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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

SLOS068U –JUNE 1976–REVISED JANUARY 2017

LM358, LM258, LM158, LM2904 Dual Operational Amplifiers

1 Features

1• Wide Supply Ranges

– Single Supply: 3 V to 32 V

(26 V for LM2904)

– Dual Supplies: ±1.5 V to ±16 V

(±13 V for LM2904)

• Low Supply-Current Drain, Independent of Supply

Voltage: 0.7 mA Typical

• Wide Unity Gain Bandwidth: 0.7 MHz

• Common-Mode Input Voltage Range Includes

Ground, Allowing Direct Sensing Near Ground

• Low Input Bias and Offset Parameters

– Input Offset Voltage: 3 mV Typical

A Versions: 2 mV Typical

– Input Offset Current: 2 nA Typical

– Input Bias Current: 20 nA Typical

A Versions: 15 nA Typical

• Differential Input Voltage Range Equal to

Maximum-Rated Supply Voltage: 32 V

(26 V for LM2904)

• Open-Loop Differential Voltage Gain:

100 dB Typical

• Internal Frequency Compensation

• On Products Compliant to MIL-PRF-38535,

All Parameters are Tested Unless Otherwise

Noted. On All Other Products, Production

Processing Does Not Necessarily Include Testing

of All Parameters.

2 Applications

• Blu-ray Players and Home Theaters

• Chemical and Gas Sensors

• DVD Recorder and Players

• Digital Multimeter: Bench and Systems

• Digital Multimeter: Handhelds

• Field Transmitter: Temperature Sensors

• Motor Control: AC Induction, Brushed DC,

Brushless DC, High-Voltage, Low-Voltage,

Permanent Magnet, and Stepper Motor

• Oscilloscopes

• TV: LCD and Digital

• Temperature Sensors or Controllers Using

Modbus

• Weigh Scales

3 Description

These devices consist of two independent, high-gain

frequency-compensated operational amplifiers

designed to operate from a single supply or split

supply over a wide range of voltages.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LMx58, LMx58x,

LM2904, LM2904V

VSSOP (8) 3.00 mm × 3.00 mm

SOIC (8) 4.90 mm × 3.90 mm

SO (8) 5.20 mm × 5.30 mm

TSSOP (8) 3.00 mm × 4.40 mm

PDIP (8) 9.81 mm × 6.35 mm

LMx58, LMx58x,

LM2904V CDIP (8) 9.60 mm × 6.67 mm

LCCC (20) 8.89 mm × 8.89 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Symbol (Each Amplifier)

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

SLOS068U –JUNE 1976–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics for LMx58.......................... 5

6.6 Electrical Characteristics for LM2904 ....................... 6

6.7 Electrical Characteristics for LM158A and LM258A . 7

6.8 Electrical Characteristics for LM358A....................... 7

6.9 Operating Conditions ................................................ 8

6.10 Typical Characteristics............................................ 9

7 Parameter Measurement Information ................ 11

8 Detailed Description............................................ 12

8.1 Overview................................................................. 12

8.2 Functional Block Diagram....................................... 12

8.3 Feature Description................................................. 13

8.4 Device Functional Modes........................................ 13

9 Application and Implementation ........................ 14

9.1 Application Information............................................ 14

9.2 Typical Application ................................................. 14

10 Power Supply Recommendations ..................... 15

11 Layout................................................................... 15

11.1 Layout Guidelines ................................................. 15

11.2 Layout Examples................................................... 16

12 Device and Documentation Support................. 17

12.1 Documentation Support ........................................ 17

12.2 Related Links ........................................................ 17

12.3 Receiving Notification of Documentation Updates 17

12.4 Community Resources.......................................... 17

12.5 Trademarks........................................................... 17

12.6 Electrostatic Discharge Caution............................ 17

12.7 Glossary................................................................ 17

13 Mechanical, Packaging, and Orderable

Information........................................................... 18

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision T (April 2015) to Revision U Page

• Changed data sheet title......................................................................................................................................................... 1

• Added Receiving Notification of Documentation Updates section and Community Resources section ............................. 17

Changes from Revision S (January 2014) to Revision T Page

• Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes,Application

and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1

Changes from Revision R (July 2010) to Revision S Page

• Converted this data sheet from the QS format to DocZone using the PDF on the web........................................................ 1

• Deleted Ordering Information table ........................................................................................................................................ 1

• Updated Features to include Military Disclaimer.................................................................................................................... 1

• Added Typical Characteristics section.................................................................................................................................... 9

• Added ESD warning............................................................................................................................................................. 17

3 2 1 20 19

9 10 11 12 13

2OUT

2IN−

1IN−

1IN+

1OUT

NC NC

GND

CC+

2IN+

1OUT

1IN−

1IN+

GND

VCC

2OUT

2IN−

2IN+

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

www.ti.com

SLOS068U –JUNE 1976–REVISED JANUARY 2017

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

5 Pin Configuration and Functions

D, DGK, P, PS, PW and JG Package

8-Pin SOIC, VSSOP, PDIP, SO, TSSOP and CDIP

(Top View) FK Package

20-Pin LCCC

(Top View)

NC - No internal connection

Pin Functions

I/O DESCRIPTION

NAME LCCC NO.

SOIC, SSOP,

CDIP, PDIP

SO, TSSOP,

CFP NO.

1IN– 5 2 I Negative input

1IN+ 7 3 I Positive input

1OUT 2 1 O Output

2IN– 15 6 I Negative input

2IN+ 12 5 I Positive input

2OUT 17 7 O Output

GND 10 4 — Ground

— — Do not connect

VCC — 8 — Power supply

VCC+ 20 — — Power supply

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

SLOS068U –JUNE 1976–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.

(3) Differential voltages are at IN+, with respect to IN−.

(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

LMx58, LMx58x,

LM2904V LM2904 UNIT

MIN MAX MIN MAX

VCC Supply voltage(2) –0.3 ±16 or 32 –0.3 ±13 or 26 V

VID Differential input voltage(3) –32 32 –26 26 V

VIeither

input Input voltage –0.3 32 –0.3 26 V

Duration of output short circuit (one amplifier) to ground at

(or below) TA= 25°C,

VCC ≤15 V(4) Unlimited Unlimited s

TAOperating free air temperature

LM158, LM158A –55 125

°C

LM258, LM258A –25 85

LM358, LM358A 0 70

LM2904 –40 125 –40 125

TJOperating virtual junction temperature 150 150 °C

Case temperature for 60

seconds FK package 260 °C

Lead temperature 1.6 mm (1/16

inch) from case for 60 seconds JG package 300 300 °C

Tstg Storage temperature –65 150 –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2) ±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) LMx58, LMx58x,

LM2904V LM2904 UNIT

MIN MAX MIN MAX

VCC Supply voltage 3 30 3 26 V

VCM Common-mode voltage 0 VCC – 2 0 VCC – 2 V

TAOperating free air temperature

LM158 –55 125

°C

LM2904 –40 125 –40 125

LM358 0 70

LM258 –25 85

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

www.ti.com

SLOS068U –JUNE 1976–REVISED JANUARY 2017

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LMx58, LMx58x, LM2904V, LM2904 LMx58,

LMx58x,

LM2904

LMx58,

LMx58x,

LM2904

VUNIT

D (SOIC) DGK

(VSSOP) P (PDIP) PS (SO) PW

(TSSOP) FK

(LCCC) JG

(CDIP)

8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 20 PINS 8 PINS

RθJA Junction-to-ambient

thermal resistance 97 172 85 95 149 — — °C/W

RθJC(top) Junction-to-case

(top) thermal

resistance 72.2 — — — — 5.61 14.5 °C/W

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX

VCC for testing purposes is 26 V for LM2902 and 30 V for the others.

(2) Full range is –55°C to 125°C for LM158, –25°C to 85°C for LM258, and 0°C to 70°C for LM358, and –40°C to 125°C for LM2904.

(3) All typical values are at TA= 25°C

6.5 Electrical Characteristics for LMx58

at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS(1) TA(2) LM158

LM258 LM358 UNIT

MIN TYP(3) MAX MIN TYP(3) MAX

VIO Input offset voltage VCC = 5 V to MAX,

VIC = VICR(min),

VO= 1.4 V

25°C 3 5 3 7 mV

Full range 7 9

αVIO Average temperature coefficient of

input offset voltage Full range 7 7 µV/°C

IIO Input offset current VO= 1.4 V 25°C 2 30 2 50 nA

Full range 100 150

αIIO Average temperature coefficient of

input offset current Full range 10 10 pA/°C

IIB Input bias current VO= 1.4 V 25°C –20 –150 –20 –250 nA

Full range –300 –500

VICR Common-mode input voltage range VCC = 5 V to MAX 25°C 0 to

VCC – 1.5 0 to

VCC – 1.5 V

Full range 0 to

VCC – 2 0 to

VCC – 2

VOH High-level output voltage

RL≥2 kΩ25°C VCC – 1.5 VCC – 1.5

RL≥10 kΩ25°C

VCC = MAX RL= 2 kΩFull range 26 26

RL≥10 kΩFull range 27 28 27 28

VOL Low-level output voltage RL≤10 kΩFull range 5 20 5 20 mV

AVD Large-signal differential

voltage amplification

VCC = 15 V

VO= 1 V to 11 V,

RL≥2 kΩ

25°C 50 100 25 100 V/mV

Full range 25 15

CMRR Common-mode rejection ratio VCC= 5 V to MAX,

VIC = VICR(min) 25°C 70 80 65 80 dB

kSVR Supply-voltage rejection ratio

(ΔVDD /ΔVIO)VCC = 5 V to MAX 25°C 65 100 65 100 dB

VO1/ VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 120 dB

IOOutput current

VCC = 15 V,

VID = 1 V,

VO= 0 Source 25°C –20 –30 –20 –30

Full range –10 –10

VCC = 15 V,

VID = –1 V,

VO= 15 V Sink 25°C 10 20 10 20

Full range 5 5

VID = –1 V, VO= 200 mV 25°C 12 30 12 30 μA

IOS Short-circuit output current VCC at 5 V, GND at –5 V,

VO= 0 25°C ±40 ±60 ±40 ±60 mA

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

SLOS068U –JUNE 1976–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

Electrical Characteristics for LMx58 (continued)

at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS(1) TA(2) LM158

LM258 LM358 UNIT

MIN TYP(3) MAX MIN TYP(3) MAX

ICC Supply current

(two amplifiers)

VO= 2.5 V, No load Full range 0.7 1.2 0.7 1.2 mA

VCC = MAX, VO= 0.5 VCC,

No load Full range 1 2 1 2

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX

VCC for testing purposes is 26 V for LM2902 and 32 V for LM2902V.

(2) Full range is –55°C to 125°C for LM158, –25°C to 85°C for LM258, 0°C to 70°C for LM358, and –40°C to 125°C for LM2904.

(3) All typical values are at TA= 25°C.

6.6 Electrical Characteristics for LM2904

at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS(1) TA(2) LM2904 UNIT

MIN TYP(3) MAX

VIO Input offset voltage VCC = 5 V to MAX,

VIC = VICR(min),

VO= 1.4 V

Non-A-suffix

devices 25°C 3 7

Full range 10

A-suffix devices 25°C 1 2

Full range 4

αVIO Average temperature coefficient

of input offset voltage Full range 7 μV/°C

IIO Input offset current VO= 1.4 V

Non-V device 25°C 2 50

Full range 300

V-suffix device 25°C 2 50

Full range 150

αIIO Average temperature coefficient

of input offset current Full range 10 pA/°C

IIB Input bias current VO= 1.4 V 25°C –20 –250 nA

Full range –500

VICR Common-mode input

voltage range VCC = 5 V to MAX 25°C 0 to

VCC – 1.5 V

Full range 0 to

VCC – 2

VOH High-level output voltage

RL≥10 kΩ25°C VCC – 1.5

VCC = MAX,

Non-V device RL= 2 kΩFull range 22

RL≥10 kΩFull range 23 24

VCC = MAX

V-suffix device RL= 2 kΩFull range 26

RL≥10 kΩFull range 27 28

VOL Low-level output voltage RL≤10 kΩFull range 5 20 mV

AVD Large-signal differential

voltage amplification

VCC = 15 V,

VO= 1 V to 11 V,

RL≥2 kΩ

25°C 25 100 V/mV

Full range 15

CMRR Common-mode rejection ratio VCC = 5V to MAX,

VIC = VICR(min)

Non-V device 25°C 50 80 dB

V-suffix device 25°C 65 80

kSVR Supply-voltage rejection ratio

(ΔVCC /ΔVIO)VCC = 5 V to MAX 25°C 65 100 dB

VO1/ VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 dB

IOOutput current

VCC = 15 V,

VID = 1 V,

VO= 0 Source 25°C –20 –30

Full range –10

VCC = 15 V,

VID = –1 V,

VO= 15 V Sink 25°C 10 20

Full range 5

VID = –1 V, VO= 200 mV Non-V device 25°C 30 μA

V-suffix device 25°C 12 40

IOS Short-circuit output current VCC at 5 V, VO= 0, GND at −5 V 25°C ±40 ±60 mA

ICC Supply current

(four amplifiers) VO= 2.5 V, No load Full range 0.7 1.2 mA

VCC = MAX, VO= 0.5 VCC, No load Full range 1 2

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

www.ti.com

SLOS068U –JUNE 1976–REVISED JANUARY 2017

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX

VCC for testing purposes is 26 V for LM2904 and 30 V for others.

(2) All typical values are at TA= 25°C.

(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.

6.7 Electrical Characteristics for LM158A and LM258A

at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS(1) TA(1) LM158A LM258A UNIT

MIN TYP(2) MAX MIN TYP(2) MAX

VIO Input offset voltage VCC = 5 V to 30 V,

VIC = VICR(min),

VO= 1.4 V

25°C 2 2 3 mV

Full range 4 4

αVIO

Average temperature

coefficient of input

offset voltage Full range 7 15(3) 7 15 µA/°C

IIO Input offset current VO= 1.4 V 25°C 2 10 2 15 nA

Full range 30 30

αIIO

Average temperature

coefficient of input

offset current Full range 10 200 10 200 pA/°C

IIB Input bias current VO= 1.4 V 25°C –15 –50 –15 –80 nA

Full range –100 –100

VICR Common-mode input

voltage range VCC = 30 V 25°C 0 to

VCC – 1.5 0 to

VCC – 1.5 V

Full range 0 to

VCC – 2 0 to

VCC – 2

VOH High-level output

voltage

RL≥2 kΩ25°C VCC – 1.5 VCC – 1.5

VCC = 30 V RL= 2kΩFull range 26 26

RL≥10kΩFull range 27 28 27 28

VOL Low-level output

voltage RL≤10 kΩFull range 5 20 5 20 mV

AVD

Large-signal

differential voltage

amplification

VCC = 15 V, VO= 1 V to 11 V,

RL≥2 kΩ

25°C 50 100 50 100 V/mV

Full range 25 25

CMRR Common-mode

rejection ratio 25°C 70 80 70 80 dB

kSVR

Supply-voltage

rejection ratio

(ΔVD/ΔVIO)25°C 65 100 65 100 dB

VO1/ VO2 Crosstalk

attenuation f = 1 kHz to 20 kHz 25°C 120 120 dB

IOOutput current

VCC = 15 V,

VID = 1 V,

VO= 0 Source 25°C –20 –30 –60 –20 –30 −60

Full range –10 –10

VCC = 15 V,

VID = –1 V,

VO= 15 V Sink 25°C 10 20 10 20

Full range 5 5

VID =−1 V, VO= 200 mV 25°C 12 30 12 30 μA

IOS Short-circuit

output current VCC at 5 V, GND at –5 V,

VO= 0 25°C ±40 ±60 ±40 ±60 mA

ICC Supply current

(four amplifiers)

VO= 2.5 V, No load Full range 0.7 1.2 0.7 1.2 mA

VCC = MAX V, VO= 0.5 V,

No load Full range 1 2 1 2

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX

VCC for testing purposes is 26 V for LM2904 and 30 V for others.

(2) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX

VCC for testing purposes is 26 V for LM2904 and 30 V for others.

(3) All typical values are at TA= 25°C.

6.8 Electrical Characteristics for LM358A

at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS(1) TA(2) LM358A UNIT

MIN TYP(3) MAX

VIO Input offset voltage VCC = 5 V to 30 V,

VIC = VICR(min),

VO= 1.4 V

25°C 2 3 mV

Full range 5

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

SLOS068U –JUNE 1976–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

Electrical Characteristics for LM358A (continued)

at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS(1) TA(2) LM358A UNIT

MIN TYP(3) MAX

αVIO Average temperature coefficient

of input offset voltage Full range 7 20 µA/°C

IIO Input offset current VO= 1.4 V 25°C 2 30 nA

Full range 75

αIIO Average temperature coefficient

of input offset current Full range 10 300 pA/°C

IIB Input bias current VO= 1.4 V 25°C –15 –100 nA

Full range –200

VICR Common-mode input

voltage range VCC = 30 V 25°C 0 to

VCC – 1.5 V

Full range 0 to

VCC – 2

VOH High-level output voltage

RL≥2 kΩ25°C VCC – 1.5

VCC = 30 V RL= 2kΩFull range 26

RL≥10kΩFull range 27 28

VOL Low-level output voltage RL≤10 kΩFull range 5 20 mV

AVD Large-signal differential

voltage amplification VCC = 15 V, VO= 1 V to 11 V,

RL≥2 kΩ

25°C 25 100 V/mV

Full range 15

CMRR Common-mode rejection ratio 25°C 65 80 dB

kSVR Supply-voltage rejection ratio

(ΔVDD /ΔVIO)25°C 65 100 dB

VO1/ VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 dB

IOOutput current

VCC = 15 V,

VID = 1 V,

VO= 0 Source 25°C –20 –30 −60

Full range –10

VCC = 15 V,

VID = –1 V,

VO= 15 V Sink 25°C 10 20

Full range 5

VID = –1 V, VO= 200 mV 25°C 30 μA

IOS Short-circuit output current VCC at 5 V, GND at –5 V,

VO= 0 25°C ±40 ±60 mA

ICC Supply current

(four amplifiers)

VO= 2.5 V, No load Full range 0.7 1.2 mA

VCC = MAX V, VO= 0.5 V,

No load Full range 1 2

6.9 Operating Conditions

VCC = ±15 V, TA= 25°C

PARAMETER TEST CONDITIONS TYP UNIT

SR Slew rate at unity gain RL= 1 MΩ, CL= 30 pF, VI= ±10 V (see Figure 11) 0.3 V/μs

B1Unity-gain bandwidth RL= 1 MΩ, CL= 20 pF (see Figure 11) 0.7 MHz

VnEquivalent input noise voltage RS= 100 Ω, VI= 0 V, f = 1 kHz (see Figure 12) 40 nV/√Hz

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0 4 8 12 16 20 24 28 32 36 40

Voltage (V)

Time (s)

VOUT

C001

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0 2 4 6 8 10

Voltage (V)

Time (s)

VOUT

C001

100

120

140

160

0 5 10 15 20 25 30 35 40

Avol Voltage Gain (dB)

V+ Supply Voltage (Vdc)

RL=20K

RL=2K

100

0.1 1 10 100 1000

CMRR (dB)

Frequency (kHz)

CMRR

C001

0.2

0.22

0.24

0.26

0.28

0.3

0.32

0.34

0.36

0 5 10 15 20 25 30

Supply Current (mA)

Supply Voltage (Vdc)

–55C

125C

–55 –35 –15 525 45 65 85 105 125

Input Current (nAdc)

Temperature (°C)

5Vdc

15Vdc

30Vdc

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

www.ti.com

SLOS068U –JUNE 1976–REVISED JANUARY 2017

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

6.10 Typical Characteristics

Figure 1. Input Current vs. Temperature Figure 2. Supply Current vs. Supply Voltage

Figure 3. Voltage Gain vs. Supply Voltage Figure 4. Common-mode Rejection Ratio vs. Frequency

Figure 5. Voltage Follower Large Signal Response (50 pF) Figure 6. Voltage Follower Small Signal Response (50 pF)

0.01

0.1

0.001 0.01 0.1 1 10 100

Output Voltage (Vdc)

Output Sink Current (mAdc)

5Vdc

15Vdc

30Vdc

–55 –35 –15 525 45 65 85 105 125

Output Current (mAdc)

Temperature (°C)

2.5

7.5

12.5

17.5

1 10 100 1k

Output Swing (Vp-p)

Frequency (kHz)

0.001 0.01 0.1 1 10 100

Output Voltage (Vdc) relative to Vcc

Output Sink Current (mAdc)

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

SLOS068U –JUNE 1976–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

Typical Characteristics (continued)

Figure 7. Maximum Output Swing vs. Frequency

(VCC = 15 V) Figure 8. Output Sourcing Characteristics

Figure 9. Output Sinking Characteristics Figure 10. Source Current Limiting

−

VCC+

VCC−

−

100 Ω

VCC+

VCC−

900 Ω

VI= 0 V

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

www.ti.com

SLOS068U –JUNE 1976–REVISED JANUARY 2017

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

7 Parameter Measurement Information

Figure 11. Unity-Gain Amplifier Figure 12. Noise-Test Circuit

VCC+

OUT

GND (or VCC−)

To Other Amplifier

IN−

IN+

≈6- Aµ

Current

Regulator

≈6- Aµ

Current

Regulator

≈100- Aµ

Current

Regulator

≈50- Aµ

Current

Regulator

Epi-FET

Diodes

Resistors

Transistors

Capacitors

COMPONENT COUNT

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

SLOS068U –JUNE 1976–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

8 Detailed Description

8.1 Overview

These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to

operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the

difference between the two supplies is 3 V to 32 V (3 V to 26 V for the LM2904 device), and VCC is at least 1.5 V

more positive than the input common-mode voltage. The low supply-current drain is independent of the

magnitude of the supply voltage.

Applications include transducer amplifiers, DC amplification blocks, and all the conventional operational amplifier

circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices

can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required

interface electronics without additional ±5-V supplies.

8.2 Functional Block Diagram

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

www.ti.com

SLOS068U –JUNE 1976–REVISED JANUARY 2017

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

8.3 Feature Description

8.3.1 Unity-Gain Bandwidth

The unity-gain bandwidth is the frequency up to which an amplifier with a unity gain may be operated without

greatly distorting the signal. These devices have a 0.7-MHz unity-gain bandwidth.

8.3.2 Slew Rate

The slew rate is the rate at which an operational amplifier can change its output when there is a change on the

input. These devices have a 0.3-V/μs slew rate.

8.3.3 Input Common Mode Range

The valid common mode range is from device ground to VCC - 1.5 V (VCC - 2 V across temperature). Inputs may

exceed VCC up to the maximum VCC without device damage. At least one input must be in the valid input

common mode range for output to be correct phase. If both inputs exceed valid range then output phase is

undefined. If either input is less than -0.3 V then input current should be limited to 1mA and output phase is

undefined.

8.4 Device Functional Modes

These devices are powered on when the supply is connected. This device can be operated as a single supply

operational amplifier or dual supply amplifier depending on the application.

Vsup+

+VOUT

VIN

Vsup-

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

SLOS068U –JUNE 1976–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The LMx58 and LM2904 operational amplifiers are useful in a wide range of signal conditioning applications.

Inputs can be powered before VCC for flexibility in multiple supply circuits.

9.2 Typical Application

A typical application for an operational amplifier in an inverting amplifier. This amplifier takes a positive voltage

on the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes

negative voltages positive.

Figure 13. Application Schematic

9.2.1 Design Requirements

The supply voltage must be chosen such that it is larger than the input voltage range and output range. For

instance, this application will scale a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to

accommodate this application.

9.2.2 Detailed Design Procedure

Determine the gain required by the inverting amplifier using Equation 1 and Equation 2:

(1)

(2)

Once the desired gain is determined, choose a value for RI or RF. Choosing a value in the kilohm range is

desirable because the amplifier circuit will use currents in the milliamp range. This ensures the part will not draw

too much current. This example will choose 10 kΩfor RI which means 36 kΩwill be used for RF. This was

determined by Equation 3.

(3)

-2

-1.5

-1

-0.5

0.5

1.5

0 0.5 1 1.5 2

Volts

Time (ms)

VIN

VOUT

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

www.ti.com

SLOS068U –JUNE 1976–REVISED JANUARY 2017

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

Typical Application (continued)

9.2.3 Application Curve

Figure 14. Input and Output Voltages of the Inverting Amplifier

10 Power Supply Recommendations

CAUTION

Supply voltages larger than 32 V for a single supply (26 V for the LM2904), or outside

the range of ±16 V for a dual supply (±13 V for the LM2904) can permanently damage

the device (see the Absolute Maximum Ratings).

Place 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high

impedance power supplies. For more detailed information on bypass capacitor placement, refer to the Layout.

11 Layout

11.1 Layout Guidelines

For best operational performance of the device, use good PCB layout practices, including:

• Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the

operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance

power sources local to the analog circuitry.

– Connect low-ESR, 0.1-μF ceramic bypass capacitors between each supply pin and ground, placed as

close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single

supply applications.

• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective

methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.

A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital

and analog grounds, paying attention to the flow of the ground current.

• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If

it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as

opposed to in parallel with the noisy trace.

• Place the external components as close to the device as possible. Keeping RF and RG close to the inverting

input minimizes parasitic capacitance, as shown in Layout Examples.

• Keep the length of input traces as short as possible. Always remember that the input traces are the most

sensitive part of the circuit.

• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce

leakage currents from nearby traces that are at different potentials.

RIN

RG RF

VOUT

VIN

VCC+

IN1í

IN1+

VCCí

OUT

RIN

GND

VIN

VS-GND

VS+

GND

Run the input traces as far

away from the supply lines

as possible

Only needed for

dual-supply

operation

Place components close to

device and to each other to

reduce parasitic errors

Use low-ESR, ceramic

bypass capacitor

(or GND for single supply) Ground (GND) plane on another layerVOUT

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

SLOS068U –JUNE 1976–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

11.2 Layout Examples

Figure 15. Operational Amplifier Board Layout for Noninverting Configuration

Figure 16. Operational Amplifier Schematic for Noninverting Configuration

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

www.ti.com

SLOS068U –JUNE 1976–REVISED JANUARY 2017

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

•Circuit Board Layout Techniques, SLOA089.

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

LM158 Click here Click here Click here Click here Click here

LM158A Click here Click here Click here Click here Click here

LM258 Click here Click here Click here Click here Click here

LM258A Click here Click here Click here Click here Click here

LM358 Click here Click here Click here Click here Click here

LM358A Click here Click here Click here Click here Click here

LM2904 Click here Click here Click here Click here Click here

LM2904V Click here Click here Click here Click here Click here

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

12.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.7 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms and definitions.

LM158, LM158A

LM258

LM258A

LM358

LM358A

LM2904

LM2904V

SLOS068U –JUNE 1976–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser based versions of this data sheet, refer to the left hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

5962-87710012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-

87710012A

LM158FKB

5962-8771001PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771001PA

LM158

5962-87710022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-

87710022A

LM158AFKB

5962-8771002PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771002PA

LM158A

LM158AFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-

87710022A

LM158AFKB

LM158AJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM158AJG

LM158AJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771002PA

LM158A

LM158FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-

87710012A

LM158FKB

LM158JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM158JG

LM158JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771001PA

LM158

LM258AD ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A

LM258ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU |

CU NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M3L, M3P, M3S, M3

LM258ADR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM258A

LM258ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A

LM258ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A

LM258AP ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN N / A for Pkg Type -25 to 85 LM258AP

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM258APE4 ACTIVE PDIP P 8 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM258AP

LM258D ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258

LM258DG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258

LM258DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU |

CU NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2

LM258DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2

LM258DR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM258

LM258DRG3 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 85 LM258

LM258DRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258

LM258P ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN N / A for Pkg Type -25 to 85 LM258P

LM258PE4 ACTIVE PDIP P 8 50 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM258P

LM2904AVQDR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV

LM2904AVQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV

LM2904AVQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV

LM2904AVQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV

LM2904D ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DE4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU |

CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2904DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB

LM2904DR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DRE4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DRG3 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904

LM2904P ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN N / A for Pkg Type -40 to 125 LM2904P

LM2904PE4 ACTIVE PDIP P 8 TBD Call TI Call TI -40 to 125

LM2904PSR ACTIVE SO PS 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904

LM2904PW ACTIVE TSSOP PW 8 150 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904

LM2904PWR ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L2904

LM2904PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L2904

LM2904PWRG4-JF ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904

LM2904QDR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1

LM2904QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1

LM2904VQDR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V

LM2904VQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V

LM2904VQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V

LM2904VQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

Addendum-Page 4

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM358AD ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A

LM358ADE4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A

LM358ADG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A

LM358ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU |

CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6

LM358ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6

LM358ADR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 LM358A

LM358ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A

LM358ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A

LM358AP ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN N / A for Pkg Type 0 to 70 LM358AP

LM358APE4 ACTIVE PDIP P 8 50 TBD Call TI Call TI 0 to 70 LM358AP

LM358APW ACTIVE TSSOP PW 8 150 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A

LM358APWR ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 L358A

LM358APWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A

LM358D ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358

LM358DG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358

LM358DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU |

CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5

LM358DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5

LM358DR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 LM358

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

Addendum-Page 5

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM358DRE4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358

LM358DRG3 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM358

LM358DRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358

LM358P ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN N / A for Pkg Type 0 to 70 LM358P

LM358PE3 ACTIVE PDIP P 8 50 Pb-Free

(RoHS) CU SN N / A for Pkg Type 0 to 70 LM358P

LM358PE4 ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 LM358P

LM358PSR ACTIVE SO PS 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358

LM358PW ACTIVE TSSOP PW 8 150 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358

LM358PWR ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 L358

LM358PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 L358

LM358PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358

LM358PWRG4-JF ACTIVE TSSOP PW 8 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

Addendum-Page 6

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM258A, LM2904 :

•Automotive: LM2904-Q1

•Enhanced Product: LM258A-EP, LM2904-EP

NOTE: Qualified Version Definitions:

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•Enhanced Product - Supports Defense, Aerospace and Medical Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258ADR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258ADR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM258DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM258DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 15-Dec-2017

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM2904AVQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1

LM2904AVQDRG4 SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1

LM2904AVQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904AVQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1

LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904PWRG4-JF TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904VQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1

LM2904VQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358ADR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358ADR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM358ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358APWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM358DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 15-Dec-2017

Pack Materials-Page 2

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM358DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1

LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358PWRG4-JF TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM258ADGKR VSSOP DGK 8 2500 332.0 358.0 35.0

LM258ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0

LM258ADR SOIC D 8 2500 367.0 367.0 35.0

LM258ADR SOIC D 8 2500 333.2 345.9 28.6

LM258ADR SOIC D 8 2500 364.0 364.0 27.0

LM258ADR SOIC D 8 2500 340.5 338.1 20.6

LM258ADRG4 SOIC D 8 2500 340.5 338.1 20.6

LM258ADRG4 SOIC D 8 2500 367.0 367.0 35.0

LM258DGKR VSSOP DGK 8 2500 364.0 364.0 27.0

PACKAGE MATERIALS INFORMATION

www.ti.com 15-Dec-2017

Pack Materials-Page 3

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM258DGKR VSSOP DGK 8 2500 332.0 358.0 35.0

LM258DR SOIC D 8 2500 364.0 364.0 27.0

LM258DR SOIC D 8 2500 340.5 338.1 20.6

LM258DR SOIC D 8 2500 367.0 367.0 35.0

LM258DR SOIC D 8 2500 333.2 345.9 28.6

LM258DRG3 SOIC D 8 2500 364.0 364.0 27.0

LM258DRG3 SOIC D 8 2500 333.2 345.9 28.6

LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6

LM258DRG4 SOIC D 8 2500 367.0 367.0 35.0

LM2904AVQDR SOIC D 8 2500 340.5 338.1 20.6

LM2904AVQDRG4 SOIC D 8 2500 340.5 338.1 20.6

LM2904AVQPWR TSSOP PW 8 2000 367.0 367.0 35.0

LM2904AVQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0

LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0

LM2904DGKR VSSOP DGK 8 2500 332.0 358.0 35.0

LM2904DGKR VSSOP DGK 8 2500 358.0 335.0 35.0

LM2904DR SOIC D 8 2500 340.5 338.1 20.6

LM2904DR SOIC D 8 2500 364.0 364.0 27.0

LM2904DR SOIC D 8 2500 367.0 367.0 35.0

LM2904DRG3 SOIC D 8 2500 364.0 364.0 27.0

LM2904DRG3 SOIC D 8 2500 333.2 345.9 28.6

LM2904DRG4 SOIC D 8 2500 367.0 367.0 35.0

LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6

LM2904PSR SO PS 8 2000 367.0 367.0 38.0

LM2904PWR TSSOP PW 8 2000 367.0 367.0 35.0

LM2904PWR TSSOP PW 8 2000 364.0 364.0 27.0

LM2904PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0

LM2904PWRG4-JF TSSOP PW 8 2000 367.0 367.0 35.0

LM2904QDR SOIC D 8 2500 367.0 367.0 38.0

LM2904VQDR SOIC D 8 2500 340.5 338.1 20.6

LM2904VQPWR TSSOP PW 8 2000 367.0 367.0 35.0

LM2904VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0

LM358ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0

LM358ADGKR VSSOP DGK 8 2500 332.0 358.0 35.0

LM358ADR SOIC D 8 2500 340.5 338.1 20.6

LM358ADR SOIC D 8 2500 333.2 345.9 28.6

LM358ADR SOIC D 8 2500 367.0 367.0 35.0

LM358ADR SOIC D 8 2500 364.0 364.0 27.0

LM358ADRG4 SOIC D 8 2500 340.5 338.1 20.6

LM358ADRG4 SOIC D 8 2500 367.0 367.0 35.0

LM358APWR TSSOP PW 8 2000 364.0 364.0 27.0

LM358APWR TSSOP PW 8 2000 367.0 367.0 35.0

LM358APWRG4 TSSOP PW 8 2000 367.0 367.0 35.0

LM358DGKR VSSOP DGK 8 2500 332.0 358.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 15-Dec-2017

Pack Materials-Page 4

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM358DGKR VSSOP DGK 8 2500 358.0 335.0 35.0

LM358DGKR VSSOP DGK 8 2500 364.0 364.0 27.0

LM358DR SOIC D 8 2500 367.0 367.0 35.0

LM358DR SOIC D 8 2500 364.0 364.0 27.0

LM358DR SOIC D 8 2500 340.5 338.1 20.6

LM358DR SOIC D 8 2500 333.2 345.9 28.6

LM358DRG3 SOIC D 8 2500 364.0 364.0 27.0

LM358DRG3 SOIC D 8 2500 333.2 345.9 28.6

LM358DRG4 SOIC D 8 2500 340.5 338.1 20.6

LM358DRG4 SOIC D 8 2500 367.0 367.0 35.0

LM358PSR SO PS 8 2000 367.0 367.0 38.0

LM358PWR TSSOP PW 8 2000 367.0 367.0 35.0

LM358PWR TSSOP PW 8 2000 364.0 364.0 27.0

LM358PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0

LM358PWRG4 TSSOP PW 8 2000 367.0 367.0 35.0

LM358PWRG4-JF TSSOP PW 8 2000 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 15-Dec-2017

Pack Materials-Page 5

MECHANICAL DATA

MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE

0.310 (7,87)

0.290 (7,37)

0.014 (0,36)

0.008 (0,20)

Seating Plane

4040107/C 08/96

0.065 (1,65)

0.045 (1,14)

0.020 (0,51) MIN

0.400 (10,16)

0.355 (9,00)

0.015 (0,38)

0.023 (0,58)

0.063 (1,60)

0.015 (0,38)

0.200 (5,08) MAX

0.130 (3,30) MIN

0.245 (6,22)

0.280 (7,11)

0.100 (2,54)

0°–15°

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a ceramic lid using glass frit.

D. Index point is provided on cap for terminal identification.

E. Falls within MIL STD 1835 GDIP1-T8

www.ti.com

PACKAGE OUTLINE

TYP

6.6

6.2

1.2 MAX

6X 0.65

8X 0.30

0.19

1.95

0.15

0.05

(0.15) TYP

0 - 8

0.25

GAGE PLANE

0.75

0.50

NOTE 3

3.1

2.9

NOTE 4

4.5

4.3

4221848/A 02/2015

TSSOP - 1.2 mm max heightPW0008A

SMALL OUTLINE PACKAGE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-153, variation AA.

0.1 C A B

PIN 1 ID

AREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.800

www.ti.com

EXAMPLE BOARD LAYOUT

(5.8)

0.05 MAX

ALL AROUND 0.05 MIN

ALL AROUND

8X (1.5)

8X (0.45)

6X (0.65)

(R )

TYP

0.05

4221848/A 02/2015

TSSOP - 1.2 mm max heightPW0008A

SMALL OUTLINE PACKAGE

SYMM

LAND PATTERN EXAMPLE

SCALE:10X

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

www.ti.com

EXAMPLE STENCIL DESIGN

(5.8)

6X (0.65)

8X (0.45)

8X (1.5)

(R ) TYP0.05

4221848/A 02/2015

TSSOP - 1.2 mm max heightPW0008A

SMALL OUTLINE PACKAGE

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:10X

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Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

LM358H LM358DGKR LM358D LM358PE3 LM358PE4 LM358PW LM358DE4 LM358PWRG4 LM358PWE4

LM358DRE4 LM358DRG3 LM358PSRE4 LM358PWRG3 LM358DGKRG4 LM358P LM358DG4 LM358PWR

LM358DR LM358DRG4 LM358PWRE4 LM358PSRG4 LM358PWG4 LM358PSR LM358PWRG4-JF