EC1SMC-15-25.000M TR - Ecliptek Corporation

EC1SMC-15-25.000M TR

EC1SM C -15 -25.000M TR

Series

Resistance Welded Short HC-49/UP SMD Crystal

Frequency Tolerance/Stability

±30ppm at 25°C, ±50ppm over 0°C to +70°C

Mode of Operation

AT-Cut Fundamental

Packaging Options

Tape & Reel

Nominal Frequency

25.000MHz

Load Capacitance

15pF Parallel Resonant

ELECTRICAL SPECIFICATIONS

Nominal Frequency 25.000MHz

Frequency Tolerance/Stability ±30ppm at 25°C, ±50ppm over 0°C to +70°C

Aging at 25°C ±5ppm/year Maximum

Load Capacitance 15pF Parallel Resonant

Shunt Capacitance (C0) 7pF Maximum

Equivalent Series Resistance 40 Ohms Maximum

Mode of Operation AT-Cut Fundamental

Drive Level 1mWatt Maximum

Storage Temperature Range -40°C to +85°C

Insulation Resistance 500 Megaohms Minimum at 100Vdc

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test MIL-STD-883, Method 1014 Condition A

Gross Leak Test MIL-STD-883, Method 1014 Condition C

Mechanical Shock MIL-STD-202, Method 213 Condition C

Resistance to Soldering Heat MIL-STD-202, Method 210

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010

Vibration MIL-STD-883, Method 2007 Condition A

MECHANICAL DIMENSIONS (all dimensions in millimeters)

3.20

MAX

13.30 MAX 4.85

MAX

4.88 ±0.20 0.50 MIN (x2)

11.60 MAX

0.80 ±0.30 (x2)

NOTE: Coplanarity 0.360 MAX

LINE MARKING

1E25.000M

E=Ecliptek Designator

M=Frequency Unit of

Measure

www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 2/19/2010 | Page 1 of 5

EC1SMC-15-25.000M TR

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X2)

All Dimensions in Millimeters

4.0

2.0 (X2)

5.5 (X2)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 2/19/2010 | Page 2 of 5

DIA 50 MIN

DIA 20.2 MIN

DIA 13.0 ±0.2

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 40 MIN

Access Hole at

Slot Location

1.5 MIN

Tape & Reel Dimensions

*Compliant to EIA 481A

EC1SMC-15-25.000M TR

24.0 ±0.3

11.5 ±0.1

10.75 ±0.10

4.0 ±0.2

2.0 ±0.1

12.0 ±0.2 B0*

DIA 1.5 ±0.1

A0*

0.4 ±0.1

K0*

30.4 MAX

360 MAX

Quantity Per Reel: 1,000 units

24.4 +2.0/-0.0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 2/19/2010 | Page 3 of 5

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EC1SMC-15-25.000M TR

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) 150°C

- Temperature Typical (TS TYP) 175°C

- Temperature Maximum (TS MAX) 200°C

- Time (tS MIN) 60 - 180 Seconds

Ramp-up Rate (TL to TP)3°C/second Maximum

Time Maintained Above:

- Temperature (TL)217°C

- Time (tL)60 - 150 Seconds

Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum

Target Peak Temperature (TP Target) 250°C +0/-5°C

Time within 5°C of actual peak (tp)20 - 40 seconds

Ramp-down Rate 6°C/second Maximum

Time 25°C to Peak Temperature (t) 8 minutes Maximum

Moisture Sensitivity Level Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 2/19/2010 | Page 4 of 5

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EC1SMC-15-25.000M TR

Low Temperature Infrared/Convection 245°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 30 - 60 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)245°C Maximum

Target Peak Temperature (TP Target) 245°C Maximum 2 Times / 230°C Maximum 1 Time

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 2/19/2010 | Page 5 of 5