPUT
SOURCE ADC CLOCK SOURCE
Output 1 0 XTAL attached XTAL XTAL FLL/HFCLK
Input 0 1 XTAL attached XTAL CLK32K FLL/HFCLK
Table 13. Configuring the CLK32K as an Input or Output
CLOCK FREQUENCY
(kHz) CKSEL2 CKSEL1 CKSEL0
4915.2 0 0 0
2457.6 0 0 1
1228.8 0 1 0
614.4 0 1 1
32.768 1 0 0
16.384 1 0 1
8.192 1 1 0
4.096 1 1 1
Table 12. Setting the CLK Frequency
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
43
Maxim Integrated
The RTC register stores the 40-bit second and subsec-
ond count of the respective time-of-day and system
clocks.
SEC<31:0>: The second bits store the time-of-day
clock settings. It is a 32-bit binary counter with 1s reso-
lution that can keep time for a span of over 136 years.
Firmware in the µC can translate this time count to units
that are meaningful to the system (i.e., translate to cal-
endar time or as an elapsed time from some predefined
time = 0, such as January 1, 2000). The RTC runs con-
tinuously as long as RTCE = 1 (see the
CLK_CNTL
Register
section) and does not stop for reads or writes.
The counter increments when the subsecond counter
overflows. Set RWE = 1 to enable writing to the RTC
register. After writing to RWE, perform another write
and set RTCE = 1 to enable the RTC. A 40-bit burst
write operation, starting with SEC31 and finishing with
SUB0 is required to set the RTC second and subsec-
ond bits. If CS is brought high before the 40th rising
SCLK edge, the write is aborted and the RTC contents
are unchanged. The RTC register is loaded on the ris-
ing SCLK edge of the 40th bit (SUB0). A 40-bit burst
read operation, starting with SEC31 and finishing with
SUB0, is required to retrieve the current RTC second
and subsecond counts. The read command can be
aborted prior to receiving the 40th bit (SUB0) by raising
CS and any RTC data read to that point is valid. When
the read command is received, a snapshot of a valid
RTC second count is latched to avoid reading an erro-
neous, transitioning RTC value. Due to the asynchro-
nous nature of RTC reads, it is possible to have a
maximum 1s error between the actual and reported
times from the time-of-day clock. To prevent the data
from changing during a read operation, complete reads
of the RTC register in less than 1ms. The power-on
default state is 0000 0000 hex.
SUB<7:0>: The subsecond bits store the system clock.
This 8-bit binary counter has 3.9ms resolution (1/256Hz)
and a span of 1s. The subsecond counter increments in
single counts from 00 hex to FF hex before rolling over
again to 00 hex, at which time the RTC second counter
(SEC<31:0>) increments. The RTC runs continuously
(as long as RTCE = 1) and does not stop for reads or
writes. A 256Hz clock, derived from the 32kHz crystal,
increments this counter. Set the RWE = 1 bit to enable
writing to the RTC register. After writing to RWE, perform
another write, setting RTCE = 1, to enable the RTC. A
40-bit burst write operation, starting with SEC31 and fin-
ishing with SUB0, is required to set the RTC second and
subsecond bits. If CS is brought high before the 40th
rising SCLK edge, the write is aborted and the RTC con-
tents are unchanged. The RTC register is loaded on the
rising SCLK edge of the 40th bit (SUB0). A 40-bit burst
read operation, starting with SEC31 and finishing with
SUB0, is required to retrieve the current RTC second
and subsecond counts. The read command can be
aborted prior to receiving the 40th bit (SUB0) by raising
CS, and any RTC data read to that point is valid. When
the read command is received, a snapshot of a valid
RTC second count is latched to avoid reading an erro-
neous, transitioning RTC value. Due to the asynchro-
nous nature of RTC reads, it is possible to have a
maximum 1s error between the actual and reported
times from the time-of-day clock. To prevent the data
from changing during a read operation, complete reads
of the RTC registers occur in less than 1ms. The power-
on default state is 00 hex.
MSB
SEC31 SEC30 SEC29 SEC28 SEC27 SEC26 SEC25 SEC24
SEC23 SEC22 SEC21 SEC20 SEC19 SEC18 SEC17 SEC16
SEC15 SEC14 SEC13 SEC12 SEC11 SEC10 SEC9 SEC8
SEC7 SEC6 SEC5 SEC4 SEC3 SEC2 SEC1 SEC0
LSB
SUB7 SUB6 SUB5 SUB4 SUB3 SUB2 SUB1 SUB0
RTC Register (Power-On State: 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000)
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
44 Maxim Integrated
The PWM_CTRL register contains control bits for the 8-
bit PWM.
PWME: PWM-enable bit. Set PWME = 1 to enable the
internal PWM, and set PWME = 0 to disable the internal
PWM. Enable the high-frequency clock before enabling
the PWM when using input clock frequencies above
32.768kHz. The power-on default state is 0.
FSEL<2:0>: Frequency selection bits. Selects the PWM
input clock frequency as shown in Table 14. The
power-on default is 000.
SWAH: SWA-switch PWM-high control bit. Set SWAH =
1 to enable the PWM output to directly control the SWA
switch. When SWAH = SWAL, the PWM output is dis-
abled from controlling the SWA switch. When SWAH =
1, a PWM high output closes the SWA switch and a
PWM low output opens the SWA switch. The PWM high
output refers to the beginning of the period when the
output is logic-high. See Table 17 for more details. The
power-on default is 0.
SWAL: SWA-switch PWM-low control bit. Set SWAL = 1
to enable the inverted PWM output to directly control
the SWA switch. When SWAH = SWAL, the PWM output
is disabled from controlling the SWA switch. When
SWAL = 1, a PWM low output closes the SWA switch
and a PWM high output opens the SWA switch. The
PWM low output refers to the end of the period when
the output is logic-low. See Table 17 for more details.
The power-on default is 0.
SPD1: SPDT1-switch PWM drive control bit. Set SPD1
= 1 to enable the PWM output to directly control the
SPDT1 switch, and set SPD1 = 0 to disable the PWM
output controlling the SPDT1 switch. The SPDT1<1:0>
bits, the UPIO pins (if programmed), and the PWM out-
put (if enabled), determine the SPDT1-switch state. See
Table 18 for more details. The power-on default is 0.
SPD2: SPDT2-switch PWM drive control bit. Set SPD2
= 1 to enable the PWM output to directly control the
SPDT2 switch, and set SPD2 = 0 to disable the PWM
output controlling the SPDT2 switch. The SPDT2<1:0>
bits, the UPIO pins (if programmed), and the PWM out-
put (if enabled), determine the SPDT2-switch state. See
Table 19 for more details. The power-on default is 0.
MSB
PWME FSEL2 FSEL1 FSEL0 SWAH SWAL X X
LSB
SPD1 SPD2 X X X X X X
PWM_CTRL Register (Power-On State: 0000 0000 00XX XXXX)
PWM INPUT FREQUENCY*
(kHz) FSEL2 FSEL1 FSEL0
4915.2** 0 0 0
2457.6** 0 0 1
1228.8** 0 1 0
32.768 0 1 1
8.192 1 0 0
1.024 1 0 1
0.256 1 1 0
0.032 1 1 1
Table 14. Setting the PWM Frequency
*
The lower PWM frequencies are useful for power-supply duty
cycling to conserve battery life and enable a single-battery cell-
powered system. The higher frequencies allow reasonably small,
external components for RC filtering when used as a DAC for bias
adjustments.
**
When the part is in sleep mode, the HFCK is shut down. In this
case, PWM frequencies above 32kHz are not available (see
SPWME in the SLEEP_CFG Register section).
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
45
Maxim Integrated
The PWM_THTP register contains the bits that set the
PWM on-time and period.
PWMTH<7:0>: PWM time high bits. These bits define
the PWM on (or high) time and when combined with the
PWMTP<7:0> bits, they determine the duty cycle and
period. The on-time duty cycle is defined as:
(PWMTH<7:0> + 1)/(PWMTP<7:0> + 1)
To get 50% duty cycle, set PWMTH<7:0> to 127 deci-
mal and PWMTP<7:0> to 255 decimal. A 100% duty
cycle (i.e., always on) is possible with a value of
PWMTH<7:0> ≥PWMTP<7:0> > 0. A 0% duty cycle is
possible by setting PWMTH<7:0> = 0 or PWME = 0 in
the PWM_CTRL register. If the PWM is selected to drive
the UPIO_ pin(s), the ALH_ bit(s) (UPIO_CTRL register)
determine the on-time polarity at the beginning of the
PWM cycle. If ALH_ = 1, the on-time at the start of the
PWM period causes a logic-high level (DVDD or
CPOUT) at the UPIO_ pin. When ALH_ = 0, it causes a
logic-low level (DGND) during the on-time. When the
PWM output drives the SWA/B switches, the SWA(B)H
or SWA(B)L bits in the PWM_CTRL register determine
which PWM phase closes these switches. The SPDT1
and SPDT2 switches do not have PWM polarity inver-
sion bits (see the SPDT1<1:0> and SPDT2<1:0> bit
descriptions in the
SW_CTRL Register
section), but
their effective polarity is set by how the switches are
connected externally. The power-on default is 00 hex.
PWMTP<7:0>: PWM time period bits. These bits con-
trol the PWM output period defined. The PWM output
period is defined as:
(PWMTP<7:0> + 1)/(PWM input frequency)
Set the PWM input frequency by selecting the
FSEL<2:0> bits as described in Table 14. The power-
on default is 00 hex.
WATCHDOG Register (Power-On State: N/A)
Writing to the WATCHDOG register address sets the
watchdog timer to 0ms. If the watchdog is enabled
(WDE = 1) and the WATCHDOG register is not written
to before the 750ms expiration, RESET asserts low for
250ms and the watchdog timer restarts at 0ms when
the watchdog timer is enabled. There are no data bits
for this register, and the watchdog timer is reset on the
rising edge of SCLK during the ADR0 bit in the
WATCHDOG register address control byte. Figure 17
shows an example of watchdog timing.
NORM_MD Register (Power-On State: N/A)
Exit sleep mode and enter normal mode by writing to
the NORM_MD register. The specific normal-mode
state of all circuit blocks is set by the user, who must
configure the individual power-enable bits before enter-
ing sleep mode (Table 15). There are no data bits for
this register, and normal mode begins on the rising
edge of SCLK during the ADR0 bit in the NORM_MD
register address control byte.
SLEEP Register (Power-On State: N/A)
Enter sleep mode by writing to the SLEEP register. This
low-power state overrides most of the normal power-
control bits. Table 15 shows which functions are off,
which functions are unaffected (ADE, RTCE, LSDE, and
HYSE), and which functions are controlled by special
sleep-mode bits (SOSCE, SCK32E, and SPWME) while
in sleep mode. There are no data bits for this register,
and sleep mode begins on the rising edge of SCLK
during the ADR0 bit in the SLEEP register address con-
trol byte.
MSB
PWMTH7 PWMTH6 PWMTH5 PWMTH4 PWMTH3 PWMTH2 PWMTH1 PWMTH0
LSB
PWMTP7 PWMTP6 PWMTP5 PWMTP4 PWMTP3 PWMTP2 PWMTP1 PWMTP0
PWM_THTP Register (Power-On State: 0000 0000 0000 0000)
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
46 Maxim Integrated
REGISTER
NAME
CIRCUIT BLOCK
DESCRIPTION POR DEFAULT NORMAL MODE SLEEP
ADC ADC ADCE = 0 ADCE Off
DACA/OP3 DAE/OP3E = 0 DAE/OP3E Off
DACA_OP OP1 OP1E = 0 OP1E Off
Reference Buffer Gain
and Enable REFV<1:0> = 00 REFV<1:0> Off
REF_SDC
Signal-Detect Comparator SDCE = 0 SDCE Off
Time-of-Day Alarm Enable ADE = 0 ADE ADE
RTC RTCE = 1 RTCE RTCE
CK32 Xtal Oscillator OSCE = 1 OSCE SOSCE
CK32 Output Buffer CK32E = 1 CK32E SCK32E
High-Frequency Clock HFCE = 1 HFCE Off
High-Frequency Clock Output
Buffer CLKE = 1 CLKE Off
FLL Enable FLLE = 1 FLLE Off
CLK_CTRL
Watchdog Timer WDE = 0 WDE Off
PWM_CTRL PWM PWME = 0 PWME SPWME
Linear Regulator LDOE = 0 LDOE Off
Charge-Pump Doubler CPE = 0 CPE Off
CPOUT Voltage Monitor CPDE = 0 CPDE Off
1.8V DVDD Monitor LSDE = 1 LSDE LSDE
PS_VMONS
1.8V Monitor Hysteresis HYSE = 0 HYSE HYSE
TEMP_CTRL Temperature Sense Source IMUX<1:0> = 00 IMUX<1:0> Off
UPIO_ Function UP_MD<3:0> = 0 hex UP_MD<3:0> UP_MD<3:0>
UPIO_ Pullup PUP_ = 1 PUP_ PUP_
UPIO_ Supply Voltage SV_ = 0 SV_ SV_
UPIO_CTRL
UPIO_ Assertion Level ALH_ = 0 ALH_ ALH_
Table 15. Normal-Mode and Sleep-Register Summary
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
47
Maxim Integrated
The SLEEP_CFG register allows users to program spe-
cific behavior for the 32kHz oscillator, buffer, and PWM
in sleep mode. It also contains a sleep-control bit (SLP)
to enable sleep mode.
SLP (ADR0): Sleep bit. The SLP bit is the LSB in the
SLEEP_CFG address control byte. Set SLP = 1 to
assert the SHDN bit and enter sleep mode. Writing the
register with SLP = 0 or reading with SLP = 0 or SLP =
1 has no effect on the SHDN bit.
SOSCE: Sleep-mode 32kHz crystal oscillator enable
bit. SOSCE = 1 enables the 32kHz oscillator in sleep
mode, and SOSCE = 0 disables it in sleep mode,
regardless of the state of the OSCE bit. The power-on
default is 1.
SCK32E: Sleep-mode CK32K-pin output-buffer enable
bit. SCK32E = 1 enables the 32kHz output buffer in
sleep mode, and SCK32E = 0 disables it in sleep
mode, regardless of the state of the CK32E bit. The
power-on default is 1.
SPWME: Sleep-mode PWM enable bit. SPWME = 1
enables the internal PWM in sleep mode, and SPWME
= 0 disables it in sleep mode, regardless of the state of
the PWME bit.
Input frequencies are limited to 32.768kHz or lower
since the high-frequency clock is disabled in sleep
mode. SOSCE must be asserted to have 32kHz avail-
able as an input to the PWM. The power-on default is 0.
SHDN: Shutdown bit. This bit is read only. SHDN is
asserted by writing to the SLEEP register address or by
writing to the SLEEP_CFG register with SLP = 1. When
SHDN is asserted, the device is in sleep mode even if
the SLEEP or SLEEP function on the UPIO is deassert-
ed. The SHDN bit is deasserted by writing to the
NORM_MD register or by other defined events. Events
that cause SHDN to be deasserted are a day alarm or
an edge on the UPIO wake-up pin causing wake-up to
be asserted. The power-on default is 0.
MSB LSB
SLP (ADR0) SOSCE SCK32E SPWME SHDN X X X X
SLEEP_CFG Register (Power-On State: 1100 XXXX)
4Hz CLOCK
2-BIT COUNTER X
WDE = 1
012 3
RESET WATCHDOG
ADDRESS
01 2
WATCHDOG
ADDRESS
WATCHDOG
ADDRESS
01 0120
750ms
250ms
SPI WRITES
DQ
Q
R
CK
DQ
Q
R
CK
DIVIDE-
BY-8192
32K
WDE
POR
WDW WATCHDOG TIMER
4Hz
RESET
Figure 17. Watchdog Timer Architecture
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
48 Maxim Integrated
MSB LSB
UP4MD3 UP4MD2 UP4MD1 UP4MD0 PUP4 SV4 ALH4 LL4
UPIO4_CTRL Register (Power-On State: 0000 1000)
MSB LSB
UP3MD3 UP3MD2 UP3MD1 UP3MD0 PUP3 SV3 ALH3 LL3
UPIO3_CTRL Register (Power-On State: 0000 1000)
UPIO3_CTRL register. This register configures the
UPIO3 pin functionality.
UP3MD<3:0>: UPIO3-mode selection bits. These bits
configure the mode for the UPIO3 pin. See Table 16 for
a detailed description. The power-on default is 0 hex.
PUP3: Pullup UPIO3 control bit. Set PUP3 = 1 to enable
a weak pullup resistor on the UPIO3 pin, and set PUP3
= 0 to disable it. The pullup resistor is connected to
either DVDD or CPOUT as programmed by the SV3 bit.
The pullup is enabled only when UPIO3 is configured as
an input. Open-drain behavior can be simulated at
UPIO3 by setting the mode to GPO with LL3 = 0 and by
changing the mode to GPI with PUP3 = 0, allowing
external high pullup. The power-on default is 1.
SV3: Supply-voltage UPIO3 selection bit. Set SV3 = 0
to select DVDD as the supply voltage for the UPIO3 pin,
and set SV3 = 1 to select CPOUT as the supply volt-
age. The selected supply voltage applies to all modes
for the UPIO3 pin. The power-on default is 0.
ALH3: Active logic-level assertion high UPIO3 bit. Set
ALH3 = 0 to define the input or output assertion level
for UPIO3 as low except when in GPI and GPO modes.
Set ALH3 = 1 to define the input or output assertion
level as high. For example, asserting ALH3 defines the
UPIO3 output signal as ALARM, while deasserting
ALH3 defines it as ALARM. Similarly, asserting ALH3
defines the UPIO3 input signal as WU, while deassert-
ing ALH3 defines it as WU. The power-on default is 0.
LL3: Logic-level UPIO3 bit. When UPIO3 is configured
as GPO, LL3 = 0 sets the output to a logic-low and LL3
= 1 sets the output to a logic-high. A read of LL3
returns the voltage level at the UPIO3 pin at the time of
the read, regardless of how it is programmed. The
power-on default is 0.
UPIO4_CTRL register. This register configures the
UPIO4 pin functionality.
UP4MD<3:0>: UPIO4-mode selection bits. These bits
configure the mode for the UPIO4 pin. See Table 16 for
a detailed description. The power-on default is 0 hex.
PUP4: Pullup UPIO4 control bit. Set PUP4 = 1 to enable
a weak pullup resistor on the UPIO4 pin, and set PUP4
= 0 to disable it. The pullup resistor is connected to
either DVDD or CPOUT as programmed by the SV4 bit.
The pullup is enabled only when UPIO4 is configured as
an input. Open-drain behavior can be simulated at
UPIO4 by setting the mode to GPO with LL4 = 0 and by
changing the mode to GPI with PUP4 = 0, allowing
external high pullup. The power-on default is 1.
SV4: Supply-voltage UPIO4 selection bit. Set SV4 = 0
to select DVDD as the supply voltage for the UPIO4
pin, and set SV4 = 1 to select CPOUT as the supply
voltage. The selected supply voltage applies to all
modes for the UPIO4 pin. The power-on default is 0.
ALH4: Active logic-level assertion high UPIO4 bit. Set
ALH4 = 0 to define the input or output assertion level
for UPIO4 as low except when in GPI and GPO modes.
Set ALH4 = 1 to define the input or output assertion
level as high. For example, asserting ALH4 defines the
UPIO4 output signal as ALARM, while deasserting
ALH4 defines it as ALARM. Similarly, asserting ALH4
defines the UPIO4 input signal as WU, while deassert-
ing ALH4 defines it as WU. The power-on default is 0.
LL4: Logic-level UPIO4 bit. When UPIO4 is configured
as GPO, LL4 = 0 sets the output to a logic-low and LL4
= 1 sets the output to a logic-high. A read of LL4
returns the voltage level at the UPIO4 pin at the time of
the read, regardless of how it is programmed. The
power-on default is 0.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
49
Maxim Integrated
UPIO2_CTRL register. This register configures the
UPIO2 pin functionality.
UP2MD<3:0>: UPIO2-mode selection bits. These bits
configure the mode for the UPIO2 pin. See Table 16 for
a detailed description. The power-on default is 0 hex.
PUP2: Pullup UPIO2 control bit. Set PUP2 = 1 to enable
a weak pullup resistor on the UPIO2 pin, and set PUP2
= 0 to disable it. The pullup resistor is connected to
either DVDD or CPOUT as programmed by the SV2 bit.
The pullup is enabled only when UPIO2 is configured as
an input. Open-drain behavior can be simulated at
UPIO2 by setting the mode to GPO with LL2 = 0 and by
changing the mode to GPI with PUP2 = 0, allowing
external high pullup. The power-on default is 1.
SV2: Supply-voltage UPIO2 selection bit. Set SV2 = 0
to select DVDD as the supply voltage for the UPIO2
pin, and set SV2 = 1 to select CPOUT as the supply
voltage. The selected supply voltage applies to all
modes for the UPIO2 pin. The power-on default is 0.
ALH2: Active logic-level assertion high UPIO2 bit. Set
ALH2 = 0 to define the input or output assertion level
for UPIO2 as low except when in GPI and GPO modes.
Set ALH2 = 1 to define the input or output assertion
level as high. For example, asserting ALH2 defines the
UPIO2 output signal as ALARM, while deasserting
ALH2 defines it as ALARM. Similarly, asserting ALH2
defines the UPIO2 input signal as WU, while deassert-
ing ALH2 defines it as WU. The power-on default is 0.
LL2: Logic-level UPIO2 bit. When UPIO2 is configured
as GPO, LL2 = 0 sets the output to a logic-low and LL2
= 1 sets the output to a logic-high. A read of LL2
returns the voltage level at the UPIO2 pin at the time of
the read, regardless of how it is programmed. The
power-on default is 0.
UPIO1_CTRL register. This register configures the
UPIO1 pin functionality.
UP1MD<3:0>: UPIO1-mode selection bits. These bits
configure the mode for the UPIO1 pin. See Table 16 for
a detailed description. The power-on default is 0 hex.
PUP1: Pullup UPIO1 control bit. Set PUP1 = 1 to enable
a weak pullup resistor on the UPIO1 pin, and set PUP1
= 0 to disable it. The pullup resistor is connected to
either DVDD or CPOUT as programmed by the SV1 bit.
The pullup is enabled only when UPIO1 is configured as
an input. Open-drain behavior can be simulated at
UPIO1 by setting the mode to GPO with LL1 = 0 and by
changing the mode to GPI with PUP1 = 0, allowing
external high pullup. The power-on default is 1.
SV1: Supply-voltage UPIO1 selection bit. Set SV1 = 0
to select DVDD as the supply voltage for the UPIO1
pin, and set SV1 = 1 to select CPOUT as the supply
voltage. The selected supply voltage applies to all
modes for the UPIO1 pin. The power-on default is 0.
ALH1: Active logic-level assertion high UPIO1 bit. Set
ALH1 = 0 to define the input or output assertion level
for UPIO1 as low except when in GPI and GPO modes.
Set ALH1 = 1 to define the input or output assertion
level as high. For example, asserting ALH1 defines the
UPIO1 output signal as ALARM, while deasserting
ALH1 defines it as ALARM. Similarly, asserting ALH1
defines the UPIO1 input signal as WU, while deassert-
ing ALH1 defines it as WU. The power-on default is 0.
LL1: Logic-level UPIO1 bit. When UPIO1 is configured
as GPO, LL1 = 0 sets the output to a logic-low and LL1
= 1 sets the output to a logic-high. A read of LL1
returns the voltage level at the UPIO1 pin at the time of
the read, regardless of how it is programmed. The
power-on default is 0.
MSB LSB
UP2MD3 UP2MD2 UP2MD1 UP2MD0 PUP2 SV2 ALH2 LL2
UPIO2_CTRL Register (Power-On State: 0000 1000)
MSB LSB
UP1MD3 UP1MD2 UP1MD1 UP1MD0 PUP1 SV1 ALH1 LL1
UPIO1_CTRL Register (Power-On State: 0000 1000)
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
50 Maxim Integrated
MODE
UP4MD<3:0>, UP3MD<3:0>,
UP2MD<3:0>, UP1MD<3:0> MAX11359A DESCRIPTION
0000 GPI General-purpose digital input. Active edges detected by UPR_ or UPF_ status
register bits. ALH_ has no effect with this setting.
0001 GPO General-purpose digital output. Logic level set by LL_ bit. ALH_ has no effect with
this setting.
0010SWA or SWA Digital input. DAC A buffer switch control. See the SWA bit description in the
SW_CTRL Register section.
0011 Reserved Reserved. Do not use these settings.
0100 SPDT1 or
SPDT1
D i g i tal i np ut. S P D T1 sw i tch contr ol . S ee the S P D T1< 1:0> b i t d escr i p ti on i n the
S W _C TRL Reg i ster secti on.
0101 SPDT2 or
SPDT2
D i g i tal i np ut. S P D T2 sw i tch contr ol . S ee the S P D T2< 1:0> b i t d escr i p ti on i n the
S W _C TRL Reg i ster secti on.
0110 SLEEP or
SLEEP
Sleep-mode digital input. Overrides power-control register and puts the part into
sleep mode when asserted. When deasserted, power mode is determined by the
SHDN bit.
0111WU or WU Wake-up digital input. Asserted edge clears SHDN bit.
1000
1001
1010
Reserved Reserved. Do not use these settings.
1011PWM or PWM
PWM digital output. Signal defined by the PWM_CTRL register. PWM on (or high or
“1”); assertion level defined by the ALH_ bit. When PWM is disabled (PWME = 0),
the UPIO pin idles high (DVDD or CPOUT) if ALH = 1, and low (DGND) if ALH = 0.
1100 SHDN or
SHDN
Power-supply shutdown digital output. Equivalent to SHDN bit. Power-on default of
GPI with pullup ensures initial power-supply turn-on when UPIO is connected to a
power supply with a SHDN input.
1101AL_DAY or
AL_DAY
RTC alarm digital output. Asserts for time-of-day alarm events; equivalent to ALD in
STATUS register.
1110 Reserved Reserved. Do not use these settings.
1111DRDY or DRDY ADC data-ready digital output. Asserts when analog-to-digital conversion or
calibration completes. Not masked by MADD bit.
Table 16. UPIO Mode Configuration
Note: When multiple UPIO inputs are configured for the same input function, the inputs are OR’ed together.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
51
Maxim Integrated
UPIO_SPI pass-through control register. These bits
map the serial interface signals to the UPIO pins, allow-
ing the DAS to drive other devices at CPOUT or DVDD
voltage levels, depending on the SV_ bit setting found
in the UPIO_CTRL register. Individual bits are provided
to set only the desired UPIO inputs to the SPI pass-
through mode. This mode becomes active when CS is
driven high to complete the write to this register, and
remains active as long as CS stays high (i.e., multiple
pass-through writes are possible). The SPI pass-
through mode is deactivated immediately when CS is
pulled low for the next DAS write.
The UPIO_ state (both before and after the SPI pass-
through mode) is set by the UP_MD<3:0> and LL_ bits.
When a UPIO is configured for SPI pass-through mode
and the CS is high, UPR_, UPF_, and LL_ continue to
detect UPIO_ edges, which can still generate interrupts.
See Figure 19 for an SPI pass-through timing diagram.
UP4S: UPIO4 SPI pass-through-mode enable bit. A
logic 1 maps the inverted CS signal to the UPIO4 pin.
Therefore, UPIO4 is low (near DGND) when SPI pass-
through mode is active, and is high (near DVDD or
CPOUT) when the mode is inactive. A logic 0 disables
the UPIO4 SPI pass-through mode. The power-on
default is 0.
UP3S: UPIO3 SPI pass-through-mode enable bit. A
logic 1 maps the SCLK signal to UPIO3 (directly with no
inversion), while a logic 0 disables the UPIO3 SPI pass-
through mode. The power-on default is 0.
UP2S: UPIO2 SPI pass-through-mode enable bit. A
logic 1 maps the DIN signal to UPIO2 (directly with no
inversion), while a logic 0 disables the UPIO2 SPI pass-
through mode. The power-on default is 0.
UP1S: UPIO1 SPI pass-through-mode enable bit. A
logic 1 maps the UPIO1 input signal to DOUT (directly
with no inversion), while a logic 0 disables the UPIO1
SPI pass-through mode. The power-on default is 0.
MSB LSB
UP4S UP3S UP2S UP1S X X X X
UPIO_SPI Register (Power-On State: 0000 XXXX)
CS WRITE TO DAS TO ENABLE SPI MODE WRITE THROUGH DAS TO UPIO DEVICE NORMAL WRITE TO DAS
SCLK
DIN DNDN-1 DN-2 DN-3 D3D2D1D0ENEN-1 EN-2 EN-3 X X X X
ENEN-1 EN-2 EN-3 X X X X
D7D6D5D4D3D2D1D0
DOUT E3E2E1E0
E3E2E1E0
UPIO4 SET BY UPIO4_CTRL REGISTER SET BY UPIO4_CTRL REGISTER
UPIO3 SET BY UPIO3_CTRL REGISTER SET BY UPIO3_CTRL REGISTER
UPIO2 SET BY UPIO2_CTRL REGISTER SET BY UPIO2_CTRL REGISTER
UPIO1 SET BY UPIO1_CTRL REGISTER SET BY UPIO1_CTRL REGISTER
Figure 18. SPI Pass-Through Timing Diagram
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
52 Maxim Integrated
The switch-control register controls the two SPDT
switches (SPDT1 and SPDT2) and the DACA output
buffer SPST switch (SWA). Control this switch by the
serial bits in this register, by any of the UPIO pins that
are enabled for that function, or by the PWM.
SWA: DACA output buffer SPST-switch A control bit.
The SWA bit, the UPIO inputs (if configured), and the
PWM (if configured) control the state of the SWA switch
as shown in Table 17. The UPIO_ states of 0 and 1 in the
table correspond to respective deasserted and asserted
logic states as defined by the ALH_ bit of the
UPIO_CTRL register. If a UPIO is not configured for this
mode, its value applied to the table is 0. The PWM states
of 0 and 1 in the table correspond to the respective
PWM off (or low) and on (or high) states defined by the
SWAH and SWAL bits (see the
PWM_CTRL Register
section). If the PWM is not configured for this mode, its
value applied to the table is 0. The power-on default is 0.
SPDT1<1:0>: Single-pole double-throw switch 1 control
bits. The SPDT1<1:0> bits, the UPIO pins (if config-
ured), and the PWM (if configured) control the state of
the switch as shown in Table 18. The UPIO_ states of 0
and 1 in the table correspond to respective deasserted
and asserted logic states as defined by the ALH_ bit of
the UPIO_CTRL register. If a UPIO is not configured for
this mode, its value applied to Table 18 is 0. The PWM
states of 0 and 1 in Table 18 correspond to the respec-
tive PWM off (low) and on (high) states defined by the
SPD1 bit in the PWM_CTRL register. If the PWM is not
configured for this mode, its value applied to Table 18
is 0. The power-on default is 00.
SPDT2<1:0>: Single-pole double-throw switch 2 control
bits. The SPDT2<1:0> bits, the UPIO pins (if config-
ured), and the PWM (if configured) control the state of
the switch as shown in Table 19. The UPIO_ states of 0
and 1 in the table correspond to respective deasserted
and asserted logic states as defined by the ALH_ bit in
the UPIO_CTRL register. If a UPIO is not configured for
this mode, its value applied to Table 19 is 0. The PWM
states of 0 and 1 in Table 19 correspond to the respec-
tive PWM off (low) and on (high) states defined by the
SPD2 bit in the PWM_CTRL register. If the PWM is not
configured for this mode, its value applied to Table 19 is
0. The power-on default is 00.
MSB LSB
SWA X SPDT11 SPDT10 SPDT21 SPDT20 X X
SW_CTRL Register (Power-On State: 0000 00XX)
SWA BIT* UPIO_* PWM* SWA SWITCH STATE
0 0 0 Switch open
X X 1 Switch closed
X 1 X Switch closed
1 X X Switch closed
Table 17. SWA States
X = Don’t care.
*
Switch SW_ control is effectively an OR of the SW_ bit, UPIO
pins, and PWM.
SPDT1<1:0> UPIO_* PWM* SPDT1 SWITCH STATE
0 0 0 0 SNO1 open, SNC1 open
0 X X 1 SNO1 closed, SNC1 closed
0 X 1 X SNO1 closed, SNC1 closed
0 1 X X SNO1 closed, SNC1 closed
1 0 0 0 SNC1 closed, SNO1 open
1 X X 1 SNC1 open, SNO1 closed
1 X 1 X SNC1 open, SNO1 closed
1 1 X X SNC1 open, SNO1 closed
Table 18. SPDT Switch 1 States
X = Don’t care.
*
Switch SPDT1 control is effectively an OR of the SPDT10 bit, the
UPIO pins, and the PWM output. The SPDT11 bit determines if
the switches open and close together or if they toggle.
SPDT2<1:0> UPIO_* PWM* SPDT2 SWITCH STATE
0 0 0 0 SNO2 open, SNC2 open
0 X X 1 SNO2 closed, SNC2 closed
0 X 1 X SNO2 closed, SNC2 closed
0 1 X X SNO2 closed, SNC2 closed
1 0 0 0 SNC2 closed, SNO2 open
1 X X 1 SNC2 open, SNO2 closed
1 X 1 X SNC2 open, SNO2 closed
1 1 X X SNC2 open, SNO2 closed
Table 19. SPDT Switch 2 States
X = Don’t care.
*
Switch SPDT2 control is effectively an OR of the SPDT20 bit, the
UPIO pins, and the PWM output. The SPDT21 bit determines if
the switches open and close together or if they toggle.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
53
Maxim Integrated
This register is the internal temperature sensor calibra-
tion register.
TGAIN<7:0>: Factory-preset temperature gain correction
coefficient bits. This is the linear scaling factor used to
derive absolute temperature values from temperature val-
ues measured with the internal temperature sensor
(TACTUAL = TMEAS x TGAIN + TOFFS). The coefficients are
optimized for an internal voltage reference of 1.25V using
the four-current method. The power-on default varies.
TOFFS<5:0>: Factory-preset temperature offset cor-
rection coefficient bits. This is the linear offset factor
used to derive absolute temperature values from tem-
perature values measured with the internal temperature
sensor (TACTUAL = TMEAS x TGAIN + TOFFS). The coeffi-
cients are optimized for an internal voltage reference of
1.25V using the four-current method. The power-on
default varies.
The temperature-sensor control register controls the
internal and external temperature measurement.
IMUX<1:0>: Internal current-source MUX bits. Selects
the pin to be driven by the internal current sources as
shown in Table 20. The power-on default is 00.
IVAL<1:0>: Internal current-source value bits. Selects
the value of the internal current source as shown in
Table 21. The power-on default is 00.
MSB LSB
IMUX1 IMUX0 IVAL1 IVAL0 X X X X
TEMP_CTRL Register (Power-On State: 0000 XXXX)
CURRENT SOURCE IMUX1 IMUX0
Disabled 0 0
Internal temperature sensor 0 1
AIN1 1 0
AIN2 1 1
Table 20. Selecting Internal Current Source
CURRENT TYPICAL CURRENT (µA) IVAL1 IVAL0
I1400
I260 0 1
I364 1 0
I4120 1 1
Table 21. Setting the Current Level
MSB
TGAIN7 TGAIN6 TGAIN5 TGAIN4 TGAIN3 TGAIN2 TGAIN1 TGAIN0
LSB
TOFFS5 TOFFS4 TOFFS3 TOFFS2 TOFFS1 TOFFS0 X X
TEMP_CAL Register (Power-On State: Varies By Factory Calibration)
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
54 Maxim Integrated
MSB
MLDVD MLCPD MADO MSDC MCRDY MADD MALD X
LSB
MUPR4 MUPR3 MUPR2 MUPR1 MUPF4 MUPF3 MUPF2 MUPF1
IMSK Register (Power-On State: 1111 011X 1111 1111)
MSB LSB
LDOE CPE LSDE CPDE HYSE RSTE X X
PS_VMONS Register (Power-On State: 0010 01XX)
This register is the power-supply and voltage monitors
control register.
LDOE: Low-dropout linear-regulator enable bit. Set
LDOE = 1 to enable the low-dropout linear regulator to
provide the internal source voltage for the charge
pump. Set LDOE = 0 to disable the LDO, allowing an
external drive to the charge-pump input through REG.
The power-on default value is 0.
CPE: Charge-pump enable bit. Set CPE = 1 to enable the
charge-pump doubler, and set CPE = 0 to disable the
charge-pump doubler. The power-on default value is 0.
LSDE: DVDD low-supply voltage-detector power-
enable bit. Set LSDE = 1 to enable the +1.8V (DVDD)
low-supply-voltage detector, and set LSDE = 0 to
disable the DVDD low-supply-voltage detector. The
power-on default value is 1.
CPDE: CPOUT low-supply voltage-detector power-
enable bit. Set CPDE = 1 to enable the +2.7V CPOUT
low-supply voltage-detector comparator, and set CPDE
= 0 to disable the CPOUT low-supply voltage-detector
comparator. The power-on default value is 0.
HYSE: DVDD low-supply voltage-detector hysteresis-
enable bit. Set HYSE = 1 to set the hysteresis for the
+1.8V (DVDD) low-supply-voltage detector to +200mV,
and set HYSE = 0 to set the hysteresis to +20mV. On initial
power-up, the hysteresis is +20mV and can be pro-
grammed to 200mV once RESET goes high. Once pro-
grammed to +200mV, the DVDD falling threshold is +1.8V
nominally and the rising threshold is +2.0V nominally. The
The IMSK register determines which bits of the STATUS
register generate an interrupt on INT. The bits in this
register do not mask output signals routed to UPIO
since the output signals are masked by disabling that
UPIO function.
MLDVD: LDVD status bit mask. Set MLDVD = 0 to
enable the LDVD status bit interrupt to INT, and set
MLDVD = 1 to mask the LDVD status bit interrupt. The
power-on default value is 1.
MLCPD: LCP status bit mask. Set MLCPD = 0 to
enable the LCP status bit interrupt to INT, and set
MLCPD = 1 to mask the LCP status bit interrupt. The
power-on default value is 1.
MADO: ADO status bit mask. Set MADO = 0 to enable
the ADO status bit interrupt to INT, and set MADO = 1
to mask the ADO status bit interrupt. The power-on
default value is 1.
MSDC: SDC status bit mask. Set MSDC = 0 to enable
the SDC status bit interrupt to INT, and set MSDC = 1
to mask the SDC status bit interrupt. The power-on
default value is 1.
MCRDY: CRD status bit mask. Set MCRDY = 0 to
enable the CRDY status bit interrupt to INT, and set
MCRDY = 1 to mask the CRDY status bit interrupt. The
power-on default value is 0.
MADD: ADD status bit mask. Set MADD = 0 to enable
the ADD status bit interrupt to INT, and set MADD = 1
to mask the ADD status bit interrupt. The power-on
default value is 1.
MALD: ALD status bit mask. Set MALD = 0 to enable
the ALD status bit interrupt to INT, and set MALD = 1 to
mask the ALD status bit interrupt. The power-on default
value is 1.
MUPR<4:1>: UPR<4:1> status bits mask. Set MUPR_ =
0 to enable the UPR_ status bit interrupt to INT, and set
MUPR_ = 1 to mask the UPR_ status bit interrupt. (_ =
1, 2, 3, or 4 and corresponds to the UPIO1, UPIO2,
UPIO3, or UPIO4 pins, respectively.) The power-on
default value is F hex.
MUPF<4:1>: UPF<4:1> status bits mask. Set MUPF_ =
0 to enable the UPF_ status bit interrupt to INT, and set
MUPF_ = 1 to mask the UPF_ status bit interrupt. (_ = 1,
2, 3, or 4 and corresponds to the UPIO1, UPIO2,
UPIO3, or UPIO4 pins, respectively.) The power-on
default value is F hex.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
55
Maxim Integrated
The STATUS register contains the status bits of events in
various system blocks. Any status bits not masked in the
IMSK register cause an interrupt on INT. Some of the
status bit setting events (GPI, WAKEUP, ALARM, DRDY)
can be directed to UPIO_ to provide multiple µC inter-
rupt inputs. There are no specific mask bits for the UPIO
interrupt signals since the bits are effectively masked by
selecting a different function for UPIO. The STATUS bits
always record the triggering event(s), even for masked
bits, which do not generate an interrupt on INT. It is pos-
sible to set multiple STATUS bits during a single INT
interrupt event. Clear all STATUS bits except for ADD
and ADOU by reading the STATUS register. During a
STATUS register read, INT deasserts when the first
STATUS data bit (LDVD) reads out (9th rising SCLK) and
remains deasserted until shortly after the last STATUS
data bit (~15ns). At this point, INT reasserts if any
STATUS bit is set during the STATUS register read. If the
STATUS register is partially read (i.e., the read is aborted
midway), none of the STATUS bits are cleared. New
events occurring during a STATUS register read, or
events that persist after reading the STATUS bits result in
another interrupt immediately after the STATUS register
read finishes. This is a read-only register.
LDVD: Low DVDD voltage-detector status bit. LDVD =
1 indicates DVDD is below the +1.8V threshold; other-
wise LDVD = 0. LDVD clears during the STATUS register
read as long as the condition does not persist.
Otherwise, the LDVD bit reasserts immediately. If the
DVDD low voltage detector is disabled, LDVD = 0. The
power-on default is 0.
LCPD: Low CPOUT voltage-detector status bit. LCPD =
1 indicates CPOUT is below the +2.7V threshold; other-
wise LCPD = 0. LCPD clears during the STATUS regis-
ter read as long as the condition does not persist.
Otherwise the LCPD bit reasserts immediately. LCPD =
0 when the CPOUT low voltage detector is disabled.
The power-on default is 0.
ADOU: ADC overflow/underflow status bit. ADOU = 1
indicates an ADC underflow or overflow condition in the
current ADC result. New conversions that are valid
clear the ADOU bit. ADOU = 0 when the ADC data is
valid or the ADC is disabled (ADCE = 0). An underflow
condition occurs when the ADC data is theoretically
less than 0000 hex in unipolar mode and less than
8000 hex in bipolar mode. An overflow condition occurs
when the ADC data is theoretically greater than FFFF
hex in unipolar mode and greater than 7FFF hex in
bipolar mode. Use this bit to determine the validity of
an ADC result at the maximum or minimum code values
(i.e., 0000 hex or FFFF hex for unipolar mode and 8000
hex and 7FFF hex for bipolar mode). The power-on
default is 0. Reading the STATUS register does not
clear the ADOU bit.
SDC: Signal-detect comparator status bit. When SDC =
1, the positive input to the signal-detect comparator
exceeds the negative input plus the programmed thresh-
old voltage. The SDC bit clears during the STATUS regis-
ter read unless the condition remains true. The SDC bit
also deasserts when the signal-detect comparator pow-
ers down (SDCE = 0). The power-on default is 0.
CRDY: High-frequency-clock ready status bit. CRDY =
1 indicates a locked high-frequency clock to the 32kHz
reference frequency by the FLL. The CRDY bit clears
during the STATUS register read. This bit only asserts
after power-up or after enabling the FLL using the FLLE
bit. The power-on default is 0.
ADD: ADC-done status bit. ADD = 1 indicates a com-
pleted ADC conversion or calibration. Clear the ADD bit
by reading the appropriate ADC data, offset, or gain-cali-
bration registers. The ADC status bit also clears when a
new ADC result updates to the data or calibration regis-
ters (i.e., it follows the assertion level of the UPIO =
DRDY signal). Reading the STATUS register does not
clear this bit. This bit is equivalent to the DRDY signal
available through UPIO_. The power-on default is 0.
hysteresis helps eliminate chatter when running directly off
unregulated batteries. If DVDD falls below +1.3V (typ), the
power-on reset circuitry is enabled and the HYSE bit is
deasserted setting the hysteresis back to +20mV. The
power-on default is 0.
RSTE: RESET output enable bit. Set RSTE = 1 to
enable RESET to be controlled by the +1.8V DVDD low-
supply-voltage detector, and set RSTE = 0 to disable
this control. The power-on default is 1.
MSB
LDVD LCPD ADOU SDC CRDY ADD ALD X
LSB
UPR4 UPR3 UPR2 UPR1 UPF4 UPF3 UPF2 UPF1
STATUS Register (Power-On State: 0000 000X 0000 0000)
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
56 Maxim Integrated
ALD: Alarm (day) status bit. ALD = 1 when the value
programmed in ASEC<19:0> in the AL_DAY register
matches SEC<19:0> in the RTC register. Clear the ALD
bit by reading the STATUS register or by disabling the
day alarm (ADE = 0). The power-on default is 0.
UPR<4:1>: User-programmable I/O rising-edge status
bits. UPR_ = 1 indicates a rising edge on the respec-
tive UPIO_ pin has occurred. Clear UPR_ by reading
the STATUS register. Rising edges are detected inde-
pendent of UPIO_ configuration, providing the ability to
capture and record rising input (e.g., WU) or output
(e.g., PWM) edge events on the UPIO_. Set the appro-
priate mask to determine if the edge will generate an
interrupt on INT. If the UPIO_ is configured as an out-
put, INT provides confirmation that an intended rising
edge output occurred and has reached the desired
DVDD or CPOUT level (i.e., was not loaded down exter-
nally). The power-on default is 0.
UPF<4:1>: User-programmable I/O falling-edge status
bit. UPF_ = 1 indicates a falling edge on the respective
UPIO_ has occurred. Clear UPF_ by reading the
STATUS register. Falling edges are detected indepen-
dent of UPIO_ configuration, providing the ability to cap-
ture and record falling input (e.g., WU) or output (e.g.,
PWM) edge events on the UPIO_. Set the appropriate
mask to determine if that edge should generate an inter-
rupt on the INT pin. If the UPIO is configured as an out-
put, INT provides confirmation that an intended falling
edge output occurred at the pin and it reached the
desired DGND level. The power-on default is 0.
Applications Information
Analog Filtering
The internal digital filter does not provide rejection
close to the harmonics of the modulator sample fre-
quency. However, due to high oversampling ratios in
the MAX11359A, these bands typically occupy a small
fraction of the spectrum and most broadband noise is
filtered. Therefore, the analog filtering requirements in
front of the MAX11359A are considerably reduced
compared to a conventional converter with no on-chip
filtering. In addition, because the device’s common-
mode rejection (60dB) extends out to several kHz, the
common-mode noise susceptibility in this frequency
range is substantially reduced.
Depending on the application, provide filtering prior to the
MAX11359A to eliminate unwanted frequencies the digital
filter does not reject. Providing additional filtering in some
applications ensures that differential noise signals outside
the frequency band of interest do not saturate the analog
modulator.
When placing passive components in front of the
MAX11359A, ensure a low enough source impedance
to prevent introducing gain errors to the system. This
configuration significantly limits the amount of passive
anti-aliasing filtering that can be applied in front of the
MAX11359A. See Table 3 for acceptable source
impedances.
Power-On Reset or Power-Up
After a power-on reset, the DVDD voltage supervisor is
enabled and all UPIOs are configured as inputs with
pullups enabled. The internal oscillators are enabled and
are output at CLK and CLK32K once the DVDD voltage
supervisor is cleared and the subsequent timeout period
has expired. All interrupts are masked except CRDY.
Figure 19 illustrates the timing of various signals during
initial power-up, sleep mode, and wake-up events. The
ADC, charge pump, internal reference, op amp(s), DAC,
and switches are disabled after power-up.
Power Modes
Two power modes are available for the MAX11359A:
sleep and normal mode. In sleep mode, all functional
blocks are powered down except the serial interface,
data registers, internal bandgap, wake-up circuitry (if
enabled), DVDD voltage supervisor (if enabled), and
the 32kHz oscillator (if enabled), which remain active.
See Table 15 for details of the sleep-mode and normal-
mode power states of the various internal blocks.
Each analog block can be shut down individually
through its respective control register with the excep-
tion of the bandgap reference.
Sleep Mode
Sleep mode is entered one of three ways:
• Writing to the SLEEP register address. The result is
the SHDN bit is set to 1.
• Asserting the SLEEP or SLEEP function on a UPIO
(SLEEP takes precedence over software writes or
wake-up events). The SHDN bit is unaffected.
• Asserting the SHDN bit by writing SLP = 1 in the
SLEEP_CFG register.
Entering sleep mode is an OR function of the UPIO or
SHDN bit. Before entering sleep mode, configure the
normal mode conditions.
Exit sleep mode and enter normal mode by one of the
following methods:
• With the SHDN bit = 0, deassert the SLEEP or
SLEEP function on UPIO, only if SLEEP or SLEEP
function is used for entering sleep mode.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
57
Maxim Integrated
INTERNAL
LOW DVDD DETECTOR
OUTPUT DISABLED,
BUT
PULLED LOW OUTPUT ENABLED
SCLK,
DIN
CS
DOUT
INTERNAL
DRDY
UPIO(PWM)
CONNECTED TO POWER
SUPPLY SHDN PIN
INT
UPIO(SHDN)
UPIO(WU)
(INT. PULLUP)
CK32K
(32kHz)
SCK32E = 0
BUFFER DISABLED
CK32E = 1CK32E = 1
XIN, XOUT
(32kHz)
SOSCE = 1 OSCE = 1
OSCE = 1
POR
DVDD
1.8V
AVDD
1.8V
RESET
(OPEN-DRAIN) INTERNAL EXTERNAL
INTERNAL
CRDY
HFCE = 1, FLLE = 1
CLK
LO
HI
LO
HI
LO
HI
LO
HI
LO
HI
LO
HI
LO
HI
LO
HI
LO
HI
LO
HI
LO
HI
LO
HI
0V
1
2
0V
1
2
LO
HI
LO
HI
LO
HI
SLEEP
WRITE
THREE-STATED
SPWME = 1 PWME = 0
PWME = 0
POWER SUPPLY OFF POWER SUPPLY OFF
tDPU
tDFI tDFI
INTERNAL
tWU
tDFON tDFON
tDFOF
tDPD
INTERNAL
IF FLLE = 0, CRDY WILL
STAY LOW, DFON = 0 )
INITIAL POWER, WAKE-UP, AND SLEEP
XTAL B/W 32KIN AND 32KOUT PIN
Figure 19. Initial Power-Up, Sleep Mode, and Wake-Up Timing Diagram with VAVDD > 1.8V
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
58 Maxim Integrated
• With the SLEEP or SLEEP function deasserted on
UPIO, clear the SHDN bit by writing to the normal-
mode register address control byte.
• With the SLEEP or SLEEP function deasserted,
assert WU or WU (wake-up) function on UPIO.
• With the SLEEP or SLEEP function deasserted, the
day alarm triggers.
Wake-Up
A wake-up event, such as an assertion of a UPIO con-
figured as WU or a time-of-day alarm causes the
MAX11359A to exit sleep mode, if in sleep mode. A
wake-up event in normal mode results only in a wake-up
event being recorded in the STATUS register.
RESET
The RESET output pulls low for any one of the following
cases: power-on reset, DVDD monitor trips and RSTE =
0, watchdog timer expires, crystal oscillator is attached,
and 32kHz clock not ready.
The RESET output can be turned off through the RSTE
bit in the PS_VMONS register, causing DVDD low sup-
ply voltage events to issue an interrupt or poll through
the LDVD status bit. This allows brownout detection
µCs that operate with VDVDD < 1.8V.
Driving UPIO Outputs to AVDD Levels
UPIO outputs can be driven to AVDD levels in systems
with separate AVDD and DVDD supplies. Disable the
charge-pump doubler by setting CPE = 0 in the
PS_VMONS register, and connect the system’s analog
supply to AVDD and CPOUT. Setting UPIO outputs to
drive to CPOUT results in AVDD-referenced logic levels.
Supply Voltage Measurement
The AVDD supply voltage can be measured with the
ADC by reversing the normal input and reference sig-
nal s. The REF voltage is applied to one multiplexer
input, and AGND is selected in the other. The AVDD
signal is then switched in as the ADC reference voltage
and a conversion is performed. The AVDD value can
then be calculated directly as:
VAVDD = (VREF x Gain x 65536)/N
where VREF is the reference voltage for the ADC, Gain
is the PGA gain before the ADC, and N is the ADC
result. Note the AVDD voltage must be greater than the
gained-up REF voltage (VAVDD > VREF x Gain). This
measurement must be done in unipolar mode.
0000 0000 0000 0000
0000 0000 0000 0001
0000 0000 0000 0010
65,53565,533
INPUT VOLTAGE (LSB)
BINARY OUTPUT CODE
1111 1111 1111 1101
1111 1111 1111 1110
1111 1111 1111 1111
1 LSB = VREF
(GAIN x 65,536)
02
VREF/GAIN
VREF/GAIN
13
1111 1111 1111 1100
0000 0000 0000 0011
FULL-SCALE TRANSITION
Figure 20. ADC Unipolar Transfer Function
MAX11359A
DAC A OUTA
FBA
Figure 22. DAC Unipolar Output Circuit
0+1-1
1000 0000 0000 0000
1000 0000 0000 0001
1000 0000 0000 0010
+32,767+32,765
INPUT VOLTAGE (LSB)
BINARY OUTPUT CODE
0111 1111 1111 1101
0111 1111 1111 1110
0111 1111 1111 1111
0000 0000 0000 0000
0000 0000 0000 0001
1111 1111 1111 1111
1 LSB = VREF
(GAIN x 65,536) x 2
-32,768 -32,766
VREF/GAIN VREF/GAIN
VREF/GAINVREF/GAIN
Figure 21. ADC Bipolar Transfer Function
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
59
Maxim Integrated
Power Supplies
AVDD and DVDD provide power to the MAX11359A. The
AVDD powers up the analog section, while the DVDD pow-
ers up the digital section. The power supply for both AVDD
and DVDD ranges from +1.8V to +3.6V. Both AVDD and
DVDD must be greater than +1.8V for device operation.
AVDD and DVDD can connect to the same power supply.
Bypass AVDD to AGND with a 10µF electrolytic capacitor
in parallel with a 0.1µF ceramic capacitor, and bypass
DVDD to DGND with a 10µF electrolytic capacitor in paral-
lel with a 0.1µF ceramic capacitor. For improved perfor-
mance, place the bypass capacitors as close to the device
as possible.
ADC Transfer Functions
Figures 20 and 21 provide the ADC transfer functions
for unipolar and bipolar mode. The digital output code
format is binary for unipolar mode and two’s comple-
ment for bipolar mode. Calculate 1 LSB using the fol-
lowing equations:
1 LSB (Unipolar Mode) = VREF/(Gain x 65,536)
1 LSB (Bipolar Mode) = ±2VREF/(Gain x 65,536)
where VREF equals the reference voltage at REF and
Gain equals the PGA gain.
In unipolar mode, the output code ranges from 0 to
65,535 for inputs from zero to full-scale. In bipolar
mode, the output code ranges from -32,768 to +32,767
for inputs from negative full-scale to positive full-scale.
DAC Unipolar Output
For a unipolar output, the output voltages and the refer-
ence have the same polarity. Figure 22 shows the
unipolar output circuit of the MAX11359A, which is also
the typical operating circuit for the DAC. Table 22 lists
some unipolar input codes and their corresponding
output voltages.
For larger output swing, see Figure 23. This circuit
shows the output amplifiers configured with a closed-
loop gain of +2V/V to provide 0 to 2.5V full-scale range
with the 1.25V reference.
DAC Bipolar Output
The MAX11359A DAC output can be configured for
bipolar operation using the application circuit in
Figure 24:
where N is the decimal value of the DAC’s binary input code.
Table 23 shows digital codes (offset binary) and corre-
sponding output voltages for Figure 24 assuming
R1= R2.
VVN
OUT REF
=⎛
⎝
⎜⎞
⎠
⎟−
⎡
⎣
⎢⎤
⎦
⎥
2
1024 1
MAX11359A
DAC A OUTA
VREF = 1.25V
FBA 10kΩ
10kΩ
R2
R2 = R1
R1
MAX11359A
DAC_
OUT_
VOUT
+3.3V
-3.3V
FB_
VREF = 1.25V
VREF
Figure 24. DAC Bipolar Output Circuit
Figure 23. DAC Unipolar Rail-to-Rail Output Circuit
DAC CONTENTS
MSB LSB ANALOG OUTPUT
1111 1111 11 +VREF (1023/1024)
1000 0000 01 +VREF (513/1024)
1000 0000 00 +VREF (512/1024) = +VREF/2
0111 1111 11 +VREF (511/1024)
0000 0000 01 +VREF (1/1024)
0000 0000 00 0
Table 22. Unipolar Code
DAC CONTENTS
MSB LSB ANALOG OUTPUT
1111 1111 11 +VREF (511/512)
1000 0000 01 +VREF (1/512)
1000 0000 00 0
0111 1111 11 -VREF (1/512)
0000 0000 01 -VREF (511/512)
0000 0000 00 -VREF (512/512) = -VREF
Table 23. Bipolar Code
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
60 Maxim Integrated
MAX11359A
32KIN
100kΩ
CMOS CLOCK
(0 TO VDVDD)
100kΩ
Figure 25. Clocking with a CMOS Signal
MAX11359A
UPIO1 GPIOn
AIN1
x2
VREF = 1.25V
BATTVCHECK < 0.6125V
VBATT1
BACKLIGHT
VDD
NOTE:
GPIOn IS LOW = LED ON,
HIGH-Z = LED OFF
µP
VBATT2
Figure 26. Input Multiplexer
Clocking with a CMOS Signal
A CMOS signal can be used to drive 32KIN if it is
divided down. Figure 25 is an example circuit, which
works well.
Input Multiplexer
The mux inputs can range between AGND to AVDD.
However, when the internal temperature sensor is
enabled, AIN1 and AIN2 cannot exceed 0.7V. This
necessitates additional circuitry to divide down the
input signal. See Figure 26 for an example circuit that
divides down backlight VDD to work properly with the
AIN1 pin.
Optical Reflectometry Application with
Dual LED and Single Photodiode
Figure 27 illustrates the MAX11359A in a complete opti-
cal reflectometry application with two transmitting LEDs
and one receiving photodiode. The LEDs transmit light
at a specific wavelength onto the sample strip, and the
photodiode receives the reflections from the strip. Set
the DAC to provide appropriate bias currents for the
LEDs. Always keep the photodiodes reverse-biased or
zero-biased. SPDT1 and SPDT2 switch between the
two LEDs.
Electrochemical Sensor Operation
The MAX11359A family interfaces with electrochemical
sensors. The 10-bit DAC with the force-sense buffers
have the flexibility to connect to many different types of
sensors. An external precision resistor completes the
transimpedance amplifier configuration to convert the
current generated by the sensor to a voltage measure-
ment using the ADC. The induced error from this source
is negligible due to FBA’s extremely low input bias cur-
rent. Internally, the ADC can differentially measure
directly across the external transimpedance resistor,
RF, eliminating any errors due to voltages drifting over
time, temperature, or supply voltage.
Temperature Measurement with
Two Remote Sensors
Use two diode-connected 2N3904 transistors for exter-
nal temperature sensing in Figure 28. Select AIN1 and
AIN2 through the positive and negative mux, respec-
tively. For internal temperature sensor measurements,
set MUXP<3:0> to 0111, and set MUXN<3:0> to 0000.
The analog input signals feed through a PGA to the
ADC for conversion.
Programmable-Gain Instrumentation
Amplifier
Use two op amps and two SPDT switches to implement
a programmable-gain instrumentation amplifier as
shown in Figure 29.
PWM Applications
The MAX11359A integrated PWM is available for LCD bias
control, sensor-bias voltage trimming, buzzer drive, and
duty-cycled sleep-mode power-control schemes. Figure
30 shows the MAX11359A performing LCD bias control.
A sensor-bias voltage trimming application is shown in
Figure 31. Figures 33 and 34 show the PWM circuitry
being used in a single-ended and differential piezo-
electric buzzer-driving application.
ADC Calibration
Internal to the MAX11359A, the ADC is 24 bits and is
always in bipolar mode. The OFFSET CAL and GAIN
CAL data are also 24 bits. The conversion to unipolar
and the gain are performed digitally. The default values
for the OFFSET CAL and GAIN CAL registers in the
MAX11359A are 00 0000h and 80 0000h, respectively.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
61
Maxim Integrated
µC
DOWN
UP
MEM
VSS
INPUT
INPUT
INPUT
UPIO2
UPIO1
UPIO3
UPIO4
MAX11359A
DIN
DOUT
SCLK
CS
RESET
INT
CLK
CLK32K
AVDD
DVDD
TEST
STRIP
VSS
AGND
DGND
32KIN
32KOUT
32.768kHz
LINEAR
REG
DVDD
CHARGE-
PUMP
DOUBLER
VSS
REG
CF+
CF-
CPOUT
VSS
VBAT
2 AAA OR
1 LITHIUM
COIN CELL
VSS
VSS
VDD
CS2
RESET
INPUT
X2IN
32KIN
EEPROM
VSS
VBAT
GND
VCC
CS
SI
SCK
SO
SERIAL-PORT INTERFACE
VSS
CS1
SCK
MISO
MOSI
VSS
VCP
VSS
TXD
RXD
VCP
HIGH-FREQUENCY MICRO CLOCK
32kHz MICRO CLOCK
LCD MODULE
BDIN
BDOUT
BSCLK
BCS2
VSS
VCP
IN2-
IN2+
OUT2
IN1-
IN1+
OUT1 VSS
ADC
PWM
DACA
REF
BG
LED
VCP
VCP
LED
AMBIENT LIGHT
LED SOURCES
SNC1
SCM1
SNO1
FBA
VSS
SWA
OUTA
AIN1
AIN2
SCM2
SNC2
SNO2
VSS
1nF
VSS
CS2
Figure 27. Optical Reflectometry Application with Dual LED and Single Photodiode
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
62 Maxim Integrated
The calibration works as follows:
ADC = (RAW - OFFSET) x Gain x PGA
where ADC is the conversion result in the DATA register,
RAW is the output of the decimation filter internal to the
MAX11359A, OFFSET is the value stored in the OFFSET
CAL register, Gain is the value stored in the GAIN CAL
register, and PGA is the selected PGA gain found in the
ADC register as GAIN<1:0>. In unipolar mode, all nega-
tive values return a zero result and an additional gain of
2 is added.
For self-calibration, the offset value is the RAW result
when the inputs are shorted internally and the gain value
is 1/(RAW - OFFSET) with the reference connected to the
input. This is done automatically when these modes are
selected. The self offset and gain calibration corrects for
errors internal to the ADC and the results are stored and
used automatically in the OFFSET CAL and GAIN CAL
registers. For best results, use the ADC in the same con-
figuration as the calibration. This pertains to conversion
rate only because the PGA gain and unipolar/bipolar
modes are performed digitally.
For system calibration, the offset and gain values cor-
rect for errors in the whole signal path including the
internal ADC and any external circuits in the signal
path. For the system calibration, a user-provided zero-
input condition is required for the offset calibration and
a user-provided full-scale input is required for the gain
calibration. These values are automatically written to
the OFFSET CAL and GAIN CAL registers. The order of
the calibrations should be offset followed by gain.
The offset correction value is in two’s complement. The
default value is 000000h, 00...00b, or 0 decimal.
The gain correction value is an unsigned binary number
with 23 bits to the right of the decimal point. The largest
number is therefore 1.1111...1b = 2 - 2-23 and the small-
est is 0.000...0b = 0, although it does not make sense to
use a number smaller than 0.1000...0b = 0.5. The default
value is 800000h, 1.000...0b or 1 decimal.
Changing the offset or gain calibration values does not
affect the value in the DATA register until a new conver-
sion has completed. This applies to all the mode bits
for PGA gain, unipolar/bipolar, etc.
Grounding and Layout
For best performance, use PCB with separate analog
and digital ground planes.
Design the PCB so that the analog and digital sections
are separated and confined to different areas of the
board. Join the digital and analog ground planes at one
point. If the DAS is the only device requiring an AGND-to-
DGND connection, connect planes to the AGND pin of the
DAS. In systems where multiple devices require AGND-to-
DGND connections, the connection should still be made
at only one point. Make the star ground as close as possi-
ble to the MAX11359A.
Avoid running digital lines under the device because
these may couple noise onto the device. Run the ana-
log ground plane under the MAX11359A to minimize
coupling of digital noise. Make the power-supply lines
to the MAX11359A as wide as possible to provide low-
impedance paths and reduce the effects of glitches on
the power-supply line.
Shield fast-switching signals such as clocks with digital
ground to avoid radiating noise to other sections of the
board. Avoid running clock signals near the analog
inputs. Avoid crossover of digital and analog signals.
Good decoupling is important when using high-resolu-
tion ADCs. Decouple all analog supplies with 10µF
capacitors in parallel with 0.1µF HF ceramic capacitors
to AGND. Place these components as close to the
device as possible to achieve the best decoupling.
Crystal Layout
Follow basic layout guidelines when placing a crystal
on a PCB with a DAS to avoid coupled noise:
1) Place the crystal as close as possible to 32KIN and
32KOUT. Keeping the trace lengths between the
crystal and inputs as short as possible reduces the
probability of noise coupling by reducing the length
of the “antennae”. Keep the 32KIN and 32KOUT
lines close to each other to minimize the loop area
of the clock lines. Keeping the trace lengths short
also decreases the amount of stray capacitance.
2) Keep the crystal solder pads and trace width to
32KIN and 32KOUT as small as possible. The larg-
er these bond pads and traces are, the more likely
it is that noise will couple from adjacent signals.
3) Place a guard ring (connect to ground) around the
crystal to isolate the crystal from noise coupled
from adjacent signals.
4) Ensure that no signals on other PCB layers run
directly below the crystal or below the traces to
32KIN and 32KOUT. The more the crystal is isolat-
ed from other signals on the board, the less likely it
is that noise will be coupled into the crystal.
Maintain a minimum distance of 5mm between any
digital signal and any trace connected to 32KIN or
32KOUT.
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
63
Maxim Integrated
5) Place a local ground plane on the PCB layer imme-
diately below the crystal guard ring. This helps to
isolate the crystal from noise coupling from signals
on other PCB layers.
Note: The ground plane must be in the vicinity of the
crystal only and not on the entire board.
Parameter Definitions
INL
Integral nonlinearity (INL) is the deviation of the values on
an actual transfer function from a straight line. This
straight line is either a best-straight-line fit or a line drawn
between the end points of the transfer function, once off-
set and gain errors have been nulled. INL for the
MAX11359A is measured using the end-point method.
DNL
Differential nonlinearity (DNL) is the difference between
an actual step width and the ideal value of 1 LSB. A DNL
error specification of greater than -1 LSB guarantees no
missing codes and a monotonic transfer function.
Gain Error
Gain error is the amount of deviation between the mea-
sured full-scale transition point and the ideal full-scale
transition point.
AV = 1, 2, 4, 8
AV = 1, 1.638, 2
MAX11359A
PGA
MUX
2N3904
16-BIT ADC
CREF
REF
REF
MUX
TEMP
SENSOR
AIN1
AGND
AIN2
AGND
2N3904
1.25V
REF
Figure 28. Temperature Measurement with Two Remote Sensors
MAX11359A
R3
R2
R2
R3
R1
R1
IN1+
IN1-
SCM1
VOUT
SCM2
OUT1
SNO1
SNC1
SNO2
SNC2
VIN+
VIN- OUT2
IN2+
IN2-
Figure 29. Programmable-Gain Instrumentation Amplifier
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
64 Maxim Integrated
Common-Mode Rejection
Common-mode rejection (CMR) is the ability of a
device to reject a signal that is common to both input
terminals. The common-mode signal can be either an
AC or a DC signal or a combination of the two. CMR is
often expressed in decibels.
Power-Supply Rejection Ratio (PSRR)
Power-supply rejection ratio (PSRR) is the ratio of the
input supply change (in volts) to the change in the
converter output (in volts). It is typically measured in
decibels.
REF
SNO1
SCM1
SNC1
AGND
SPDT1
PWM
IN1+
IN1-
OUT1
TRANSDUCER
0.300V (±1mV)
IT
0.1µF60kΩ
~0.3V
240kΩ
350kΩ
~19kHz
VOLTAGE
RIPPLE < 1mV
~1.25V
MAX11359A
Figure 31. Sensor-Bias Voltage Trim Application
MAX11359A
(1.8V
TO
2.6V)
0.01µF
µC
MUX
SV_
ALH_
UPIO_
LCD
DRIVERS
SEG
LCD
COM
n
m
CPOUT
200kΩ
100kΩ
100kΩ
100kΩ
100kΩ
PWM
DVDD CPOUT
EN_
Figure 30. LCD Contrast-Adjustment Application
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
65
Maxim Integrated
SHDN
PWM
ALH_
UPIO_
SV_
DVDD CPOUT
MUX
MAX11359A
VIN VOUT
POWER SUPPLY
AVDD
VDD
µC
100µF
< 10µA
VDD
PSCTL
VBATT
DVDD
ON-TIME <100ms TYP
10s PERIOD TYP
+3.3V
VDD
+2.3V
PSCTL
EN_
10MΩ
Figure 32. Power-Supply Sleep-Mode Duty-Cycle Control
PWM
ALH_
UPIO_
SV_
DVDD CPOUT
MUX
1kΩ
0V
CPOUT(+3.2V)
1kHz TO 8kHz TYP
~10,000pF
MAX11359A
Figure 33. Single-Ended Piezoelectric Buzzer Drive
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
66 Maxim Integrated
MAX11359A
MUX
SV_
ALH_
UPIO_ 1kΩ
PWM
DVDD CPOUT
MUX
SV_
ALH_
UPIO_ 1kΩ
DVDD CPOUT
0V
0V
CPOUT(+3.2V)
CPOUT
+
6.4V DIFF
-
-CPOUT
CPOUT(~+3.2V)
1kHz TO 8kHz TYP
1kHz TO 8kHz TYP
~10,000pF
Figure 34. Differential Piezoelectric Buzzer Drive
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE OUTLINE NO. LAND
PATTERN NO.
40 TQFN-EP T4066+5 21-0141 90-0055
MAX11359A
16-Bit Data-Acquisition System with ADC, DAC,
UPIOs, RTC, Voltage Monitors, and Temp Sensor
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent
licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and
max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 ________________________________
67
© 2012 Maxim Integrated Products, Inc. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 5/09 Initial release —
1 1/12 Updated package information and style updates.
1–10,
12–29, 31, 32, 35,
45, 46, 48–51,
54-61, 64–66
