ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 Dual Channel 14-/12-Bit, 250-/210-MSPS ADC With DDR LVDS and Parallel CMOS Outputs Check for Samples: ADS62P49 / ADS62P29, ADS62P48 / ADS62P28 FEATURES * 1 * * * * * * * * Maximum Sample Rate: 250 MSPS 14-Bit Resolution - ADS62P49/ADS62P48 12-Bit Resolution - ADS62P29/ADS62P28 Total Power: 1.25 W at 250 MSPS Double Data Rate (DDR) LVDS and Parallel CMOS Output Options Programmable Gain up to 6dB for SNR/SFDR Trade-Off DC Offset Correction 90dB Cross-Talk * * Supports Input Clock Amplitude Down to 400 mVPP Differential Internal and External Reference Support 64-QFN Package (9 mm x 9 mm) ADS62Pxx High Speed Family 250 MSPS 210 MSPS 14-Bit Family ADS62P49 ADS62P48 12-Bit Family ADS62P29 ADS62P28 11-Bit Family 200 MSPS ADS62C17 DESCRIPTION The ADS62Px9/x8 is a family of dual channel 14-bit and 12-bit A/D converters with sampling rates up to 250 MSPS. It combines high dynamic performance and low power consumption in a compact 64 QFN package. This makes it well-suited for multi-carrier, wide band-width communications applications. The ADS62Px9/x8 has gain options that can be used to improve SFDR performance at lower full-scale input ranges. It includes a dc offset correction loop that can be used to cancel the ADC offset. Both DDR LVDS (Double Data Rate) and parallel CMOS digital output interfaces are available. It includes internal references while the traditional reference pins and associated decoupling capacitors have been eliminated. Nevertheless, the device can also be driven with an external reference. The device is specified over the industrial temperature range (-40C to 85C). Table 1. Performance Summary AT 170MHZ INPUT SFDR, dBc SINAD, dBFS ADS62P49 ADS62P48 ADS62P29 ADS62P28 0 dB gain 75 78 75 78 6 dB gain 82 84 82 84 0 dB gain 69.8 70.1 68.3 68.7 6 dB gain 66.5 66.3 65.8 65.8 1 0.92 1 0.92 Analog Power, W 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2009-2011, Texas Instruments Incorporated ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 DRGND DRVDD www.ti.com AGND AVDD SLAS635B - APRIL 2009 - REVISED JANUARY 2011 LVDS INTERFACE DA0_P/M DA2_P/M INA_P INA_M Sample and Hold DA4_P/M Digital and DDR Serializer 14-Bit ADC DA6_P/M DA8_P/M DA10_P/M DA12_P/M CLKP CLKM Output Clock Buffer CLOCKGEN CLKOUTP/M DB0_P/M DB2_P/M INB_P INB_M Sample and Hold DB4_P/M Digital and DDR Serializer 14-Bit ADC DB6_P/M DB8_P/M DB10_P/M DB12_P/M VCM Control Interface Reference SDOUT CTRL1 CTRL2 CTRL3 SCLK SEN SDATA RESET ADS62P49/48 B0349-01 Figure 1. ADS62P49/48 Block Diagram 2 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 DRGND AGND DRVDD SLAS635B - APRIL 2009 - REVISED JANUARY 2011 AVDD www.ti.com LVDS INTERFACE DA0_P/M DA2_P/M INA_P INA_M Sample and Hold DA4_P/M Digital and DDR Serializer 12-Bit ADC DA6_P/M DA8_P/M DA10_P/M CLKP CLKM Output Clock Buffer CLOCKGEN CLKOUTP/M DB0_P/M DB2_P/M INB_P INB_M Sample and Hold DB4_P/M Digital and DDR Serializer 12-Bit ADC DB6_P/M DB8_P/M DB10_P/M VCM Control Interface Reference SDOUT CTRL1 CTRL2 CTRL3 SCLK SEN SDATA RESET ADS62P29/28 B0350-01 Figure 2. ADS62P29/28 Block Diagram Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 3 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGELEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE ECO PLAN (2) LEAD/BALL FINISH ADS62P49 ADS62P48 QFN-64 RGC -40C to 85C ADS62P29 GREEN (RoHS and no Sb/Br) (2) ORDERING NUMBER AZ62P49 ADS62P49IRGCT, ADS62P49IRGCR AZ62P48 ADS62P48IRGCT, ADS62P48IRGCR AZ62P29 ADS62P29IRGCT, ADS62P29IRGCR AZ62P28 ADS62P28IRGCT, ADS62P28IRGCR Cu NiPdAu ADS62P28 (1) PACKAGE MARKING TRANSPORT MEDIA,QUANTITY Tape and Reel Tape and Reel For the most current product and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Eco Plan - The planned eco-friendly classification: Green (RoHS and no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible) and free of Bromine (Br) and Antimony (Sb) based flame retardants. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT Supply voltage range, AVDD -0.3 V to 3.9 V Supply voltage range, DRVDD -0.3 V to 2.2 V Voltage between AGND and DRGND -0.3 to 0.3 V Voltage between AVDD to DRVDD (AVDD leads DRVDD during power up/DRVDD leads AVDD during power down) -0.3 to 4.2 V Voltage between DRVDD to AVDD (DRVDD leads AVDD during power up/AVDD leads DRVDD during power down) -2.5 to 1.7 V Voltage applied to external pin, VCM (in external reference mode) Voltage applied to analog input pins - INP_A, INM_A, INP_B, INM_B Voltage applied to input pins - CLKP, CLKM (2), RESET, SCLK, SDATA, SEN, CTRL1, CTRL2, CTRL3 -0.3 to 2.0 V -0.3V to minimum ( 3.6, AVDD + 0.3V ) V -0.3V to AVDD + 0.3V V TA Operating free-air temperature range -40 to 85 C TJ Operating junction temperature range 125 C Tstg Storage temperature range -65 to 150 C 2 kV ESD, human body model (1) (2) 4 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKM is < |0.3V|). This prevents the ESD protection diodes at the clock input pins from turning on. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 THERMAL INFORMATION ADS62Pxx THERMAL METRIC (1) RGC PACKAGE UNITS 64 PINS Junction-to-ambient thermal resistance (2) qJA 23.0 (3) qJCtop Junction-to-case (top) thermal resistance qJB Junction-to-board thermal resistance (4) 4.2 yJT Junction-to-top characterization parameter (5) 0.1 yJB Junction-to-board characterization parameter (6) 4.2 qJCbot Junction-to-case (bottom) thermal resistance (7) 0.57 (1) (2) (3) (4) (5) (6) (7) 10.5 C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, yJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 5 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com RECOMMENDED OPERATING CONDITIONS MIN TYP MAX UNIT SUPPLIES AVDD Analog supply voltage 3.15 3.3 3.6 V DRVDD Digital supply voltage 1.7 1.8 1.9 V ANALOG INPUTS Differential input voltage range 2 Input common-mode voltage 1.5 0.1 Voltage applied on CM in external reference mode 1.50.05 VPP V V Maximum analog input frequency with 2 Vpp input amplitude (1) 500 MHz Maximum analog input frequency with 1 Vpp input amplitude (1) 800 MHz CLOCK INPUT Input clock sample rate ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 Enable low speed mode (2) Low speed mode disabled (default mode after reset) 1 80 >80 250 (3) Enable low speed mode (2) Low speed mode disabled (default mode after reset) 1 80 >80 210 1 65 With multiplexed mode enabled (4) Input clock amplitude differential (VCLKP-VCLKM) MSPS MSPS MSPS (5) (6) Sine wave, ac-coupled 1.5 VPP LVPECL, ac-coupled 0.2 1.6 VPP LVDS, ac-coupled 0.7 VPP LVCMOS, single-ended, ac-coupled 3.3 Input clock duty cycle 40% 50% V 60% DIGITAL OUTPUTS CLOAD Maximum external load capacitance from each output pin to DRGND RLOAD Differential load resistance between the LVDS output pairs (LVDS mode) TA Operating free-air temperature (1) (2) (3) (4) (5) (6) 5 pF 100 -40 85 C See the Theory of Operation section for information. Use register bit <ENABLE LOW SPEED MODE>, refer to the Serial Register Map section for information. With LVDS interface only; maximum recommended sample rate with CMOS interface is 210 MSPS. See the Multiplexed Output Mode section for information. Refer to Performance vs Input Clock Amplitude Chart on Figure 35, Figure 52, Figure 69, and Figure 86. Refer to Figure 3 for the definition of clock amplitude. VCLKP - VCLKM Vp 0 Vpp Figure 3. Clock Amplitude Definition Diagram 6 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 ELECTRICAL CHARACTERISTICS - ADS62P49/48 and ADS62P29/28 Typical values are at 25C, AVDD = 3.3V, DRVDD = 1.8V, 50% clock duty cycle, -1dBFS differential analog input, internal reference mode (unless otherwise noted). Min and max values are across the full temperature range TMIN = -40C to TMAX = 85C, AVDD = 3.3V, DRVDD = 1.8V PARAMETER ADS62P49/ADS62P29 250 MSPS MIN TYP ADS62P48/ADS62P28 210 MSPS MAX MIN TYP UNIT MAX ANALOG INPUT Differential input voltage range (0 dB gain) 2 2 Vpp Differential input resistance (at dc), See Figure 100 >1 >1 M Differential input capacitance, See Figure 101 3.5 3.5 pF Analog input bandwidth (with 25 source impedance) 700 700 MHz Analog Input common mode current (per channel) 3.6 3.6 mA/MSPS VCM Common mode output voltage 1.5 1.5 V VCM Output current capability 4 4 mA DC ACCURACY Offset error -20 Temperature coefficient of offset error Variation of offset error with supply 2 20 -20 2 20 mV 0.02 0.02 mV/ C 0.5 0.5 mV/V There are two sources of gain error - internal reference inaccuracy and channel gain error. EGREF Gain error due to internal reference inaccuracy alone -1 0.2 1 -1 0.2 1 EGCHAN Gain error of channel alone (1) -1 0.2 1 -1 0.2 1 Temperature coefficient of EGCHAN Gain matching (2) 0.002 % FS % FS % /C 0.002 Difference in gain errors between two channels within the same device -2 2 -2 2 Difference in gain errors between two channels across two devices -4 4 -4 4 % FS POWER SUPPLY IAVDD Analog supply current 305 350 280 320 mA IDRVDD Output buffer supply current, LVDS interface with 100 external termination 133 175 122 165 mA IDRVDD Output buffer supply current, CMOS interface, Fin = 2MHz, No external load capacitance (3) (4) (4) 91 mA Analog power 1.01 1.15 0.92 Digital power, LVDS interface 0.24 0.315 0.22 0.3 W 45 100 45 100 mW Global power down (1) (2) (3) - 1.05 W This is specified by design and characterization; it is not tested in production. For two channels within the same device, only the channel gain error matters, as the reference is common for both channels. In CMOS mode, the DRVDD current scales with the sampling frequency, the load capacitance on output pins, input frequency and the supply voltage (see Figure 92 and CMOS interface power dissipation in application section). The maximum DRVDD current with CMOS interface depends on the actual load capacitance on the digital output lines. Note that the maximum recommended load capacitance on each digital output line is 10 pF. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 7 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com ELECTRICAL CHARACTERISTICS - ADS62P49/48 Typical values are at 25C, AVDD = 3.3V, DRVDD = 1.8V, 50% clock duty cycle, -1dBFS differential analog input, 0 dB gain, internal reference mode (unless otherwise noted). Min and max values are across the full temperature range TMIN = -40C to TMAX = 85C, AVDD = 3.3V, DRVDD = 1.8V PARAMETER TEST CONDITIONS ADS62P49 250 MSPS MIN SNR Signal to noise ratio, LVDS MAX MIN TYP Fin= 20 MHz 73.4 73.4 Fin = 60 MHz 73 73 Fin = 100 MHz 72 Fin = 170 MHz SINAD Signal to noise and distortion ratio, LVDS TYP ADS62P48 210 MSPS 0 dB gain 68 72 71 68 66.6 66.4 69.8 69.7 Fin= 20 MHz 73.2 73 Fin = 60 MHz 72.7 72.8 Fin = 100 MHz 71.2 0 dB gain 66.5 6 dB gain dBFS 71 Fin = 230 MHz Fin = 170 MHz 6 dB gain UNIT MAX 71.5 69.8 66.5 dBFS 70.1 66.5 66.3 Fin = 230 MHz 69 68 ENOB, Effective number of bits Fin = 170 MHz 11.3 11.4 DNL Differential non-linearity Fin = 170 MHz -0.95 0.6 1.3 -0.95 0.6 1.3 LSB INL Integrated non-linearity Fin = 170 MHz -5 2.5 5 -5 2.5 5 LSB LSB ELECTRICAL CHARACTERISTICS - ADS62P29/28 Typical values are at 25C, AVDD = 3.3V, DRVDD = 1.8V, 50% clock duty cycle, -1dBFS differential analog input, 0 dB gain, internal reference mode (unless otherwise noted). Min and max values are across the full temperature range TMIN = -40C to TMAX = 85C, AVDD = 3.3V, DRVDD = 1.8V PARAMETER TEST CONDITIONS ADS62P29 250 MSPS MIN SNR Signal to noise ratio, LVDS ENOB, Effective number of bits MAX MIN TYP Fin= 20 MHz 70.7 70.8 Fin = 60 MHz 70.5 70.6 Fin = 100 MHz 69.8 Fin = 170 MHz SINAD Signal to noise and distortion ratio, LVDS TYP ADS62P28 210 MSPS 0 dB gain 66.5 70 69.4 66.5 66 65.9 68.4 68.4 Fin= 20 MHz 70.6 70.6 Fin = 60 MHz 70.3 70.5 Fin = 100 MHz 69.3 0 dB gain 66 6 dB gain dBFS 69.4 Fin = 230 MHz Fin = 170 MHz 6 dB gain UNIT MAX 69.7 68.3 66 dBFS 68.7 65.9 65.8 Fin = 230 MHz 67.9 67.1 Fin = 170 MHz 11 11.1 LSB DNL Differential non-linearity -0.9 0.2 1.3 -0.9 0.2 1.3 LSB INL Integrated non-linearity -5 1 5 -5 1 5 LSB 8 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 ELECTRICAL CHARACTERISTICS - ADS62P49/48 Typical values are at 25C, AVDD = 3.3V, DRVDD = 1.8V, 50% clock duty cycle, -1dBFS differential analog input, 0 dB gain, internal reference mode (unless otherwise noted). Min and max values are across the full temperature range TMIN = -40C to TMAX = 85C, AVDD = 3.3V, DRVDD = 1.8V PARAMETER TEST CONDITIONS ADS62P49/ADS62P29 250 MSPS MIN SFDR Spurious Free Dynamic Range 85 85 85 Fin = 100 MHz 78 71 71 77 72 98 98 Fin = 60 MHz 95 95 92 92 90 78 90 90 Fin= 20 MHz 93 95 Fin = 60 MHz 90 94 Fin = 100 MHz 90 90 85 71 85 80 Fin= 20 MHz 89 85 Fin = 60 MHz 85 85 Fin = 170 MHz 78 71 Fin = 230 MHz 80 75 71 72 Fin= 20 MHz 87 83.5 Fin = 60 MHz 83.5 84.6 Fin = 100 MHz 77.5 70 74 79.7 70.5 dBc 77 77 Fin = 170 MHz dBc 88 Fin = 230 MHz Fin = 100 MHz dBc 91 Fin = 230 MHz 71 dBc 77 Fin= 20 MHz 77 UNIT MAX 80 75 Fin = 230 MHz Fin = 170 MHz THD Total harmonic distortion TYP 89 Fin = 170 MHz HD3 Third Harmonic Distortion MIN Fin = 60 MHz Fin = 100 MHz HD2 Second Harmonic Distortion MAX Fin= 20 MHz Fin = 170 MHz SFDR Spurious Free Dynamic Range, excluding HD2,HD3 TYP ADS62P48/ADS62P28 210 MSPS dBc 76.5 Fin = 230 MHz 75 71 F1 = 46 MHz, F2 = 50 MHz, each tone at -7 dBFS 87 91 F1 = 185 MHz, F2 = 190 MHz, each tone at -7 dBFS 85 84.5 Cross-talk Up to 200-MHz cross-talk frequency 90 90 dB Input overload recovery Recovery to within 1% (of final value) for 6-dB overload with sine wave input 1 1 Clock Cycles PSRR AC Power supply rejection ratio For 100-mV pp signal on AVDD supply 25 25 dB IMD 2-Tone Inter-modulation Distortion Copyright (c) 2009-2011, Texas Instruments Incorporated dBFS Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 9 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com DIGITAL CHARACTERISTICS -- ADS62Px9/x8 The DC specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0 or 1. AVDD = 3.3V, DRVDD = 1.8V PARAMETER ADS62P49/ADS62P48/ ADS62P29/ADS62P28 TEST CONDITIONS MIN TYP UNIT MAX DIGITAL INPUTS - CTRL1, CTRL2, CTRL3, RESET, SCLK, SDATA, SEN (1) High-level input voltage High-level input current Low-level input current 1.3 All digital inputs support 1.8V and 3.3V CMOS logic levels. Low-level input voltage SDATA, SCLK (2) SEN (3) SDATA, SCLK SEN V 0.4 16 VHIGH = 3.3 V mA 10 0 VLOW = 0 V mA -20 Input capacitance V 4 pF IOH = 1mA DRVDD DRVDD -0.1 V IOL = 1mA 0 DIGITAL OUTPUTS - CMOS INTERFACE (DA0-DA13, DB0-DB13, CLKOUT, SDOUT) High-level output voltage Low-level output voltage Output capacitance (internal to device) 0.1 2 V pF DIGITAL OUTPUTS - LVDS INTERFACE VODH High-level output differential voltage With external 100 termination. 275 350 425 mV VODL Low-level output differential voltage With external 100 termination. -425 -350 -275 mV VOCM Output common-mode voltage 1 1.15 1.4 Capacitance inside the device from each output to ground Output Capacitance (1) (2) (3) 2 V pF SCLK, SDATA, SEN function as digital input pins in serial configuration mode. SDATA, SCLK, RESET, CTRL1, CTRL2, and CTRL3 have an internal 100-k pull-down resistor. SEN has internal 100 k pull-up resistor to AVDD. Since the pull-up is weak, SEN can also be driven by 1.8V or 3.3V CMOS buffers. DAnP/DBnP Dn_Dn+1_P Logic 0 VODL = -350 mV Logic 1 (1) VODH = 350 mV (1) Dn_Dn+1_M DAnM/DBnM VOCM V GND GND T0334-02 (1) With external 100- termination Figure 4. LVDS Output Voltage Levels 10 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 TIMING REQUIREMENTS - LVDS AND CMOS MODES (1) Typical values are at 25C, AVDD = 3.3V, DRVDD = 1.8V, sampling frequency = 250 MSPS, sine wave input clock, 1.5 Vpp clock amplitude, CLOAD = 5pF (2) , RLOAD = 100 (3) , (unless otherwise noted). Min and max values are across the full temperature range TMIN = -40C to TMAX = 85C, AVDD = 3.3V, DRVDD = 1.7V to 1.9V PARAMETER ta TEST CONDITIONS MIN Aperture delay 0.7 Aperture delay matching tj Between two channels within the same device Aperture jitter Wake-up time TYP MAX 1.2 1.7 ns 50 ps 145 fs rms Time to valid data after coming out of STANDBY mode 1 3 Time to valid data after coming out of global powerdown 20 50 Time to valid data after stopping and restarting the input clock 10 ADC latency (4) UNIT ms ms Clock cycles 22 Clock cycles DDR LVDS MODE (5) tsu Data setup time Data valid (6) to zero-crossing of CLKOUTP 0.55 0.9 ns th Data hold time Zero-crossing of CLKOUTP to data becoming invalid (6) 0.55 0.95 ns Clock propagation delay Input clock falling edge cross-over to output clock rising edge cross-over 100 MSPS Sampling frequency 250 MSPS Ts = 1/Sampling frequency tdelay skew Difference in tdelay between two devices operating at same temperature and DRVDD supply voltage 500 LVDS bit clock duty cycle Duty cycle of differential clock, (CLKOUTP-CLKOUTM) 100 MSPS Sampling frequency 250 MSPS 52% tRISE, tFALL Data rise time, Data fall time Rise time measured from -100mV to +100mV Fall time measured from +100mV to -100mV 1MSPS Sampling frequency 250 MSPS 0.14 ns tCLKRISE, tCLKFALL Output clock rise time, Output clock fall time Rise time measured from -100mV to +100mV Fall time measured from +100mV to -100mV 1 MSPS Sampling frequency 250 MSPS 0.14 ns tOE Output buffer enable to data delay Time to valid data after output buffer becomes active 100 ns tPDI tdelay t PDI = 0.69xTs + tdelay 4.2 5.7 7.2 ns ps PARALLEL CMOS MODE (7) at Fs = 210 MSPS tSTART Input clock to data delay Input clock falling edge cross-over to start of data valid (8) tDV Data valid time Time interval of valid data (8) Clock propagation delay Input clock falling edge cross-over to output clock rising edge cross-over 100 MSPS Sampling frequency 150 MSPS Ts = 1/Sampling frequency Output clock duty cycle Duty cycle of output clock, CLKOUT 100 MSPS Sampling frequency 150 MSPS tRISE, tFALL Data rise time, Data fall time Rise time measured from 20% to 80% of DRVDD Fall time measured from 80% to 20% of DRVDD 1 Sampling frequency 210 MSPS 1.2 ns tCLKRISE, tCLKFALL Output clock rise time, Output clock fall time Rise time measured from 20% to 80% of DRVDD Fall time measured from 80% to 20% of DRVDD 1 Sampling frequency 150 MSPS 0.8 ns tPDI tdelay (1) (2) (3) (4) (5) (6) (7) (8) 2.5 1.7 2.7 ns ns tPDI = 0.28 x Ts + tdelay 5.5 7.0 8.5 ns 43% Timing parameters are ensured by design and characterization and not tested in production CLOAD is the effective external single-ended load capacitance between each output pin and ground RLOAD is the differential load resistance between the LVDS output pair. At higher clock frequencies, tPDI is greater than one clock period and overall latency = ADC latency + 1. Measurements are done with a transmission line of 100 characteristic impedance between the device and the load. Setup and hold time specifications take into account the effect of jitter on the output data and clock. Data valid refers to LOGIC HIGH of +100.0mV and LOGIC LOW of -100.0mV. For Fs> 150 MSPS, it is recommended to use external clock for data capture and NOT the device output clock signal (CLKOUT). Data valid refers to LOGIC HIGH of 1.26V and LOGIC LOW of 0.54V. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 11 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com TIMING REQUIREMENTS - LVDS AND CMOS MODES(1) (continued) Typical values are at 25C, AVDD = 3.3V, DRVDD = 1.8V, sampling frequency = 250 MSPS, sine wave input clock, 1.5 Vpp clock amplitude, CLOAD = 5pF(2) , RLOAD = 100(3) , (unless otherwise noted). Min and max values are across the full temperature range TMIN = -40C to TMAX = 85C, AVDD = 3.3V, DRVDD = 1.7V to 1.9V PARAMETER tOE (9) TEST CONDITIONS Output buffer enable (OE) to data delay (9) MIN Time to valid data after output buffer becomes active TYP MAX UNIT 100 ns Output buffer enable is controlled by Serial Interface Register 0x40. The output buffer becomes active once serial control data for output buffer is latched in on the 16th SCLK falling edge when SEN is low. Table 2. LVDS Timings at Lower Sampling Frequencies Setup Time, ns Sampling Frequency, MSPS MIN TYP 0.75 185 153 125 1.6 210 < 100 (Enable LOW SPEED mode for Fs 80) (1) Hold Time, ns MAX MIN TYP 1.1 0.75 1.15 0.9 1.25 0.85 1.25 1.15 1.55 1.1 1.5 2 1.45 1.85 2 MAX 2 tPDI, ns 1 Fs 100 (Enable LOW SPEED mode for Fs 80) MIN (1) TYP MAX 12.6 (1) LOW SPEED mode can be enabled with serial interface configuration only. Table 3. CMOS Timings at Lower Sampling Frequencies Timings Specified With Respect to Input Clock Sampling Frequency, MSPS tSTART, ns MIN Data Valid time, ns TYP MAX MIN TYP 210 2.5 1.7 2.7 190 1.9 2 3 170 0.9 2.7 3.7 150 6 3.6 4.6 MAX Timings Specified With Respect to CLKOUT Sampling Frequency, MSPS Setup Time, ns MIN TYP 170 2.1 150 125 <100 (Enable LOW SPEED mode for Fs 80) (1) 1 Fs 100 Enable LOW SPEED mode for Fs 80) (1) Hold Time, ns MAX MIN TYP 3.7 0.35 1.0 2.8 4.4 0.5 1.2 3.8 5.4 0.8 1.5 5 MAX 1.2 tPDI, ns MIN TYP MAX 9 (1) 12 LOW SPEED mode can be enabled with serial interface configuration only. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 N+4 N+3 N+2 N + 24 N + 23 N+1 Sample N N + 22 Input Signal ta CLKM Input Clock CLKP tPDI CLKOUTM CLKOUTP 22 Clock Cycles DDR LVDS Output Data DXP, DXM E - Even Bits D0,D2,D4,... O - Odd Bits D1,D3,D5,... O E E O E O N - 21 N - 22 O E N - 20 E O E O E O N - 19 O E O N N-1 E O E N+1 tPDI CLKOUT Parallel CMOS 22 Clock Cycles Output Data D0-D13 N - 22 N - 21 N - 20 N - 19 N - 18 N-1 N N+1 N+2 T0105-11 Figure 5. Latency Diagram CLKP Input Clock CLKM tPDI CLKOUTM Output Clock CLKOUTP th tsu tsu DAnP/M DBnP/M Output Data Pair th Dn (1) Dn+1 (2) T0106-08 (1) Dn - Bits D0, D2, D4, ... (2) Dn + 1 - Bits D1, D3, D5, ... Figure 6. LVDS Interface Timing Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 13 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 Input Clock www.ti.com CLKP CLKM tPDI Output Clock CLKOUT th tsu Output Data Input Clock DAn, DBn Dn (1) CLKP CLKM tSTART tDV Output Data DAn, DBn Dn (1) T0107-07 (1) Dn - Bits D0, D1, D2, ... of Channel A and B Figure 7. CMOS Interface Timing 14 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 DEVICE CONFIGURATION ADS62Px9/x8 can be configured independently using either parallel interface control or serial interface programming. PARALLEL CONFIGURATION ONLY To put the device in parallel configuration mode, keep RESET tied to high (AVDD or DRVDD). Now, pins SEN, SCLK, CTRL1, CTRL2 and CTRL3 can be used to directly control certain modes of the ADC. The device can be easily configured by connecting the parallel pins to the correct voltage levels (as described in Table 4 to Table 7). There is no need to apply reset and SDATA pin can be connected to ground. In this mode, SEN and SCLK function as parallel interface control pins. Frequently used functions can be controlled in this mode - power down modes, internal/external reference, selection between LVDS/CMOS interface and output data format. Table 4 has a brief description of the modes controlled by the four parallel pins. Table 4. Parallel Pin Definition PIN SCLK SEN TYPE OF PIN Analog control pins (controlled by analog voltage levels, see Figure 8) CONTROLS MODES Internal/external reference LVDS/CMOS interface and output data format CTRL1 CTRL2 Digital control pins (controlled by digital logic Controls power down modes levels) CTRL3 SERIAL INTERFACE CONFIGURATION ONLY To exercise this mode, first the serial registers have to be reset to their default values and RESET pin has to be kept low. SEN, SDATA and SCLK function as serial interface pins in this mode and can be used to access the internal registers of the ADC. The registers can be reset either by applying a pulse on RESET pin or by setting the <RESET> bit high. The serial interface section describes the register programming and register reset in more detail DETAILS OF PARALLEL CONFIGURATION ONLY The functions controlled by each parallel pin are described below. A simple way of configuring the parallel pins is shown in Figure 8. Table 5. SCLK CONTROL PIN VOLTAGE APPLIED ON SCLK DESCRIPTION 0 +200mV/-0mV Internal reference (3/8)AVDD +/- 200mV External reference (5/8) AVDD +/- 200mV External reference AVDD +0mV/-200mV Internal reference Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 15 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com Table 6. SEN CONTROL PIN VOLTAGE APPLIED ON SEN 0 (+200mV/-0mV) DESCRIPTION 2's complement, DDR LVDS output (3/8)AVDD (200mV) Offset binary, DDR LVDS output (5/8)AVDD (200mV) Offset binary, parallel CMOS output AVDD (+0mV/-200mV) 2's compliment, parallel CMOS output Table 7. CTRL1, CTRL2 and CTRL3 PINS CTRL1 CTRL2 LOW LOW LOW Normal operation LOW LOW HIGH Not available LOW HIGH LOW Not available (1) (2) CTRL3 (1) DESCRIPTION LOW HIGH HIGH Not available HIGH LOW LOW Global power down HIGH LOW HIGH Channel B standby HIGH HIGH LOW Channel A standby HIGH HIGH HIGH MUX mode of operation, Channel A and B data is multiplexed and output on DA13 to DA0 pins. (2) See POWER DOWN in the APPLICATION INFORMATION section. Low Speed mode has to be enabled for Multiplexed Output mode (MUX mode). Therefore, MUX mode works with serial interface configuration only and is not supported with parallel configuration. AVDD (5/8) AVDD 3R (5/8) AVDD GND AVDD 2R (3/8) AVDD (3/8) AVDD 3R To Parallel Pin GND S0321-01 Figure 8. Simple Scheme to Configure Parallel Pins USING BOTH SERIAL INTERFACE AND PARALLEL CONTROLS For increased flexibility, a combination of serial interface registers and parallel pin controls (CTRL1 to CTRL3) can also be used to configure the device. To allow this, keep RESET low. The parallel interface control pins CTRL1 to CTRL3 are available. After power-up, the device is automatically configured as per the voltage settings on these pins (see Table 6). SEN, SDATA, and SCLK function as serial interface digital pins and are used to access the internal registers of ADC. The registers must first be reset to their default values either by applying a pulse on RESET pin or by setting bit <RST> = 1. After reset, the RESET pin must be kept low. The Serial Interface section describes register programming and register reset in more detail. SERIAL INTERFACE The ADC has a set of internal registers, which can be accessed by the serial interface formed by pins SEN (Serial interface Enable), SCLK (Serial Interface Clock) and SDATA (Serial Interface Data). 16 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 Serial shift of bits into the device is enabled when SEN is low. Serial data SDATA is latched at every falling edge of SCLK when SEN is active (low). The serial data is loaded into the register at every 16th SCLK falling edge when SEN is low. In case the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data can be loaded in multiple of 16-bit words within a single active SEN pulse. The first 8 bits form the register address and the remaining 8 bits are the register data. The interface can work with SCLK frequency from 20 MHz down to very low speeds (few Hertz) and also with non-50% SCLK duty cycle. Register Initialization After power-up, the internal registers MUST be initialized to their default values. This can be done in one of two ways: 1. Either through hardware reset by applying a high-going pulse on RESET pin (of width greater than 10ns) as shown in Figure 9 OR 2. By applying software reset. Using the serial interface, set the <RESET> bit (D7 in register 0x00) to HIGH. This initializes internal registers to their default values and then self-resets the <RESET> bit to low. In this case the RESET pin is kept low. Register Address SDATA A7 A6 A5 A4 A3 A2 Register Data A1 A0 D7 D6 t(SCLK) D5 D4 D3 D2 D1 D0 t(DH) t(DSU) SCLK t(SLOADH) t(SLOADS) SEN RESET T0109-01 Figure 9. Serial Interface Timing Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 17 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com SERIAL INTERFACE TIMING CHARACTERISTICS Typical values at 25C, min and max values across the full temperature range TMIN = -40C to TMAX = 85C, AVDD = 3.3V, DRVDD = 1.8V (unless otherwise noted). PARAMETER MIN TYP > DC MAX UNIT 20 MHz fSCLK SCLK frequency (= 1/ tSCLK) tSLOADS SEN to SCLK setup time 25 ns tSLOADH SCLK to SEN hold time 25 ns tDS SDATA setup time 25 ns tDH SDATA hold time 25 ns Serial Register Readout The device includes an option where the contents of the internal registers can be read back. This may be useful as a diagnostic check to verify the serial interface communication between the external controller AND the ADC. a. First, set register bit <SERIAL READOUT> = 1. This also disables any further writes into the registers. b. Initiate a serial interface cycle specifying the address of the register (A7-A0) whose content has to be read. c. The device outputs the contents (D7-D0) of the selected register on the SDOUT pin (64). d. The external controller can latch the contents at the falling edge of SCLK. e. To enable register writes, reset register bit <SERIAL READOUT> = 0. SDOUT is a CMOS output pin; the readout functionality is available whether the ADC output data interface is LVDS or CMOS. When <SERIAL READOUT> is disabled, the SDOUT pin is forced low by the device (and not put in high-impedance). If serial readout is not used, the SDOUT pin has to be floated. 18 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 A) Enable serial readout (<SERIAL READOUT> = 1) Register Data (D7:D0) = 0x01 Register Address (A7:A0) = 0x00 SDATA A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN SDOUT Pin SDOUT is NOT in high-impedance state; it is forced low by the device (<SERIAL READOUT> = 0) B) Read contents of register 0x40. This register has been initialized with 0x0C (device is put in global power down mode) Register Data (D7:D0) = XX (Don't Care) Register Address (A7:A0) = 0x40 SDATA A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 1 1 0 0 SCLK SEN SDOUT Pin SDOUT functions as serial readout (<SERIAL READOUT> = 1) T0386-02 Figure 10. Serial Readout Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 19 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com RESET TIMING (ONLY WHEN SERIAL INTERFACE IS USED) Typical values at 25C, min and max values across the full temperature range TMIN = -40C to TMAX = 85C (unless otherwise noted). PARAMETER t1 Power-on delay CONDITIONS t2 Reset pulse width Pulse width of active RESET signal t3 Register write delay Delay from RESET disable to SEN active (1) MIN Delay from power-up of AVDD and DRVDD to RESET pulse active TYP MAX 1 UNIT ms 10 ns 1 (1) 100 ms ns The reset pulse is needed only when using the serial interface configuration. If the pulse width is greater than 1msec, the device could enter the parallel configuration mode briefly and then return back to serial interface mode. Power Supply AVDD, DRVDD t1 RESET t2 t3 SEN T0108-01 NOTE: A high-going pulse on RESET pin is required in serial interface mode in case of initialization through hardware reset. For parallel interface operation, RESET has to be tied permanently HIGH. Figure 11. Reset Timing Diagram 20 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 SERIAL REGISTER MAP Table 8. Summary of Functions Supported by Serial Interface REGISTER ADDRESS REGISTER FUNCTIONS A7-A0 IN HEX D7 D6 D5 D4 D3 D2 D1 D0 00 <RESET> Software Reset 0 0 0 0 0 0 <SERIAL READOUT> 20 0 0 0 0 0 <ENABLE LOW SPEED MODE> 0 0 3F 0 <REF> Internal or external reference 0 0 0 0 <STANDBY> 0 40 0 0 0 0 41 <LVDS CMOS> Output interface 0 0 0 0 0 0 <ENABLE INDIVIDUAL CHANNEL CONTROL> 0 0 52 0 0 <CUSTOM PATTERN HIGH> 53 0 <ENABLE OFFSET CORRECTION - CH A> 0 44 50 <POWER DOWN MODES> <CLKOUT EDGE CONTROL> 51 0 0 0 0 0 <DATA FORMAT> 2s comp or offset binary 0 <CUSTOM PATTERN LOW> 55 <GAIN PROGRAMMABILITY - CH A> 0 to 6 dB in 0.5 dB steps 57 0 62 0 0 63 0 0 66 0 <ENABLE OFFSET CORRECTION - CH B> 68 (1) (1) <OFFSET CORRECTION TIME CONSTANT - CH A> <FINE GAIN ADJUST - CH A> +0.001 dB to +0.134 dB, in 128 steps 0 0 0 0 0 0 <GAIN PROGRAMMABILITY - CH B> 0 to 6 dB in 0.5 dB steps 6A 0 75 0 0 76 0 0 <TEST PATTERNS - CH A> <OFFSET PEDESTAL - CH A> 0 0 0 <OFFSET CORRECTION TIME CONSTANT - CH B> <FINE GAIN ADJUST - CH B> +0.001 dB to +0.134 dB, in 128 steps 0 0 0 <TEST PATTERNS - CH B> <OFFSET PEDESTAL - CH B> Multiple functions in a register can be programmed in a single write operation. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 21 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com DESCRIPTION OF SERIAL REGISTERS A7-A0 IN HEX D7 D6 D5 D4 D3 D2 00 <RESET> Software Reset 0 0 0 0 0 D7 D1 D0 <SERIAL READOUT> <RESET> 1 Software reset applied - resets all internal registers and self-clears to 0. D0 <SERIAL READOUT> 0 Serial readout disabled. SDOUT is forced low by the device (and not put in high impedance state). 1 Serial readout enabled, Pin SDOUT functions as serial data readout. A7-A0 IN HEX D7 D6 D5 D4 D3 D2 D1 D0 20 0 0 0 0 0 <ENABLE LOW SPEED MODE> 0 0 D2 <ENABLE LOW SPEED MODE> 0 LOW SPEED mode disabled. Use for sampling frequency > 80 MSPS 1 Enable LOW SPEED mode for sampling frequencies 80 MSPS. D6-D5 A7-A0 IN HEX D7 3F 0 D6 D5 D4 D3 D2 D1 D0 0 0 0 <STANDBY> 0 <REF> <REF> Internal or external reference selection 00 Internal reference enabled 01 10 11 External reference enabled D1 <STANDBY> D3-D0 0 Normal operation 1 Both ADC channels are put in standby. Internal references, output buffers are active. This results in quick wake-up time from standby. A7-A0 IN HEX D7 D6 D5 D4 40 0 0 0 0 D3 D2 D1 D0 POWER DOWN MODES <POWER DOWN MODES> 0000 Pins CTRL1, CTRL2, and CTRL3 determine power down modes. 1000 Normal operation 1001 Output buffer disabled for channel B 1010 Output buffer disabled for channel A 1011 Output buffer disabled for channel A and B 1100 Global power down 1101 Channel B standby 1110 Channel A standby 1111 Multiplexed mode, MUX- (only with CMOS interface) Channel A and B data is multiplexed and output on DA13 to DA0 pins. Refer to the Multiplexed Output Mode section in the APPLICATION INFORMATION for additional information. 22 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com D7 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 A7-A0 IN HEX D7 D6 D5 D4 D3 D2 D1 D0 41 <LVDS CMOS> 0 0 0 0 0 0 0 D5 D4 D3 D2 D1 D0 0 0 <LVDS CMOS> 0 Parallel CMOS interface 1 DDR LVDS interface A7-A0 IN HEX D7 44 D6 <CLKOUT EDGE CONTROL> Output clock edge control LVDS interface D7-D5 <CLKOUT POSN> Output clock rising edge position (2) 000, 100 Default output clock position (refer to timing specification table) 101 Falling edge shifted (delayed) by + (4/26)xTs(1) 110 Falling edge shifted (advanced) by - (7/26)xTs 111 Falling edge shifted (advanced) by - (4/26)xTs <CLKOUT POSN> Output clock falling edge position (2) D4-D2 000, 100 Default output clock position (refer to timing specification table) 101 Rising edge shifted (delayed) by + (4/26)xTs 110 Rising edge shifted (advanced) by - (7/26)xTs 111 Rising edge shifted (advanced) by - (4/26)xTs CMOS interface D7-D5 <CLKOUT POSN> Output clock rising edge position (2) 000, 100 Default output clock position (refer to timing specification table) 101 Rising edge shifted (delayed) by + (4/26)xTs 110 Rising edge shifted (advanced) by - (7/26)xTs 111 Rising edge shifted (advanced) by - (4/26)xTs <CLKOUT POSN> Output clock falling edge position (2) D4-D2 000, 100 Default output clock position (refer to timing specification table) (1) 101 Falling edge shifted (delayed) by + (4/26)xTs 110 Falling edge shifted (advanced) by - (7/26)xTs 111 Falling edge shifted (advanced) by - (4/26)xTs Ts = 1 / sampling frequency (2) Keep the same duty cycle, move both edges by the same amount (i.e., write both D<4:2> and D<7:5> to be the same value). Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 23 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com Data CLKM D<7:5> = 000 Default position of falling edge D<4:2> = 000 Default position of rising edge CLKP CLKM D<4:2> = 101 Moves rising edge by +(4/26)Ts +(4/26)Ts D<7:5> = 101 Moves falling edge by +(4/26)Ts +(4/26)Ts CLKP CLKM -(7/26)Ts D<4:2> = 110 Moves rising edge by -(7/26)Ts -(7/26)Ts D<7:5> = 110 Moves falling edge by -(7/26)Ts CLKP CLKM -(4/26)Ts D<4:2> = 111 Moves rising edge by -(4/26)Ts -(4/26)Ts D<7:5> = 111 Moves falling edge by -(4/26)Ts CLKP Sampling Time Period Ts T0490-01 NOTES: 1. Keep the same duty cycle, move both edges by same amount (i.e. write both D<4:2> and D<7:5> to be the same value). 2. Refer to timing specification table for default output clock position. Figure 12. LVDS Interface Output Clock Edge Movement (Serial Register 0x44) Data CLKOUT D<7:5> = 000 Default position of rising edge CLKOUT D<7:5> = 101 Moves rising edge by +(4/26)Ts CLKOUT CLKOUT -(7/26)Ts -(4/26)Ts D<4:2> = 000 Default position of falling edge +(4/26)Ts D<7:5> = 110 Moves rising edge by -(7/26)Ts D<7:5> = 111 Moves rising edge by -(4/26)Ts D<4:2> = 101 Moves falling edge by +(4/26)Ts -(7/26)Ts -(4/26)Ts +(4/26)Ts D<4:2> = 110 Moves falling edge by -(7/26)Ts D<4:2> = 111 Moves falling edge by -(4/26)Ts Sampling Time Period Ts T0491-01 NOTES: 1. Keep the same duty cycle, move both edges by same amount (i.e. write both D<4:2> and D<7:5> to be the same value). 2. Refer to timing specification table for default output clock position. Figure 13. CMOS Interface Output Clock Edge Movement (Serial Register 0x44) 24 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 A7-A0 IN HEX D7 D6 D5 D4 D3 50 0 <ENABLE INDEPENDENT CHANNEL CONTROL> 0 0 0 D6 D2 D1 D0 <DATA FORMAT> 2s complement or offset binary 0 <ENABLE INDEPENDENT CHANNEL CONTROL> 0 Common control - both channels use common control settings for test patterns, offset correction, fine gain, gain correction and SNR Boost functions. These settings can be specified in a single set of registers. 1 Independent control - both channels can be programmed with independent control settings for test patterns, offset correction and SNR Boost functions. Separate registers are available for each channel. D2-D1 <DATA FORMAT> 10 2s complement 11 Offset binary A7-A0 IN HEX D7 D6 D5 51 52 D7-D0 D4 D3 D2 D1 D0 <Custom Pattern Low> 0 0 <Custom Pattern High> <CUSTOM PATTERN LOW> 8 lower bits of custom pattern available at the output instead of ADC data. D5-D0 <CUSTOM PATTERN HIGH> 6 upper bits of custom pattern available at the output instead of ADC data Use this mode along with "Test Patterns" (register 0x62). A7-A0 IN HEX D7 D6 D5 D4 D3 D2 D1 D0 53 0 <ENABLE OFFSET CORRECTION - Common/Ch A> Offset correction enable 0 0 0 0 0 0 D6 <ENABLE OFFSET CORRECTION - Common/Ch A> Offset correction enable control for both channels (with common control) or for channel A only (with independent control). 0 Offset correction disabled 1 Offset correction enabled Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 25 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 A7-A0 IN HEX 55 D7-D4 D7 D6 www.ti.com D5 <GAIN - Common/Ch A> D4 D3 D2 D1 D0 <OFFSET CORR TIME CONSTANT - Common/Ch A> Offset correction time constant <GAIN - Common/Ch A> Gain control for both channels (with common control) or for channel A only (with independent control). 0000 0 dB gain, default after reset 0001 0.5 dB gain 0010 1.0 dB gain 0011 1.5 dB gain 0100 2.0 dB gain 0101 2.5 dB gain 0110 3.0 dB gain 0111 3.5 dB gain 1000 4.0 dB gain 1001 4.5 dB gain 1010 5.0 dB gain 1011 5.5 dB gain 1100 6.0 dB gain D3-D0 <OFFSET CORR TIME CONSTANT - Common/Ch A> Correction loop time constant in number of clock cycles. Applies to both channels (with common control) or for channel A only (with independent control). 0000 256 k 0001 512 k 0010 1 M 0011 2 M 0100 4 M 0101 8 M 0110 16 M 0111 32 M 1000 64 M 1001 128 M 1010 256 M 1011 512 M 26 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 A7-A0 IN HEX D7 57 0 D6 D5 D4 D3 D2 D1 D0 <FINE GAIN ADJUST - Common/Ch A> +0.001 dB to +0.134 dB, in 128 steps Using the FINE GAIN ADJUST register bits, the channel gain can be trimmed in fine steps. The trim is only additive, has 128 steps and a range of 0.134dB. The relation between the FINE GAIN ADJUST bits and the trimmed channel gain is: Channel gain = 20*log10[1 + (FINE GAIN ADJUST/8192)] Note that the total device gain = ADC gain + Channel gain. The ADC gain is determined by register bits <GAIN PROGRAMMABILITY> D2-D0 A7-A0 IN HEX D7 D6 D5 D4 D3 62 0 0 0 0 0 D2 D1 D0 <TEST PATTERNS> <TEST PATTERNS> Test Patterns to verify data capture. Applies to both channels (with common control) or for channel A only (with independent control). 000 Normal operation 001 Outputs all zeros 010 Outputs all ones 011 Outputs toggle pattern - see Figure 14 and Figure 15 for test pattern timing diagrams for LVDS and CMOS modes. In ADS62P49/48, output data <D13:D0> alternates between 01010101010101 and 10101010101010 every clock cycle. In ADS62P29/28, output data <D11:D0> alternates between 010101010101 and 101010101010 every clock cycle. 100 Outputs digital ramp In ADS62P49/48, output data increments by one LSB (14-bit) every clock cycle from code 0 to code 16383 In ADS62P29/28, output data increments by one LSB (12-bit) every 4th clock cycle from code 0 to code 4095 101 Outputs custom pattern (use registers 0x51, 0x52 for setting the custom pattern), see Figure 16 for an example of a custom pattern. 110 Unused 111 Unused Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 27 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com CLKOUTM CLKOUTP DA0, DB0 0 (D0) 1 (D1) 1 0 0 1 1 0 DA2, DB2 0 (D2) 1 (D3) 1 0 0 1 1 0 DA10, DB10 0 (D10) 1 (D11) 1 0 0 1 1 0 DA12, DB12 0 (D12) 1 (D13) 1 0 0 1 1 0 * * * * * * Sample N Sample N+1 Sample N+2 Sample N+3 T0485-01 NOTES: 1. Even bits output at the rising edge of CLKOUTP, and odd bits output at falling edge of CLKOUTP. 2. Output toggles at half the sampling rate (Fs/2) in this test mode. Figure 14. Output Toggle Pattern (Serial Register 0x62, D<2:0> = 011) in LVDS Mode 28 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 CLKOUT DA0, DB0 1 0 1 0 DA1, DB1 0 1 0 1 DA12, DB12 1 0 1 0 DA13, DB13 0 1 0 1 Sample N Sample N+1 Sample N+2 Sample N+3 * * * * * * T0486-01 NOTE: Output toggles at half the sampling rate (Fs/2) in this test mode. Figure 15. Output Toggle Pattern (Serial Register 0x62, D<2:0> = 011) in CMOS Mode Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 29 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com Example: Register 0x51 = 0xAA and Register 0x52 = 0x2A to toggle output at Fs CLKOUTM CLKOUTP DA0, DB0 0 (D0) 1 (D1) 0 1 0 1 0 1 DA2, DB2 0 (D2) 1 (D3) 0 1 0 1 0 1 DA10, DB10 0 (D10) 1 (D11) 0 1 0 1 0 1 DA12, DB12 0 (D12) 1 (D13) 0 1 0 1 0 1 * * * * * * Sample N Sample N+1 Sample N+2 Sample N+3 T0485-02 NOTES: 1. Even bits output at the rising edge of CLKOUTP, and odd bits output at falling edge of CLKOUTP. 2. Output toggles at the sampling rate (Fs) in this test mode. Figure 16. Output Custom Pattern (Serial Register 0x62, D<2:0> = 101) in LVDS Mode 30 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 A7-A0 IN HEX D7 D6 63 0 0 D5-D0 D5 D4 D3 D2 D1 D0 <OFFSET PEDESTAL - Common/Ch A> <OFFSET PEDESTAL - Common/Ch A> When the offset correction is enabled, the final converged value (after the offset is corrected) will be the ideal ADC mid-code value (=8192 for P49/48, = 2048 for P29/28). A pedestal can be added to the final converged value by programming these bits. So, the final converged value will be = ideal mid-code + PEDESTAL. See "Offset Correction" in application section. Applies to both channels (with common control) or for channel A only (with independent control). 011111 PEDESTAL = 31 LSB 011110 PEDESTAL = 30 LSB 011101 PEDESTAL = 29 LSB .... 000000 PEDESTAL = 0 .... 111111 PEDESTAL = -1 LSB 111110 PEDESTAL = -2 LSB .... 100000 PEDESTAL = -32 LSB A7-A0 IN HEX D7 D6 D5 D4 D3 D2 D1 D0 66 0 <ENABLE OFFSET CORRECTION - CH B> Offset correction enable 0 0 0 0 0 0 D6 <ENABLE OFFSET CORRECTION - CH B> Offset correction enable control for channel B (only with independent control). 0 offset correction disabled 1 offset correction enabled Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 31 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 A7-A0 IN HEX D7 68 D7-D4 D6 www.ti.com D5 D4 D3 <GAIN - CH B> D2 D1 D0 <OFFSET CORR TIME CONSTANT - CH B> Offset correction time constant <GAIN - CH B> Gain programmability to 0.5 dB steps. Applies to channel B (only with independent control). 0000 0 dB gain, default after reset 0001 0.5 dB gain 0010 1.0 dB gain 0011 1.5 dB gain 0100 2.0 dB gain 0101 2.5 dB gain 0110 3.0 dB gain 0111 3.5 dB gain 1000 4.0 dB gain 1001 4.5 dB gain 1010 5.0 dB gain 1011 5.5 dB gain 1100 6.0 dB gain D3-D0 OFFSET CORR TIME CONSTANT - CH B> Time constant of correction loop in number of clock cycles. Applies to channel B (only with independent control) 32 0000 256 k 0001 512 k 0010 1M 0011 2M 0100 4M 0101 8M 0110 16 M 0111 32 M 1000 64 M 1001 128 M 1010 256 M 1011 512 M Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 A7-A0 IN HEX D7 D6 D5 6A D4 D3 D2 D1 D0 <FINE GAIN ADJUST - CH B> +0.001 dB to +0.134 dB, in 128 steps Using the FINE GAIN ADJUST register bits, the channel gain can be trimmed in fine steps. The trim is only additive, has 128 steps and a range of 0.134dB. The relation between the FINE GAIN ADJUST bits and the trimmed channel gain is: Channel gain = 20*log10[1 + (FINE GAIN ADJUST/8192)] Note that the total device gain = ADC gain + Channel gain. The ADC gain is determined by register bits <GAIN PROGRAMMABILITY> A7-A0 IN HEX D7 75 D2-D0 D6 D5 D4 D3 0 0 0 D2 D1 D0 <TEST PATTERNS - CH B> <TEST PATTERNS> Test Patterns to verify data capture. Applies to channel B (only with independent control) 000 Normal operation 001 Outputs all zeros 010 Outputs all ones 011 Outputs toggle pattern - see Figure 14 and Figure 15 for LVDS and CMOS modes. In ADS62P49/48, output data <D13:D0> alternates between 01010101010101 and 10101010101010 every clock cycle. In ADS62P29/28, output data <D11:D0> alternates between 010101010101 and 101010101010 every clock cycle. 100 Outputs digital ramp In ADS62P49/48, output data increments by one LSB (14-bit) every clock cycle from code 0 to code 16383 In ADS62P29/28, output data increments by one LSB (12-bit) every 4th clock cycle from code 0 to code 4095 101 Outputs custom pattern (use registers 0x51, 0x52 for setting the custom pattern), see Figure 16 for an example of a custom pattern. 110 Unused 111 Unused Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 33 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com A7-A0 IN HEX D7 D6 76 0 0 D5-D0 D5 D4 D3 D2 D1 D0 <OFFSET PEDESTAL - Common/CH B> <OFFSET PEDESTAL - Common/CH B> When the offset correction is enabled, the final converged value (after the offset is corrected) will be the ideal ADC mid-code value (=8192 for P49/48, = 2048 for P29/28). A pedestal can be added to the final converged value by programming these bits. So, the final converged value will be = ideal mid-code + PEDESTAL. See "Offset Correction" in application section. Applies to channel B (only with independent control). 011111 PEDESTAL = 31 LSB 011110 PEDESTAL = 30 LSB 011101 PEDESTAL = 29 LSB .... 000000 PEDESTAL = 0 .... 111111 PEDESTAL = -1 LSB 111110 PEDESTAL = -2 LSB .... 100000 PEDESTAL = -32 LSB 34 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 DEVICE INFORMATION PIN CONFIGURATION (LVDS MODE) - ADS62P49/P48 DB2P DB2M DB0P DB0M DRGND DRVDD CLKOUTP CLKOUTM DA12P DA12M DA10P DA10M DA8P DA8M 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 DRGND SDOUT RGC Package (Top View) DRVDD 1 49 48 DB4M 2 47 DA6P DB4P 3 46 DA6M DB6M 4 45 DA4P DB6P 5 44 DA4M DB8M 6 43 DA2P DB8P 7 42 DA2M DB10M 8 41 DA0P DB10P 9 40 DA0M DB12M 10 39 DRGND DB12P 11 38 DRVDD RESET 12 37 CTRL3 SCLK 13 36 CTRL2 SDATA 14 35 CTRL1 SEN 15 34 AVDD AVDD 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 33 32 AGND AGND INP_B INM_B AGND NC CM AGND CLKP CLKM AGND AGND INP_A INM_A AGND AGND AVDD Thermal Pad (Connected to DRGND) DRVDD P0056-14 Figure 17. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 35 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com PIN CONFIGURATION (LVDS MODE) - ADS62P29/P28 DB0P DB0M NC NC DRGND DRVDD CLKOUTP CLKOUTM DA10P DA10M DA8P DA8M DA6P DA6M 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 DRGND SDOUT RGC Package (Top View) DRVDD 1 49 48 DB2M 2 47 DA4P DB2P 3 46 DA4M DB4M 4 45 DA2P DB4P 5 44 DA2M DB6M 6 43 DA0P DB6P 7 42 DA0M DB8M 8 41 NC DB8P 9 40 NC Thermal Pad (Connected to DRGND) DRVDD SDATA 14 35 CTRL1 SEN 15 34 AVDD AVDD AVDD 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 33 32 AGND CTRL2 AGND 36 INM_A 13 INP_A SCLK AGND CTRL3 AGND 37 CLKM 12 CLKP RESET AGND DRVDD CM 38 NC 11 AGND DB10P INM_B DRGND INP_B 39 AGND 10 AGND DB10M P0056-15 Figure 18. PIN ASSIGNMENTS (LVDS MODE) - ADS62P49/P48 and ADS62P29/P28 PIN NO. NO. OF PINS I/O AVDD 16, 33, 34 3 I Analog power supply AGND 17, 18, 21, 24, 27, 28, 31, 32 8 I Analog ground CLKP, CLKM 25, 26 2 I Differential clock input INP_A, INM_A 29, 30 2 I Differential analog input, Channel A INP_B, INM_B 19, 20 2 I Differential analog input, Channel B 23 1 IO NAME VCM DESCRIPTION Internal reference mode - Common-mode voltage output. External reference mode - Reference input. The voltage forced on this pin sets the internal references. RESET 12 1 I Serial interface RESET input. When using the serial interface mode, the user must initialize internal registers through hardware RESET by applying a high-going pulse on this pin or by using software reset option. Refer to Serial Interface section. 36 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 PIN ASSIGNMENTS (LVDS MODE) - ADS62P49/P48 and ADS62P29/P28 (continued) PIN NAME NO. NO. OF PINS I/O DESCRIPTION In parallel interface mode, the user has to tie RESET pin permanently high. (SCLK and SEN are used as parallel control pins in this mode) The pin has an internal 100 k pull-down resistor. SCLK 13 1 I This pin functions as serial interface clock input when RESET is low. It controls selection of internal or external reference when RESET is tied high. See Table 5 for detailed information. The pin has an internal 100 k pull-down resistor. SDATA 14 1 I Serial interface data input. The pin has an internal 100K pull-down resistor. It has no function in parallel interface mode and can be tied to ground. SEN 15 1 I This pin functions as serial interface enable input when RESET is low. It controls selection of data format and interface type when RESET is tied high. See Table 6 for detailed information. The pin has an internal 100 k pull-up resistor to AVDD SDOUT 64 1 O This pin functions as serial interface register readout, when the <SERIAL READOUT> bit is enabled. When <SERIAL READOUT> = 0, this pin forces logic LOW and is not 3-stated. CTRL1 35 1 I CTRL2 36 1 I CTRL3 37 1 I CLKOUTP 57 1 O Differential output clock, true CLKOUTM 56 1 O Differential output clock, complement DA0P, DA0M 2 O Differential output data pair, D0 and D1 multiplexed - Channel A DA2P, DA2M 2 O Differential output data D2 and D3 multiplexed - Channel A DA4P, DA4M 2 O Differential output data D4 and D5 multiplexed - Channel A DA6P, DA6M 2 O Differential output data D6 and D7 multiplexed - Channel A DA8P, DA8M 2 O Differential output data D8 and D9 multiplexed - Channel A DA10P, DA10M 2 O Differential output data D10 and D11 multiplexed - Channel A 2 O Differential output data D12 and D13 multiplexed - Channel A DA12P, DA12M DB0P, DB0M Refer to Figure 17 and Figure 18 Digital control input pins. Together, they control various power down modes. The pin has an internal 100k pull-down resistor. 2 O Differential output data pair, D0 and D1 multiplexed - Channel B DB2P, DB2M 2 O Differential output data D2 and D3 multiplexed - Channel B DB4P, DB4M 2 O Differential output data D4 and D5 multiplexed - Channel B DB6P, DB6M 2 O Differential output data D6 and D7 multiplexed - Channel B DB8P, DB8M 2 O Differential output data D8 and D9 multiplexed - Channel B DB10P, DB10M 2 O Differential output data D10 and D11 multiplexed - Channel B DB12P, DB12M 2 O Differential output data D12 and D13 multiplexed - Channel B DRVDD 1, 38, 48, 58 4 I Output buffer supply DRGND 39, 49, 59, PAD 4 I Output buffer ground NC Refer to Figure 17 and Figure 18 Do not connect Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 37 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com PIN CONFIGURATION (CMOS MODE) - ADS62P49/P48 DB3 DB2 DB1 DB0 DRGND DRVDD CLKOUT NC DA13 DA12 DA11 DA10 DA9 DA8 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 DRGND SDOUT RGC Package (Top View) DRVDD 1 49 48 DB4 2 47 DA7 DB5 3 46 DA6 DB6 4 45 DA5 DB7 5 44 DA4 DB8 6 43 DA3 DB9 7 42 DA2 DB10 8 41 DA1 DB11 9 40 DA0 DB12 10 39 DRGND DB13 11 38 DRVDD RESET 12 37 CTRL3 SCLK 13 36 CTRL2 SDATA 14 35 CTRL1 SEN 15 34 AVDD AVDD 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 33 32 AGND AGND INP_B INM_B AGND NC CM AGND CLKP CLKM AGND AGND INP_A INM_A AGND AGND AVDD Thermal Pad (Connected to DRGND) DRVDD P0056-16 Figure 19. 38 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 PIN CONFIGURATION (CMOS MODE) - ADS62P29/P28 DB1 DB0 NC NC DRGND DRVDD CLKOUT NC DA11 DA10 DA9 DA8 DA7 DA6 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 DRGND SDOUT RGC Package (Top View) DRVDD 1 49 48 DB2 2 47 DA5 DB3 3 46 DA4 DB4 4 45 DA3 DB5 5 44 DA2 DB6 6 43 DA1 DB7 7 42 DA0 DB8 8 41 NC DB9 9 40 NC Thermal Pad (Connected to DRGND) DRVDD SDATA 14 35 CTRL1 SEN 15 34 AVDD AVDD AVDD 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 33 32 AGND CTRL2 AGND 36 INM_A 13 INP_A SCLK AGND CTRL3 AGND 37 CLKM 12 CLKP RESET AGND DRVDD CM 38 NC 11 AGND DB11 INM_B DRGND INP_B 39 AGND 10 AGND DB10 P0056-17 Figure 20. PIN ASSIGNMENTS (CMOS MODE) - ADS62P49/P48 and ADS62P29/P28 PIN NAME NO. NO. OF PINS I/O AVDD 16, 33, 34 3 I Analog power supply AGND 17, 18, 21, 24, 27, 28, 31, 32 8 I Analog ground CLKP, CLKM 25, 26 2 I Differential clock input INP_A, INM_A 29, 30 2 I Differential analog input, Channel A INP_B, INM_B 19, 20 2 I Differential analog input, Channel B 23 1 IO VCM DESCRIPTION Internal reference mode - Common-mode voltage output. External reference mode - Reference input. The voltage forced on this pin sets the internal references. RESET 12 1 I Serial interface RESET input. When using the serial interface mode, the user MUST initialize internal registers through hardware RESET by applying a high-going pulse on this pin or by using software reset option. Refer to SERIAL INTERFACE section. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 39 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com PIN ASSIGNMENTS (CMOS MODE) - ADS62P49/P48 and ADS62P29/P28 (continued) PIN NAME NO. NO. OF PINS I/O DESCRIPTION In parallel interface mode, the user has to tie RESET pin permanently high. (SCLK and SEN are used as parallel control pins in this mode. ) The pin has an internal 100 k pull-down resistor. SCLK 13 1 I This pin functions as serial interface clock input when RESET is low. It controls selection of internal or external reference when RESET is tied high. See Table 5 for detailed information. The pin has an internal 100-k pull-down resistor. SDATA 14 1 I Serial interface data input. The pin has an internal 100-k pull-down resistor. It has no function in parallel interface mode and can be tied to ground. SEN 15 1 I This pin functions as serial interface enable input when RESET is low. It controls selection of data format and interface type when RESET is tied high. See Table 6 for detailed information. The pin has an internal 100 k pull-up resistor to AVDD. SDOUT 64 1 O This pin functions as serial interface register readout, when the <SERIAL READOUT> bit is enabled. When <SERIAL READOUT> = 0, this pin forces logic LOW and is not 3-stated. CTRL1 35 1 I CTRL2 36 1 I CTRL3 37 1 I CLKOUT Digital control input pins. Together, they control various power down modes. The pin has an internal 100 k pull-down resistor. 57 1 O CMOS output clock Refer to Figure 19 and Figure 20 14 O Channel A ADC output data bits, CMOS levels 14 O Channel B ADC output data bits, CMOS levels DRVDD 1, 38, 48, 58 4 I Output buffer supply DRGND 39, 49, 59, PAD 4 I Output buffer ground DA0-DA13 DB0-DB13 NC 40 Refer to Figure 19 and Figure 20 Do not connect Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 TYPICAL CHARACTERISTICS - ADS62P49 All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) FFT FOR 20 MHz INPUT SIGNAL FFT FOR 170 MHz INPUT SIGNAL 0 0 SFDR = 89.5 dBc SINAD = 73.1 dBFS SNR = 73.2 dBFS THD = 88.1 dBc -40 SFDR = 75 dBc SINAD = 69.5 dBFS SNR = 70.7 dBFS THD = 74.5 dBc -20 Amplitude - dB Amplitude - dB -20 -60 -80 -40 -60 -80 -100 -100 -120 -120 -140 -140 0 25 50 75 100 f - Frequency - MHz 125 0 25 Figure 21. FFT FOR 300 MHz INPUT SIGNAL 100 125 G002 FFT FOR 2-TONE INPUT SIGNAL 0 SFDR = 76.5 dBc SINAD = 67.6 dBFS SNR = 68.6 dBFS THD = 73.6 dBc -20 -40 fIN1 = 185 MHz, -7 dBFS fIN2 = 190 MHz, -7 dBFS 2-Tone IMD = -85 dBFS SFDR = 90.2 dBc -20 Amplitude - dB Amplitude - dB 75 Figure 22. 0 -60 -80 -40 -60 -80 -100 -100 -120 -120 -140 -140 0 25 50 75 100 f - Frequency - MHz 125 0 25 50 75 100 125 f - Frequency - MHz G003 Figure 23. G004 Figure 24. FFT FOR 2-TONE INPUT SIGNAL SFDR vs INPUT FREQUENCY 0 92 fIN1 = 185 MHz, -36 dBFS fIN2 = 190 MHz, -36 dBFS 2-Tone IMD = -100 dBFS SFDR = 96.6 dBc -20 -40 88 84 SFDR - dBc Amplitude - dB 50 f - Frequency - MHz G001 -60 -80 80 76 -100 72 -120 68 -140 64 0 25 50 75 f - Frequency - MHz Figure 25. Copyright (c) 2009-2011, Texas Instruments Incorporated 100 125 G005 0 50 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz G006 Figure 26. Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 41 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS - ADS62P49 (continued) All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SFDR vs INPUT FREQUENCY ACROSS GAIN 92 73 90 72 88 71 86 SFDR - dBc 70 69 68 5 dB 80 78 76 65 74 64 72 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz 6 dB 82 66 50 2 dB 84 67 0 Input adjusted to get -1dBFS input 4 dB 0 dB 3 dB 1 dB 0 50 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz G007 Figure 27. SINAD vs INPUT FREQUENCY ACROSS GAIN PERFORMANCE vs INPUT AMPLITUDE, SINGLE TONE 72 120 100 70 79 SFDR - dBc, dBFS 1 dB 69 SINAD - dBFS 81 SFDR (dBFS) 0 dB 71 2 dB 68 3 dB 67 66 65 64 4 dB 80 77 SNR (dBFS) 60 75 40 73 20 5 dB 63 0 50 fIN = 60 MHz 0 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz G010 Figure 30. PERFORMANCE vs COMMON-MODE INPUT VOLTAGE 88 SFDR vs AVDD SUPPLY VOLTAGE 88 80 fIN = 60 MHz 87 SFDR 86 74 SNR SFDR - dBc 76 SNR - dBFS 78 84 82 69 0 Input Amplitude - dBFS G009 Figure 29. 86 71 SFDR (dBc) 6 dB 62 SFDR - dBc G008 Figure 28. SNR - dBFS SNR - dBFS SNR vs INPUT FREQUENCY 74 DRVDD = 1.8 V fIN = 60 MHz AVDD = 3.2 V AVDD = 3.15 V 85 AVDD = 3.3 V 84 83 82 81 80 80 72 79 78 1.35 1.40 1.45 1.50 1.55 1.60 1.65 VIC - Common-Mode Input Voltage - V Figure 31. 42 Submit Documentation Feedback 78 -40 70 1.70 G011 AVDD = 3.6 V AVDD = 3.5 V -20 0 20 AVDD = 3.4 V 40 TA - Free-Air Temperature - C 60 80 G012 Figure 32. Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 TYPICAL CHARACTERISTICS - ADS62P49 (continued) All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SNR vs AVDD SUPPLY VOLTAGE PERFORMANCE vs DRVDD SUPPLY VOLTAGE 86 AVDD = 3.2 V 85 AVDD = 3.4 V 71.75 AVDD = 3.3 V AVDD = 3.6 V 77 84 AVDD = 3.15 V 72.00 SFDR - dBc 71.50 76 83 82 74 81 73 SNR 71.25 DRVDD = 1.8 V fIN = 60 MHz 71.00 -40 -20 AVDD = 3.5 V 0 20 40 60 80 72 79 71 78 1.70 80 TA - Free-Air Temperature - C 1.74 1.78 1.82 PERFORMANCE vs INPUT CLOCK AMPLITUDE G014 PERFORMANCE vs INPUT CLOCK DUTY CYCLE 78 92 77 90 86 76 88 84 75 fIN = 60 MHz 78 fIN = 20 MHz 77 74 SNR SFDR - dBc SNR - dBFS SFDR SFDR - dBc 70 1.90 Figure 34. 90 82 1.86 DRVDD - Supply Voltage - V G013 Figure 33. 88 75 SFDR SFDR 76 86 75 84 74 80 73 78 72 80 72 76 71 78 71 70 2.5 76 74 0.0 0.5 1.0 1.5 2.0 Input Clock Amplitude - VPP 82 73 SNR SNR - dBFS SNR - dBFS 72.25 78 AVDD = 3.3 V fIN = 60 MHz SNR - dBFS 72.50 70 30 35 40 45 50 55 60 65 Input Clock Duty Cycle - % G015 Figure 35. G016 Figure 36. PERFORMANCE IN EXTERNAL REFERENCE MODE 86 80 fIN = 60 MHz External Reference Mode 84 78 82 76 80 74 SNR - dBFS SFDR - dBc SFDR SNR 78 76 1.30 72 1.35 1.40 1.45 1.50 1.55 VVCM - VCM Voltage - V 1.60 1.65 70 1.70 G017 Figure 37. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 43 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS - ADS62P48 All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) FFT FOR 20 MHz INPUT SIGNAL FFT FOR 170 MHz INPUT SIGNAL 0 0 SFDR = 84.1 dBc SINAD = 73.1 dBFS SNR = 73.4 dBFS THD = 83.5 dBc -40 SFDR = 77.4 dBc SINAD = 70.1 dBFS SNR = 70.9 dBFS THD = 77 dBc -20 Amplitude - dB Amplitude - dB -20 -60 -80 -40 -60 -80 -100 -100 -120 -120 -140 -140 0 20 40 60 80 100 f - Frequency - MHz 0 20 Figure 38. FFT FOR 300 MHz INPUT SIGNAL 100 G019 FFT FOR 2-TONE INPUT SIGNAL SFDR = 70.1 dBc SINAD = 66 dBFS SNR = 68.8 dBFS THD = 68.2 dBc -40 fIN1 = 185 MHz, -7 dBFS fIN2 = 190 MHz, -7 dBFS 2-Tone IMD = -84.7 dBFS SFDR = -97.2 dBc -20 Amplitude - dB Amplitude - dB 80 0 -20 -60 -80 -40 -60 -80 -100 -100 -120 -120 -140 -140 0 20 40 60 80 100 f - Frequency - MHz 0 20 40 60 80 f - Frequency - MHz G020 Figure 40. 100 G021 Figure 41. FFT FOR 2-TONE INPUT SIGNAL SFDR vs INPUT FREQUENCY 0 92 fIN1 = 185 MHz, -36 dBFS fIN2 = 190 MHz, -36 dBFS 2-Tone IMD = -107.1 dBFS SFDR = -98.8 dBc -20 -40 88 SFDR - dBc Amplitude - dB 60 Figure 39. 0 -60 -80 84 80 76 -100 72 -120 -140 68 0 20 40 60 f - Frequency - MHz Figure 42. 44 40 f - Frequency - MHz G018 Submit Documentation Feedback 80 100 0 G022 50 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz G023 Figure 43. Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 TYPICAL CHARACTERISTICS - ADS62P48 (continued) All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SNR vs INPUT FREQUENCY SFDR vs INPUT FREQUENCY ACROSS GAIN 74 96 Input adjusted to get -1dBFS input 73 92 72 5 dB 88 SFDR - dBc 70 69 68 4 dB 6 dB 84 80 67 76 66 0 dB 72 65 3 dB 68 0 50 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz 0 50 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz G024 Figure 44. SINAD vs INPUT FREQUENCY ACROSS GAIN PERFORMANCE vs INPUT AMPLITUDE, SINGLE TONE 120 SFDR (dBFS) 100 SFDR - dBc, dBFS 1 dB 72 2 dB 70 68 66 4 dB 50 77 SNR (dBFS) 60 75 40 73 20 5 dB 71 SFDR (dBc) 6 dB fIN = 60 MHz 62 0 79 80 3 dB 64 81 Input adjusted to get -1dBFS input 0 dB 74 SINAD - dBFS G025 Figure 45. 76 0 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz G027 Figure 47. PERFORMANCE vs COMMON-MODE INPUT VOLTAGE 88 SFDR vs AVDD SUPPLY VOLTAGE 90 80 fIN = 60 MHz 89 78 84 76 82 74 SNR 88 SFDR - dBc SFDR SNR - dBFS 86 69 0 Input Amplitude - dBFS G026 Figure 46. SFDR - dBc 1 dB 2 dB 64 SNR - dBFS SNR - dBFS 71 DRVDD = 1.8 V fIN = 20 MHz AVDD = 3.6 V 87 AVDD = 3.3 V 86 85 84 83 80 72 82 AVDD = 3.15 V 81 78 1.35 1.40 1.45 1.50 1.55 1.60 1.65 VIC - Common-Mode Input Voltage - V Figure 48. Copyright (c) 2009-2011, Texas Instruments Incorporated 70 1.70 80 -40 G028 -20 0 20 40 60 80 TA - Free-Air Temperature - C G029 Figure 49. Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 45 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS - ADS62P48 (continued) All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SNR vs AVDD SUPPLY VOLTAGE PERFORMANCE vs DRVDD SUPPLY VOLTAGE 86 DRVDD = 1.8 V fIN = 20 MHz 85 73.25 73.00 AVDD = 3.15 V AVDD = 3.6 V 72.75 72.50 -40 -20 0 20 77 SFDR 84 73.50 SFDR - dBc SNR - dBFS AVDD = 3.3 V 40 60 TA - Free-Air Temperature - C 75 82 81 73 80 72 79 71 1.74 1.78 1.82 PERFORMANCE vs INPUT CLOCK AMPLITUDE G031 SFDR 84 94 77 92 76 90 75 82 74 SNR 80 73 SFDR - dBc fIN = 60 MHz PERFORMANCE vs INPUT CLOCK DUTY CYCLE 78 SNR - dBFS SFDR - dBc 70 1.90 Figure 51. 90 86 1.86 DRVDD - Supply Voltage - V G030 Figure 50. 88 74 SNR 78 1.70 80 76 83 78 fIN = 20 MHz 77 76 SFDR 88 75 86 74 84 73 SNR - dBFS 73.75 78 AVDD = 3.3 V fIN = 20 MHz SNR - dBFS 74.00 SNR 78 72 82 72 76 71 80 71 70 2.5 78 74 0.0 0.5 1.0 1.5 2.0 Input Clock Amplitude - VPP 70 30 35 40 45 50 55 Input Clock Duty Cycle - % G032 Figure 52. 60 65 G033 Figure 53. PERFORMANCE IN EXTERNAL REFERENCE MODE 90 80 fIN = 60 MHz External Reference Mode 78 SFDR 86 76 84 74 SNR - dBFS SFDR - dBc 88 SNR 82 80 1.30 72 1.35 1.40 1.45 1.50 1.55 VVCM - VCM Voltage - V 1.60 1.65 70 1.70 G034 Figure 54. 46 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 TYPICAL CHARACTERISTICS - ADS62P29 All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) FFT FOR 20 MHz INPUT SIGNAL FFT FOR 170 MHz INPUT SIGNAL 0 0 SFDR = 87.8 dBc SINAD = 70.8 dBFS SNR = 70.9 dBFS THD = 84.9 dBc -40 SFDR = 74.8 dBc SINAD = 68.4 dBFS SNR = 69.3 dBFS THD = 74.6 dBc -20 Amplitude - dB Amplitude - dB -20 -60 -80 -40 -60 -80 -100 -100 -120 -120 -140 -140 0 25 50 75 100 f - Frequency - MHz 125 0 25 Figure 55. FFT FOR 300 MHz INPUT SIGNAL 100 125 G036 FFT FOR 2-TONE INPUT SIGNAL 0 SFDR = 76.4 dBc SINAD = 66.7 dBFS SNR = 67.5 dBFS THD = 73.5 dBc -20 -40 fIN1 = 185 MHz, -7 dBFS fIN2 = 190 MHz, -7 dBFS 2-Tone IMD = -85.3 dBFS SFDR = -90.4 dBc -20 Amplitude - dB Amplitude - dB 75 Figure 56. 0 -60 -80 -40 -60 -80 -100 -100 -120 -120 -140 -140 0 25 50 75 100 f - Frequency - MHz 125 0 25 50 75 100 125 f - Frequency - MHz G037 Figure 57. G038 Figure 58. FFT FOR 2-TONE INPUT SIGNAL SFDR vs INPUT FREQUENCY 0 92 fIN1 = 185 MHz, -36 dBFS fIN2 = 190 MHz, -36 dBFS 2-Tone IMD = -102.9 dBFS SFDR = -96.3 dBc -20 -40 88 SFDR - dBc Amplitude - dB 50 f - Frequency - MHz G035 -60 -80 84 80 76 -100 72 -120 -140 68 0 25 50 75 f - Frequency - MHz Figure 59. Copyright (c) 2009-2011, Texas Instruments Incorporated 100 125 G039 0 50 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz G040 Figure 60. Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 47 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS - ADS62P29 (continued) All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SFDR vs INPUT FREQUENCY ACROSS GAIN 92 71 90 70 88 69 86 SFDR - dBc 68 67 66 5 dB 80 78 76 63 74 62 72 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz 6 dB 82 64 50 2 dB 84 65 0 Input adjusted to get -1dBFS input 4 dB 3 dB 0 dB 1 dB 0 50 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz G041 Figure 61. SINAD vs INPUT FREQUENCY ACROSS GAIN PERFORMANCE vs INPUT AMPLITUDE, SINGLE TONE 72 120 SINAD - dBFS SFDR - dBc, dBFS 2 dB 69 SFDR (dBFS) 100 1 dB 70 85 Input adjusted to get -1dBFS input 0 dB 71 3 dB 68 67 66 65 80 70 40 65 SFDR (dBc) 20 60 6 dB 0 -70 62 0 50 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz fIN = 60 MHz -60 -50 -40 PERFORMANCE vs COMMON-MODE INPUT VOLTAGE 87 SFDR 86 82 72 SNR SFDR - dBc 74 SNR - dBFS 76 84 70 1.60 1.65 VIC - Common-Mode Input Voltage - V Figure 65. Submit Documentation Feedback DRVDD = 1.8 V fIN = 60 MHz AVDD = 3.2 V AVDD = 3.15 V 85 AVDD = 3.3 V 84 83 82 80 79 1.55 G044 81 80 1.50 55 0 SFDR vs AVDD SUPPLY VOLTAGE fIN = 60 MHz 1.45 -10 88 78 1.40 -20 Figure 64. 88 86 -30 Input Amplitude - dBFS G043 Figure 63. SFDR - dBc 75 SNR (dBFS) 60 5 dB 63 48 80 4 dB 64 78 1.35 G042 Figure 62. SNR - dBFS SNR - dBFS SNR vs INPUT FREQUENCY 72 68 1.70 78 -40 G045 AVDD = 3.6 V AVDD = 3.5 V -20 0 20 AVDD = 3.4 V 40 TA - Free-Air Temperature - C 60 80 G046 Figure 66. Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 TYPICAL CHARACTERISTICS - ADS62P29 (continued) All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SNR vs AVDD SUPPLY VOLTAGE PERFORMANCE vs DRVDD SUPPLY VOLTAGE 86 85 AVDD = 3.3 V 75 SFDR - dBc SNR - dBFS 84 70.00 AVDD = 3.2 V 69.75 AVDD = 3.6 V 69.50 DRVDD = 1.8 V fIN = 60 MHz 69.00 -40 -20 AVDD = 3.4 V 0 20 40 60 82 72 81 71 80 70 79 69 78 1.70 80 TA - Free-Air Temperature - C 1.74 1.78 1.82 PERFORMANCE vs INPUT CLOCK AMPLITUDE G048 PERFORMANCE vs INPUT CLOCK DUTY CYCLE 76 92 75 90 86 74 88 84 73 fIN = 60 MHz 76 fIN = 20 MHz 75 72 SNR 71 SFDR - dBc 82 SNR - dBFS SFDR SFDR - dBc 68 1.90 Figure 68. 90 80 1.86 DRVDD - Supply Voltage - V G047 Figure 67. 88 73 SFDR SNR AVDD = 3.5 V 69.25 74 83 SFDR 74 86 73 84 72 82 71 SNR 78 70 80 70 76 69 78 69 68 2.5 76 74 0.0 0.5 1.0 1.5 2.0 Input Clock Amplitude - VPP SNR - dBFS AVDD = 3.15 V 70.25 76 AVDD = 3.3 V fIN = 60 MHz SNR - dBFS 70.50 68 30 35 40 45 50 55 60 65 Input Clock Duty Cycle - % G049 Figure 69. G050 Figure 70. PERFORMANCE IN EXTERNAL REFERENCE MODE 86 78 fIN = 60 MHz External Reference Mode 84 76 82 74 80 72 SNR - dBFS SFDR - dBc SFDR SNR 78 76 1.30 70 1.35 1.40 1.45 1.50 1.55 VVCM - VCM Voltage - V 1.60 1.65 68 1.70 G051 Figure 71. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 49 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS - ADS62P28 All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) FFT FOR 20 MHz INPUT SIGNAL FFT FOR 170 MHz INPUT SIGNAL 0 0 SFDR = 84 dBc SINAD = 70.6 dBFS SNR = 70.8 dBFS THD = 83.4 dBc -40 SFDR = 77.6 dBc SINAD = 68.7 dBFS SNR = 69.2 dBFS THD = 77.2 dBc -20 Amplitude - dB Amplitude - dB -20 -60 -80 -40 -60 -80 -100 -100 -120 -120 -140 -140 0 20 40 60 80 100 f - Frequency - MHz 0 20 Figure 72. FFT FOR 300 MHz INPUT SIGNAL 100 G053 FFT FOR 2-TONE INPUT SIGNAL SFDR = 70.1 dBc SINAD = 65.4 dBFS SNR = 67.8 dBFS THD = 68.2 dBc -40 fIN1 = 185 MHz, -7 dBFS fIN2 = 190 MHz, -7 dBFS 2-Tone IMD = -84.8 dBFS SFDR = 97.5 dBc -20 Amplitude - dB Amplitude - dB 80 0 -20 -60 -80 -40 -60 -80 -100 -100 -120 -120 -140 -140 0 20 40 60 80 100 f - Frequency - MHz 0 20 40 60 80 f - Frequency - MHz G054 Figure 74. 100 G055 Figure 75. FFT FOR 2-TONE INPUT SIGNAL SFDR vs INPUT FREQUENCY 0 92 fIN1 = 185 MHz, -36 dBFS fIN2 = 190 MHz, -36 dBFS 2-Tone IMD = -106.3 dBFS SFDR = 98.4 dBc -20 -40 88 SFDR - dBc Amplitude - dB 60 Figure 73. 0 -60 -80 84 80 76 -100 72 -120 -140 68 0 20 40 60 f - Frequency - MHz Figure 76. 50 40 f - Frequency - MHz G052 Submit Documentation Feedback 80 100 0 G056 50 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz G057 Figure 77. Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 TYPICAL CHARACTERISTICS - ADS62P28 (continued) All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SNR vs INPUT FREQUENCY SFDR vs INPUT FREQUENCY ACROSS GAIN 72 96 71 93 90 70 69 68 67 4 dB 87 SFDR - dBc 6 dB 84 81 78 75 66 2 dB 72 65 0 dB 1 dB 69 64 66 0 50 0 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz 50 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz G058 Figure 78. SINAD vs INPUT FREQUENCY ACROSS GAIN PERFORMANCE vs INPUT AMPLITUDE, SINGLE TONE 120 SFDR (dBFS) 1 dB SINAD - dBFS 69 68 67 66 2 dB 65 100 80 80 75 SFDR - dBc, dBFS 70 60 4 dB 63 50 SFDR (dBc) 40 60 6 dB fIN = 60 MHz 0 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 100 150 200 250 300 350 400 450 500 fIN - Input Frequency - MHz PERFORMANCE vs COMMON-MODE INPUT VOLTAGE SFDR vs AVDD SUPPLY VOLTAGE 78 90 fIN = 60 MHz 89 SFDR 76 82 72 SNR SFDR - dBc 74 88 SNR - dBFS 84 DRVDD = 1.8 V fIN = 20 MHz AVDD = 3.6 V 87 86 85 84 83 80 70 82 AVDD = 3.3 V 81 1.45 1.50 1.55 G061 Figure 81. 88 1.40 55 0 Input Amplitude - dBFS G060 Figure 80. 86 65 20 5 dB 62 0 70 SNR (dBFS) 3 dB 64 85 Input adjusted to get -1dBFS input 0 dB 71 78 1.35 G059 Figure 79. 72 SFDR - dBc 3 dB SNR - dBFS SNR - dBFS Input adjusted to get -1dBFS input 5 dB 1.60 1.65 VIC - Common-Mode Input Voltage - V Figure 82. Copyright (c) 2009-2011, Texas Instruments Incorporated 68 1.70 80 -40 G062 AVDD = 3.15 V -20 0 20 40 60 80 TA - Free-Air Temperature - C G063 Figure 83. Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 51 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS - ADS62P28 (continued) All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SNR vs AVDD SUPPLY VOLTAGE PERFORMANCE vs DRVDD SUPPLY VOLTAGE 86 AVDD = 3.3 V 85 77 SFDR 84 70.50 AVDD = 3.15 V SFDR - dBc 70.75 SNR - dBFS 78 AVDD = 3.3 V fIN = 20 MHz AVDD = 3.6 V 76 83 75 82 74 81 73 80 70.25 SNR - dBFS 71.00 72 SNR 79 DRVDD = 1.8 V fIN = 20 MHz -20 0 20 40 60 80 TA - Free-Air Temperature - C 1.74 1.78 1.82 DRVDD - Supply Voltage - V G064 Figure 84. PERFORMANCE vs INPUT CLOCK AMPLITUDE fIN = 60 MHz PERFORMANCE vs INPUT CLOCK DUTY CYCLE 76 96 75 94 76 fIN = 20 MHz 75 SFDR 74 84 73 82 72 SNR 71 SFDR - dBc 86 SNR - dBFS SFDR - dBc SFDR 80 G065 Figure 85. 90 88 70 1.90 1.86 92 74 90 73 88 72 86 71 SNR 78 70 84 70 76 69 82 69 68 2.5 80 74 0.0 0.5 1.0 1.5 2.0 Input Clock Amplitude - VPP SNR - dBFS 70.00 -40 71 78 1.70 68 30 35 40 45 50 55 Input Clock Duty Cycle - % G066 Figure 86. 60 65 G067 Figure 87. PERFORMANCE IN EXTERNAL REFERENCE MODE 90 78 fIN = 60 MHz External Reference Mode SFDR 76 86 74 84 72 SNR - dBFS SFDR - dBc 88 SNR 82 80 1.30 70 1.35 1.40 1.45 1.50 1.55 VVCM - VCM Voltage - V 1.60 1.65 68 1.70 G068 Figure 88. 52 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 TYPICAL CHARACTERISTICS - COMMON PLOTS All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) CROSSTALK vs FREQUENCY CMRR vs FREQUENCY -76 -30 Signal amplitude on aggressor channel at -0.3 dBFS -35 -80 CMRR - dB Crosstalk - dB -40 -84 -88 -92 -45 -50 -55 -60 -96 -65 -100 -70 0 50 100 150 200 250 300 20 70 120 220 270 G070 G069 Figure 89. Figure 90. POWER DISSIPATION vs SAMPLING FREQUENCY DRVDD CURRENT vs SAMPLING FREQUENCY 1.4 140 fIN = 2.5 MHz fIN = 2.5 MHz 120 1.2 DRVDD Current - mA PD - Power Dissipation - W 170 f - Frequency - MHz f - Frequency - MHz LVDS 1.0 0.8 CMOS LVDS 100 80 60 CMOS, No Load 40 CMOS, 15 pF Load 0.6 20 0.4 0 25 50 75 100 125 150 175 200 fS - Sampling Frequency - MSPS Figure 91. Copyright (c) 2009-2011, Texas Instruments Incorporated 225 250 G072 25 50 75 100 125 150 175 200 225 250 fS - Sampling Frequency - MSPS G073 Figure 92. Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 53 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS - ADS62P49/48/29/28 All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SFDR CONTOUR, 0 dB GAIN, UP TO 500 MHz 250 76 240 80 76 76 76 fS - Sampling Frequency - MSPS 220 84 200 80 76 76 180 84 72 80 160 76 88 140 80 76 72 76 120 84 100 72 92 88 80 20 76 80 50 76 100 200 150 300 250 400 350 450 500 fIN - Input Frequency - MHz 70 75 85 80 90 95 SFDR - dBc M0049-17 Figure 93. SFDR CONTOUR, 6 dB GAIN, UP TO 800 MHz 250 240 85 75 79 82 88 fS - Sampling Frequency - MSPS 220 67 71 63 79 200 85 85 180 82 75 160 79 88 67 71 79 63 140 88 82 120 85 88 82 79 79 91 80 20 75 79 88 100 100 300 200 400 67 71 500 600 700 800 fIN - Input Frequency - MHz 60 65 70 75 80 85 SFDR - dBc 90 M0049-18 Figure 94. 54 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 TYPICAL CHARACTERISTICS - ADS62P49/48 All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SNR CONTOUR, 0 dB GAIN, UP TO 500 MHz 250 69 240 72 73 71 220 fS - Sampling Frequency - MSPS 66 67 70 68 65 200 69 70 180 67 66 71 72 160 73 68 140 69 70 120 71 66 67 72 100 73 80 20 50 65 68 74 100 200 150 300 250 400 350 450 500 fIN - Input Frequency - MHz 64 66 70 68 72 74 SNR - dBFS M0048-26 Figure 95. SNR CONTOUR, 6 dB GAIN, UP TO 800 MHz 250 240 64 64.5 65.5 66 66.5 67 63.5 63 62.5 62 61.5 61 fS - Sampling Frequency - MSPS 220 65 200 61.5 180 67 66.5 65.5 66 65 64.5 64 63.5 62.5 63 62 160 140 120 68 66.5 67 66 65.5 65 64.5 64 63.5 63 62.5 62 61.5 100 80 20 100 300 200 400 500 600 700 800 fIN - Input Frequency - MHz 60 61 62 63 64 65 66 67 SNR - dBFS 68 69 M0048-27 Figure 96. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 55 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS - ADS62P29/28 All plots are at 25C, AVDD = 3.3 V, DRVDD = 1.8 V, maximum rated sampling frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, -1 dBFS differential analog input, internal reference mode, 0 dB gain, LVDS output interface, 32K point FFT (unless otherwise noted) SNR CONTOUR, 0 dB GAIN, UP TO 500 MHz 250 240 66 69 fS - Sampling Frequency - MSPS 220 68 70 65 65.5 66.5 64 67 64.5 200 66 180 65.5 68 160 65 66.5 67 69 70 71 140 120 67 69 100 71 80 20 68 70 50 65 65.5 66 66.5 100 64.5 200 150 300 250 400 350 450 500 fIN - Input Frequency - MHz 64 66 65 68 67 69 70 71 72 SNR - dBFS M0048-28 Figure 97. SNR CONTOUR, 6 dB GAIN, UP TO 800 MHz 250 240 65.5 66.5 66 64.5 64 65 fS - Sampling Frequency - MSPS 63 63.5 220 62 62.5 61.5 61 200 180 66 66.5 64.5 65 65.5 64 63.5 63 62.5 61.5 62 160 140 66.5 120 66 65.5 100 80 20 65 64.5 67.5 200 100 300 63.5 64 400 63 500 62.5 61.5 62 600 800 700 fIN - Input Frequency - MHz 60 61 62 63 64 65 66 67 SNR - dBFS 68 M0048-29 Figure 98. 56 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 APPLICATION INFORMATION THEORY OF OPERATION The ADS62Px9/x8 is a family of high performance and low power dual channel 14-bit/12-bit A/D converters with sampling rates up to 250 MSPS. At every falling edge of the input clock, the analog input signal of each channel is sampled simultaneously. The sampled signal in each channel is converted by a pipeline of low resolution stages. In each stage, the sampled and held signal is converted by a high speed, low resolution flash sub-ADC. The difference (residue) between the stage input and its quantized equivalent is gained and propagates to the next stage. At every clock, each succeeding stage resolves the sampled input with greater accuracy. The digital outputs from all stages are combined in a digital correction logic block and processed digitally to create the final code, after a data latency of 22 clock cycles. The digital output is available as either DDR LVDS or parallel CMOS and coded in either straight offset binary or binary 2s complement format. The dynamic offset of the first stage sub-ADC limits the maximum analog input frequency to about 500MHz (with 2V pp amplitude) and about 800MHz (with 1V pp amplitude). ANALOG INPUT The analog input consists of a switched-capacitor based differential sample and hold architecture. This differential topology results in very good AC performance even for high input frequencies at high sampling rates. The INP and INM pins have to be externally biased around a common-mode voltage of 1.5V, available on VCM pin. For a full-scale differential input, each input pin INP, INM has to swing symmetrically between VCM + 0.5V and VCM - 0.5V, resulting in a 2Vpp differential input swing. The input sampling circuit has a high 3-dB bandwidth that extends up to 700 MHz (measured from the input pins to the sampled voltage). Sampling Switch Lpkg 1 nH Sampling Capacitor RCR Filter 10 W INP Cbond 1 pF 100 W Resr 200 W Cpar2 0.5 pF Ron 15 W Csamp 2 pF 3 pF Cpar1 0.25 pF Ron 10 W 3 pF 100 W Lpkg 1 nH Csamp 2 pF Ron 15 W 10 W INM Cbond 1 pF Sampling Capacitor Cpar2 0.5 pF Resr 200 W Sampling Switch S0322-03 Figure 99. Analog Input Circuit Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 57 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com Drive Circuit Requirements For optimum performance, the analog inputs must be driven differentially. This improves the common-mode noise immunity and even order harmonic rejection. A 5- to 15- resistor in series with each input pin is recommended to damp out ringing caused by package parasitic. SFDR performance can be limited due to several reasons - the effect of sampling glitches (described below), non-linearity of the sampling circuit and non-linearity of the quantizer that follows the sampling circuit. Depending on the input frequency, sample rate and input amplitude, one of these plays a dominant part in limiting performance. At very high input frequencies (> about 300 MHz), SFDR is determined largely by the device's sampling circuit non-linearity. At low input amplitudes, the quantizer non-linearity usually limits performance. Glitches are caused by the opening and closing of the sampling switches. The driving circuit should present a low source impedance to absorb these glitches. Otherwise, this could limit performance, mainly at low input frequencies (up to about 200 MHz). It is also necessary to present low impedance (< 50 ) for the common mode switching currents. This can be achieved by using two resistors from each input terminated to the common mode voltage (VCM). The device includes an internal R-C filter from each input to ground. The purpose of this filter is to absorb the sampling glitches inside the device itself. The cut-off frequency of the R-C filter involves a trade-off. A lower cut-off frequency (larger C) absorbs glitches better, but it reduces the input bandwidth. On the other hand, with a higher cut-off frequency (smaller C), bandwidth support is maximized. But now, the sampling glitches need to be supplied by the external drive circuit. This has limitations due to the presence of the package bond-wire inductance. In ADS62PXX, the R-C component values have been optimized while supporting high input bandwidth (up to 700 MHz). However, in applications with input frequencies up to 200-300MHz, the filtering of the glitches can be improved further using an external R-C-R filter (as shown in Figure 102 and Figure 103). In addition to the above, the drive circuit may have to be designed to provide a low insertion loss over the desired frequency range and matched impedance to the source. While doing this, the ADC input impedance must be considered. Figure 100 and Figure 101 show the impedance (Zin = Rin || Cin) looking into the ADC input pins. 100 R - Resistance - kW 10 1 0.10 0.01 0 100 200 300 400 500 600 700 800 900 1000 f - Frequency - MHz Figure 100. ADC Analog Input Resistance (Rin) Across Frequency 58 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 4.5 C - Capacitance - pF 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0 100 200 300 400 500 600 700 800 900 1000 f - Frequency - MHz G075 Figure 101. ADC Analog Input Capacitance (Cin) Across Frequency Driving Circuit Two example driving circuit configurations are shown in Figure 102 and Figure 103 one optimized for low bandwidth (low input frequencies) and the other one for high bandwidth to support higher input frequencies. In Figure 102, an external R-C-R filter using 22 pF has been used. Together with the series inductor (39 nH), this combination forms a filter and absorbs the sampling glitches. Due to the large capacitor (22 pF) in the R-C-R and the 15- resistors in series with each input pin, the drive circuit has low bandwidth and supports low input frequencies (< 100MHz). To support higher input frequencies (up to about 300 MHz, see Figure 103), the capacitance used in the R-C-R is reduced to 3.3 pF and the series inductors are shorted out. Together with the lower series resistors (5 ), this drive circuit provides high bandwidth and supports high input frequencies. Transformers such as ADT1-1WT or ETC1-1-13 can be used up to 300MHz. Without the external R-C-R filter, the drive circuit has very high bandwidth and can support very high input frequencies (> 300MHz). For example, a transmission line transformer such as ADTL2-18 can be used (see Figure 104). Note that both the drive circuits have been terminated by 50 near the ADC side. The termination is accomplished by a 25- resistor from each input to the 1.5-V common-mode (VCM) from the device. This allows the analog inputs to be biased around the required common-mode voltage. The mismatch in the transformer parasitic capacitance (between the windings) results in degraded even-order harmonic performance. Connecting two identical RF transformers back to back helps minimize this mismatch and good performance is obtained for high frequency input signals. An additional termination resistor pair may be required between the two transformers as shown in the figures. The center point of this termination is connected to ground to improve the balance between the P and M side. The values of the terminations between the transformers and on the secondary side have to be chosen to get an effective 50 (in the case of 50- source impedance). Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 59 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com 39 nH 0.1 mF 0.1 mF 15 W INP 50 W 50 W 25 W 0.1 mF 22 pF 50 W 25 W 50 W INM 1:1 1:1 15 W 0.1 mF VCM 39 nH S0396-01 Figure 102. Drive Circuit With Low Bandwidth (for low input frequencies) 0.1 mF 0.1 mF 5W INP 50 W 25 W 0.1 mF 3.3 pF 50 W 25 W INM 1:1 1:1 5W 0.1 mF VCM S0397-01 Figure 103. Drive Circuit With High Bandwidth (for high input frequencies) 0.1mF INP 0.1mF 25 W 25 W T1 T2 INM 0.1mF VCM Figure 104. Drive Circuit with Very High Bandwidth (> 300 MHz) All these examples show 1:1 transformers being used with a 50- source. As explained in the "Drive Circuit Requirements", this helps to present a low source impedance to absorb the sampling glitches. With a 1:4 transformer, the source impedance will be 200 ohms. The higher impedance can lead to degradation in performance, compared to the case with 1:1 transformers. 60 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 For applications where only a band of frequencies are used, the drive circuit can be tuned to present a low impedance for the sampling glitches. Figure 105shows an example with 1:4 transformer, tuned for a band around 150 MHz. 5W INP 0.1mF 25 W 100 W Differential input signal 72 nH 15 pF 100 W 25 W INM 1:4 5W VCM Figure 105. Drive Circuit with 1:4 Transformer Input Common-Mode To ensure a low-noise common-mode reference, the VCM pin is filtered with a 0.1mF low-inductance capacitor connected to ground. The VCM pin is designed to directly drive the ADC inputs. The input stage of the ADC sinks a common-mode current in the order of 3.6mA / MSPS (about 900mA at 250 MSPS). REFERENCE The ADS62Px9/x8 has built-in internal references REFP and REFM, requiring no external components. Design schemes are used to linearize the converter load seen by the references; this and the on-chip integration of the requisite reference capacitors eliminates the need for external decoupling. The full-scale input range of the converter can be controlled in the external reference mode as explained below. The internal or external reference modes can be selected by programming the serial interface register bit <REF>. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 61 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com INTREF Internal Reference VCM INTREF EXTREF REFM REFP S0165-09 Figure 106. Reference Section Internal Reference When the device is in internal reference mode, the REFP and REFM voltages are generated internally. Common-mode voltage (1.5V nominal) is output on VCM pin, which can be used to externally bias the analog input pins. External Reference When the device is in external reference mode, the VCM acts as a reference input pin. The voltage forced on the VCM pin is buffered and gained by 1.33 internally, generating the REFP and REFM voltages. The differential input voltage corresponding to full-scale is given by the following: Full-scale differential input pp = (Voltage forced on VCM) x 1.33 In this mode, the 1.5V common-mode voltage to bias the input pins has to be generated externally. CLOCK INPUT The ADS62Px9/x8 clock inputs can be driven differentially (sine, LVPECL or LVDS) or single-ended (LVCMOS), with little or no difference in performance between them. The common-mode voltage of the clock inputs is set to VCM using internal 5-k resistors as shown in Figure 107. This allows using transformer-coupled drive circuits for sine wave clock or ac-coupling for LVPECL, LVDS clock sources (Figure 108, Figure 109, and Figure 110). 62 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 Clock Buffer Lpkg 2 nH 20 W CLKP Cbond 1 pF Ceq Ceq 5 kW Resr 100 W VCM 2 pF 5 kW Lpkg 2 nH 20 W CLKM Cbond 1 pF Resr 100 W Ceq 1 to 3 pF, Equivalent Input Capacitance of Clock Buffer S0275-04 Figure 107. Internal Clock Buffer Single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM (pin 11) connected to ground with a 0.1-mF capacitor, as shown in Figure 111. For best performance, the clock inputs have to be driven differentially, reducing susceptibility to common-mode noise. For high input frequency sampling, it is recommended to use a clock source with very low jitter. Bandpass filtering of the clock source can help reduce the effect of jitter. There is no change in performance with a non-50% duty cycle clock input. 0.1mF 0.1mF Zo CLKP CLKP Differential Sine-wave Clock Input Typical LVDS Clock Input RT 100W Zo CLKM CLKM 0.1mF 0.1mF RT = termination resistor if necessary Figure 108. Differential Sine-Wave Clock Driving Circuit Copyright (c) 2009-2011, Texas Instruments Incorporated Figure 109. Typical LVDS Clock Driving Circuit Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 63 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com 0.1mF Zo 0.1mF CLKP Typical LVPECL Clock Input 150W CLKP CMOS Clock Input 100W VCM Zo CLKM CLKM 0.1mF 0.1mF 150W Figure 110. Typical LVPECL Clock Driving Circuit Figure 111. Typical LVCMOS Clock Driving Circuit GAIN PROGRAMMABILITY The ADS62Px9/x8 includes gain settings that can be used to get improved SFDR performance (compared to no gain). The gain is programmable from 0dB to 6dB (in 0.5 dB steps). For each gain setting, the analog input full-scale range scales proportionally, as shown in Table 9. The SFDR improvement is achieved at the expense of SNR; for each 1dB gain step, the SNR degrades about 1dB. The SNR degradation is less at high input frequencies. As a result, the gain is very useful at high input frequencies as the SFDR improvement is significant with marginal degradation in SNR. So, the gain can be used to trade-off between SFDR and SNR. Note that the default gain after reset is 0dB. Table 9. Full-Scale Range Across Gains GAIN, dB TYPE 0 Default after reset FULL-SCALE, Vpp 2V 1 1.78 2 1.59 3 4 Fine, programmable 1.42 1.26 5 1.12 6 1.00 OFFSET CORRECTION The ADS62Px9/x8 has an internal offset correction algorithm that estimates and corrects dc offset up to 10mV. The correction can be enabled using the serial register bit <ENABLE OFFSET CORRECTION>. Once enabled, the algorithm estimates the channel offset and applies the correction every clock cycle. The time constant of the correction loop is a function of the sampling clock frequency. The time constant can be controlled using register bits <OFFSET CORR TIME CONSTANT> as described in Table 10. After the offset is estimated, the correction can be frozen by setting <ENABLE OFFSET CORRECTION> back to 0. Once frozen, the last estimated value is used for offset correction every clock cycle. The correction does not affect the phase of the signal. Note that offset correction is disabled by default after reset. Figure 112 shows the time response of the offset correction algorithm, after it is enabled. Table 10. Time Constant of Offset Correction Algorithm (1) 64 <OFFSET CORR TIME CONSTANT> D3-D0 TIME CONSTANT (TCCLK), NUMBER OF CLOCK CYCLES TIME CONSTANT, sec (=TCCLK x 1/Fs) (1) 0000 256 k 1 ms 0001 512 k 2 ms Sampling frequency, Fs = 250 MSPS Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 Table 10. Time Constant of Offset Correction Algorithm (continued) <OFFSET CORR TIME CONSTANT> D3-D0 TIME CONSTANT (TCCLK), NUMBER OF CLOCK CYCLES TIME CONSTANT, sec (=TCCLK x 1/Fs) (1) 0010 1M 4 ms 0011 2M 8 ms 0100 4M 17 ms 0101 8M 33 ms 0110 16 M 67 ms 0111 32 M 134 ms 1000 64 M 268 ms 1001 128 M 536 ms 1010 256 M 1.1 s 1011 512 M 2.2 s 1100 RESERVED 1101 RESERVED 1110 RESERVED 1111 RESERVED 8200 Offset Correction Enabled 8195 Output Code - LSB 8190 8185 Output Data With Offset Corrected 8180 Offset Correction Disabled 8175 8170 Output Data With 34 LSB Offset 8165 8160 8155 -2 0 2 4 6 8 10 12 14 16 t - Time - ms 18 20 G076 Figure 112. Time Response of Offset Correction POWER DOWN The ADS62Px9/x8 has two power down modes - global power down and individual channel standby. These can be set using either the serial register bits or using the control pins CTRL1 to CTRL3. CONFIGURE USING POWER DOWN MODES SERIAL INTERFACE PARALLEL CONTROL PINS Normal operation <POWER DOWN MODES> = 0000 Output buffer disabled for channel B <POWER DOWN MODES> = 1001 Not Available - Output buffer disabled for channel A <POWER DOWN MODES> = 1010 Not Available - Output buffer disabled for channel A and B <POWER DOWN MODES> = 1011 Global power down <POWER DOWN MODES> = 1100 high low low Slow (30 ms) Channel B standby <POWER DOWN MODES> = 1101 high low high Fast (1 ms) Channel A standby <POWER DOWN MODES> = 1110 high high low Fast (1 ms) Copyright (c) 2009-2011, Texas Instruments Incorporated low low low WAKE-UP TIME Not Available - - Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 65 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com CONFIGURE USING POWER DOWN MODES SERIAL INTERFACE Multiplexed (MUX) mode - Output data of channel A <POWER DOWN MODES> = 1111 and B is multiplexed and available on DA13 to DA0 pins. (1) (1) PARALLEL CONTROL PINS high high high WAKE-UP TIME - Low Speed mode has to be enabled for Multiplexed Output mode (MUX mode). Therefore, MUX mode works with serial interface configuration only and is not supported with parallel configuration. Global Power Down In this mode, the entire chip including both the A/D converters, internal reference and the output buffers are powered down resulting in reduced total power dissipation of about 45 mW. The output buffers are in high impedance state. The wake-up time from the global power down to data becoming valid in normal mode is typically 30ms. Channel Standby Here, each channel's A/D converter can be powered down. The internal references are active, resulting in quick wake-up time of 1 ms. The total power dissipation in standby is about 475 mW. Input Clock Stop In addition to the above, the converter enters a low-power mode when the input clock frequency falls below 1 MSPS. The power dissipation is about 275 mW. POWER SUPPLY SEQUENCE During power-up, the AVDD and DRVDD supplies can come up in any sequence. The two supplies are separated in the device. Externally, they can be driven from separate supplies or from a single supply. DIGITAL OUTPUT INFORMATION The ADS62Px9/x8 provides 14-bit/12-bit data and an output clock synchronized with the data. Output Interface Two output interface options are available - Double Data Rate (DDR) LVDS and parallel CMOS. They can be selected using the serial interface register bit <LVDS_CMOS> or using DFS pin in parallel configuration mode. DDR LVDS Outputs In this mode, the data bits and clock are output using LVDS (Low Voltage Differential Signal) levels. Two data bits are multiplexed and output on each LVDS differential pair. 66 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 Pins CLKOUTP Output Clock CLKOUTM DB0_P Data Bits D0, D1 DB0_M DB2_P Data Bits D2, D3 DB2_M DB4_P Data Bits D4, D5 DB4_M DB6_P 14-Bit ADC Channel-B Data Data Bits D6, D7 DB6_M DB8_P Data Bits D8, D9 DB8_M DB10_P Data Bits D10, D11 DB10_M DB12_P Data Bits D12, D13 DB12_M LVDS Buffers ADS62P4x S0398-01 Figure 113. LVDS Outputs Even data bits D0, D2, D4... are output at the rising edge of CLKOUTP and the odd data bits D1, D3, D5... are output at the falling edge of CLKOUTP. Both the rising and falling edges of CLKOUTP have to be used to capture all the data bits (see Figure 114). Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 67 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com CLKOUTM CLKOUTP DA0, DB0 D0 D1 D0 D1 DA2, DB2 D2 D3 D2 D3 DA4, DB4 D4 D5 D4 D5 DA6, DB6 D6 D7 D6 D7 DA8, DB8 D8 D9 D8 D9 DA10, DB10 D10 D11 D10 D11 DA12, DB12 D12 D13 D12 D13 Sample N Sample N + 1 T0110-05 Figure 114. DDR LVDS Interface LVDS Buffer The equivalent circuit of each LVDS output buffer is shown in Figure 115. The buffer is designed to present an output impedance of 100 (Rout). The differential outputs can be terminated at the receive end by a 100- termination. The buffer output impedance behaves like a source-side series termination. By absorbing reflections from the receiver end, it helps to improve signal integrity. Note that this internal termination cannot be disabled and its value cannot be changed. 68 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 + - Low 0.35 V High ADS62P28/29/48/49 OUTP + - -0.35 V + - High 1.2 V Low External 100-W Load Rout OUTM Switch impedance is nominally 50 W (10%) When the High switches are closed, OUTP = 1.375 V, OUTM = 1.025 V When the Low switches are closed, OUTP = 1.025 V, OUTM = 1.375 V When the High (or Low) switches are closed, Rout = 100 W S0374-03 Figure 115. LVDS Buffer Equivalent Circuit Parallel CMOS Interface In CMOS mode, each data bit is output on a separate pin as a CMOS voltage level, every clock cycle. This mode is recommended only up to 210 MSPS, beyond which the CMOS data outputs do not have sufficient time to settle to valid logic levels. For sampling frequencies up to 150 MSPS, the rising edge of the output clock CLKOUT can be used to latch data in the receiver. The setup and hold timings of the output data with respect to CLKOUT are specified in the timing specification table up to 150 MSPS. For sampling frequencies above 150 MSPS, it is recommended to use an external clock to capture data. The delay from input clock to output data and the data valid times are specified up to 210 MSPS. These timings can be used to delay the input clock appropriately and use it to capture the data. When using the CMOS interface, it is important to minimize the load capacitance seen by data and clock output pins by using short traces on the board. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 69 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com Pins DB0 DB1 DB2 * * * * * * 14-Bit ADC Channel-B Data DB11 DB12 DB13 SDOUT CLKOUT DA0 DA1 DA2 * * * * * * 14-Bit ADC Channel-A Data DA11 DA12 DA13 ADS62P49/48/29/28 LVDS Buffers S0399-01 Figure 116. CMOS Outputs 70 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 CMOS Interface Power Dissipation With CMOS outputs, the DRVDD current scales with the sampling frequency and the load capacitance on every output pin. The maximum DRVDD current occurs when each output bit toggles between 0 and 1 every clock cycle. In actual applications, this condition is unlikely to occur. The actual DRVDD current would be determined by the average number of output bits switching, which is a function of the sampling frequency and the nature of the analog input signal. Digital current due to CMOS output switching = CL x DRVDD x (N x FAVG), where CL = load capacitance, N x FAVG = average number of output bits switching. Figure 92 shows the current with various load capacitances across sampling frequencies at 2.5-MHz analog input frequency Multiplexed Output Mode (only with CMOS interface) In this mode, the digital outputs of both channels are multiplexed and output on a single bus (DA0-DA13 pins). Channel B data bits are output at the rising edge of CLKOUT, and channel A data bits are output at the falling edge of CLKOUT. The channel B output data pins (DB0-DB13) are 3-stated (see Figure 117 for details). Since the output data rate on the DA bus is effectively doubled, this mode is recommended only for low sampling frequencies (<65MSPS). Low Speed mode has to be enabled for Multiplexed Output Mode (MUX mode). Therefore, MUX mode works with serial interface configuration only and is not supported with parallel configuration. This mode can be enabled using register bits <POWER DOWN MODES> or using the parallel pins CTRL1-3. CLKOUT DA0 DB0 DA0 DB0 DA0 DA1 DB1 DA1 DB1 DA1 DA2 DB2 DA2 DB2 DA2 DB13 DA13 DB13 DA13 * * * * * * DA13 Sample N Sample N+1 T0297-03 NOTES: 1. Both channel outputs are output on the channel A output data lines. 2. Channel A outputs are output on the falling edges whereas channel B outputs are output on the rising edges of the output clock. Figure 117. Multiplexed Output Mode Timing Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 71 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com Output Data Format Two output data formats are supported - 2s complement and offset binary. They can be selected using the serial interface register bit <DATA FORMAT> or controlling the DFS pin in parallel configuration mode. In the event of an input voltage overdrive, the digital outputs go to the appropriate full scale level. For a positive overdrive, the output code is 0x3FFF in offset binary output format, and 0x1FFF in 2s complement output format. For a negative input overdrive, the output code is 0x0000 in offset binary output format and 0x2000 in 2s complement output format. BOARD DESIGN CONSIDERATIONS Grounding A single ground plane is sufficient to give good performance, provided the analog, digital, and clock sections of the board are cleanly partitioned. See the EVM User Guide (SLAU237) for details on layout and grounding. Supply Decoupling As ADS62Px9/x8 already includes internal decoupling, minimal external decoupling can be used without loss in performance. Note that decoupling capacitors can help filter external power supply noise, so the optimum number of capacitors would depend on the actual application. The decoupling capacitors should be placed very close to the converter supply pins. Exposed Pad In addition to providing a path for heat dissipation, the pad is also electrically connected to digital ground internally. So, it is necessary to solder the exposed pad to the ground plane for best thermal and electrical performance. For detailed information, see application notes QFN Layout Guidelines (SLOA122) and QFN/SON PCB Attachment (SLUA271). 72 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 DEFINITION OF SPECIFICATIONS Analog Bandwidth - The analog input frequency at which the power of the fundamental is reduced by 3 dB with respect to the low frequency value. Aperture Delay - The delay in time between the rising edge of the input sampling clock and the actual time at which the sampling occurs. This delay will be different across channels. The maximum variation is specified as aperture delay variation (channel-channel). Aperture Uncertainty (Jitter) - The sample-to-sample variation in aperture delay. Clock Pulse Width/Duty Cycle - The duty cycle of a clock signal is the ratio of the time the clock signal remains at a logic high (clock pulse width) to the period of the clock signal. Duty cycle is typically expressed as a percentage. A perfect differential sine-wave clock results in a 50% duty cycle. Maximum Conversion Rate - The maximum sampling rate at which certified operation is given. All parametric testing is performed at this sampling rate unless otherwise noted. Minimum Conversion Rate - The minimum sampling rate at which the ADC functions. Differential Nonlinearity (DNL) - An ideal ADC exhibits code transitions at analog input values spaced exactly 1 LSB apart. The DNL is the deviation of any single step from this ideal value, measured in units of LSBs. Integral Nonlinearity (INL) - The INL is the deviation of the ADC's transfer function from a best fit line determined by a least squares curve fit of that transfer function, measured in units of LSBs. Gain Error - Gain error is the deviation of the ADC's actual input full-scale range from its ideal value. The gain error is given as a percentage of the ideal input full-scale range. Gain error has two components: error due to reference inaccuracy and error due to the channel. Both these errors are specified independently as EGREF and EGCHAN. To a first order approximation, the total gain error will be ETOTAL ~ EGREF + EGCHAN. For example, if ETOTAL = 0.5%, the full-scale input varies from (1-0.5/100) x FSideal to (1 + 0.5/100) x FSideal. Offset Error - The offset error is the difference, given in number of LSBs, between the ADC's actual average idle channel output code and the ideal average idle channel output code. This quantity is often mapped into mV. Temperature Drift - The temperature drift coefficient (with respect to gain error and offset error) specifies the change per degree Celsius of the parameter from TMIN to TMAX. It is calculated by dividing the maximum deviation of the parameter across the TMIN to TMAX range by the difference TMAX-TMIN. Signal-to-Noise Ratio - SNR is the ratio of the power of the fundamental (PS) to the noise floor power (PN), excluding the power at DC and the first nine harmonics. SNR = 10Log10 PS PN (1) SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter's full-scale range. Signal-to-Noise and Distortion (SINAD) - SINAD is the ratio of the power of the fundamental (PS) to the power of all the other spectral components including noise (PN) and distortion (PD), but excluding dc. SINAD = 10Log10 PS PN + PD (2) SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter's full-scale range. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 73 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com Effective Number of Bits (ENOB) - The ENOB is a measure of the converter performance as compared to the theoretical limit based on quantization noise. ENOB = SINAD - 1.76 6.02 (3) Total Harmonic Distortion (THD) - THD is the ratio of the power of the fundamental (PS) to the power of the first nine harmonics (PD). THD = 10Log10 PS PN (4) THD is typically given in units of dBc (dB to carrier). Spurious-Free Dynamic Range (SFDR) - The ratio of the power of the fundamental to the highest other spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier). Two-Tone Intermodulation Distortion - IMD3 is the ratio of the power of the fundamental (at frequencies f1 and f2) to the power of the worst spectral component at either frequency 2f1-f2 or 2f2-f1. IMD3 is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter's full-scale range. DC Power Supply Rejection Ratio (DC PSRR) - The DC PSSR is the ratio of the change in offset error to a change in analog supply voltage. The DC PSRR is typically given in units of mV/V. AC Power Supply Rejection Ratio (AC PSRR) - AC PSRR is the measure of rejection of variations in the supply voltage by the ADC. If VSUP is the change in supply voltage and Vout is the resultant change of the ADC output code (referred to the input), then DVOUT PSRR = 20Log 10 (Expressed in dBc) DVSUP (5) Voltage Overload Recovery - The number of clock cycles taken to recover to less than 1% error after an overload on the analog inputs. This is tested by separately applying a sine wave signal with 6dB positive and negative overload. The deviation of the first few samples after the overload (from their expected values) is noted. Common Mode Rejection Ratio (CMRR) - CMRR is the measure of rejection of variation in the analog input common-mode by the ADC. If Vcm_in is the change in the common-mode voltage of the input pins and VOUT is the resultant change of the ADC output code (referred to the input), then DVOUT CMRR = 20Log10 (Expressed in dBc) DVCM (6) Cross-Talk (only for multi-channel ADC)- This is a measure of the internal coupling of a signal from adjacent channel into the channel of interest. It is specified separately for coupling from the immediate neighboring channel (near-channel) and for coupling from channel across the package (far-channel). It is usually measured by applying a full-scale signal in the adjacent channel. Cross-talk is the ratio of the power of the coupling signal (as measured at the output of the channel of interest) to the power of the signal applied at the adjacent channel input. It is typically expressed in dBc. 74 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 www.ti.com SLAS635B - APRIL 2009 - REVISED JANUARY 2011 REVISION HISTORY Changes from Original (April 2009) to Revision A Page * Changed ADS62P48, ADS62P29, ADS62P28 from product preview to production data .................................................... 4 * Added Analog supply current max value of 320 mA ............................................................................................................ 7 * Added Output buffer supply current, LVDS interface max value of 165 mA ........................................................................ 7 * Added Analog power max value of 1.05 W .......................................................................................................................... 7 * Added Digital power, LVDS interface max value of 0.3 W ................................................................................................... 7 * Added SNR Signal to noise ratio,LVDS, Fin = 170 MHz, 0 dB gain min value of 68 dBFS ................................................. 8 * Added SINADSignal to noise and distortion ratio, LVDS, Fin = 170 MHz, 0 dB gain min value of 66.5 dBFS ................... 8 * Added SNR Signal to noise ratio,LVDS, Fin = 170 MHz, 0 dB gain min value of 66.5 dBFS .............................................. 8 * Added SNR Signal to noise ratio,LVDS, Fin = 170 MHz, 0 dB gain min value of 66.5 dBFS .............................................. 8 * Added SINADSignal to noise and distortion ratio, LVDS, Fin = 170 MHz, 0 dB gain min value of 66 dBFS ...................... 8 * Added SINADSignal to noise and distortion ratio, LVDS, Fin = 170 MHz, 0 dB gain min value of 66 dBFS ...................... 8 * Added DNL Differential non-linearity min value of -0.9 LSB ................................................................................................ 8 * Added DNL Differential non-linearity max value of 1.3 LSB ................................................................................................. 8 * Added DNL Differential non-linearity min value of -0.9 LSB ................................................................................................ 8 * Added DNL Differential non-linearity max value of 1.3 LSB ................................................................................................. 8 * Added INL Integrated non-linearity min value of -5 LSB ..................................................................................................... 8 * Added INL Integrated non-linearity max value of 5 LSB ...................................................................................................... 8 * Added INL Integrated non-linearity min value of -5 LSB ..................................................................................................... 8 * Added INL Integrated non-linearity max value of 5 LSB ...................................................................................................... 8 * Added SFDR Spurious Free Dynamic Range, Fin = 170 MHz min value of 71 dBc ........................................................... 9 * Added SFDRSpurious Free Dynamic Range, excluding HD2,HD3, Fin = 170 MHz min value of 78 dBc ........................... 9 * Added HD2 Second Harmonic Distortion, Fin = 170 MHz min value of 71 dBc ................................................................... 9 * Added HD3 Third Harmonic Distortion, Fin = 170 MHz min value of 71 dBc ....................................................................... 9 * Added THDTotal harmonic distortion, Fin = 170 MHz min value of 70.5 dBc ...................................................................... 9 * Added IMD2-Tone Inter-modulation Distortion, F1 = 46 MHz, F2 = 50 MHz, each tone at -7 dBFS typ value of 91 dBFS ..................................................................................................................................................................................... 9 Changes from Revision A (June 2009) to Revision B Page * Changed Voltage between AVDD to DRVDD in ABSOLUTE MAXIMUM RATINGS ........................................................... 4 * Changed Voltage between DRVDD to AVDD in ABSOLUTE MAXIMUM RATINGS ........................................................... 4 * Added new thermal table ...................................................................................................................................................... 6 * Added table note 2 ................................................................................................................................................................ 6 * Added table notes 5 and 6 and Figure 3 .............................................................................................................................. 6 * Changed Sine wave, ac-coupled, TYP from 3 to 1.5 VPP ..................................................................................................... 6 * Added Figure 3 ..................................................................................................................................................................... 6 * Changed Digital Characteristics - ADS62Px9/x8 table note 2 ............................................................................................ 10 * Added table note to Timing Requirements table in row tOE ................................................................................................ 12 * Added table note 1 to Table 2 and Table 3 ........................................................................................................................ 12 * Added for Fs 80 to Table 2 and Table 3 .......................................................................................................................... 12 * Changed To put the device in parallel configuration mode, keep RESET tied to high (AVDD). to To put the device in parallel configuration mode, keep RESET tied to high (AVDD or DRVDD). in PARALLEL CONFIGURATION ONLY section ................................................................................................................................................................................. 15 * Changed Table 4 ................................................................................................................................................................ 15 Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 75 ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 SLAS635B - APRIL 2009 - REVISED JANUARY 2011 www.ti.com * Deleted 2 in Table 5 ............................................................................................................................................................ 15 * Changed Table 6 ................................................................................................................................................................ 16 * Added note to Table 7 and changed rows to Not available ................................................................................................ 16 * Changed sampling frequency from 100 MSPS to 80 MSPS in serial register 20 .............................................................. 22 * Added 00 and 10 to D6-D5 of serial register 3F ................................................................................................................. 22 * Added reference to the Multiplexed Output Mode section in the APPLICATION INFORMATION .................................... 22 * Changed Serial register 44 description ............................................................................................................................... 23 * Added Figure 12 ................................................................................................................................................................. 24 * Added Figure 13 ................................................................................................................................................................. 24 * Added information to serial register 62 D2-D0 test patterns .............................................................................................. 27 * Added Figure 14 ................................................................................................................................................................. 28 * Added Figure 15 ................................................................................................................................................................. 29 * Added Figure 16 ................................................................................................................................................................. 30 * Added information to serial register 75 D2-D0 test patterns .............................................................................................. 33 * Changed DRVDD to AVDD in Pin Assignments (LVDS MODE) pin 15 description .......................................................... 37 * Added to Pin Assignments (LVDS MODE) pin 37 description ........................................................................................... 37 * Deleted true from DA and DB descriptions in Pin Assignments (LVDS MODE) ................................................................ 37 * Changed SDATA to SCLK in Pin Assignments (CMOS MODE) pin 12 description .......................................................... 40 * Changed DRVDD to AVDD in Pin Assignments (CMOS MODE) pin 15 description ......................................................... 40 * Added to Pin Assignments (CMOS MODE) pin 37 description .......................................................................................... 40 * Changed CMSO mode CLKOUT pin number from 5 to 57 ................................................................................................ 40 * Changed Figure 96 ............................................................................................................................................................. 55 * Changed Figure 98 ............................................................................................................................................................. 56 * Changed Figure 108 ........................................................................................................................................................... 63 * Changed Figure 109 ........................................................................................................................................................... 63 * Added Figure 110 ............................................................................................................................................................... 63 * Added Figure 111 ............................................................................................................................................................... 63 * Changed Power Down Modes table and added note ......................................................................................................... 65 * Changed Figure 115 ........................................................................................................................................................... 69 * Added Multiplexed Output Mode (only with CMOS interface) section information ............................................................. 71 76 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ADS62P49 / ADS62P29 ADS62P48 / ADS62P28 PACKAGE OPTION ADDENDUM www.ti.com 8-Jul-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) ADS62P28IRGC25 ACTIVE VQFN RGC 64 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P28IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P28IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P29IRGC25 ACTIVE VQFN RGC 64 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P29IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P29IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P48IRGC25 ACTIVE VQFN RGC 64 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P48IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P48IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P49IRGC25 ACTIVE VQFN RGC 64 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P49IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62P49IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 8-Jul-2010 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 3-Sep-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing ADS62P28IRGCR VQFN RGC 64 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS62P28IRGCT VQFN RGC 64 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS62P29IRGCR VQFN RGC 64 2000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS62P29IRGCT VQFN RGC 64 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS62P48IRGCR VQFN RGC 64 2000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS62P48IRGCT VQFN RGC 64 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS62P49IRGCR VQFN RGC 64 2000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS62P49IRGCT VQFN RGC 64 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Sep-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS62P28IRGCR VQFN RGC 64 2000 336.6 336.6 28.6 ADS62P28IRGCT VQFN RGC 64 250 336.6 336.6 28.6 ADS62P29IRGCR VQFN RGC 64 2000 336.6 336.6 28.6 ADS62P29IRGCT VQFN RGC 64 250 336.6 336.6 28.6 ADS62P48IRGCR VQFN RGC 64 2000 336.6 336.6 28.6 ADS62P48IRGCT VQFN RGC 64 250 336.6 336.6 28.6 ADS62P49IRGCR VQFN RGC 64 2000 336.6 336.6 28.6 ADS62P49IRGCT VQFN RGC 64 250 336.6 336.6 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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