Crane Aerospace & Electronics
Microwave Solutions – Signal Technology
28 Tozer Road, Beverly, MA 01915
+1.978.524.7200 mw@crane-eg.com
www.craneae.com/mw
The information in this document is a derivative of a document cleared by the Department of Defense (DoD) Office of Security Review (OSR) for public release.
OSR case number 10-S-0983 dated March 11, 2010. DS_T_ISLT_2_2131_High Power Microwave Sp2t Switch_MW_031110.doc. This revision supersedes all
previous releases. All technical information is believed to be accurate, but no responsibility is assumed for errors. We reserve the right to make changes in
products or specifications without notice. Copyright © 2011 Crane Electronics, Inc. All rights reserved.
Crane Aerospace & Electronics Microwave Solutions
MODEL T-ISLT-2-2131 - HIGH POWER MICROWAVE SP2T SWITCH
PERFORMANCE
Frequency Range ..................................... 6 to 18 GHz
Insertion Loss ........................................... 1.75 dB max
Isolation ...................................................... 25 dB min.
Operating Power ................................... 100 Watts CW
Switching Speed ............................................. 1us max
Control .......................................................... TTL Logic
Power Supply ........................................ +30, +/- 5 VDC
Physical Size ................................ 2” x 1.8” x 1.05” max
Mounting Temperature ............................... +50˚C max
DESCRIPTION
The T-ISLT-2-2131 is a PIN diode based high power
microwave switch covering 6 to 18 GHz. Power levels up
to 100 W CW are handled over the operating temperature
range. The switch offers high isolation and termination for
the non-selected port.
This switch is suitable for signal control applications
including ECM and radar transmitters. This might apply
as a transmit/receive switch or selection between bands
of high power signal sources or antennas.
The T-ISLT-2-2131 represents just one example of the
extensive design capability of the recently initiated control
device product.
TECHNICAL FEATURE
FEATURES
Internally Terminated Design (on receive)
Integrated Driver Assembly
