INTEGRATED CIRCUITS DIVISION
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DS-CPC1219-R06 1
CPC1219
e3
Pb
Voltage-Controlled, Single-Pole,
Normally Closed, 4-Pin SIP OptoMOS® Relay
Part # Description
CPC1219Y 4-Pin SIP (8-Pin Body) (25/tube)
Parameter Rating Units
Blocking Voltage 60 VP
Load Current 200 mArms / mADC
On-Resistance (max) 16
Input Voltage to operate 5-12 V
Applications
Features
Description
Ordering Information
Pin Configuration
Security
Passive Infrared Detectors (PIR)
Data Signalling
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Energy Meters
Medical Equipment—Patient/Equipment Isolation
Aerospace
Industrial Controls
Designed for use in Security Systems Complying
with EN50130-4
Voltage-Controlled Operation
2500Vrms Input/Output Isolation
100% Solid State
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Immune to Radiated EM Fields
Small 4-Pin SIP Package
Auto Pick & Place, Wave Solderable
The CPC1219 is a voltage-controlled,
single-pole, normally closed (1-Form-B) optically
coupled solid state relay in a 4-pin Single In-line
Package (SIP). IXYS Integrated Circuits Division's
patented OptoMOS architecture makes available the
optically coupled technology necessary to activate the
output's efficient MOSFET switches while providing a
2500Vrms input-to-output isolation barrier. Control of the
isolated output is accomplished by means of a highly
effective GaAlAs infrared LED at the input. An internal
resistor in series with the LED enables the voltage-
controlled operation of the input.
Because the input is solid state there is no need for
snubbers or "catch" diodes to suppress the inductive
fly-back transient voltage normally associated with
EMR coils.
CPC1219 Pinout
Switching Characteristics
of Normally Closed Devices
Approvals
UL 508 Approved Component: File E69938
CSA Certified Component: Certificate 1172007
Form-B
IF
10%
90%
ILOAD
ton
toff
Load LoadIN + IN -
1234
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2R06
CPC1219
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Voltage 15 V
Input Power Dissipation 225 mW
Total Power Dissipation 1800 mW
Isolation Voltage, Input to Output 2500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 6.67 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 200 mArms / mADC
Peak t10ms ILPK - - ±400 mAP
On-Resistance 2IL=200mA RON --16
Off-State Leakage Current VIN=5V , VL=60VPILEAK --1A
Switching Speeds
Turn-On (Output Closed) VIN = 5V, VL = 10V ton --5ms
Turn-Off (Output Open) toff --5ms
Output Capacitance VIN=5V, VL=50V, f=1MHz COUT -25 - pF
Input Characteristics
Input Control Voltage
Output Open
IL = 200mA VIN
- - 3.75 V
Output Closed 1 - - V
Recommended Operating Range 5 - 12 V
Reverse Input Current VIN = -5V IR--10A
Input Resistor - - 900 1000 1100
Common Characteristics
Capacitance, Input to Output - - - 1 - pF
1 Load current derates linearly from 200mA @ 25oC to 125mA @80oC.
2 Measurement taken within 1 second of on-time.
Electrical Characteristics @ 25ºC
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CPC1219
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R06
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
0.28 0.42 0.56 0.700.35 0.49 0.63
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, VIN=5V, IL=100mA, TA=25ºC)
0.41 0.55 0.69 0.830.760.620.48
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, VIN=5V, IL=100mA, TA=25ºC)
35
30
25
20
15
10
5
0
Device Count (N)
4.9 5.0 5.25.1 5.55.3 5.4
Typical On-Resistance Distribution
(N=50, VIN=0V, IL=100mA, TA=25ºC)
On-Resistance (:)
1.23 1.25 1.271.22 1.24 1.26 1.28
VIN (V)
Device Count (N)
25
20
15
10
5
0
Typical VIN for Switch Operation
(N=50, IL=100mA, TA=25ºC)
25
20
15
10
5
0
1.23 1.25 1.271.22 1.24 1.26 1.28
VIN (V)
Device Count (N)
Typical VIN for Switch Dropout
(N=50, IL=100mA, TA=25ºC)
35
30
25
20
15
10
5
0
89 91 93 9590 92 94
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, VIN=5V, TA=25ºC)
VIN (V)
Turn-On (ms)
05101520
0.54
0.53
0.52
0.51
0.50
0.49
0.48
0.47
0.46
0.45
0.44
Typical Turn-On vs. VIN
(IL=100mA, TA=25ºC)
VIN (V)
-40 -20 0 20 40 60 80 100
1.32
1.30
1.28
1.26
1.24
1.22
1.20
Temperature (ºC)
Typical VIN for Switch Operation
vs. Temperature
(IL=100mA)
VIN = 5V
Turn-On (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Turn-On vs. Temperature
(IL=100mA)
VIN (V)
Turn-Off (ms)
02 4 6 8 10 12 14 16 18
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
20
Typical Turn-Off vs. VIN
(IL=100mA, TA=25ºC)
VIN (V)
-40
1.30
1.28
1.26
1.24
1.22
1.20
1.18
-20 0 20 40 60 80 100
Temperature (ºC)
Typical VIN for Switch Dropout
vs. Temperature
(IL=100mA)
Turn-Off (ms)
-40
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100
VIN = 5V
Temperature (ºC)
Typical Turn-Off vs. Temperature
(IL=100mA)
INTEGRATED CIRCUITS DIVISION
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4R06
CPC1219
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
-40
9
8
7
6
5
4
3
-20 0 20 40 60 80 100
Steady State VIN = 0V
Temperature (ºC)
On-Resistance (:)
Typical On-Resistance vs. Temperature
(IL=Max Rated @ Temperature)
Load Voltage (V)
Load Current (mA)
200
50
-200
-1.0 -0.75 -0.50 0 0.25 0.50 1.0
100
-150
0
150
-50
-100
0.75-0.25
Typical Load Current vs. Load Voltage
(VIN=0V, TA=25ºC)
Load Current (mA)
225
200
175
150
125
100
75
50
25
0
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
V
IN
= 0V
Typical Maximum Load Current
vs. Temperature
Blocking Voltage (VP)
-40
104
102
100
98
96
94
92
90
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
(VIN=5V)
Leakage (PA)
-40
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 1&4
(VIN=5V, VL=60V)
Time
Load Current (mA)
10Ps
500
450
400
350
300
250
200
150
100
50
0
1ms100Ps 100ms 1s
10ms 10s 100s
Energy Rating Curve
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CPC1219
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R06
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1219Y MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1219Y 245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e3
Pb
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1219-R06
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/14/2012
For additional information please visit our website at: www.ixysic.com
6
CPC1219
MECHANICAL DIMENSIONS
CPC1219Y
DIMENSIONS
mm
(inches)
19.202 ± 0.381
(0.756 ± 0.015)
6.401 ± 0.127
(0.252 ± 0.005)
5.944 ± 0.127
(0.234 ± 0.005)
2.642 ± 0.127
(0.104 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003) 3.251 ± 0.102
(0.128 ± 0.004)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 ± 0.013
(0.010 ± 0.0005)
5.08
(0.200) 10.16
(0.400) 15.24
(0.600)
1.30
(0.051)
FINISHED HOLE
0.80 DIA x4
(0.031 DIA x4)
Pin 1 Pin 7
PCB Hole Pattern