IN
EN GND
OUT OUTPUT
0.47 PF
0.47 PF
INPUT
ENABLE
GND
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LP5900
SNVS358R –JULY 2005–REVISED JUNE 2016
LP5900 150-mA Ultra-Low-Noise LDO for RF and Analog Circuits -
Requires No Bypass Capacitor
1
1 Features
1• Input Voltage Range, 2.5 V to 5.5 V
• Output Voltage Range, 1.5 V to 4.5 V
• Stable with 0.47-μF Ceramic Input and Output
Capacitors
• No Noise Bypass Capacitor Required
• Logic Controlled Enable
• Thermal-Overload and Short-Circuit Protection
•−40°C to 125°C Junction Temperature Range for
Operation
• Output Current, 150 mA
• Low Output Voltage Noise, 6.5 μVRMS
• PSRR, 75 dB at 1 kHz
• Output Voltage Tolerance, ±2%
• Virturally Zero IQ(Disabled), < 1 µA
• Very Low IQ(Enabled), 25 μA
• Start-up Time, 150 μs
• Low Dropout, 80 mV Typ.
2 Applications
• Cellular Phones
• PDA Handsets
• Wireless LAN Devices
3 Description
The LP5900 is an LDO capable of supplying 150-mA
output current. Designed to meet the requirements of
RF and analog circuits, the LP5900 device provides
low noise, high PSRR, low quiescent current, and low
line transient response figures. Using new innovative
design techniques the LP5900 offers class-leading
device noise performance without a noise bypass
capacitor.
The device is designed to work with 0.47-μF input
and output ceramic capacitors (no bypass capacitor
required).
The device is available in a DSBGA (YZR) package
and a WSON package; the device is also available in
an extremely thin DSBGA (YPF) package. For all
voltage and package options available today, see the
Package Option Addendum (POA) at the end of this
data sheet. For any other fixed output voltages from
1.5 V to 4.5 V in 25-mV steps and all other package
options, contact your local TI Sales office.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE
LP5900 DSBGA (4) 1.108 mm × 1.083 mm (MAX)
WSON (6) 2.50 mm × 2.20 mm (NOM)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Output and Input Capacitor, Recommended
Specifications............................................................. 6
6.7 Typical Characteristics.............................................. 7
7 Detailed Description............................................ 10
7.1 Overview................................................................. 10
7.2 Functional Block Diagram....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 11
8 Application and Implementation ........................ 12
8.1 Application Information............................................ 12
8.2 Typical Application.................................................. 12
9 Power Supply Recommendations...................... 14
10 Layout................................................................... 15
10.1 Layout Guidelines ................................................. 15
10.2 Layout Examples................................................... 15
10.3 DSBGA Mounting.................................................. 15
10.4 DSBGA Light Sensitivity ....................................... 16
10.5 WSON Mounting................................................... 16
11 Device and Documentation Support................. 17
11.1 Documentation Support ........................................ 17
11.2 Trademarks........................................................... 17
11.3 Electrostatic Discharge Caution............................ 17
11.4 Glossary................................................................ 17
12 Mechanical, Packaging, and Orderable
Information........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision Q (February 2015) to Revision R Page
• Changed "Linear Regulator" to "LDO" in title and first sentence of Description ................................................................... 1
Changes from Revision P (December 2014) to Revision Q Page
• Added NC and Thermal Pad descriptions in Pin Functions .................................................................................................. 3
• Changed Handling Ratings to ESD Ratings table format; move storage temp spec to Ab Max; delete soldering info
(in POA).................................................................................................................................................................................. 4
• Changed Unit for Line and Load regulation .......................................................................................................................... 5
• Changed Ilto Iout ..................................................................................................................................................................... 7
• Changed Ilto Iout ..................................................................................................................................................................... 8
• Changed Ilto Iout ..................................................................................................................................................................... 9
• Added WSON Mounting subsection .................................................................................................................................... 16
• Added another related doc link ............................................................................................................................................ 17
Changes from Revision O (April 2013) to Revision P Page
• Added Pin Configuration and Functions section, Handling Ratings table, Feature Description section, Device
Functional Modes,Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section; updated pin names and thermal information ........................................................................................................... 1
Changes from Revision N (April 2013) to Revision O Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 16
this is the ROD for SNVS358
1 OUT
2 N/C
3 GND
IN 6
N/C 5
Bottom View
Thermal
Pad
OUT 1
N/C 2
GND 3
6 IN
5 N/C
Top View
4 EN EN 4
Thermal
Pad
IN
A2 OUT
B2 IN
A2
OUT
B2
A1
EN B1
GND A1
EN
B1
GND
Top View Bottom View
3
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5 Pin Configuration and Functions
YZR and YPF Packages
4-Pin DSBGA
NGF Package
6-Pin WSON with Exposed Thermal Pad
Pin Functions
PIN TYPE DESCRIPTION
DSBGA WSON NAME
A1 4 EN I Enable input; disables the regulator when ≤0.4 V. Enables the regulator when ≥
1.2 V. An internal 1-MΩpull-down resistor connects this input to ground.
A2 6 IN I Input voltage supply. Connect a 0.47-µF capacitor at this input.
B1 3 GND — Common ground
B2 1 OUT O Output voltage. A 0.47-μF Low ESR capacitor should be connected to this pin.
Connect this output to the load circuit.
— 2 NC — No internal connection.
—Thermal
Pad Thermal Pad —
The exposed thermal pad on the bottom of the packagemust be connected to a
copper area on the PCB under the package. TI recommends use of thermal vias
to remove heat from the package into the PCB. Connect the thermal pad to
ground potential or leave floating. Do not connect the thermal pad to any potential
other than the same ground potential seen at device pin 3. For additional
information on using TI's non-pullback WSON package, see AN-1187 Leadless
Leadframe Package (LLP) (SNOA401).
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
Input voltage, VIN –0.3 6 VOutput voltage, VOUT –0.3 VIN + 0.3
Enable input voltage, VEN –0.3 VIN + 0.3
Continuous power dissipation(4) Internally Limited
Junction temperature, TJMAX 150 °C
Storage temperature, Tstg –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) All voltages are with respect to the potential at the GND pin.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See Application and
Implementation.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage, VIN 2.5 5.5 V
Enable voltage, VEN 0 VIN + 0.3 V
Output current, IOUT(2) 0 150 mA
Junction temperature, TJ–40 125 °C
Ambient temperature, TA(2) –40 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1) LP5900
UNITNGF YZR/YPF
6 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance 79.8 177.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 84.4 0.7 °C/W
RθJB Junction-to-board thermal resistance 20.4 35.6 °C/W
ψJT Junction-to-top characterization parameter 2.6 5.8 °C/W
ψJB Junction-to-board characterization parameter 20.3 35.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 11.2 — °C/W
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(1) All voltages are with respect to the potential at the GND pin.
(2) Minimum and Maximum limits are specified by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the
most likely norm.
(3) The device maintains a stable, regulated output voltage without a load current.
(4) Quiescent current is defined here as the difference in current between the input voltage source and the load at the OUT pin.
(5) Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device.
(6) Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its
nominal value. This parameter only applies to output voltages above 2.5 V.
(7) Short-circuit current is measured with OUT pulled to 0 V and IN worst case = 6 V.
(8) This specification is specified by design.
(9) There is a 1-MΩresistor between EN pin and ground on the device.
6.5 Electrical Characteristics
Unless otherwise noted, specifications apply in Figure 16 with: VIN = VOUT (NOM) + 1 V, VEN = 1.2 V, CIN = COUT = 0.47 μF, IOUT
= 1 mA.(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage 2.5 5.5 V
ΔVOUT
Output voltage tolerance VIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1
mA to 150 mA,
–40°C ≤TJ≤125°C
−2% 2%
Line regulation VIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1
mA 0.05 %V
Load regulation IOUT = 1 mA to 150 mA 0.001 %mA
ILOAD Load current See(3) mA
Maximum output current –40°C ≤TJ≤125°C 150
IQQuiescent current(4)
VEN = 1.2 V, IOUT = 0 mA 25
µA
VEN = 1.2 V, IOUT = 0 mA, –40°C ≤TJ≤
125°C 50
VEN = 1.2 V, IOUT = 150 mA 160
VEN = 1.2 V, IOUT = 150 mA, –40°C ≤TJ≤
125°C 230
VEN = 0.3 V (disabled) 0.003
VEN = 0.3 V (disabled, –40°C ≤TJ≤
125°C 1
IGGround current(5) IOUT = 0 mA (VOUT = 2.5 V) 30 µA
VDO Dropout voltage(6) IOUT = 150 mA 80 mV
IOUT = 150 mA, –40°C ≤TJ≤125°C 150
ISC Short-circuit current limit(7) 300 mA
PSRR Power supply rejection ratio(8)
f = 100 Hz, IOUT = 150 mA 85
dB
f = 1 kHz, IOUT = 150 mA 75
f = 10 kHz, IOUT = 150 mA 65
f = 50 kHz, IOUT = 150 mA 52
f = 100 kHz, IOUT = 150 mA 40
enOutput noise voltage(8) BW = 10 Hz to 100
kHz, VIN = 4.2 V IOUT = 0 mA 7 μVRMS
IOUT = 1 mA 10
IOUT = 150 mA 6.5
TSHUTDOWN Thermal shutdown Temperature 160 ºC
Hysteresis 20
LOGIN INPUT THRESHOLDS
VIL Low input threshold (VEN) VIN = 2.5 V to 5.5 V, –40°C ≤TJ≤125°C 0.4 V
VIH High input threshold (VEN) VIN = 2.5 V to 5.5 V, –40°C ≤TJ≤125°C 1.2 V
IEN Input current at EN pin(9) VEN = 5.5 V and VIN = 5.5 V 5.5 μA
VEN = 0 V and VIN = 5.5 V 0.001
6
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Electrical Characteristics (continued)
Unless otherwise noted, specifications apply in Figure 16 with: VIN = VOUT (NOM) + 1 V, VEN = 1.2 V, CIN = COUT = 0.47 μF, IOUT
= 1 mA.(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TRANSIENT CHARACTERISTICS
ΔVOUT
Line transient(8) VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) +
1.6 V) in 30 μs, IOUT = 1 mA, –40°C ≤TJ≤
125°C −2
mV
VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) +
1 V) in 30 μs, IOUT = 1 mA, –40°C ≤TJ≤
125°C 2
Load transient(8) IOUT = 1 mA to 150 mA in 10 μs, –40°C ≤
TJ≤125°C −110 mV
IOUT = 150 mA to 1 mA in 10 μs, –40°C ≤
TJ≤125°C 50
Overshoot on start-up(8) –40°C ≤TJ≤125°C 20 mV
Turnon time To 95% of VOUT(NOM) 150 300 μs
(1) The minimum capacitance must be greater than 0.33 µF over the full range of operating conditions. The capacitor tolerance must be
30% or better over the full temperature range. The full range of operating conditions for the capacitor in the application should be
considered during device selection to ensure this minimum capacitance specification is met. TI recommends X7R capacitors; however,
capacitor types X5R, Y5V and Z5U may be used with consideration of the application and conditions.
6.6 Output and Input Capacitor, Recommended Specifications(1)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
CIN Input capacitance Capacitance for stability 0.47 µF
Capacitance for stability, –40°C ≤TJ≤
125°C 0.33
COUT Output capacitance Capacitance for stability 0.47
Capacitance for stability, –40°C ≤TJ≤
125°C 0.33 10
ESR Output/Input capacitance 5 500 mΩ
7
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6.7 Typical Characteristics
Unless otherwise specified, CIN = COUT = 0.47 µF, VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA , T A= 25°C.
Figure 1. Output Noise Density Figure 2. Power Supply Rejection Ratio
Figure 3. Power Supply Rejection Ratio Figure 4. Output Voltage Change vs Temperature
Figure 5. Ground Current vs VIN, ILOAD = 0 mA Figure 6. Ground Current vs VIN, ILOAD = 1 mA
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Typical Characteristics (continued)
Unless otherwise specified, CIN = COUT = 0.47 µF, VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA , T A= 25°C.
Figure 7. Ground Current vs VIN, ILOAD = 100 mA Figure 8. Ground Current vs Load Current
Figure 9. Short-Circuit Current Figure 10. Load Transient
Figure 11. Line Transient Figure 12. Enable Start-up Time, (IOUT= 1 mA, VOUT = 2.8 V)
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Typical Characteristics (continued)
Unless otherwise specified, CIN = COUT = 0.47 µF, VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA , T A= 25°C.
Figure 13. Enable Start-up Time, (IOUT= 100 mA, VOUT = 2.8
V) Figure 14. Enable Start-up Time, (IOUT= 1 mA, VOUT = 2.8 V)
Figure 15. Dropout Over Temperature (100 mA)
IN
VBG
1.2 V
+
EN
GND
POR
+
OUT
VIH
RFCF
+
EN
EN
1 M
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7 Detailed Description
7.1 Overview
Designed to meet the needs of sensitive RF and analog circuits, the LP5900 provides low noise, high PSRR, and
low quiescent current, as well as low line and load transient response figures. Using new innovative design
techniques, the LP5900 offers class-leading noise performance without the need for a separate noise filter
capacitor.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 No-Load Stability
The LP5900 remains stable and in regulation with no external load.
7.3.2 Enable Control
The LP5900 enable (EN) pin is internally held low by a 1-MΩresistor to GND. The EN must be higher than the
VIH threshold to ensure that the device is fully enabled under all operating conditions. The EN pin voltage must
be lower than the VIL threshold to ensure that the device is fully disabled.
7.3.3 Low Noise Output
Any internal noise at the LP5900 reference voltage is reduced by a first order low-pass RC filter before it is
passed to the output buffer stage. This eliminates the need for the external bypass capacitor for noise
suppression.
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Feature Description (continued)
7.3.4 Thermal-Overload Protection
Thermal-overload protection disables the output when the junction temperature rises to approximately 160°C
which allows the device to cool. When the junction temperature cools to approximately 140°C, the output is
enabled. Based on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit
may cycle on and off. This thermal cycling limits the dissipation of the regulator and protects it from damage as a
result of overheating.
7.4 Device Functional Modes
7.4.1 Operation with Enable Control
The LP5900 may be switched ON or OFF by a logic input at the EN pin. A high voltage at this pin turns the
device on. When the EN pin is low, the regulator output is off, and the device typically consumes 3 nA. However,
if the application does not require the shutdown feature, the EN pin can be tied to IN pin to keep the regulator
output permanently on. In this case the supply voltage must be fully established 500 μs or less to ensure correct
operation of the start-up circuit. Failure to comply with this condition may cause a delayed start-up time of
several seconds.
A1MΩpull-down resistor ties the EN input to ground, and this ensures that the device will remain off when the
EN pin is left open circuit. To ensure proper operation, the signal source used to drive the EN input must be able
to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics
section under VIL and VIH.
7.4.2 Operation with Minimum Operating Input Voltage (VIN)
The LP5900 does not include any dedicated UVLO circuitry. The LP5900 internal circuitry is not fully functional
until VIN is at least 2.5 V. The output voltage is not regulated until VIN ≥(VOUT + VDO).
IN
EN GND
OUT OUTPUT
0.47 PF
0.47 PF
INPUT
ENABLE
GND
LP5900
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LP5900 is a linear regulator capable of supplying a 150-mA output current. Designed to meet the
requirements of RF and nalog circuits, the device provides low noise, high PSRR, low quiescent current, and low
line transient response figures. Using new innovative design techniques the LP5900 offers class-leading device
noise performance and is designed to work with 0.47-μF input and output ceramic capacitors (no bypass
capacitor is required).
8.2 Typical Application
Figure 16 shows the typical application circuit for the LP5900. Input and output capacitances may need to be
increased above the 0.47-μF minimum for some applications.
Figure 16. LP5900 Typical Application
8.2.1 Design Requirements
DESIGN PARAMETER MIN MAX UNITS
Input voltage range 2.5 5.5 V
Output voltage 2.8 V
Output current 150 mA
Output capacitor range 0.47 10 μF
Input/Output capacitor ESR range 5 500 mΩ
8.2.2 Detailed Design Procedure
8.2.2.1 Power Dissipation
The permissible power dissipation for any package is a measure of the capability of the device to pass heat from
the power source, the junctions of the device, to the ultimate heat sink, the ambient environment. Thus the power
dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces
between the die and ambient air. As stated in Recommended Operating Conditions, the allowable power
dissipation for the device in a given package can be calculated using Equation 1:
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(1)
The actual power dissipation across the device can be represented by Equation 2:
PD= (VIN – VOUT)×IOUT (2)
This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage
drop across the device, and the continuous current capability of the device. These two equations should be used
to determine the optimum operating conditions for the device in the application.
8.2.2.2 External Capacitors
Like any low-dropout regulator, the LP5900 requires external capacitors for regulator stability. The LP5900 is
specifically designed for portable applications requiring minimum board space and smallest components. These
capacitors must be correctly selected for good performance.
8.2.2.2.1 Input Capacitor
An input capacitor is required for stability. The input capacitor should be at least equal to or greater than the
output capacitor. It is recommended that a 0.47-µF capacitor be connected between the LP5900 IN pin and
ground.
This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean
analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
Important: To ensure stable operation it is essential that good PCB practices are employed to minimize ground
impedance and keep input inductance low. If these conditions cannot be met, or if long leads are to be used to
connect the battery or other power source to the LP5900, then it is recommended to increase the input capacitor
to at least 2.2 µF. Also, tantalum capacitors can suffer catastrophic failures due to surge current when connected
to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at
the input, it must be ensured by the manufacturer to have a surge current rating sufficient for the application.
There are no requirements for the equivalent series resistance (ESR) on the input capacitor, but tolerance and
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain
0.47 μF ±30% over the entire operating temperature range.
8.2.2.2.2 Output Capacitor
The LP5900 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor
(dielectric types X5R or X7R) in the 0.47 μF to 10 μF range, and with ESR between 5 mΩto 500 mΩ, is suitable
in the LP5900 application circuit. For this device the output capacitor should be connected between the OUT pin
and a good ground connection and should be mounted within 1 cm of the device.
It may also be possible to use tantalum or film capacitors at the device output, OUT, but these are not as
attractive for reasons of size and cost (see the Capacitor Characteristics section below).
The output capacitor must meet the requirement for the minimum value of capacitance and have an ESR value
that is within the range 5 mΩto 500 mΩfor stability.
8.2.2.2.3 Capacitor Characteristics
The LP5900 is designed to work with ceramic capacitors on the input and output to take advantage of the
benefits they offer. For capacitance values in the range of 0.47 μF to 4.7 μF, ceramic capacitors are the smallest,
least expensive and have the lowest ESR values, thus making them best for eliminating high frequency noise.
The ESR of a typical 0.47-μF ceramic capacitor is in the range of 20 mΩto 40 mΩ, which easily meets the
equivalent series resistance (ESR) requirement for stability for the LP5900.
The temperature performance of ceramic capacitors varies by type and manufacturer. Most large value ceramic
capacitors (≥2.2 µF) are manufactured with Z5U or Y5V temperature characteristics, which results in the
capacitance dropping by more than 50% as the temperature goes from 25°C to 85°C.
A better choice for temperature coefficient in a ceramic capacitor is X7R. This type of capacitor is the most stable
and holds the capacitance within ±15% over the temperature range. Tantalum capacitors are less desirable than
ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance
and voltage ratings in the 0.47 μF to 4.7 μF range.
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Another important consideration is that tantalum capacitors have higher ESR values than equivalent size
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the
stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about
2:1 as the temperature goes from 25°C down to −40°C, so some guard band must be allowed.
8.2.3 Application Curve
Figure 17. Enable Start-up Time, IOUT = 100 mA, VOUT = 2.8 V
9 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 2.5 V and 5.5 V. This input supply
must be well regulated. To ensure that the LP5900 output voltage is well regulated, the input supply must be at
least VOUT + 1 V.
COUT
IN
EN
OUT CIN
LP5900SD
Power Ground
1
2
3 4
5
6
PAD
1
A2 B2
B1A1
IN OUT
Power Ground
EN
CIN COUT
LP5900TL
15
LP5900
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SNVS358R –JULY 2005–REVISED JUNE 2016
Product Folder Links: LP5900
Submit Documentation FeedbackCopyright © 2005–2016, Texas Instruments Incorporated
10 Layout
10.1 Layout Guidelines
The device is designed to operate from an input voltage supply range between 2.5 V and 5.5 V. This input supply
must be well regulated. To ensure that the LP5900 output voltage is well regulated, the input supply must be at
least VOUT + 1 V.
10.2 Layout Examples
Figure 18. DSBGA Layout
Figure 19. WSON Layout
10.3 DSBGA Mounting
The DSBGA package requires specific mounting techniques, which are detailed in AN-1112 DSBGA Wafer Level
Chip Scale Package (SNVA009). For best results during assembly, alignment ordinals on the PC board may be
used to facilitate placement of the DSBGA device.
For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the
DSBGA device.
16
LP5900
SNVS358R –JULY 2005–REVISED JUNE 2016
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Product Folder Links: LP5900
Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated
10.4 DSBGA Light Sensitivity
Exposing the DSBGA device to direct light may cause incorrect operation of the device. Light sources such as
halogen lamps can affect electrical performance if they are situated in proximity to the device.
Light with wavelengths in the red and infra-red part of the spectrum has the most detrimental effect; thus, the
fluorescent lighting used inside most buildings has very little effect on performance.
10.5 WSON Mounting
The 6-lead WSON package requires specific mounting techniques which are detailed in AN-1187 Leadless
Leadframe Package (LLP) (SNOA401). Referring to the section PCB Design Recommendations, it should be
noted that the pad style which should be used with the WSON package is the NSMD (non-solder mask defined)
type. Additionally, it is recommended the PCB terminal pads to be 0.2 mm longer than the package pads to
create a solder fillet to improve reliability and inspection.
The exposed thermal pad on the bottom of the WSON package must be connected to a copper area on the PCB
under the package. TI recommends use of thermal vias to remove heat from the package into the PCB is
recommended. Connect the thermal pad to ground potential or leave floating. Do not connect the thermal pad to
any potential other than the same ground potential seen at device pin 3.
17
LP5900
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SNVS358R –JULY 2005–REVISED JUNE 2016
Product Folder Links: LP5900
Submit Documentation FeedbackCopyright © 2005–2016, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009)
AN-1112 AN-1112 Leadless Leadframe Package (LLP) (SNOA401)
IC Package Thermal Metrics application report (SPRA953)
11.2 Trademarks
All trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP5900SD-1.5/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L15
LP5900SD-1.8/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L17
LP5900SD-2.0/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L18
LP5900SD-2.2/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L19
LP5900SD-2.5 NRND WSON NGF 6 1000 TBD Call TI Call TI -40 to 125 L13
LP5900SD-2.5/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L13
LP5900SD-2.7/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L14
LP5900SD-2.8/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L12
LP5900SD-3.0/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L20
LP5900SD-3.3/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L16
LP5900SDX-1.8/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L17
LP5900SDX-2.5/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L13
LP5900SDX-2.7/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L14
LP5900SDX-2.8/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L12
LP5900SDX-3.0/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L20
LP5900SDX-3.3/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L16
LP5900TL-1.5/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP5900TL-1.575/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-1.8/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-1.9/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-2.0/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-2.2/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-2.3/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-2.5/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-2.6/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-2.65/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-2.7/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-2.75/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-2.8/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-2.85/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-3.0/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-3.3/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TL-4.5/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-1.5/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-1.8/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP5900TLX-1.9/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-2.1/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-2.2/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-2.3/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-2.5/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-2.6/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-2.65/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-2.7/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-2.75/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-2.8/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-2.85/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-3.0/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-3.3/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900TLX-4.5/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900XR-1.8/NOPB ACTIVE DSBGA YPF 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900XR-2.8/NOPB ACTIVE DSBGA YPF 4 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900XRX-1.8/NOPB ACTIVE DSBGA YPF 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
LP5900XRX-2.8/NOPB ACTIVE DSBGA YPF 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125
PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 4
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP5900SD-1.5/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SD-1.8/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SD-2.0/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SD-2.2/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SD-2.5 WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SD-2.5/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SD-2.7/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SD-2.8/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SD-3.0/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SD-3.3/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SDX-1.8/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SDX-2.5/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SDX-2.7/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SDX-2.8/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SDX-3.0/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900SDX-3.3/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
LP5900TL-1.5/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-1.575/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Aug-2017
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP5900TL-1.8/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-1.9/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-2.0/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-2.2/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-2.3/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-2.5/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-2.6/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-2.65/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-2.7/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-2.75/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-2.8/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-2.85/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-3.0/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-3.3/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TL-4.5/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-1.5/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-1.8/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-1.9/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-2.1/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-2.2/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-2.3/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-2.5/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-2.6/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-2.65/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-2.7/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-2.75/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-2.8/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-2.85/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-3.0/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-3.3/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900TLX-4.5/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1
LP5900XR-1.8/NOPB DSBGA YPF 4 250 178.0 8.4 1.16 1.2 0.4 4.0 8.0 Q1
LP5900XR-2.8/NOPB DSBGA YPF 4 250 178.0 8.4 1.16 1.2 0.4 4.0 8.0 Q1
LP5900XRX-1.8/NOPB DSBGA YPF 4 3000 178.0 8.4 1.16 1.2 0.4 4.0 8.0 Q1
LP5900XRX-2.8/NOPB DSBGA YPF 4 3000 178.0 8.4 1.16 1.2 0.4 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Aug-2017
Pack Materials-Page 2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP5900SD-1.5/NOPB WSON NGF 6 1000 210.0 185.0 35.0
LP5900SD-1.8/NOPB WSON NGF 6 1000 210.0 185.0 35.0
LP5900SD-2.0/NOPB WSON NGF 6 1000 210.0 185.0 35.0
LP5900SD-2.2/NOPB WSON NGF 6 1000 210.0 185.0 35.0
LP5900SD-2.5 WSON NGF 6 1000 210.0 185.0 35.0
LP5900SD-2.5/NOPB WSON NGF 6 1000 210.0 185.0 35.0
LP5900SD-2.7/NOPB WSON NGF 6 1000 210.0 185.0 35.0
LP5900SD-2.8/NOPB WSON NGF 6 1000 210.0 185.0 35.0
LP5900SD-3.0/NOPB WSON NGF 6 1000 210.0 185.0 35.0
LP5900SD-3.3/NOPB WSON NGF 6 1000 210.0 185.0 35.0
LP5900SDX-1.8/NOPB WSON NGF 6 4500 367.0 367.0 35.0
LP5900SDX-2.5/NOPB WSON NGF 6 4500 367.0 367.0 35.0
LP5900SDX-2.7/NOPB WSON NGF 6 4500 367.0 367.0 35.0
LP5900SDX-2.8/NOPB WSON NGF 6 4500 367.0 367.0 35.0
LP5900SDX-3.0/NOPB WSON NGF 6 4500 367.0 367.0 35.0
LP5900SDX-3.3/NOPB WSON NGF 6 4500 367.0 367.0 35.0
LP5900TL-1.5/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-1.575/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-1.8/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-1.9/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Aug-2017
Pack Materials-Page 3
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP5900TL-2.0/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-2.2/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-2.3/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-2.5/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-2.6/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-2.65/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-2.7/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-2.75/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-2.8/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-2.85/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-3.0/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-3.3/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TL-4.5/NOPB DSBGA YZR 4 250 210.0 185.0 35.0
LP5900TLX-1.5/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-1.8/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-1.9/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-2.1/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-2.2/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-2.3/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-2.5/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-2.6/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-2.65/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-2.7/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-2.75/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-2.8/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-2.85/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-3.0/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-3.3/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900TLX-4.5/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0
LP5900XR-1.8/NOPB DSBGA YPF 4 250 210.0 185.0 35.0
LP5900XR-2.8/NOPB DSBGA YPF 4 250 210.0 185.0 35.0
LP5900XRX-1.8/NOPB DSBGA YPF 4 3000 210.0 185.0 35.0
LP5900XRX-2.8/NOPB DSBGA YPF 4 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Aug-2017
Pack Materials-Page 4
MECHANICAL DATA
NGF0006A
www.ti.com
MECHANICAL DATA
YPF0004
www.ti.com
XRA04XXX (Rev C)
TOP SIDE OF PACKAGE
BOTTOM SIDE OF PACKAGE
0.250±0.045
D
E
4215204/A 12/12
A
. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
D: Max =
E: Max =
1.108 mm, Min =
1.083 mm, Min =
1.047 mm
1.022 mm
MECHANICAL DATA
YZR0004xxx
www.ti.com
TLA04XXX (Rev D)
0.600±0.075 D
E
4215042/A 12/12
A
. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
D: Max =
E: Max =
1.108 mm, Min =
1.083 mm, Min =
1.047 mm
1.022 mm
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Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
LP5900SD-1.5 LP5900SD-1.5/NOPB LP5900SD-1.8 LP5900SD-1.8/NOPB LP5900SD-2.0 LP5900SD-2.0/NOPB
LP5900SD-2.2 LP5900SD-2.2/NOPB LP5900SD-2.5 LP5900SD-2.5/NOPB LP5900SD-2.7 LP5900SD-2.7/NOPB
LP5900SD-2.8 LP5900SD-2.8/NOPB LP5900SD-3.0/NOPB LP5900SD-3.3/NOPB LP5900SDX-1.5 LP5900SDX-
1.5/NOPB LP5900SDX-1.8 LP5900SDX-1.8/NOPB LP5900SDX-2.0 LP5900SDX-2.0/NOPB LP5900SDX-2.2
LP5900SDX-2.2/NOPB LP5900SDX-2.5 LP5900SDX-2.5/NOPB LP5900SDX-2.7 LP5900SDX-2.7/NOPB
LP5900SDX-2.8 LP5900SDX-2.8/NOPB LP5900SDX-3.0 LP5900SDX-3.0/NOPB LP5900SDX-3.3 LP5900SDX-
3.3/NOPB LP5900TL-1.5/NOPB LP5900TL-1.575/NOPB LP5900TL-1.8/NOPB LP5900TL-1.9/NOPB LP5900TL-
2.0/NOPB LP5900TL-2.1/NOPB LP5900TL-2.2/NOPB LP5900TL-2.3/NOPB LP5900TL-2.5/NOPB LP5900TL-
2.6/NOPB LP5900TL-2.65/NOPB LP5900TL-2.7/NOPB LP5900TL-2.75/NOPB LP5900TL-2.8/NOPB LP5900TL-
2.85/NOPB LP5900TL-3.0/NOPB LP5900TL-3.3/NOPB LP5900TL-4.5/NOPB LP5900TLX-1.5/NOPB LP5900TLX-
1.575/NOPB LP5900TLX-1.8/NOPB LP5900TLX-1.9/NOPB LP5900TLX-2.0/NOPB LP5900TLX-2.1/NOPB
LP5900TLX-2.2/NOPB LP5900TLX-2.3/NOPB LP5900TLX-2.5/NOPB LP5900TLX-2.6/NOPB LP5900TLX-2.65/NOPB
LP5900TLX-2.7/NOPB LP5900TLX-2.75/NOPB LP5900TLX-2.8/NOPB LP5900TLX-2.85/NOPB LP5900TLX-
3.0/NOPB LP5900TLX-3.3/NOPB LP5900TLX-4.5/NOPB LP5900XR-1.8/NOPB LP5900XR-2.8/NOPB LP5900XRX-
1.8/NOPB LP5900XRX-2.8/NOPB