SFH3201 - OSRAM Opto Semiconductors

SFH 3201

NPN-Silizium-Fototransistor im SMT-Gehäuse

Silicon NPN Phototransistor in SMT Package

Lead (Pb) Free Product - RoHS Compliant

2007-03-30 1

Wesentliche Merkmale

• Speziell geeignet für Anwendunge n im Bereich

von 460 nm bis 1080 nm

• Hohe Linearität

• Nur gegurtet lieferbar

Anwendungen

• Umgebungslicht-Detektor

• Lichtschranken für Gleich- und

Wechsel-lichtbetrieb

• Industrieelektronik

• „Messen/Steuern/Regeln“

Typ

Type Bestellnummer

Ordering Code

SFH 3201 Q65110A1207

SFH 3201-2/3 Q65110A2479

Features

• Especially suitable for applications from

460 nm to 1080 nm

• High linearity

• Available only on tape and reel

Applications

• Ambient light detector

• Photointerrupters

• Industrial electronics

• For control and drive circuits

2007-03-30 2

SFH 3201

Grenzwerte

Maximum Ratings

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range Top; Tstg – 40 … + 100 °C

Kollektor-Emitterspannung

Collector-emitter voltage VCE 20 V

Kollektor-Emitterspannung, t < 120 s

Collector-emitter voltage VCE 70 V

Kollektorstrom

Collector curr ent IC50 mA

Kollektorspitzenstrom, τ < 10 μs

Collector surge current ICS 100 mA

Emitter-Kollektorspannung

Emitter-collector voltage VEC 7 V

Verlustleistung, TA = 25 °C

Total power dissipation Ptot 120 mW

Wärmewiderstand für Montage auf PC-Board

Thermal resistance for mounting on pcb RthJA 500 K/W

SFH 3201

2007-03-30 3

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Wellenlänge der max. Fotoempfindlichkeit

Wavelength of max. sensitivity λS max 850 nm

Spektraler Bereich der Fotoempfindlichkeit

S = 10% von Smax

Spectr al range of sens itivity

S = 10% of Smax

λ460 … 1080 nm

Bestrahlungsempfindliche Fläche

Radiant sensitive area A0.55 mm2

Abmessung der Chipfläche

Dimensions of chip area L × B

L × W1 × 1 mm × mm

Halbwinkel

Half angle ϕ± 60 Grad

deg.

Kapazität, VCE = 0 V, f = 1 MHz, E = 0

Capacitance CCE 15 pF

Dunkelstrom

Dark current

VCE = 20 V, E = 0

ICEO 3 (≤ 200) nA

2007-03-30 4

SFH 3201

Directional Characteristics

Srel = f (ϕ)

Die Fototransistoren werden nach ihrer Fotoempfindlichkeit gruppiert und mit arabischen Ziffern

gekennzeichnet.

The phototransistors are grouped according to their spectral sensitivity and distinguished by

arabian figures.

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

-1 -2 -3

Fotostrom, λ = 950 nm

Photocurrent

Ee = 0.1 mW/cm2, VCE = 5 V

Ev = 1000 Ix, Normlicht/

standard light A, VCE = 5 V

IPCE

63 … 125

1.65

100 … 200

2.6

160 … 320

4.2

μA

Anstiegszeit/Abfallzeit

Rise and fall time

IC = 1 mA, VCC = 5 V, RL = 1 kΩ

tr, tf16 24 34 μs

Kollektor-Emitter-

Sättigungsspannung

Collector-emitter saturation voltage

IC = IPCEmin1) × 0.3,

Ee = 0.1 mW/cm2

VCEsat 170

(≤ 250) 170

(≤ 250) mV

1) IPCEmin ist der minimale Fotostrom der jeweiligen Gruppe.

1) IPCEmin is the min. photocurrent of the specified group.

OHF01402

40 30 20 10

20 40 60 80 100 1200.40.60.81.0

0.2

0.4

0.6

0.8

1.0

100 0

SFH 3201

2007-03-30 5

TA = 25 °C, λ = 950 nm

Rel. Spectral Sensitivity,

Srel = f (λ)

Photocurrent IPCE = f (TA),

VCE = 5 V, normalized to 25 °C

Photocurrent

IPCE = f (VCE)

OHF02332

rel

400

100

500 600 700 800 900 nm 1100

OHF01524

-25

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 25 50 75 100

PCE

OHF00327

001020 30 40 50 60 70V

pce

1.0 mW/cm

0.5

1.0

1.5

2.0

2.5

3.0

0.5 mW/cm

0.25 mW/cm

0.1 mW/cm

Photocurrent

IPCE = f (Ee), VCE = 5 V

Dark Current

ICEO = f (VCE), E = 0

Collector-Emitter Capacitance

CCE = f (VCE), f = 1 MHz

OHF00326

-3

pce

-4

mW/cm10

-2

-3

-2

-1

10 1

OHF02341

CEO

-2

-1

10 20 30 40 50 70V

OHF02344

10 -2 -1

10 0

10 1

10 10 2

Total Power Dissipation

Ptot = f (TA)

Dark Current

ICEO = f (TA), VCE = 10 V, E = 0

OHF00309

tot

020 40 60 80 C 100

100

120

140

OHF02342

CEO

-1

20 40 60 80 100˚C

2007-03-30 6

SFH 3201

Maßzeichnung

Package Outlines

Maße in mm (inch) / Dimensions in mm (inch).

3.4 (0.134)

3.0 (0.118)

5.8 (0.228)

6.2 (0.244)

0.15 (0.006)

0.13 (0.005)

0...0.1 (0...0.004)

2.1 (0.083)

1.7 (0.067)

GEOY6982

4.2 (0.165)

3.8 (0.150)

- Emitter Collector

12 3 4 6

---

0.3 (0.012)

0.5 (0.020)

spacing

0.4 (0.016)

0.7 (0.028)

0.2 M

Active area 0.55 (0.022)

0.1 M

2.54 (0.100)

1.27 (0.050)

SFH 3201

2007-03-30 7

Empfohlenes Lötpaddesign Reflow Löten

Recommended Solder Pad Reflow Soldering

Solder resist

Lötstopplack

Cu-area >5 mm

Cu-Fläche >5 mm

OHPY0030

3.9 (0.154)

1.2 (0.047)

1.27 (0.050)

0.6 (0.024)

1.27 (0.050)

Paddesign

Wärmeableitung

for improved

für verbesserte

Padgeometrie

Heat dissipation

2007-03-30 8

SFH 3201

Lötbedingungen Vorbehandlung nach JEDEC Level 4

Soldering Conditions Preconditioning acc. to JEDEC Level 4

Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)

Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)

Wellenlöten (TTW) (nach CECC 00802)

TTW Soldering (acc. to CECC 00802)

OHLA0687

˚C

120 s max

100

150

200

250

300

Ramp Up

100 s max

50 100 150 200 250 300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

245 ˚C

±5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

235 ˚C

-0 ˚C

+5 ˚C

Minimum Solder Profile

10 s min

OHLY0598

050 100 150 200 250

100

150

200

250

300

235 C

10 s

C... 260

1. Welle

1. wave

2. Welle

2. wave

5 K/s 2 K/s

ca 200 K/s

CC... 130100

2 K/s Zwangskühlung

forced cooling

Normalkurve

standard curve

Grenzkurven

limit curves

SFH 3201

2007-03-30 9

Published by

OSRAM Opto Semiconductors GmbH

Wernerwerkstrasse 2, D-93049 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organiza tion.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be used in life-supp ort devices or systems 2 with the express written approval of OSRAM OS.

1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected

to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.

2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain

and sustain human life. If they fail, it is reas onable to assume that the health of the user may be endangered.