CPC1219 Voltage-Controlled, Single-Pole, Normally Closed, 4-Pin SIP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Input Voltage to operate Rating 60 200 16 5-12 Units VP mArms / mADC V Features * Designed for use in Security Systems Complying with EN50130-4 * Voltage-Controlled Operation * 2500Vrms Input/Output Isolation * 100% Solid State * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Immune to Radiated EM Fields * Small 4-Pin SIP Package * Auto Pick & Place, Wave Solderable Description The CPC1219 is a voltage-controlled, single-pole, normally closed (1-Form-B) optically coupled solid state relay in a 4-pin Single In-line Package (SIP). IXYS Integrated Circuits Division's patented OptoMOS architecture makes available the optically coupled technology necessary to activate the output's efficient MOSFET switches while providing a 2500Vrms input-to-output isolation barrier. Control of the isolated output is accomplished by means of a highly effective GaAlAs infrared LED at the input. An internal resistor in series with the LED enables the voltagecontrolled operation of the input. Because the input is solid state there is no need for snubbers or "catch" diodes to suppress the inductive fly-back transient voltage normally associated with EMR coils. Approvals Applications * Security * Passive Infrared Detectors (PIR) * Data Signalling * Sensor Circuitry * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Energy Meters * Medical Equipment--Patient/Equipment Isolation * Aerospace * Industrial Controls * UL 508 Approved Component: File E69938 * CSA Certified Component: Certificate 1172007 Ordering Information Part # CPC1219Y Description 4-Pin SIP (8-Pin Body) (25/tube) Pin Configuration CPC1219 Pinout 1 2 3 4 Load IN + IN - Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% toff Pb DS-CPC1219-R06 ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1219 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Voltage Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 60 5 15 225 800 2500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V V mW mW Vrms C C Derate linearly 6.67 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On (Output Closed) Turn-Off (Output Open) Output Capacitance Input Characteristics Input Control Voltage Output Open Output Closed Recommended Operating Range Reverse Input Current Input Resistor Common Characteristics Capacitance, Input to Output 1 2 2 Conditions Symbol Min Typ Max Units t10ms IL=200mA VIN=5V , VL=60VP IL ILPK RON ILEAK - - 200 400 16 1 mArms / mADC mAP VIN = 5V, VL = 10V ton toff - - 5 5 ms ms VIN=5V, VL=50V, f=1MHz COUT - 25 - pF - - 3.75 V IL = 200mA VIN VIN = -5V - IR - 1 5 900 1000 12 10 1100 V V A - - - 1 - pF A Load current derates linearly from 200mA @ 25oC to 125mA @80oC. Measurement taken within 1 second of on-time. www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1219 PERFORMANCE DATA* 25 Device Count (N) 20 15 10 5 35 15 10 5 0.28 0.35 0.42 0.49 0.56 Turn-On (ms) 0.63 15 10 0.48 0.55 0.62 0.69 Turn-Off (ms) 0.76 4.9 0.83 25 20 20 15 10 5 0 35 15 10 5 1.23 1.24 1.25 1.26 1.27 1.28 1.23 1.24 VIN (V) 1.25 1.26 VIN (V) 1.27 1.32 Turn-On (ms) VIN (V) 1.28 1.26 1.24 1.22 1.20 10 15 20 -40 -20 0 VIN (V) Typical Turn-Off vs. VIN (IL=100mA, TA=25C) 2.1 60 20 40 Temperature (C) 80 Turn-Off (ms) 1.28 1.5 VIN (V) 1.26 1.2 0.9 1.24 1.22 0.6 1.20 0.3 1.18 0 0 2 4 6 8 10 12 VIN (V) 14 16 18 20 20 15 10 -40 -20 0 20 40 60 Temperature (C) 80 100 90 91 92 93 94 Blocking Voltage (VP) 95 Typical Turn-On vs. Temperature (IL=100mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 VIN = 5V -40 100 Typical VIN for Switch Dropout vs. Temperature (IL=100mA) 1.30 1.8 5.5 25 89 1.30 5 5.4 Typical Blocking Voltage Distribution (N=50, VIN=5V, TA=25C) 1.28 Typical VIN for Switch Operation vs. Temperature (IL=100mA) Typical Turn-On vs. VIN (IL=100mA, TA=25C) 0 5.3 0 1.22 0.54 0.53 0.52 0.51 0.50 0.49 0.48 0.47 0.46 0.45 0.44 5.2 5 0 1.22 5.1 30 Device Count (N) 25 5.0 On-Resistance (:) Typical VIN for Switch Dropout (N=50, IL=100mA, TA=25C) Device Count (N) Device Count (N) 20 0 0.41 0.70 Typical VIN for Switch Operation (N=50, IL=100mA, TA=25C) Turn-On (ms) 25 5 0 0 Turn-Off (ms) Typical On-Resistance Distribution (N=50, VIN=0V, IL=100mA, TA=25C) 30 20 Device Count (N) 25 Device Count (N) Typical Turn-Off Time (N=50, VIN=5V, IL=100mA, TA=25C) Typical Turn-On Time (N=50, VIN=5V, IL=100mA, TA=25C) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -40 -20 0 20 40 60 Temperature (C) 80 100 Typical Turn-Off vs. Temperature (IL=100mA) VIN = 5V -20 0 20 40 60 Temperature (C) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1219 PERFORMANCE DATA* 200 225 8 150 200 7 VIN = 0V Steady State 6 5 4 Load Current (mA) 9 100 50 0 -50 -100 104 -20 0 20 40 60 Temperature (C) 80 -200 -1.0 -0.75 -0.50 -0.25 0 0.25 0.50 0.75 Load Voltage (V) 100 Typical Blocking Voltage vs. Temperature (VIN=5V) 0.16 0.14 100 0.12 Leakage (PA) 102 98 96 94 90 -40 0.10 0.08 0.06 0 0 20 40 60 Temperature (C) 80 100 -40 100 75 50 -20 0 20 40 60 Temperature (C) 80 -20 0 20 40 60 80 Temperature (C) 100 120 Energy Rating Curve 0.02 -20 125 -40 Typical Leakage vs. Temperature Measured Across Pins 1&4 (VIN=5V, VL=60V) 0.04 92 VIN = 0V 150 0 1.0 Load Current (mA) -40 175 25 -150 3 Blocking Voltage (VP) Typical Maximum Load Current vs. Temperature Typical Load Current vs. Load Voltage (VIN=0V, TA=25C) Load Current (mA) On-Resistance (:) Typical On-Resistance vs. Temperature (IL=Max Rated @ Temperature) 100 500 450 400 350 300 250 200 150 100 50 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1219 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1219Y MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1219Y 245C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R06 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1219 MECHANICAL DIMENSIONS CPC1219Y 6.401 0.127 (0.252 0.005) 19.202 0.381 (0.756 0.015) PCB Hole Pattern 3.302 0.051 (0.130 0.002) 5.08 (0.200) 2.642 0.127 (0.104 0.005) 10.16 (0.400) 15.24 (0.600) 5.944 0.127 (0.234 0.005) 1.30 (0.051) Pin 1 0.457 0.076 (0.018 0.003) 5.080 0.127 (0.200 0.005) Pin 7 3.251 0.102 (0.128 0.004) 5.080 0.127 (0.200 0.005) 0.254 0.013 (0.010 0.0005) FINISHED HOLE 0.80 DIA x4 (0.031 DIA x4) DIMENSIONS mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1219-R06 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/14/2012