INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1001N-R05 1
e3
Pb
CPC1001N
Optocoupler: Unidirectional Input,
Single-Transistor Output
Part # Description
CPC1001N 4-Pin SOP (100/Tube)
CPC1001NTR 4-Pin SOP Surface Mount (2000/Reel)
Parameter Rating Units
Breakdown Voltage BVCEO 30 V
Current Transfer Ratio (Min) 100 %
Saturation Voltage 0.3 V
Input Control Current 0.2 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Loop Detect
• Ringing Detect
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• I/O Subsystems
• Industrial Control
• 100mA Continuous Load Rating
• 1500Vrms Input/Output Isolation
• Small 4-Pin SOP Package
• Machine Insertable, Wave Solderable
• Surface Mount and Tape & Reel Version Available
CPC1001N is a unidirectional input optocoupler with
a single transistor output. Current transfer ratios
range from 100% to 800%.
1
23
4
+ Control
– Control
Load
Load
Approvals
• UL Recognized Component: File # E76270
• CSA Certified Component: Certificate # 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R05
CPC1001N
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Input Power Dissipation 1150 mW
Input Control Current
Peak (10ms)
5mA
1A
Reverse Input Voltage 5 V
Phototransistor 2150 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 2.00 mW / ºC
Electrical Characteristics @ 25ºC
Characteristic Symbol Test Condition Typ Units
Turn-On Time ton IF=2mA, VCC=5V, RL=1K1s
Turn-Off Time toff 30
Switching Characteristics @ 25ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Blocking Voltage ICEO=10µA BVCEO 30 90 - VP
Phototransistor Output (Dark) Current IF=0mA, VCEO=5V ICEO - 9 500 nA
Saturation Voltage IF=1mA, IC=1mA VCE(sat) - - 0.3 V
Current Transfer Ratio IF=0.2mA, VCE=0.5V CTR 100 330 800 %
Output Capacitance VCEO=25V, f=1MHz COUT -6-pF
Input Characteristics
Input Control Current IC=0.2mA, VCE=0.5V IF- 0.1 0.2 mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Input Reverse Current VR=5V IR- - 10 µA
Common Characteristics
Input to Output Capacitance - CI/O -3-pF
Switching Time Test Circuit VCC
VCE
RL
IF
Pulse Width=5ms
Duty Cycle=1%
IF
10%
90%
tON tOFF
VCE
INTEGRATED CIRCUITS DIVISION
CPC1001N
www.ixysic.com 3
R05
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Refer to the Test Circuit
on the previous page
for these two graphs.
LED Forward Voltage (V)
1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0
10
20
30
40
50
LED Voltage vs. LED Current
(TA=25ºC)
LED Forward Voltage (V)
1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0.1
1
10
100
LED Voltage vs. LED Current
(TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
LED Forward Voltage vs. Temperature
IF=50mA
IF=5mA
IF=10mA
IF=20mA
IF=0.2mA
IF=1mA
IF=2mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Typical ICE (mA)
0.1
1
10
100
Typical ICE Current vs. Temperature
(VCE=0.5V)
IF=10mA
IF=5mA
IF=2mA
IF=1mA
IF=0.5mA
IF=0.2mA
IF=0.1mA
0.0 0.2 0.4 0.6 0.8 1.0 1.2
0
5
10
15
20
25
30
Typical Voltage vs. Current
(TA=25ºC)
Collector Voltage (V)
Collector Current (mA)
IF=0.2mA
IF=0.5mA
IF=1mA
IF=2mA
IF=5mA
IF=10mA
LED Forward Current (mA)
0.1 1 10
CTR (%)
100
150
200
250
300
350
Typical CTR vs. LED Forward Current
(VCE=0.5V)
55ºC
85ºC
25ºC
-40ºC
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Saturation Voltage (V)
0.08
0.10
0.12
0.14
0.16
0.18
0.20
Typical Saturation Voltage
vs. Temperature
(IF=2mA, IC=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
88
89
90
91
92
93
94
95
96
Blocking Voltage vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
100
200
300
400
500
Collector Leakage Current
vs. Temperature
VCC=10V
VCC=5V
VCC=3V
Load Resistance (k:)
0.1 1 10 100
Turn-On Time (Ps)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Turn-On Time vs. Load Resistance
(TA=25ºC, VCC=5V)
IF=5mA
IF=2mA
IF=1mA
Load Resistance (k:)
0.1 1 10 100
Turn-Off Time (Ps)
10
100
1000
Turn-Off Time vs. Load Resistance
(TA=25ºC, VCC=5V)
IF=5mA
IF=1mA
IF=2mA
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R05
CPC1001N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1001N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1001N 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
For additional information please visit our website at: www.ixysic.com
CPC1001N
Specification: DS-CPC1001N-R05
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/13/2012
MECHANICAL DIMENSIONS
Recommended PCB Land Pattern
2.54
(0.10)
5.60
(0.2205)
1.30
(0.0512)
0.60
(0.0217)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.203
(0.161 ± 0.008)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003) 0.432 ± 0.127
(0.017 ± 0.005)
0.200 ± 0.025
(0.008 ± 0.001)
1.02 ± 0.025
(0.040 ± 0.001)
2.184 Max
(0.086 Max)
0.381 TYP.
(0.015 TYP.)
Lead to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction o
f
Feed
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A0=6.50
(0.256)
CPC1001N
CPC1001NTR Tape & Reel
