SCANSTA112
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SNLS161I –DECEMBER 2002–REVISED APRIL 2013
SCANSTA112 7-Port Multidrop IEEE 1149.1 (JTAG) Multiplexer
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1FEATURES DESCRIPTION
The SCANSTA112 extends the IEEE Std. 1149.1 test
2• True IEEE 1149.1 Hierarchical and Multidrop bus into a multidrop test bus environment. The
Addressable Capability advantage of a multidrop approach over a single
• The 8 Address Inputs Support up to 249 serial scan chain is improved test throughput and the
Unique Slot Addresses, an Interrogation ability to remove a board from the system and retain
Address, Broadcast Address, and 4 Multi-Cast test access to the remaining modules. Each
Group Addresses (Address 000000 is SCANSTA112 supports up to 7 local IEEE1149.1
scan chains which can be accessed individually or
Reserved) combined serially.
• 7 IEEE 1149.1-Compatible Configurable Local
Scan Ports Addressing is accomplished by loading the instruction
register with a value matching that of the Slot inputs.
• Bi-directional Backplane and LSP0Ports are Backplane and inter-board testing can easily be
Interchangeable Slave Ports accomplished by parking the local TAP Controllers in
• Capable of Ignoring TRST of the Backplane one of the stable TAP Controller states via a Park
Port when it Becomes the Slave. instruction. The 32-bit TCK counter enables built in
• Stitcher Mode Bypasses Level 1 and 2 self test operations to be performed on one port while
other scan chains are simultaneously tested.
Protocols
• Mode Register0Allows Local TAPs to be The STA112 has a unique feature in that the
Bypassed, Selected for Insertion into the Scan backplane port and the LSP0 port are bidirectional.
They can be configured to alternatively act as the
Chain Individually, or Serially in Groups of master or slave port so an alternate test master can
Two or Three take control of the entire scan chain network from the
• Transparent Mode can be Enabled with a LSP0 port while the backplane port becomes a slave.
Single Instruction to Conveniently Buffer the
Backplane IEEE 1149.1 Pins to Those on a
Single Local Scan Port
• General Purpose Local Port Pass Through Bits
are Useful for Delivering Write Pulses for Flash
Programming or Monitoring Device Status.
• Known Power-Up State
• TRST on all Local Scan Ports
• 32-bit TCK Counter
• 16-bit LFSR Signature Compactor
• Local TAPs can Become TRI-STATE via the OE
Input to Allow an Alternate Test Master to Take
Control of the Local TAPs (LSP0-3 have a TRI-
STATE Notification Output)
• 3.0-3.6V VCC Supply Operation
• Supports Live Insertion/Withdrawal
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2002–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
STA112
STA112
STA112
STA112
STA112
STA112
Backplane IEEE
1149.1
Test Bus
ASIC
with
JTAG
Backplane
IEEE 1149.1
Test Bus
Buffer with
JTAG
Buffer with
JTAG
Buffer with
JTAG
Flash
Memory
R/W
SCANSTA112
FPGA
vendor1
with JTAG
FPGA
vendor2
with JTAG
Processor
with JTAG
LSP0 LSP1 LSP2
LSP3
LSP4
SCANSTA112
SNLS161I –DECEMBER 2002–REVISED APRIL 2013
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Figure 1. Typical use of SCANSTA112 for board-level management of multiple scan chains.
Figure 2. Example of SCANSTA112 in a multidrop addressable backplane.
Introduction
The SCANSTA112 is the third device in a series that enable multi-drop address and multiplexing of IEEE-1149.1
scan chains. The SCANSTA112 is a superset of its predecessors - the SCANPSC110 and the SCANSTA111.
The STA112 has all features and functionality of these two previous devices.
The STA112 is essentially a support device for the IEEE 1149.1 standard. It is primarily used to partition scan
chains into managable sizes, or to isolate specific devices onto a seperate chain (Figure 1). The benefits of
multiple scan chains are improved fault isolation, faster test times, faster programiing times, and smaller vector
sets.
In addition to scan chain partitioning, the device is also addressable for use in a multidrop backplane
environment (Figure 2). In this configuration, multiple IEEE-1149.1 accessible cards with an STA112 on board
can utilize the same backplane test bus for system-level IEEE-1149.1 access. This approach facilitates a system-
wide commitment to structural test and programming throughout the entire system life sycle.
Architecture
Figure 3 shows the basic architecture of the 'STA112. The device's major functional blocks are illustrated here.
The TAP Controller, a 16-state state machine, is the central control for the device. The instruction register and
various test data registers can be scanned to exercise the various functions of the 'STA112 (these registers
behave as defined in IEEE Std. 1149.1).
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Boundary
32-bit Counter
SGPIO
Mode0-3
Control
ID
ByPass
LFSR
MultiCast
PortEnable
Instruction
Selection
Control
TAP
Controller
Local
Scan
Port
Network
LSP
Controller
TCKB0
TMSB0
TRSTB0
S0-7
TDIB0
A0B0, A1B0
Y0B0, Y1B0
TDOB0
Mode0-3
TDI/TDO
Crossover
Master/
Slave
Logic
TDIB1, A0B1 A1B1
TMSB1 TCKB1 TRSTB1
TDOB1 TRISTB1Y0B1 Y1B1
TRISTB0
TDO01 TCK01 TMS01
TRST01 Y001 Y101 TRIST01
TDI01 A001 A101
LSPSel0-6
MPSelB1/B0
TRANS
TDO02-03 TCK02_03 TMS02-03
TRST02-03 TRIST02-03
TDI02-03
TDO04-06 TCK04-06
TMS04-06 TRST04-06
TDI04-06
OE
MstrPortSel
ADDMASK
SB/S
RESET
TLR_TRST
TLR_TRST6
TDI/TDO
Crossover
Master/
Slave
Logic
/2
SCANSTA112
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SNLS161I –DECEMBER 2002–REVISED APRIL 2013
The 'STA112 selection controller provides the functionality that allows the 1149.1 protocol to be used in a multi-
drop environment. It primarily compares the address input to the slot identification and enables the 'STA112 for
subsequent scan operations.
The Local Scan Port Network (LSPN) contains multiplexing logic used to select different port configurations. The
LSPN control block contains the Local Scan Port Controllers (LSPC) for each Local Scan Port (LSP0, LSP1...
LSPn). This control block receives input from the 'STA112 instruction register, mode registers, and the TAP
controller. Each local port contains all four boundary scan signals needed to interface with the local TAPs plus
the optional Test Reset signal (TRST).
The TDI/TDO Crossover Master/Slave logic is used to define the bidirectional B0 and B1 ports in a Master/Slave
configuration.
Block Diagram
Figure 3. SCANSTA112 Block Diagram
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A3 A4 A5 A6A2A1
B7B3 B4 B5 B6B2B1
C7C3 C4 C5 C6C2C1
D7D3 D4 D5 D6D2D1
E7E3 E4 E5 E6E2E1
F7F3 F4 F5 F6F2F1
G7G3 G4 G5 G6G2G1
A7
B8
C8
D8
E8
F8
G8
A8
B9
C9
D9
E9
F9
G9
A9
B10
C10
D10
E10
F10
G10
A10
H7H3 H4 H5 H6H2H1 H8 H9 H10
J7J3 J4 J5 J6J2J1 J8 J9 J10
K7K3 K4 K5 K6K2K1 K8 K9 K10
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
S0
TMSB0
GND
S7
ADDMASK
OE
GND
LSPsel5
TCK06
TCK05
TCK04
TCK03
TCK01
TCK02
S1
S3
TRANS
LSPsel0
LSPsel2
LSPsel4
LSPsel3
LSPsel6
LSPsel1
MPselB1/B0
TDIB0
TDOB0
TDO06
GND
S5
S6
GND
TCKB0
TRISTB0
TDI06
TMS06
S4
S2
SB/S
TRSTB0
Y1B0
Y0B0
TMS05
TRST05
TRST06
A0B1
A0B0
A1B0
TDOB1
GND
GND
GND
VCC
GND
GND GND
TDO05
TDO04
TRST03
TDI05
A001
A1B1
TRSTB1
TCKB1
TDIB1
TRST04
TDI04
TRIST03
TDI03
RESET
TDO01
TRISTB1
TMSB1
TMS04
TRST02
TDO02
TMS01
Y1B1
TMS03
TMS02
TDI02
Y001
Y101
TDI01
TLRTRST6
Y0B1 TLRTRST
TRST01
TRIST01
A101
TRIST02
TDO03
SCANSTA112
SNLS161I –DECEMBER 2002–REVISED APRIL 2013
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Connection Diagrams
Figure 4. (NFBGA Top view)
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PIN DESCRIPTIONS
No.
Pin Name Pins I/O Description
VCC 10 N/A Power
GND 10 N/A Ground
RESET 1 I RESET Input: will force a reset of the device regardless of the current state.
ADDMASK 1 I ADDRESS MASK input: Allows masking of lower slot input pins.
MPselB1/B0 1 I MASTER PORT SELECTION: Controls selection of LSPB0 or LSPB1 as the backplane port. The
unselected port becomes LSP00. A value of "0" will select LSPB0 as the master port.
SB/S 1 I Selects ScanBridge or Stitcher Mode.
LSPsel (0-6) 7 I In Stitcher Mode these inputs define which LSP's are to be included in the scan chain
TRANS 1 I Transparent Mode enable input: The value of this pin is loaded into the TRANSENABLE bit of the
control register at power-up. This value is used to control the presence of registers and pad-bits in
the scan chain while in the stitcher mode.
TLR_TRST 1 I Sets the driven value of TRST0-5 when LSP TAPs are in TLR and the device is not being reset.
During RESET = "0" or TRSTB= "0" (IgnoreReset = "0") TRSTn= "0". This pin is to be tied low to
match the function of the SCANSTA111
TLR_TRST61 I This pin affects TRST of LSP6only. This pin is to be tied low to match the function of the
SCANSTA111
TDIB0, TDIB1 2 I BACKPLANE TEST DATA INPUT: All backplane scan data is supplied to the 'STA112 through this
input pin. MPselB1/B0 determines which port is the master backplane port and which is LSP00. This
input has a 25KΩinternal pull-up resistor and no ESD clamp diode (ESD is controlled with an
alternate method). When the device is power-off (VDD floating), this input appears to be a capacitive
load to ground (1). When VDD = 0V (i.e.; not floating but tied to VSS) this input appears to be a
capacitive load with the pull-up to ground.
TMSB0, TMSB1 2 I/O BACKPLANE TEST MODE SELECT: Controls sequencing through the TAP Controller of the
'STA112. Also controls sequencing of the TAPs which are on the local scan chains. MPselB1/B0
determines which port is the master backplane port and which is LSP00. This bidirectional TRI-
STATE pin has 24mA of drive current, with a 25KΩinternal pull-up resistor and no ESD clamp
diode (ESD is controlled with an alternate method). When the device is power-off (VDD floating), this
input appears to be a capacitive load to ground (1). When VDD = 0V (i.e.; not floating but tied to VSS)
this input appears to be a capacitive load with the pull-up to ground.
TDOB0, TDOB1 2 I/O BACKPLANE TEST DATA OUTPUT: This output drives test data from the 'STA112 and the local
TAPs, back toward the scan master controller. This bidirectional TRI-STATE pin has 12mA of drive
current. MPselB1/B0 determines which port is the master backplane port and which is LSP00. Output
is sampled during interrogation addressing. When the device is power-off (VDD = 0V or floating), this
output appears to be a capacitive load (1).
TCKB0, TCKB1 2 I/O TEST CLOCK INPUT FROM THE BACKPLANE: This is the master clock signal that controls all
scan operations of the 'STA112 and of the local scan ports. MPselB1/B0 determines which port is the
master backplane port and which is LSP00. These bidirectional TRI-STATE pins have 24mA of drive
current with hysterisis. This input has no pull-up resistor and no ESD clamp diode (ESD is controlled
with an alternate method). When the device is power-off (VDD floating), this input appears to be a
capacitive load to ground (1). When VDD = 0V (i.e.; not floating but tied to VSS) this input appears to
be a capacitive load to ground.
TRSTB0, TRSTB1 2 I/O TEST RESET: An asynchronous reset signal (active low) which initializes the 'STA112 logic.
MPselB1/B0 determines which port is the master backplane port and which is LSP00. This
bidirectional TRI-STATE pin has 24mA of drive current, with a 25KΩinternal pull-up resistor and no
ESD clamp diode (ESD is controlled with an alternate method). When the device is power-off (VDD
floating), this pin appears to be a capacitive load to ground (1). When VDD = 0V (i.e.; not floating but
tied to VSS) this input appears to be a capacitive load with the pull-up to ground.
TRISTB0, TRISTB1,5 O TRI-STATE NOTIFICATION OUTPUT: This signal is asserted high when the associated TDO is
TRIST(01-03) TRI-STATEd. Associated means TRISTB0 is for TDOB0, TRIST01 is for TDO01, etc. This output has
12mA of drive current.
A0B0, A1B0, A0B1,4 I BACKPLANE PASS-THROUGH INPUT: A general purpose input which is driven to the Ynof a
A1B1 single selected LSP. (Not available when multiple LSPs are selected). This input has a 25KΩ
internal pull-up resistor. MPselB1/B0 determines which port is the master backplane port and which is
LSP00.
Y0B0, Y1B0, Y0B1,4 O BACKPLANE PASS-THROUGH OUTPUT: A general purpose output which is driven from the Anof
Y1B1 a single selected LSP. (Not available when multiple LSPs are selected). This TRI-STATE output has
12mA of drive current. MPselB1/B0 determines which port is the master backplane port and which is
LSP00.
(1) Refer to the IBIS model on our website for I/O characteristics.
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PIN DESCRIPTIONS (continued)
No.
Pin Name Pins I/O Description
S(0-7) 8 I SLOT IDENTIFICATION: The configuration of these pins is used to identify (assign a unique
address to) each 'STA112 on the system backplane
OE 1 I OUTPUT ENABLE for the Local Scan Ports, active low. When high, this active-low control signal
TRI-STATEs all local scan ports on the 'STA112, to enable an alternate resource to access one or
more of the local scan chains.
TDO(01-06) 6 O TEST DATA OUTPUTS: Individual output for each of the local scan ports . These TRI-STATE
outputs have 12mA of drive current.
TDI(01-06) 6 I TEST DATA INPUTS: Individual scan data input for each of the local scan ports. This input has a
25KΩinternal pull-up resistor.
TMS(01-06) 6 O TEST MODE SELECT OUTPUTS: Individual output for each of the local scan ports. TMSndoes not
provide a pull-up resistor (which is assumed to be present on a connected TMS input, per the IEEE
1149.1 requirement) . These TRI-STATE outputs have 24mA of drive current.
TCK(01-06) 6 O LOCAL TEST CLOCK OUTPUTS: Individual output for each of the local scan ports. These are
buffered versions of TCKB. These TRI-STATE outputs have 24mA of drive current.
TRST(01-06) 6 O LOCAL TEST RESETS: A gated version of TRSTB. These TRI-STATE outputs have 24mA of drive
current.
A001, A101 2 I LOCAL PASS-THROUGH INPUTS: General purpose inputs which can be driven to the backplane
pin YB. (Only on LSP0and LSP1. Only available when a single LSP is selected) . These inputs have
a 25KΩinternal pull-up resistor.
Y001, Y101 2 O LOCAL PASS-THROUGH OUTPUT: General purpose outputs which can be driven from the
backplane pin AB. (Only on LSP0and LSP1. Only available when a single LSP is selected) . These
TRI-STATE outputs have 12mA of drive current.
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APPLICATION OVERVIEW
ADDRESSING SCHEME
The SCANSTA112 architecture extends the functionality of the IEEE 1149.1 Standard by supplementing that
protocol with an addressing scheme which allows a test controller to communicate with specific 'STA112s within
a network of 'STA112s. That network can include both multi-drop and hierarchical connectivity. In effect, the
'STA112 architecture allows a test controller to dynamically select specific portions of such a network for
participation in scan operations. This allows a complex system to be partitioned into smaller blocks for testing
purposes. The 'STA112 provides two levels of test-network partitioning capability. First, a test controller can
select individual 'STA112s, specific sets of 'STA112s (multi-cast groups), or all 'STA112s (broadcast). This
'STA112-selection process is supported by a Level-1 communication protocol. Second, within each selected
'STA112, a test controller can select one or more of the chip's seven local scan-ports. That is, individual local
ports can be selected for inclusion in the (single) scan-chain which a 'STA112 presents to the test controller. This
mechanism allows a controller to select specific scan-chains within the overall scan network. The port-selection
process is supported by a Level-2 protocol.
HIERARCHICAL SUPPORT
Multiple SCANSTA112's can be used to assemble a hierarchical boundary-scan tree. In such a configuration, the
system tester can configure the local ports of a set of 'STA112s so as to connect a specific set of local scan-
chains to the active scan chain. Using this capability, the tester can selectively communicate with specific
portions of a target system. The tester's scan port is connected to the backplane scan port of a root layer of
'STA112s, each of which can be selected using multi-drop addressing. A second tier of 'STA112s can be
connected to this root layer, by connecting a local port (LSP) of a root-layer 'STA112 to the backplane port of a
second-tier 'STA112. This process can be continued to construct a multi-level scan hierarchy. 'STA112 local
ports which are not cascaded into higher-level 'STA112s can be thought of as the terminal leaves of a scan tree.
The test master can select one or more target leaves by selecting and configuring the local ports of an
appropriate set of 'STA112s in the test tree.
STANDARD SCANBRIDGE MODE
ScanBridge mode refers to functionality and protocol that has been used since the introduction of the PSC110 in
1993. This functionality consists of a multidrop addressable IEEE1149.1 switch. This enables one (or more)
device to be selected from many that are connected to a parallel IEEE1149.1 bus or backplane. The second
function that ScanBridge mode accomplishes is to act as a mux for multiple IEEE1149.1 local scan chains. The
Local Scan Ports (LSP) of the device creates a connection between one or more of the local scan chains to the
backplane bus.
To accomplish this functionality the ScanBridge has two levels of protocol and an operational mode. Level 1
protocol refers to the required actions to address/select the desired ScanBridge. Level 2 protocol is required to
configuring the mux'ing function and enable the connection (UNPARK) between the local scan chain and the
backplane bus via an LSP. Upon completion of level 1 and 2 protocols the ScanBridge is prepared for its
operational mode. This is where scan vectors are moved from the backplane bus to the desired local scan
chain(s).
STITCHER MODE
Stitcher Mode is a method of skipping level 1 and 2 protocol of the ScanBridge mode of operation. This is
accomplished via external pins. When in stitcher mode the SCANSTA112 will go directly to the operational mode.
TRANSPARENT MODE
Transparent mode refers to a condition of operation in which there are no pad-bits or SCANSTA112 registers in
the scan chain. The Transparent mode of operation is available in both ScanBridge and Stitcher modes. Only the
activation method differs. Once transparent mode has been activated there is no difference in operation.
Transparent mode allows for the use of vectors that have been generated for a chain where these bits were not
included.
Check with your ATPG tool vendor to ensure support of these features.
For details regarding the internal operation of the SCANSTA112 device, refer to applications note AN-
1259(SNLA055) SCANSTA112 Designers Reference.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage (VCC)−0.3V to +4.0V
DC Input Diode Current (IIK) VI=−0.5V −20 mA
DC Input Voltage (VI)−0.5V to +3.9V
DC Output Diode Current (IOK) VO=−0.5V −20 mA
DC Output Voltage (VO)−0.3V to +3.9V
DC Output Source/Sink Current (IO) ±50 mA
DC VCC or Ground Current per Output Pin ±50 mA
DC Latchup Source or Sink Current ±300 mA
Junction Temperature (Plastic) +150°C
Storage Temperature −65°C to +150°C
Lead Temperature (Solder, 4sec) 100L NFBGA 220°C
100L TQFP 220°C
Max Package Power Capacity @ 25°C 100L NFBGA 3.57W
100L TQFP 2.11W
Thermal Resistance (θJA) 100L NFBGA 35°C/W
100L TQFP 59.1°C/W
Package Derating above +25°C 100L NFBGA 28.57mW/°C
100L TQFP 16.92mW/°C
ESD Last Passing Voltage (HBM Min) 2500V
(1) Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met,
without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. TI
does not recommend operation of SCAN STA products outside of recommended operation conditions.
RECOMMENDED OPERATING CONDITIONS
Supply Voltage (VCC) 'STA112 3.0V to 3.6V
Input Voltage (VI) 0V to VCC
Output Voltage (VO) 0V to VCC
Operating Temperature (TA) Industrial −40°C to +85°C
DC ELECTRICAL CHARACTERISTICS
Over recommended operating supply voltage and temperature ranges unless otherwise specified
Symbol Parameter Conditions Min Max Units
VIH Minimum High Input Voltage VOUT = 0.1V or 2.1 V
VCC −0.1V
VIL Maximum Low Input Voltage VOUT = 0.1V or 0.8 V
VCC −0.1V
VOH Minimum High Output Voltage IOUT =−100 μA VCC - 0.2v V
All Outputs and I/O Pins VIN = VIH or VIL
VOH Minimum High Output Voltage IOUT =−12 mA 2.4 V
TDOB0, TDOB1, TRISTB0, TRISTB1, Y0B0, Y1B0, Y0B1, All Outputs Loaded
Y1B1, TDO(01-06), Y001, Y101, TRIST(01-03)
VOH Minimum High Output Voltage IOUT =−24mA 2.2 V
TMSB0, TMSB1, TCKB0, TCKB1, TRSTB0, TRSTB1,
TMS(01-06), TCK(01-06), TRST(01-06)
VOL Maximum Low Output Voltage IOUT = +100 μA 0.2 V
All Outputs and I/O Pins VIN = VIH or VIL
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DC ELECTRICAL CHARACTERISTICS (continued)
Over recommended operating supply voltage and temperature ranges unless otherwise specified
Symbol Parameter Conditions Min Max Units
VOL Maximum Low Output Voltage IOUT = +12 mA 0.4 V
TDOB0, TDOB1, TRISTB0, TRISTB1, Y0B0, Y1B0, Y0B1,
Y1B1, TDO(01-06), Y001, Y101, TRIST(01-03)
VOL Maximum Low Output Voltage IOUT = +24mA 0.55 V
TMSB0, TMSB1, TCKB0, TCKB1, TRSTB0, TRSTB1,
TMS(01-06), TCK(01-06), TRST(01-06)
VIKL Maximum Input Clamp Diode Voltage IIK = -18mA -1.2 V
IIN Maximum Input Leakage Current VIN = VCC or GND ±5.0 μA
(non-resistor input pins)
IILR Input Current Low VIN = GND -45 -200 µA
(Input and I/O pins with pull-up resistors: TDIB0, TDIB1,
TMSB0, TMSB1, TRSTB0, TRSTB1, A0B0, A1B0, A0B1,
A1B1, TDI(01-06), A001, A101)
IIH Input High Current VIN = VCC 5.0 µA
(Input and I/O pins with pull-up resistors: TDIB0, TDIB1,
TMSB0, TMSB1, TRSTB0, TRSTB1, A0B0, A1B0, A0B1,
A1B1, TDI(01-06), A001, A101)
IOFF Power-off Leakage Current VCC = 0V, VIN = 3.6V(1) ±5.0 μA
Outputs and I/O pins without pull-up resistors
Outputs and I/O pins with pull-up resistors ±200 μA
IOZ Maximum TRI-STATE Leakage Current ±5.0 μA
Outputs and I/O pins without pull-up resistors
ICC Maximum Quiescent Supply Current VIN = VCC or GND 3.8 mA
ICCD Maximum Dynamic Supply Current VIN = VCC or GND, Input 68 mA
Freq = 25MHz
(1) Specified by equivalent test method.
AC ELECTRICAL CHARACTERISTICS: SCAN BRIDGE MODE
Over recommended operating supply voltage and temperature ranges unless otherwise specified(1).
Symbol Parameter Conditions Typ Max Units
tPHL, Propagation Delay 8.5 13.5 ns
tPLH TCKB0 to TDOB0 or TDOB1
tPHL, Propagation Delay 8.5 14.0 ns
tPLH TCKB1 to TDOB0 or TDOB1
tPHL, Propagation Delay 7.5 12.5 ns
tPLH TCKB0 to TDO(01-06)
tPHL, Propagation Delay 7.5 13.0 ns
tPLH TCKB1 to TDO(01-06)
tPHL, Propagation Delay 8.0 12.0 ns
tPLH TMSB0 to TMSB1
tPHL, Propagation Delay 8.0 12.0 ns
tPLH TMSB1 to TMSB0
tPHL, Propagation Delay 8.0 12.0 ns
tPLH TMSB0 to TMS(01-06)
tPHL, Propagation Delay 8.0 12.0 ns
tPLH TMSB1 to TMS(01-06)
tPHL, Propagation Delay 8.0 12.0 ns
tPLH TCKB0 to TCKB1
(1) RL= 500Ωto GND, CL= 50pF to GND, tR/tF= 2.5ns, Frequency = 25MHz, VM= 1.5V
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SNLS161I –DECEMBER 2002–REVISED APRIL 2013
AC ELECTRICAL CHARACTERISTICS: SCAN BRIDGE MODE (continued)
Over recommended operating supply voltage and temperature ranges unless otherwise specified(1).
Symbol Parameter Conditions Typ Max Units
tPHL, Propagation Delay 8.0 12.0 ns
tPLH TCKB1 to TCKB0
tPHL, Propagation Delay 7.5 12.0 ns
tPLH TCKB0 to TCK(01-06)
tPHL, Propagation Delay 7.5 12.0 ns
tPLH TCKB1 to TCK(01-06)
tPHL, Propagation Delay 11.5 18.0 ns
tPLH TCKB0 to TRSTB1
tPHL, Propagation Delay 11.5 18.0 ns
tPLH TCKB1 to TRSTB0
tPHL, Propagation Delay 12.0 18.5 ns
tPLH TCKB0 to TRST(01-06)
tPHL, Propagation Delay 12.0 18.5 ns
tPLH TCKB1 to TRST(01-06)
tPHL Propagation Delay 8.5 12.5 ns
TCKBn to TRISTBn
tPHL Propagation Delay 8.0 12.0 ns
TCKBn to TRIST(01-03)
tPZL, Propagation Delay 9.0 14.5 ns
tPZH TCKBn to TDOBn or TDO(01-06)
tPHL, Propagation Delay 6.0 9.0 ns
tPLH An to Yn
AC TIMING CHARACTERISTICS: SCAN BRIDGE MODE
Over recommended operating supply voltage and temperature ranges unless otherwise specified(1)(2).
Symbol Parameter Conditions Min Max Units
tSSetup Time 2.5 ns
TMSBn to TCKBn
tHHold Time 1.5 ns
TMSBn to TCKBn
tSSetup Time 3.0 ns
TDIBn to TCKBn
tHHold Time 2.0 ns
TDIBn to TCKBn
tSSetup Time 1.0 ns
TDI(01-06) to TCKBn
tHHold Time 3.5 ns
TDI(01-06) to TCKBn
(1) Specified by Design (GBD) by statistical analysis
(2) RL= 500Ωto GND, CL= 50pF to GND, tR/tF= 2.5ns, Frequency = 25MHz, VM= 1.5V
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www.ti.com
AC TIMING CHARACTERISTICS: SCAN BRIDGE MODE (continued)
Over recommended operating supply voltage and temperature ranges unless otherwise specified(1)(2).
Symbol Parameter Conditions Min Max Units
tREC Recovery Time 1.0 ns
TCKBn from TRSTBn
tWClock Pulse Width tR/tF= 1.0ns 10.0 ns
TCKBn(H or L)
tWL Reset Pulse Width tR/tF= 1.0ns 2.5 ns
TRSTBn(L)
FMAX Maximum Clock Frequency(3) tR/tF= 1.0ns 25 MHz
(3) When sending vectors one-way to a target device on an LSP (such as in FPGA/PLD configuration/programming), the clock frequency
may be increased above this specification. In Scan Mode (expecting to capture returning data at the LSP), the FMAX must be limited to
the above specification.
AC ELECTRICAL CHARACTERISTICS: STITCHER TRANSPARENT MODE
Over recommended operating supply voltage and temperature ranges unless otherwise specified (1).
Symbol Parameter Conditions Typ Max Units
tPHL, Propagation Delay 12.5 ns
tPLH TDIB0 to TDOB1, TDIB1 to TDOB0
tPHL, Propagation Delay 12.5 ns
tPLH TDIB0 to TDO01, TDIB1 to TDO01
tPHL, Propagation Delay 12.5 ns
tPLH TDILSPn to TDOLSPn+1
tPHL, Propagation Delay 12.5 ns
tPLH TMSB0 to TMSB1, TMSB1 to TMSB0
tPHL, Propagation Delay 12.5 ns
tPLH TMSB0 to TMS(01-06), TMSB1 to TMS(01-06)
tPHL, Propagation Delay 12.5 ns
tPLH TRSTB0 to TRSTB1, TRSTB1 to TRSTB0
tPHL, Propagation Delay 12.5 ns
tPLH TRSTB0 to TRST(01-06), TRSTB1 to TRST(01-06)
(1) RL= 500Ωto GND, CL= 50pF to GND, tR/tF= 2.5ns, Frequency = 25MHz, VM= 1.5V
12 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
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SNLS161I –DECEMBER 2002–REVISED APRIL 2013
TEST CIRCUIT DIAGRAMS
Figure 6. Waveforms for an Unparked STA112 in the Shift-DR (IR) TAP Controller State
Figure 7. Reset Waveforms
Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 13
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SNLS161I –DECEMBER 2002–REVISED APRIL 2013
www.ti.com
Figure 8. Output Enable Waveforms
Capacitance & I/O Characteristics
Refer to TI's website for IBIS models at www.ti.com.com/lsds/ti/analog/interface.page
14 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
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SNLS161I –DECEMBER 2002–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision H (April 2013) to Revision I Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 14
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PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SCANSTA112SM ACTIVE NFBGA NZD 100 240 TBD Call TI Call TI -40 to 85 SCANSTA112
SM
SCANSTA112SM/NOPB ACTIVE NFBGA NZD 100 240 Green (RoHS
& no Sb/Br) SNAGCU Level-4-260C-72 HR -40 to 85 SCANSTA112
SM
SCANSTA112SMX NRND NFBGA NZD 100 1000 TBD Call TI Call TI -40 to 85 SCANSTA112
SM
SCANSTA112SMX/NOPB ACTIVE NFBGA NZD 100 1000 Green (RoHS
& no Sb/Br) SNAGCU Level-4-260C-72 HR -40 to 85 SCANSTA112
SM
SCANSTA112VS ACTIVE TQFP NEZ 100 90 TBD Call TI Call TI -40 to 85 SCANSTA112
VS
SCANSTA112VS/NOPB ACTIVE TQFP NEZ 100 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 SCANSTA112
VS
SCANSTA112VSX/NOPB ACTIVE TQFP NEZ 100 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 SCANSTA112
VS
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SCANSTA112SMX NFBGA NZD 100 1000 330.0 24.4 10.3 10.3 2.0 16.0 24.0 Q1
SCANSTA112SMX/NOPB NFBGA NZD 100 1000 330.0 24.4 10.3 10.3 2.0 16.0 24.0 Q1
SCANSTA112VSX/NOPB TQFP NEZ 100 1000 330.0 32.4 18.0 18.0 1.6 24.0 32.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SCANSTA112SMX NFBGA NZD 100 1000 367.0 367.0 45.0
SCANSTA112SMX/NOPB NFBGA NZD 100 1000 367.0 367.0 45.0
SCANSTA112VSX/NOPB TQFP NEZ 100 1000 367.0 367.0 55.0
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 2
MECHANICAL DATA
PFD0100A
www.ti.com
VJD100A (Rev C)
TYPICAL
NEZ0100A
MECHANICAL DATA
NZD0100A
www.ti.com
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