General Description
The MAX174/MX574A/MX674A are complete 12-bit
analog-to-digital converters (ADCs) that combine high
speed, low-power consumption, and on-chip clock and
voltage reference. The maximum conversion times are
8μs (MAX174), 15μs (MX674A), and 25μs (MX574A).
Maxim’s BiCMOS construction reduces power dissipation
3 times (150mW) over comparable devices. The internal
buried zener reference provides low-drift and low-noise
performance. External component requirements are lim-
ited to only decoupling capacitors and fixed resistors. The
versatile analog input structure allows for 0 to +10V or 0
to +20V unipolar or ±5V or ±10V bipolar input ranges with
pin strapping.
The MAX174/MX574A/MX674A use standard micropro-
cessor interface architectures and can be interfaced to 8-,
12-, and 16-bit wide buses. Three-state data outputs are
controlled by CS, CE, and R/C logic inputs.
Features
Complete ADC with Reference and Clock
12-Bit Resolution and Linearity
No Missing Codes Over Temperature
150mW Power Dissipation
8μs (MAX174), 15μs (MX674A), and 25μs (MX574A)
Max Conversion Times
Precision Low TC Reference: 10ppm/°C
Monolithic BiCMOS Construction
150ns Maximum Data Access Time
Applications
Digital Signal Processing
High-Accuracy Process Control
High-Speed Data Acquisition
Electro-Mechanical Systems
Ordering Information appears at end of data sheet.
19-2765; Rev 4; 6/18
Click here for production status of specic part numbers.
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
Functional Diagram
R
14
5kΩ
9.950kΩ
5kΩ
131211
VEE BIPOFF 10VIN 20VIN
2R
+10V
REF
9
8
10
REFIN
AGND
REFOUT
12-BIT
DAC
7
VCC
15
DGND
1
VL
SAR
12
LOW
NIBBLE
4 4 4
MIDDLE
NIBBLE
HIGH
NIBBLE
CLOCK
AND
CONTROL
LOGIC
212/8
A0
3
4
27 56282423201916
D0 D3 D4 D7 D8 D11 STS CE R/C
CS
MAX174
MX574A
MX674A
EVALUATION KIT AVAILABLE
VCC to DGND ............................................................. 0 to 16.5V
VEE to DGND ............................................................. 0 to 16.5V
VL to DGND ..................................................................... 0 to 7V
DGND to AGND .....................................................................±1V
Control Inputs to DGND
(CE, CS, A0, 12/8, R/C)........................ -0.3V to (VCC + 0.3V)
Digital Output Voltage to DGND
(DB11–DB0, STS) ...................................-0.3V to (VL + 0.3V)
Analog Inputs to AGND (REFIN, BIPOFF, 10VIN) ...........±16.5V
20VIN to AGND ....................................................................±24V
REFOUT ...................................Indefinite short to VCC or AGND
Power Dissipation (any package) to +75°C ..................1000mW
Derates above +75°C ...............................................10mW/°C
Operating Temperature Ranges
MAX174_C, MX_74AJ/K/L .....................................0 to +70°C
MAX174_E, MX_74AJE/KE/LE ...................... -40°C to +85°C
MAX174_M, MX_74AS/T/U .......................... -55°C to +125°C
Storage Temperature Range ............................ -55°C to +160°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
PDIP, Wide SO ............................................................+260°C
PLCC ...........................................................................+245°C
(VL = +5V, VEE = +15V or +12V, VEE = -15V or -12V, TA = +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ACCURACY
Resolution RES 12 Bits
Integral Nonlinearity INL
TA = +25°C MAX174A/B ±1/2
LSB
MAX174C ±1
TA = TMIN to
TMAX
MAX174AC/BC ±1/2
MAX174AE/BE/AM/BM ±3/4
MAX174C ±1
Di󰀨erential Nonlinearity DNL 12 bits, no missing codes over temperature ±1 LSB
Unipolar O󰀨set Error (Note 1) MAX174A/B ±1 LSB
MAX174C ±2
Bipolar O󰀨set Error (Notes 2, 3) MAX174A ±3 LSB
MAX174B/C ±4
Full-Scale Calibration Error (Note 3) ±0.25 %
TEMPERATURE COEFFICIENTS (Using Internal Reference) (Notes 2, 3, 4)
Unipolar O󰀨set Change MAX174A/B ±1 LSB
MAX174C ±2
Bipolar O󰀨set Change
MAX174AC/BC ±1
LSB
MAX174CC ±2
MAX174AE/AM ±1
MAX174BE/BM ±2
MAX174CE/CM ±4
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
2
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics—MAX174
(VL = + 5V, VEE = +15V or +12V, VEE = -15V or -12V, TA = +25°C, unless otherwise noted.)
(VL = +5V, VEE = +15V or +12V, VEE = -15V or -12V, TA = +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ACCURACY
Resolution RES 12 Bits
Integral Nonlinearity INL
TA = +25°C
MX574AK/L/T/U,
MX674AK/L/T/U ±1/2
LSB
MX574AJ/S, MX674AJ/S ±1
TA = TMIN to
TMAX
MX574AK/L/KE/LE ±1/2
MX674AK/L/KE/LE ±1/2
MX574AT/U, MX674AT/U ±3/4
MX574AJ/S, MX674AJ/S ±1
Di󰀨erential Nonlinearity DNL 12 bits, no missing codes over temperature ±1 LSB
Unipolar O󰀨set Error (Note 1) MX574AK/L/T/U, MX674AK/L/T/U ±1 LSB
MX574AJ/S, MX674AJ/S ±2
Bipolar O󰀨set Error (Notes 2, 3) MX574AL/U, MX674AL/U ±3 LSB
MX574AJ/K/S/T, MX674AJ/K/S/T ±4
Full-Scale Calibration Error
(Note 3)
MX574AL/U ±0.125 %
MX574AJ/K/S/T, MX674A ±0.25
TEMPERATURE COEFFICIENTS (Using Internal Reference) (Notes 2, 3, 4)
Unipolar O󰀨set Change MX574AK/L/T/U, MX674AK/L/T/U ±1 LSB
MX574AJ/S, MX674AJ/S ±2
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Full-Scale Calibration Change
MAX174AC ±2 (10)
LSB
(ppm/°C
MAX174BC ±5 (27)
MAX174CC ±9 (50)
MAX174AE ±7 (19)
MAX174BE ±10 (38)
MAX174CE ±20 (75)
MAX174AM ±5 (12)
MAX174BM ±10 (25)
MAX174CM ±20 (50)
INTERNAL REFERENCE
Output Voltage No load MAX174A 9.98 10.00 10.02 V
MAX174B/C 9.97 10.00 10.03
Output Current (Note 5) Available for external loads, in addition to
REFIN and BIPOFF load 2 mA
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
3
Electrical Characteristics—MX574A, MX674A
Electrical Characteristics—MAX174 (continued)
(VL = +5V, VCC = +15V or +12V, VEE = -15V or -12V, TA = +25°C, unless otherwise noted.)
(VL = +5V, VCC = +15V or +12V, VEE = -15V or -12V, TA = +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Bipolar O󰀨set Change
MX574AK/L, MX674AK/L ±1
LSB
MX574AJ, MX674AJ ±2
MX574AU/LE, MX674AU/LE ±1
MX574AT/KE, MX674AT/KE ±2
MX574AS/JE, MX674AS/JE ±4
Full-Scale Calibration Change
MX574AL, MX674AL ±2 (10)
LSB
(ppm/°C
MX574AK, MX674AK ±5 (27)
MX574AJ, MX674AJ ±9 (50)
MX574ALE, MX674ALE ±7 (19)
MX574AKE, MX674AKE ±10 (38)
MX574AJE, MX674AJE ±20 (75)
MX574AU, MX674AU ±5 (12)
MX574AT, MX674AT ±10 (25)
MX574AS, MX674AS ±20 (50)
INTERNAL REFERENCE
Output Voltage No load
MX574AL/U 9.99 10.00 10.01
VMX574AJ/K/S/T, MX674AL/U 9.98 10.00 10.02
MX674AJ/K/S/T 9.97 10.00 10.03
Output Current (Note 5) Available for external loads, in addition to
REFIN and BIPOFF load 2 mA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ANALOG INPUT
Bipolar Input Range Using 10V input ±5 V
Using 20V input ±10
Unipolar Input Range Using 10V input 0 +10 V
Using 20V input 0 +20
Input Impedance 10V input 3 5 7 kΩ
20V input 6 10 14
POWER-SUPPLY REJECTION (Max Change in Full-Scale Calibration)
VCC Only 15V ±1.5V or
12V ±0.6V
MAX174A/B, MX_74AK/L/TU ±1/8 ±1 LSB
MAX174C, MX_74AJ/S ±1/8 ±2
VEE Only 15V ±1.5V or 12V ±0.6V ±1/8 ±1/2 LSB
VL Only 5V ±0.5V ±1/8 ±1/2 LSB
LOGIC INPUTS
Input Low Voltage VIL CS, CE, R/C, A0, 12/8 0.8 V
Input High Voltage VIH CS, CE, R/C, A0, 12/8 2.0 V
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
4
Electrical Characteristics—MX574A, MX674A (continued)
Electrical Characteristics—MAX174/MX574/MX674A
(VL = +5V, VCC = +15V or +12V, VEE = -15V or -12V, TA = +25°C, unless otherwise noted.)
Note 1: Adjustable to zero.
Note 2: With 50Ω fixed resistor from REFOUT to BIPOFF. Adjustable to zero.
Note 3: With 50Ω fixed resistor from REFOUT to REFIN. Adjustable to zero.
Note 4: Maximum change in specification from TA = +25°C to TMIN or TA = +25°C to TMAX.
Note 5: External load current should not change during a conversion. For ±12V supply operation, REFOUT need not be buffered
except when external load in addition to REFIN and BIPOFF inputs have to be driven.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Current IIN CS, CE, R/C, A0, 12/8, VIN = 0 to VL±5 µA
Input Capacitance CIN CS, CE, R/C, A0, 12/8 7 pF
LOGIC OUTPUTS
Output Low Voltage VOL DB11–DB0, STS ISINK = 1.6mA 0.4 V
Output High Voltage VOH DB11–DB0, STS ISOURCE = 500µA 4 V
Floating State Leakage Current ILKG DB11–DB0, STS VOUT = 0 to VL±10 µA
Floating State Output Capacitance COUT DB11–DB0 8 pF
CONVERSION TIME
12-Bit Cycle tCONV
MX574A 15 20 25
µsMX674A 9 12 15
MAX174 6 7 8
8-Bit Cycle tCONV
MX574A 10 14 18
µsMX674A 6 8 11
MAX174 4 5 6
POWER REQUIREMENTS
VCC Operating Range 11.4 16.5 V
VL Operating Range 4.5 5.5 V
VEE Operating Range -11.4 -16.5 V
VCC Supply Current (Note 5) ICC 3 5 mA
VL Supply Current (Note 5) IL3 8 mA
VEE Supply Current (Note 5) IEE 6 10 mA
Power Dissipation (Note 5) PDVCC = +15V and VEE = -15V 150 265 mW
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
5
Electrical Characteristics—MAX174/MX574/MX674A (continued)
(VL = +5V, VCC = +15V or +12V, VEE = -15V or -12V.)
Note 6: Timing specifications guaranteed by design. All input control signals specified with tR = tF = 5ns (10% to 90% of +5V) and
timed from a voltage level of +1.6V. See loading circuits in Figures 1 and 2.
PARAMETER SYMBOL CONDITIONS TA = +25°C TA = -40°C TO +85°C
TA = 0°C TO +70°C TA = -55°C TO +125°C UNITS
MIN TYP MAX MIN TYP MAX MIN TYP MAX
CONVERT START TIMING—FULL CONTROL MODE
STS Delay from CE tDSC CL = 50pF 100 200 250 320 ns
CE Pulse Width tHEC 50 15 50 50 ns
CS to CE Setup tSSC 50 50 50 ns
CS Low During CE High tHSC 50 50 50 ns
R/C to CE Setup tSRC 50 50 50 ns
R/C Low During CE High tHRC 50 50 50 ns
A0 to CE Setup tSAC 0 0 0 ns
A0 Valid During CE High tHAC 50 50 50 ns
READ TIMING—FULL CONTROL MODE
Access Time (From CE) tDD CL = 100pF 60 120 150 200 ns
Data Valid After CE Low tHD 25 40 20 15 ns
Output Float Delay tHL 75 100 120 ns
CS to CE Setup tSSR 50 50 50 ns
R/C to CE Setup tSRR 0 0 0 ns
A0 to CE Setup tSAR 50 50 50 ns
CS Valid After CE Low tHSR 0 0 0 ns
R/C High After CE Low tHRR 0 0 0 ns
A0 Valid After CE Low tHAR 0 0 0 ns
STAND-ALONE MODE
Low R/C Pulse Width tHRL 50 15 50 50 ns
STS Delay from R/CtDS 115 200 250 320 ns
Data Valid After R/C Low tHDR 25 40 20 15 ns
STS Delay After Data Valid tHS
MX574A 300 600 1000 300 1000 300 1000
ns
MX674A 30 320 600 30 600 30 600
MAX174 30 140 300 30 300 30 400
High R/C Pulse Width tHRH 150 150 200 ns
Data Access Time tDDR CL = 100pF 60 120 150 200 ns
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
6
Timing Characteristics—MAX174/MX574A/MX674A (Note 6)
Figure 1. Load Circuit for Access Time Test Figure 2. Load Circuit for Output Float Delay Test
PIN NAME FUNCTION
1VLLogic Supply, +5V
2 12/8Data Mode Select Input
3 CS Chip-Select Input. Must be low to select device.
4 A0 Byte Address/Short-Cycle Input. When starting a conversion, controls number of bits converted (low = 12
bits, high = 8 bits). When reading data, if 12/8 = low, enables low byte (A0 = high) or high byte (A0 = low).
5 R/CRead/Convert Input. When high, the device will be in the data-read mode. When low, the device will be
in the conversion start mode.
28
27
26
25
24
23
22
21
1
2
3
4
5
6
7
8
VLSTS
D11
D10
D9
D8
D7
D6
D5
TOP VIEW
CE
A0
VCC
REFOUT
20
19
9
10
D4
D3
AGND
REFIN
18
17
11
12
D2
D1
VEE
BIPOFF
16
15
13
14
D0
DGND
10VIN
20VIN
MAX174
MX574A
MX674A
DIP/SO
+
12/8
R/C
CS
12
BIPOFF
10VIN
20VIN
DGND
D0
D1
D2
A0
CS
12/8
VL
STS
D11
D10
D3VEE
D4REFIN
D5AGND
D6REFOUT
D7VCC
D8CE
D9R/C
13 14 15 16 17 18
1234 262728
19
20
21
22
23
24
25
5
6
7
8
9
10
11
MAX174
MX574A
MX674A
PLCC
TOP VIEW
3kΩ
DN
100pF
HIGH-Z TO LOGIC 1
3kΩ
+5V
DN
100pF
HIGH-Z TO LOGIC 1
3kΩ
DN
100pF
LOGIC 1 TO HIGH - Z
3kΩ
+5V
DN
100pF
LOGIC 0 TO HIGH - Z
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
7
Pin Description
Pin Congurations
Detailed Description
Converter Operation
The MAX174/MX574A/MX674A use a successive approx-
imation technique to convert an unknown analog input
to a 12-bit digital output code. The control logic provides
easy interface to most microprocessors. Most applica-
tions require only a few external passive components to
perform the analog-to-digital (A/D) function.
The internal voltage output DAC is controlled by a suc-
cessive approximation register (SAR) and has an output
impedance of 2.5kΩ. The analog input is connected to
the DAC output with a 5kΩ resistor for the 10V input and
10kΩ resistor for the 20V input. The comparator is essen-
tially a zero-crossing detector, and its output is fed back
to the SAR input.
The SAR is set to half-scale as soon as a conversion
starts. The analog input is compared to 1/2 of the full-scale
voltage. The bit is kept if the analog input is greater than
halfscale or dropped if smaller. The next bit, bit 10, is then
set with the DAC output either at 1/4 scale, if the most
significant bit (MSB) is dropped, or 3/4 scale if the MSB
is kept. The conversion continues in this manner until the
least significant bit (LSB) is tried. At the end of the conver-
sion, the SAR output is latched into the output buffers.
Digital Interface
CE, CS, and R/C control the operation of the MAX174/
MX574A/MX674A. While both CE and CS are asserted,
the state of R/C selects whether a conversion (R/C = 0) or
a data read (R/C = 1) is in progress. The register control
inputs, 12/8 and A0, select the data format and conver-
sion length. A0 is usually tied to the LSB of the address
bus. To perform a full 12-bit conversion, set A0 low during
a convert start. For a shorter 8-bit conversion, A0 must be
high during a convert start.
Output Data Format
During a data read, A0 also selects whether the three-
state buffers contain the 8 MSBs (A0 = 0) or the 4 LSBs
(A0 = 1) of the digital result. The 4 LSBs are followed by
4 trailing 0s.
Output data is formatted according to the 12/8 pin. If this
input is low, the output will be a word broken into two 8-bit
bytes. This allows direct interlace to 8-bit buses without
the need for external three-state buffers. If 12/8 is high,
the output will be one 12-bit word. A0 can change state
while a data-read operation is in effect.
To begin a conversion, the microprocessor must write to
the ADC address. Then, since a conversion usually takes
longer than a single clock cycle, the microprocessor must
wait for the ADC to complete the conversion. Valid data
will be made available only at the end of the conversion,
which is indicated by STS. STS can be ether polled or
used to generate an interrupt upon completion. Or, the
microprocessor can be kept idle by inserting the appropri-
ate number of No Operation (NOP) instructions between
the conversion-start and data-read commands.
PIN NAME FUNCTION
6 CE Chip-Enable Input. Must be high to select device.
7VCC +12V or +15V Supply
8 REFOUT +10V Reference Output
9 AGND Analog Ground
10 REFIN Reference Input
11 VEE -12V or -15V Supply
12 BIPOFF Bipolar O󰀨set Input. Connect to REFOUT for bipolar input range.
13 10VIN 10V Span Input
14 20VIN 20V Span Input
15 DGND Digital Ground
16–27 D0–D11 Three-State Data Outputs
28 STS Status Output
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
8
Pin Description (continued)
After the conversion is completed, data can be obtained
by the microprocessor. The ADCs have the required logic
for 8-, 12-, and 16-bit bus interfacing, which is determined
by the 12/8 input. If 12/8 is high, the ADCs are configured
for a 16-bit bus. Data lines D0–D11 may be connected to
the bus as either the 12 MSBs or the 12 LSBs. The other
4 bits must be masked out in software.
For 8-bit bus operation, 12/8 is set low. The format is left
justified, and the even address, A0 low, contains the 8
MSBs. The odd address, A0 high, contains the 4 LSBs,
which is followed by 4 trailing 0s. There is no need to
use a software mask when the ADCs are connected to
an 8-bit bus.
Note that the output cannot be forced to a right-justified for-
mat by rearranging the data lines on the 8-bit bus interface.
Figure 3. Analog Equivalent Circuit
Table 1. Truth Table Table 2. MAX174/MX574A/MX674A Data
Format for 8-Bit Bus
CE CS R/C12/8A0 OPERATION
0 X X X X None
X 1 X X X None
1 0 0 X 0 Initiate 12-bit conversion
1 0 0 X 1 Initiate 12-bit conversion
1 0 1 1 X Enable 12-bit conversion
1 0 1 0 0 Enable 8 MSBs
1 0 1 0 1 Enable 4 LSBs + 4
trailing 0s
D7 D6 D5 D4 D3 D2 D1 D0
High Byte
(A0 = 0) MSB D10 D9 D8 D7 D6 D5 D4
Low Byte
(A0 = 1) D3 D2 D1 D0 0 0 0 0
27 (MSB)
26 (D10)
25 (D9)
24 (D8)
23 (D7)
22 (D6)
21 (D5)
20 (D4)
19 (D3)
18 (D2)
17 (D1)
16 (LSB)
HARDWIRING FOR 8-BIT DATA BUSES
D7
D6
D5
D4
D3
D2
D1
D0
DATA BUS
MAX174
MX574A
MX674A
R*
2R* -50Ω
5kΩ
9.950kΩ
5kΩ
1.6kΩ
BIPOFF 10VIN
20VIN
REFIN
SAR
2.5kΩ
DAC
REFIN
2
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
9
Timing and Control
Convert Start Timing—Full Control Mode
R/C must be low before asserting both CE and CS. If it
is high, a brief read operation occurs possibly resulting in
system bus contention. To initiate a conversion, use either
CE or CS. CE is recommended since it is shorter by one
propagation delay than CS and is the faster input of the
two. CE is used to begin the conversion in Figure 4.
The STS output is high during the conversion indicating
the ADC is busy. During this period, additional convert
start commands will be ignored, so that the conversion
cannot be prematurely terminated or restarted. However,
if the state of A0 is changed after the beginning of the
conversion, any additional start conversion transitions will
latch the new state of A0, possibly resulting in an incorrect
conversion length (8 bits vs. 12 bits) for that conversion.
Read Timing—Full Control Mode
Figure 5 illustrates the read-cycle timing. While reading
data, access time is measured from when CE and R/C
are both high. Access time is extended 10ns if CS is used
to initiate a read.
Figure 4. Convert Start Timing Figure 5. Read Timing
tHSC
tHEC
CE
A0
STS
D0–D11
tSSC
tHRC
tSRC
tHAC
tDSC tC
tSAC
HIGH IMPEDANCE
R/C
CS
tSSR
tSRR
tSAR tHAR
tHRR
tHSR
HIGH IMPEDANCE
tDD tHD,tHL
CE
A0
STS
D0–D11
R/C
CS
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
10
Stand-Alone Operation
For systems which do not use or require full bus inter-
facing, the MAX174/MX574A/MX674A can be operated
in a stand-alone mode directly linked through dedicated
input ports.
When configured in the stand-alone mode, conversion is
controlled by R/C. In addition, CS and A0 are wired low;
CE and 12/8 are wired high. To enable the three-state
buffers, set R/C low. A conversion starts when R/C is set
high. This allows either a high- or a low-pulse control sig-
nal. Shown in Figure 6 is the operation with a low pulse. In
this mode, the outputs, in response to the falling edge of
R/C, are forced into the high-impedance state and return
to valid logic-levels after the conversion is complete. The
STS output goes high following the R/C falling edge and
returns low when the conversion is complete.
A high-pulse conversion initiation is illustrated in Figure 7.
When R/C is high, the data lines are enabled. The next con-
version starts with the falling edge of R/C. The data lines
return and remain in high impedance state until another R/C
high pulse.
Analog Considerations
Application Hints
Physical Layout
For best system performance, PCBs should be used for
the MAX174/MX574A/MX674A. Wirewrap boards are not
recommended. The layout of the board should ensure that
digital and analog signal lines are kept separated from
each other as much as possible. Care should be taken
not to run analog and digital lines parallel to each other or
digital lines underneath the MAX174/MX574A/MX674A.
Grounding
The recommended power-supply grounding practice is
shown in Figure 8. The ground reference point for the
onchip reference is AGND. It should be connected directly
to the analog reference point of the system. The analog
and digital grounds should be connected together at the
package in order to gain all of the accuracy possible from
the MAX174/MX574A/MX674A in high digital noise envi-
ronments. In situations permitting, they can be connected
to the most accessible ground-reference point. The pref-
erence is analog power return.
Figure 6. Low Pulse for R//C in Stand-Alone Mode
Figure 7. High Pulse for R//C in Stand-Alone Mode
Figure 8. Power-Supply Grounding Practice
tHDR tHS
tDS
tHRL
tC
R/C
STS
D0–11 HIGH IMPEDANCE
tHRH
tDS
R/C
STS
D0–11
tDDR
tHDR
HIGH IMPEDANCE
S/H AND
ANALOG
CIRCUITRY
DIGITAL
CIRCUITRY
VEE GND VCC VEE AGND DGND DGND+5VVL
VCC
MAX174
MX574A
MX674A
ANALOG SUPPLY DIGITAL SUPPLY
-15V GND +15V +5V GND
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
11
Power-Supply Bypassing
The MAX174/MX574A/MX674A power supplies must
be filtered, well regulated, and free from high-frequency
noise, or unstable output codes will result. Unless great
care is taken in filtering any switching spikes present in
the output, switching power supplies is not suggested for
applications requiring 12-bit resolution. Take note that a
few millivolts of noise converts to several error counts in
a 12-bit ADC.
All power-supply pins should use supply decoupling
capacitors connected with short lead length to the pins,
as shown in Figure 9. The VCC and VEE pins should
be decoupled directly to AGND. A 4.7μF tantalum type
in parallel with a 0 1μF disc ceramic type is a suitable
decoupling.
Internal Reference
The MAX174/MX574A/MX674A have an internal buried
zener reference that provides a 10V, low-noise and low
temperature drift output. An external reference voltage
can also be used for the ADC. When using ±15V supplies,
the internal reference can source up to 2mA in addition to
the BIPOFF and REFIN inputs over the entire operating
temperature range. With ±12V supplies, the reference can
drive the BIPOFF and REFIN inputs over temperature,
but it CANNOT drive an additional load.
Driving the Analog Input
The input leads to AGND and 10VIN or 20VIN should be
as short as possible to minimize noise pick up. If long
leads are needed, use shielded cables.
When using the 20VIN as the analog input, load capaci-
tance on the 10VIN pin must be minimized. Especially on
the faster MAX174, leave the 10VIN pin open to minimize
capacitance and to prevent linearity errors caused by
inadequate settling time.
The amplifier driving the analog input must have low
enough DC output impedance for low full-scale error.
Furthermore, low AC output impedance is also required
since the analog input current is modulated at the clock
rate during the conversion. The output impedance of an
amplifier is the open-loop output impedance divided by
the loop gain at the frequency of interest.
MX574A and MX674A—The approximate internal clock
rate is 600kHz and 1MHz, respectively, and amplifiers like
the MAX400 can be used to drive the input.
MAX174—The internal clock rate is 2MHz and faster
amplifiers like the OP-27, AD711, or OP-42 are required.
Track-and-Hold Interface
The analog input to the ADC must be stable to within 1/2
LSB during the entire conversion for specified 12-bit accu-
racy. This limits the input signal bandwidth to a couple of
hertz for sinusoidal inputs even with the faster MAX174.
For higher bandwidth signals, a track-and-hold amplifier
should be used.
The STS output may be used to provide the Hold signal
to the track-and-hold amplifier. However, since the A/D’s
DAC is switched at approximately the same time as the
conversion is initiated, the switching transients at the out-
put of the T/H caused by the DAC switching may result in
code dependent errors. It is recommended that the Hold
signal to the T/H amplifier precede a conversion or be
coincident with the conversion start.
The first bit decision by the A/D is made approximately
1.5 clock cycles after the start of the conversion. This is
2.5μs, 1.5μs, and 0.8μs for the MX574A, MX674A, and
MAX174, respectively. The T/H hold settling time must
be less than this time. For the MX574A and MX674A, the
AD585 sample-and-hold is recommended (Figure 10).
For the MAX174, a faster T/H amplifier, like the HA5320
or HA5330, should be used (Figure 11).
Input Congurations
The MAX174/MX574A/MX674A input range can be set
using pin strapping. Table 3 shows the possible input
ranges and ideal transition voltages. End-point errors can
be adjusted in all ranges.
Figure 9. Power-Supply Bypassing
VL
+5V
DIGITAL
GROUND
ANALOG
GROUND
+12V/15V
-12V/15V
VCC
VEE
DGND
RECOMMENDED
C1, C2, C4 – 0.1µF CERAMIC
C4, C5, C6 – 4.7µF
AGND
MAX174
MX574A
MX674A
C4C1
C5C2
C6C3
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
12
Note 6: For unipolar input ranges, output coding is straight binary.
Note 8: For bipolar input ranges, output coding is offset binary.
Note 9: For 0 to + 10V or ±5V ranges, 1 LSB = 2.44mV.
Note 10: For 0 to +20V or ±10V ranges, 1 LSB = 4.88mV.
Table 3. Input Ranges and Ideal Digital Output Codes
*The digital outputs will be flickering between the Indicated code and the indicated code plus one.
Figure 10. MX574/MX674A to AD585 Sample-and-Hold Interface
ANALOG INPUT VOLTAGE (V) DIGITAL OUTPUT
0 to +10V 0 to +20V ±5V ±10V MSB LSB
+10.0000 +20.0000 +5.0000 +10.0000 1111 1111 1111
+9.9963 +19.9927 +4.9963 +9.9927 1111 1111 1110*
+5.0012 +10.0024 +0.0012 +0.0024 1000 0000 0000*
+4.9988 +9.9976 -0.0012 -0.0024 0111 1111 1111*
+4.9963 +9.9927 -0.0037 -0.0073 0111 1111 1110*
+0.0012 +0.0024 -4.9988 -9.9976 0000 0000 0000*
0.0000 0.0000 -5.0000 -10.0000 0000 0000 0000
STS
20VIN
10VIN
BIPOFF
REFOUT
REFIN
-VS
VCC
+VIN
*ADDITIONAL PINS OMITTED FOR CLARITY
GND
0.1µF
ANALOG
INPUT
-15V
4.7µF
AGND DGND
HOLD
LREF
VOUT
-VIN
50Ω
50Ω
HOLD
+15V
4.7µF
0.1µF
VEE -15V
4.7µF
0.1µF
VL+5V
4.7µF
0.1µF
AD585*
CONTROL
INPUTS
+VS
+15V
4.7µF 0.1µF MX574A*
MX674A D0 11
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
13
Unipolar Input Operation
The unipolar transfer function and input connections are
shown in Figure 12 and Figure 13.
Because all internal resistors of the MAX174/MX574A/
MX674A are trimmed for absolute calibration, additional
trimming is not necessary for most applications. The
absolute accuracy for each grade is given in the specifica-
tion tables.
If the offset trim is not needed, BIPOFF can be tied directly
to AGND. The two resistors and trimmer for BIPOFF can
then be discarded. A 50Ω ±1% metal film resistor should
be attached between REFOUT and REFIN.
For a 0 to +10V input range, the analog input is connected
between AGND and 10VIN. For a 0 to +20V input range,
the analog input is connected between AGND and 20VIN.
These ADCs can easily handle an input signal beyond
the supplies. If full-scale trim is not needed, the gain trim-
mer, R2, should be swapped with a 50Ω resistor. Should a
10.24V input range be selected, a 200Ω trimmer should be
inserted in series with 10VIN. For a fullscale input range of
20.48V, use a 500Ω trimmer in series with 20VIN. The nomi-
nal input impedance into 10VIN is 5kΩ and 10kΩ for 20VIN.
O󰀨set and Full-Scale Adjustment
In applications where the offset and full-scale range
have to be adjusted, use the circuit shown in Figure 12.
The offset should be adjusted first. Apply 1/2 LSB at the
analog input and adjust R1 until the digital output code
flickers between 0000 0000 0000 and 0000 0000 0001.
To adjust the full-scale range, apply FS - 3/2 LSB at the
analog input and adjust R2 until the output code changes
between 1111 1111 1110 and 1111 1111 1111.
Bipolar Input Operation
The bipolar transfer function is shown in Figure 14, and
input connections are shown in Figure 15. One or both
of the trimmers can be exchanged with a 50Ω ±1% fixed
resistor if the offset and gain specifications suffice.
O󰀨set and Full-Scale Adjustment
To begin bipolar calibration, a signal 1/2 LSB above nega-
tive full-scale is applied. R1 is trimmed until the digital
output flickers between 0000 0000 0000 and 0000 0000
0001. Next, a signal 3/2 LSB below positive full scale
is applied. Then, R2 is trimmed until the output flickers
between 1111 1111 1110 and 1111 1111 1111.
Figure 11. MAX174 to HA5320 Sample-and-Hold Interface
STS
20VIN
10VIN
BIPOFF
REFOUT
REFIN
-VS
VCC
+VIN
*ADDITIONAL PINS OMITTED FOR CLARITY
GND
0.1µF
ANALOG
INPUT
-15V
4.7µF
AGND DGND
S/H
VOUT
-VIN
50Ω
50Ω
+15V
4.7µF
0.1µF
VEE -15V
4.7µF
0.1µF
VL+5V
4.7µF
0.1µF
HA5320*
CONTROL
INPUTS
+VS
+15V
4.7µF 0.1µF MAX174* D0 11
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
14
Figure 12. Ideal Unipolar Transfer Function
Figure 13. Unipolar Input Connections
Figure 14. Ideal Bipolar Transfer Function
Figure 15. Bipolar Input Connections
0
OUTPUT CODE
1111 1111 1111
1111 1111 1110
1111 1111 1101
0000 0000 0011
0000 0000 0010
0000 0000 0001
0000 0000 0000 1 2 3 FS-1
FULL-SCALE
TRANSITION
FS = 4069 LSBs
FS
REFOUT
GAIN
REFIN
BIPOFF
10VIN
*ADDITIONAL PINS OMITTED FOR CLARITY
100Ω
100kΩ
+12V TO +15V
-12V TO -15V
0 TO +10V
0 TO +20V
ANALOG
INPUTS
OFFSET
R1
100kΩ
R2
100Ω
20VIN
AGND
MAX174*
MX574A
MX674A
OUTPUT CODE
1111 1111 1111
1111 1111 1110
1111 1111 1101
1000 0000 0001
1000 0000 0000
0111 1111 1111
0111 1111 1110
0000 0000 0011
0000 0000 0010
0000 0000 0001
0000 0000 0000
ANALOG INPUT VOLTAGE IN LSBs
FS
2
-
FS = 4069 LSBs
FS
2
-+2 -2 -1 0 1 FS
22
FS
21
FS
2
FS
2
-+1
REFIN
GAIN
REFOUT
BIPOFF
10VIN
*ADDITIONAL PINS OMITTED FOR CLARITY
Q5V
Q10V
ANALOG
INPUTS
R2
100Ω
R1
100Ω
OFFSET
20VIN
AGND
MAX174*
MX574A
MX674A
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
15
+Denotes a lead(Pb)-free/RoHS-compliant package.
*Maxim reserves the right to ship Ceramic SB in lieu of CERDIP packages.
**Consult factory for dice specifications.
PART PIN-
PACKAGE
LINEARITY
(LSB)
TEMPCO
(ppm/°C)
8µs Maximum Conversion Time
TEMP RANGE: 0°C to +70°C
MAX174ACPI+ 28 Plastic DIP ½ 10
MAX174BCPI+ 28 Plastic DIP ½ 27
MAX174CCPI+ 28 Plastic DIP 1 50
MAX174ACWI+ 28 Wide SO ½ 10
MAX174BCWI+ 28 Wide SO ½ 27
MAX174CCWI+ 28 Wide SO 1 50
MAX174BC/D Dice* ½
TEMP RANGE: -40°C to +85°C
MAX174AEPI+ 28 Plastic DIP ½ 19
MAX174BEPI+ 28 Plastic DIP ½ 38
MAX174CEPI+ 28 Plastic DIP 1 75
MAX174AEWI+ 28 Wide SO ½ 19
MAX174BEWI+ 28 Wide SO ½ 38
MAX174CEWI+ 28 Wide SO 1 75
TEMP RANGE: -55°C to +125°C
MAX174AMJI 28 CERDIP ¾ 12
MAX174BMJI 28 CERDIP ¾ 25
MAX174CMJ 28 CERDIP 1/21 50
15µs Maximum Conversion Time
TEMP RANGE: 0°C to +70°C
MX674AJN+ 28 Plastic DIP 1 50
MX674AKN+ 28 Plastic DIP ½ 27
MX674ALN+ 28 Plastic DIP ½ 10
MX674AJCWI+ 28 Wide SO 1 50
MX674AKCWI+ 28 Wide SO ½ 27
MX674ALCWI+ 28 Wide SO ½ 10
MX674AK/D Dice* ½
TEMP RANGE: -40°C to +85°C
MX674AJEPI+ 28 Plastic DIP 1 75
MX674AKEPI+ 28 Plastic DIP ½ 38
MX674ALEPI+ 28 Plastic DIP ½ 19
MX674AJEWI+ 28 Wide SO 1 75
MX674AKEWI+ 28 Wide SO ½ 38
MX674ALEWI+ 28 Wide SO ½ 19
PART PIN-
PACKAGE
LINEARITY
(LSB)
TEMPCO
(ppm/°C)
TEMP RANGE: -55°C to +125°C
MX674ASQ 28 CERDIP* 1 50
MX674ATQ 28 CERDIP* ¾ 25
MX674AUQ 28 CERDIP* ¾ 12
MX674ASD 28 Ceramic SB 1 50
MX674ATD 28 Ceramic SB ¾ 25
MX674AUD 28 Ceramic SB ¾ 12
25µs Maximum Conversion Time
TEMP RANGE: 0°C to +70°C
MX574AJN+ 28 Plastic DIP 1 50
MX574AKN+ 28 Plastic DIP ½ 27
MX574ALN+ 28 Plastic DIP ½ 10
MX574AJCWI+ 28 Wide SO 1 50
MX574AKCWI+ 28 Wide SO ½ 27
MX574ALCWI+ 28 Wide SO ½ 10
MX574AJP+ 28 PLCC 1 50
MX574AKP+ 28 PLCC ½ 27
MX574ALP+ 28 PLCC ½ 10
MX574AK/D Dice* ½
TEMP RANGE: -40°C to +85°C
MX574AJEPI+ 28 Plastic DIP 1 75
MX574AKEPI+ 28 Plastic DIP ½ 38
MX574ALEPI+ 28 Plastic DIP ½ 19
MX574AJEWI+ 28 Wide SO 1 75
MX574AKEQI+ 28 PLCC ½ 38
MX574AKEWI+ 28 Wide SO ½ 38
MX574ALEWI+ 28 Wide SO ½ 19
TEMP RANGE: -55°C to +125°C
MX574ASQ 28 CERDIP* 1 50
MX574ATQ 28 CERDIP* ¾ 25
MX574AUQ 28 CERDIP* ¾ 12
MX574ASD 28 Ceramic SB 1 50
MX574ATD 28 Ceramic SB ¾ 25
MX574AUD 28 Ceramic SB ¾ 12
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
16
Ordering Information
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
28 PDIP P28+2 21-0044
28 PLCC Q28+3 21-0049 90-0235
28 Wide SO W28+2 21-0042 90-0109
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
www.maximintegrated.com Maxim Integrated
17
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: BiCMOS
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
3 8/11 Updated the Electrical Characteristics and Ordering Information. Added
Revision History.2–4
4 6/18 Updated Ordering Information 16
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
MAX174/MX574A/
MX674A
Industry-Standard, Complete 12-Bit ADCs
© 2018 Maxim Integrated Products, Inc.
18
Revision History
For pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https://www.maximintegrated.com/en/storefront/storefront.html.