© 2016 IXYS CORPORATION, All Rights Reserved
Symbol Test Conditions Maximum Ratings
VDSS TJ= 25C to 150C - 500 V
VDGR TJ= 25C to 150C, RGS = 1M- 500 V
VGSS Continuous 20 V
VGSM Transient 30 V
ID25 TC= 25C - 20 A
IDM TC= 25C, Pulse Width Limited by TJM - 60 A
IATC= 25C - 20 A
EAS TC= 25C 2.5 J
dv/dt IS IDM, VDD VDSS, TJ 150C 10 V/ns
PDTC= 25C 460 W
TJ- 55 ... +150 C
TJM 150 C
Tstg - 55 ... +150 C
TLMaximum Lead Temperature for Soldering 300 °C
TSOLD 1.6 mm (0.062in.) from Case for 10s 260 °C
MdMounting Torque (TO-247) 1.13 / 10 Nm/lb.in.
Weight TO-268 4 g
TO-247 6 g
DS99984C(11/16)
Symbol Test Conditions Characteristic Values
(TJ = 25C, Unless Otherwise Specified) Min. Typ. Max.
BVDSS VGS = 0V, ID = - 250 A - 500 V
VGS(th) VDS = VGS, ID = - 250A - 2.0 - 4.5 V
IGSS VGS = 20V, VDS = 0V 100 nA
IDSS VDS = VDSS, VGS = 0V - 25 A
TJ = 125C - 200A
RDS(on) VGS = -10V, ID = 0.5 • ID25, Note 1 450 m
PolarPTM
Power MOSFET
P-Channel Enhancement Mode
Avalanche Rated
IXTT20P50P
IXTH20P50P
VDSS = - 500V
ID25 = - 20A
RDS(on)
450m
Features
International Standard Packages
Avalanche Rated
Rugged PolarPTM Process
Low Package Inductance
Fast Intrinsic Diode
Advantages
Easy to Mount
Space Savings
High Power Density
Applications
High-Side Switches
Push Pull Amplifiers
DC Choppers
Automatic Test Equipment
Current Regulators
G = Gate D = Drain
S = Source Tab = Drain
TO-247 (IXTH)
G
SD (Tab)
D
TO-268 (IXTT)
S
G
D (Tab)
IXTT20P50P
IXTH20P50P
IXYS Reserves The Right to Change Limits, Test Conditions, and Dimensions.
Symbol Test Conditions Characteristic Values
(TJ = 25C, Unless Otherwise Specified) Min. Typ. Max.
gfs VDS = -10V, ID = 0.5 • ID25, Note 1 11 18 S
Ciss 5120 pF
Coss VGS = 0V, VDS = - 25V, f = 1MHz 525 pF
Crss 75 pF
td(on) 26 ns
tr 32 ns
td(off) 80 ns
tf 34 ns
Qg(on) 103 nC
Qgs VGS = -10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 28 nC
Qgd 38 nC
RthJC 0.27C/W
RthCS 0.21 C/W
Source-Drain Diode
Symbol Test Conditions Characteristic Values
(TJ = 25C, Unless Otherwise Specified) Min. Typ. Max.
ISVGS = 0V - 20 A
ISM Repetitive, Pulse Width Limited by TJM - 80 A
VSD IF = -10A, VGS = 0V, Note 1 - 2.8 V
trr 406 ns
QRM 8.93 μC
IRM - 44 A
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,860,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Note 1: Pulse test, t 300s, duty cycle, d 2%.
Resistive Switching Times
VGS = -10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 3 (External)
IF = -10A, -di/dt = -150A/s
VR = -100V, VGS = 0V
© 2016 IXYS CORPORATION, All Rights Reserved
IXTT20P50P
IXTH20P50P
Fig. 1. Output Characteristics @ TJ = 25 ºC
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0-9-8-7-6-5-4-3-2-10V
DS
- Volts
I
D
- Amperes
V
GS
= - 10V
- 7V
- 5V
- 6V
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0-30-25-20-15-10-50V
DS
- Volts
I
D
- Amperes
V
GS
= - 10V
- 7V
- 6V
- 5V
Fig. 3. Output Characteristics @ TJ = 125ºC
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0-18-16-14-12-10-8-6-4-20
V
DS
- Volts
I
D
- Amperes
V
GS
= - 10V
- 7V
- 6V
- 5V
Fig. 4. RDS(on) Normalize d to ID = -10A Value vs.
Junction Temperature
0.4
0.8
1.2
1.6
2.0
2.4
-50 -25 0 25 50 75 100 125 150
T
J
- Degrees Centigrade
R
DS(on)
- Normalized
V
GS
= - 10V
I
D
= - 20A
I
D
= -10A
Fig. 5. R
DS(on)
Normalized to I
D
= -10A Value vs.
Dra in Cu r rent
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
-50-45-40-35-30-25-20-15-10-50
I
D
- Amperes
R
DS(on)
- Normalized
V
GS
= - 10V
T
J
= 25ºC
T
J
= 125ºC
Fig. 6. Maximum Drain Current v s .
Case Temperature
-22
-18
-14
-10
-6
-2
-50 -25 0 25 50 75 100 125 150
T
C
- Degrees Centi gra de
I
D
- Amperes
IXTT20P50P
IXTH20P50P
IXYS Reserves The Right to Change Limits, Test Conditions, and Dimensions.
Fig. 7. Input Admittance
-35
-30
-25
-20
-15
-10
-5
0-6.0-5.5-5.0-4.5-4.0-3.5-3.0
V
GS
- Volts
I
D
- Amperes
T
J
= 125ºC
25ºC
- 40º C
Fig. 8. Transconductance
0
5
10
15
20
25
30
35
40
-35-30-25-20-15-10-50
I
D
- Amperes
g
f s
- Siem en s
T
J
= - 40ºC
125ºC
25ºC
Fig. 9. Forward Voltage Drop of Intrinsic Diode
-60
-50
-40
-30
-20
-10
0-3.5-3.0-2.5-2.0-1.5-1.0-0.5
V
SD
- Volts
I
S
- Amper es
T
J
= 125ºC
T
J
= 25ºC
Fig. 10. Gate Charge
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
00 102030405060708090100110
Q
G
- NanoCoulombs
V
GS
- Volts
V
DS
= - 250V
I
D
= - 10A
I
G
= -1mA
Fig. 11. Capacitance
10
100
1,000
10,000
-40-35-30-25-20-15-10-50
V
DS
- Volts
Capacitance - PicoF arad
s
f
= 1 MHz
Ciss
Crss
Coss
Fig. 12. Forward-Bias Safe Operating Area
0.1
1
10
100
10 100 1000
V
DS
- Volts
I
D
- Amperes
T
J
= 150ºC
T
C
= 25ºC
Singl e Pulse
100µs
R
DS(on)
Limit
-
---
100ms
-
-
1ms
10ms
-
DC
© 2016 IXYS CORPORATION, All Rights Reserved IXYS REF: T_20P50P(B7) 5-13-08
IXTT20P50P
IXTH20P50P
Fig. 13. Maximum Transient Thermal Impedance
0.001
0.01
0.1
1
0.00001 0.0001 0.001 0.01 0.1 1 10
Pulse Width - Seconds
Z
(th)JC
- K / W
TO-268 OUTLINE TO-247 OUTLINE
PINS: 1 - Gate
2,4 - Drain
3 - Source
PINS: 1 - Gate
2,4 - Drain
3 - Source
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