DATA SH EET
Product specification
Supersedes data of 1999 Feb 25
File under Integrated Circuits, IC06
1999 Sep 27
INTEGRATED CIRCUITS
74AHC04; 74AHCT04
Hex inverter
1999 Sep 27 2
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
FEATURES
•ESD protection:
HBM EIA/JESD22-A114-A
exceeds 2000 V
MM EIA/JESD22-A115-A
exceeds 200 V
•Balanced propagation delays
•Inputsacceptsvoltageshigherthan
VCC
•For AHC only:
operates with CMOS input levels
•For AHCT only:
operates with TTL input levels
•Specified from
−40 to +85 and +125 °C.
DESCRIPTION
The 74AHC/AHCT04 are high-speed
Si-gate CMOS devices and are pin
compatible with low power Schottky
TTL (LSTTL). They are specified in
compliance with JEDEC standard
No. 7A.
The 74AHC/AHCT04 provide six
inverting buffers.
FUNCTION TABLE
See note 1.
Note
1. H = HIGH voltage level;
L = LOW voltage level.
INPUT nA OUTPUT nY
LH
HL
QUICK REFERENCE DATA
GND = 0 V; Tamb =25°C; tr=t
f≤3.0 ns.
Notes
1. CPD is used to determine the dynamic power dissipation (PDin µW).
PD=C
PD ×VCC2×fi+∑(CL×VCC2×fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
∑(CL×VCC2×fo) = sum of outputs;
CL= output load capacitance in pF;
VCC = supply voltage in Volts.
2. The condition is VI= GND to VCC.
PINNING
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
AHC AHCT
tPHL/tPLH propagation
delay nA to nY CL=15pF;
V
CC =5V 3.0 3.0 ns
CIinput
capacitance VI=V
CC or GND 4.0 4.0 pF
CPD powerdissipation
capacitance CL=50pF;
f = 1 MHz;
notes 1 and 2
13.5 13.9 pF
PIN SYMBOL DESCRIPTION
1, 3, 5, 9, 11 and 13 1A to 6A data inputs
2, 4, 6, 8, 10 and 12 1Y to 6Y data outputs
7 GND ground (0 V)
14 VCC DC supply voltage
1999 Sep 27 3
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
ORDERING INFORMATION
OUTSIDE NORTH
AMERICA NORTH AMERICA PACKAGES
PINS PACKAGE MATERIAL CODE
74AHC04D 74AHC04D 14 SO plastic SOT108-1
74AHC04PW 74AHC04PW DH 14 TSSOP plastic SOT402-1
74AHCT04D 74AHCT04D 14 SO plastic SOT108-1
74AHCT04PW 74AHCT04PW DH 14 TSSOP plastic SOT402-1
Fig.1 Pin configuration.
handbook, halfpage
MNA340
04
1
2
3
4
5
6
78
14
13
12
11
10
9
1A
1Y
2A
2Y
3A
3Y
GND 4Y
4A
5Y
5A
6Y
6A
VCC
Fig.2 Logic diagram (one gate).
handbook, halfpage
MNA341
AY
Fig.3 Functional diagram.
handbook, halfpage
MNA342
1A 1Y
12
2A 2Y
34
3A 3Y
56
4A 4Y
98
5A 5Y
11 10
6A 6Y
13 12
Fig.4 IEC logic symbol.
handbook, halfpage
112
MNA343
314
516
918
11 110
13 112
1999 Sep 27 4
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
RECOMMENDED OPERATING CONDITIONS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. For SO packages: above 70 °C the value of PDderates linearly with 8 mW/K.
For TSSOP packages: above 60 °C the value of PDderates linearly with 5.5 mW/K.
SYMBOL PARAMETER CONDITIONS 74AHC 74AHCT UNIT
MIN. TYP. MAX. MIN. TYP. MAX.
VCC DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V
VIinput voltage 0 −5.5 0 −5.5 V
VOoutput voltage 0 −VCC 0−VCC V
Tamb operating ambient temperature
range see DC and AC
characteristics per
device
−40 +25 +85 −40 +25 +85 °C
−40 +25 +125 −40 +25 +125 °C
tr,tf (∆t/∆f) input rise and fall times except
for Schmitt-trigger inputs VCC = 3.3 V ±0.3 V −−100 −−−ns/V
VCC =5V±0.5 V −−20 −−20
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC DC supply voltage −0.5 +7.0 V
VIinput voltage range −0.5 +7.0 V
IIK DC input diode current VI<−0.5 V; note 1 −−20 mA
IOK DC output diode current VO<−0.5 Vor VO>V
CC + 0.5 V; note 1 −±20 mA
IODC output source or sink current −0.5V<V
O<V
CC + 0.5 V −±25 mA
ICC DC VCC or GND current −±75 mA
Tstg storage temperature range −65 +150 °C
PDpower dissipation per package for temperature range: −40 to +125 °C; note 2 −500 mW
1999 Sep 27 5
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
DC CHARACTERISTICS
74AHC family
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
OTHER VCC (V) 25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VIH HIGH-level input
voltage 2.0 1.5 −−1.5 −1.5 −V
3.0 2.1 −−2.1 −2.1 −
5.5 3.85 −−3.85 −3.85 −
VIL LOW-level input
voltage 2.0 −− 0.5 −0.5 −0.5 V
3.0 −− 0.9 −0.9 −0.9
5.5 −− 1.65 −1.65 −1.65
VOH HIGH-level output
voltage; all
outputs
VI=V
IH or VIL;
IO=−50 µA2.0 1.9 2.0 −1.9 −1.9 −V
3.0 2.9 3.0 −2.9 −2.9 −
4.5 4.4 4.5 −4.4 −4.4 −
HIGH-level output
voltage VI=V
IH or VIL;
IO=−4.0 mA 3.0 2.58 −−2.48 −2.40 −V
VI=V
IH or VIL;
IO=−8.0 mA 4.5 3.94 −−3.8 −3.70 −
VOL LOW-level output
voltage; all
outputs
VI=V
IH or VIL;
IO=50µA2.0 −0 0.1 −0.1 −0.1 V
3.0 −0 0.1 −0.1 −0.1
4.5 −0 0.1 −0.1 −0.1
LOW-level output
voltage VI=V
IH or VIL;
IO=4mA 3.0 −− 0.36 −0.44 −0.55 V
VI=V
IH or VIL;
IO=8mA 4.5 −− 0.36 −0.44 −0.55
IIinput leakage
current VI=V
CC or GND 5.5 −− 0.1 −1.0 −2.0 µA
IOZ 3-state output
OFF current VI=V
IH or VIL;
VO=V
CC or GND 5.5 −− ±0.25 −±2.5 −±10.0 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 5.5 −− 4.0 −40 −80 µA
CIinput capacitance −−310−10 −10 pF
1999 Sep 27 6
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
74AHCT family
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
OTHER VCC (V) 25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VIH HIGH-level input
voltage 4.5 to 5.5 2.0 −−2.0 −2.0 −V
VIL LOW-level input
voltage 4.5 to 5.5 −− 0.8 −0.8 −0.8 V
VOH HIGH-leveloutput
voltage; all
outputs
VI=V
IH or VIL;
IO=−50 µA4.5 4.4 4.5 −4.4 −4.4 −V
HIGH-leveloutput
voltage VI=V
IH or VIL;
IO=−8.0 mA 4.5 3.94 −−3.8 −3.70 −V
VOL LOW-level output
voltage; all
outputs
VI=V
IH or VIL;
IO=50µA4.5 −0 0.1 −0.1 −0.1 V
LOW-level output
voltage VI=V
IH or VIL;
IO=8mA 4.5 −− 0.36 −0.44 −0.55 V
IIinput leakage
current VI=V
IH or VIL 5.5 −− 0.1 −1.0 −2.0 µA
IOZ 3-state output
OFF current VI=V
IH or VIL;
VO=V
CC or GND
per input pin;
other inputs at
VCC or GND;
IO=0
5.5 −− ±0.25 −±2.5 −±10.0 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 5.5 −− 4.0 −40 −80 µA
∆ICC additional
quiescent supply
current per input
pin
VI=V
CC −2.1 V
other inputs at
VCC or GND;
IO=0
4.5 to 5.5 −− 1.35 −1.5 −1.5 mA
CIinput capacitance −−310−10 −10 pF
1999 Sep 27 7
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
AC CHARACTERISTICS
Type 74AHC04
GND = 0 V; tr=t
f≤3.0 ns.
Notes
1. Typical values at VCC = 3.3 V.
2. Typical values at VCC = 5.0 V.
Type 74AHCT04
GND = 0 V; tr=t
f≤3.0 ns.
Note
1. Typical values at VCC = 5.0 V.
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
WAVEFORMS CL25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VCC = 3.0 to 3.6 V; note 1
tPHL/tPLH propagation
delay nA to nY see Figs 5 and 6 15 pF −4.0 8.5 1.0 10.5 1.0 11.0 ns
50 pF −6.0 11.4 1.0 13 1.0 14.5 ns
VCC = 4.5 to 5.5 V; note 2
tPHL/tPLH propagation
delay nA to nY see Figs 5 and 6 15 pF −3.0 5.5 1.0 6.5 1.0 7.0 ns
50 pF −4.5 7.5 1.0 8.5 1.0 9.5 ns
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
WAVEFORMS CL25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VCC = 4.5 to 5.5 V; note 1
tPHL/tPLH propagation
delay nA to nY see Figs 5 and 6 15 pF −3.0 6.7 1.0 7.5 1.0 8.5 ns
50 pF −4.5 7.7 1.0 8.5 1.0 10.0 ns
1999 Sep 27 8
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
AC WAVEFORMS
Fig.5 The input (nA) to output (nY) propagation delay.
FAMILY VI INPUT
REQUIREMENTS VM(1)
INPUT VM(1)
OUTPUT
AHC GND to VCC 50% VCC 50% VCC
AHCT GND to 3.0 V 1.5 V 50% VCC
handbook, halfpage
MNA344
tPHL tPLH
VM(1)
VM(1)
nA INPUT
nY OUTPUT
GND
VI
VOH
VOL
Fig.6 Load circuitry for switching times.
TEST S1
tPLH/tPHL open
tPLZ/tPZL VCC
tPHZ/tPZH GND
handbook, full pagewidth
open
GND
VCC
VCC
VIVO
MNA219
D.U.T.
CL
RT
1000 Ω
PULSE
GENERATOR
S1
1999 Sep 27 9
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
PACKAGE OUTLINES
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 8.75
8.55 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT108-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
7
8
1
14
y
076E06S MS-012AB
pin 1 index
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.35
0.34 0.16
0.15 0.050
1.05
0.041
0.244
0.228 0.028
0.024 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
95-01-23
97-05-22
0 2.5 5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
1999 Sep 27 10
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 5.1
4.9 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.72
0.38 8
0
o
o
0.13 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1 MO-153 94-07-12
95-04-04
wM
bp
D
Z
e
0.25
17
14 8
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
A
max.
1.10
pin 1 index
1999 Sep 27 11
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
SOLDERING
Introduction to soldering surface mount packages
Thistext givesa verybrief insightto acomplex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardbyscreen printing,stencillingor
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
•Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
•For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
•Forpackageswithleadsonfoursides, thefootprint must
be placed at a 45°angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Sep 27 12
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE SOLDERING METHOD
WAVE REFLOW(1)
BGA, LFBGA, SQFP, TFBGA not suitable suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2) suitable
PLCC(3), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(3)(4) suitable
SSOP, TSSOP, VSO not recommended(5) suitable
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1999 Sep 27 13
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
NOTES
1999 Sep 27 14
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
NOTES
1999 Sep 27 15
Philips Semiconductors Product specification
Hex inverter 74AHC04; 74AHCT04
NOTES
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
1999 68
Philips Semiconductors – a w orldwide compan y
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Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
Printed in The Netherlands 245002/02/pp16 Date of release: 1999 Sep 27 Document order number: 9397 750 06286
