SSL2101T/DB/FBCB120V,598\"\" - NXP SEMICONDUCTORS

1. General description

The SSL2101 is a Switched Mode Power Supply (SMPS) driver IC that operates in

combination with a ph ase cut dimmer directly fr om the rectified mains. It is designed to

drive LED devices. The device includes a high-voltage power switch, a circuit to allow

start-up directly from the rectified mains voltage and a high-voltage circuitry to supply the

phase cut dimmer.

For dimmer applications, an integrated dedicated circuitry optimizes the dimming curve.

•SSL2101: fully integrated LED driver for lamps up to 10 W

•SSL2102: fully integrated LED driver for lamps up to 25 W

•SSL2103: gives the application designer flexibility to:

–Use an external power switch to allow the IC to provide any power

–Use external bleeder transistors to provide extended dimmer interoperability

2. Features and benefits

Easy migration to existing lighting control infrastructure

Supports most available dimming solutions

Optimized efficiency with valley switching managed by a built- in circuitry

Demagnetization detection

OverTemperature Protection (OTP)

Short-Winding Protection (SWP) and OverCurrent Protection (OCP)

Internal VCC generation allowing start-up from the rectified main s voltage

Natural dimming curve by logarithmic correction, down to 1 %

Limited external components required because of the high integration level

Thermal enhanced SO16 wide body package

Suitable for flyback and buck applications

3. Applications

SSL applications below 15 W

Retro-fit lamps (for example, GU10, E27)

LED modules such as LED spots, down-lights

LED strings suitable for retail displays, etc.

SSL2101

Dimmable GreenChip driver for LED lighting

Rev. 4.1 — 5 December 2011 Product data sheet

Product data sheet Rev. 4.1 — 5 December 2011 2 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

4. Quick reference data

5. Ordering information

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

RDSon drain-so urce on -state

resistance power switch; ISOURCE =0.50 A

Tj=25C 4.5 6.5 7.5 

Isource =0.20 A

Tj= 125 C-9.510

VCC supply voltage 8.5 - 40 V

fosc oscillator frequency 10 100 200 kHz

IDRAIN current on pi n DR AIN VDRAIN >60V;

no auxiliary supply -- 2.2mA

VDRAIN >60V;

with auxiliary supply - 30 125 A

VDRAIN voltage on pin DRAIN 40 - 600 V

min minimum duty factor - 0 - %

max maximum duty cycle f = 100 kHz - 75 - %

Tamb ambient temperature 40 - +100 C

Table 2: Ordering information

Type number Package

Name Description Version

SSL2101T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

Product data sheet Rev. 4.1 — 5 December 2011 3 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

6. Block diagram

Fig 1. Block diagram

ISENSE SBLEED WBLEED

BLEEDER

SUPPLY

LOGIC

PROTECTION

LOGIC

OSCILLATOR

FREQUENCY

REDUCTION

CIRCUIT

Overcurrent

Blank

Low freq

Stop

Short-winding protection

THERMAL

SHUTDOWN

POWER - UP

RESET

PWM

LIMIT

CIRCUIT

VALLEY

DRAIN

AUX

SOURCE

100 mV

0.5 V

1.5 V

BRIGHTNESS

RC2

PWMLIMIT

GND

014aaa567

4, 5,13,

14, 15

10 1 2

Product data sheet Rev. 4.1 — 5 December 2011 4 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

7. Pinning information

7.1 Pinning

7.2 Pin description

Fig 2. Pin configurat io n SO1 6

SSL2101

SBLEED DRAIN

WBLEED GND

VCC GND

GND GND

GND SOURCE

BRIGHTNESS AUX

RC2 ISENSE

RC PWMLIMIT

014aaa568

Table 3: Pin de scription

Symbol Pin Description

SBLEED 1 drain of internal strong bleeder sw itch

WBLEED 2 drain of internal weak bleeder switch

VCC 3 supply voltage

GND 4 ground

GND 5 ground

BRIGHTNESS 6 brightness input

RC2 7 setting for frequency reduction

RC 8 frequency setting

PWMLIMIT 9 PWM limit input

ISENSE 10 current sense input for WBLEED

AUX 11 Input for voltage from auxiliary winding for timing

(demagnetization)

SOURCE 12 source of internal power switch

GND 13 ground

GND 14 ground

GND 15 ground

DRAIN 16 drain of internal power switch; input for start-up current and valley

sensing

Product data sheet Rev. 4.1 — 5 December 2011 5 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

8. Functional description

The SSL2101 is an LED driver IC that operates directly from the rectified mains.

The SSL2101 uses on-time mode control and frequency control to control the LED

brightness. The BRIGHTNESS and PWMLIMIT input of the IC can be used to control the

LED light output in combination with an external dimmer. The PWMLIMIT input can also

be used for Thermal Lumen Management (TLM) and for precision LED current control.

8.1 Start-up and UnderVoltage LockOut (UVLO)

Initially, the IC is self-supplying from the rectified mains voltage. The IC st arts switchi ng as

soon as the volt age on pin VCC passes the VCC(startup) le vel. The supply can be t aken over

by the auxiliary winding of the transformer as soon as VCC is high enough and the supply

from the line is stopped for high efficiency operation. Alternatively the IC can be supplied

via a bleeder resistor connected to a high voltage. Note however the maximum VCC

voltage rating of the IC.

If for some reason the auxiliary supply is not sufficient, the high-voltage supply can also

supply the IC. As soon as the voltage on pin VCC drops below the VCC(UVLO) level, the IC

stops switching and will restart from the rectified mains voltage, if the internal current

delivered is sufficient.

8.2 Oscillator

An internal oscillator inside the IC provides the timing for the switching converter logic.

The frequency of the oscillator is set by the external resistors and the capacitor on pin RC

and pin RC2. The external capacitor is charged rapidly to the VRC(max) level and, starting

from a new primary stroke, it discharges to the VRC(min) level. Because the discharge is

exponential, the relative sensitivity of the duty factor to the regulation voltage at low duty

factor is almost equal to the sensitivity at high duty factors. This results in a more constant

gain over the duty factor range comp ared to Phase Width Modulated (PWM) systems with

a linear sawtooth oscillator. Stable operation at low duty factors is easily realized. The

frequency of the converter when VBRIGHTNESS is high can be estimated usin g Equation 1:

(1)

R equals the parallel resist ance of both oscillator resistors. C is the capacitor connected at

the RC pin (pin 8).

The BRIGHTNESS input controls the frequency reduction mode. Figure 3 shows that the

oscillator switches over from an RC curve with R1 in parallel with R2 to R1 only. A low

BRIGHTNESS voltage will reduce the switching frequency.

RC 1

3.5

------- 1

fosc

-------- tch earg

–





=

Product data sheet Rev. 4.1 — 5 December 2011 6 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

A typical RC waveform is given in Figure 4. The RC switch-over threshold is co ntrolled by

the BRIGHTNESS pin.

To ensure that the capacitor can be charged within the charge time, the value of the

oscillator capacitor should be limited to 1 nF. Due to leakage current, the value of the

resistor connected betwe en the RC pin a nd the ground should be limited to a maximum of

220 k.

8.3 Duty factor control

The duty factor is controlled by an internally regulated voltage and the oscillator signal on

pin RC. The internal regulation voltage is set by the voltage on the PWMLIMIT pin.

A low PWMLIMIT voltage will results in a low on-time for the internal power switch. The

minimum duty factor of th e switched mode power supply ca n be set to 0 %. The maximum

duty factor is set to 75 %.

Fig 3. Brightness control block

Fig 4. Brightness timing waveform

STARplug

OSCILLATOR

24 μA

5 V

rc_threshold

Comparator

10 kΩ

220 kΩ

330 pF

BRIGHTNESS

RC2

014aaa574

time 014aaa582

rc_threshhold

75 mV

RC voltage

Voltage

(mV)

Product data sheet Rev. 4.1 — 5 December 2011 7 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

8.4 Bleeder for dimming applications

The SSL2101 IC contains some circuitry intended for mains dimmer compatibility. This

circuit contains two current sinks that are called bleeders. A strong bleeder is used for

zero-cross reset of the dimmer and triac latching. A weak bleeder is added to ma intain the

hold current through the dimmer.

The strong bleeder switch is switched on when the maximum voltag e on pin WBLEED and

SBLEED is below the Vth(SBLEED) level (52 V typically). The weak bleeder switch is

switched on as soon as the voltage on pin ISENSE exceeds the Vth(high)(ISENSE) level

(100 mV typically). The weak bleeder switch is switched off when the ISENSE voltage

drops below the Vth(low)(ISENSE) level (250 mV typically). The weak bleeder switch is also

switched off when the strong bleeder switch is switched on. See Figure 5.

8.5 Valley switching

A new cycle is started when the primary switch is switched on (see Figure 6). Af ter a time

determined by the oscillator voltage, RC and the internal regulation level, the switch is

turned off and the secondary stroke starts. The internal regulation level is determined by

the voltage on pin PWMLIMIT.

After the secondary stroke, the drain voltage shows an oscillation with a frequency of

approximately:

(2)

where:

Lp = primary self inductance

Cp = parasitic capacitance on drain node

Fig 5. Bleeder circuit

014aaa571

WBLEED SBLEED

D2 D3

20 μA

LOW V DETECT

−0.1 V

−0.25 V

ISENSE GND

M2 M1

Integrated

2 LpCp



----------------------------------------------

Product data sheet Rev. 4.1 — 5 December 2011 8 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

As soon as the oscillator voltage is high again and the secondary stroke has ended, the

circuit waits for a low drain voltage before starting a new primary stroke.

Figure 6 shows the drain volt age together with the valley signal, the signal indicating the

secondary stroke and the RC voltage.

The primary stroke starts some time before the actual valley at low ringing frequencies,

and some time after the actu al valle y at high ring ing fre qu en cie s.

Figure 7 shows a typical curve for a reflected output voltage N at an output voltage of

80 V. This voltage is the output voltage transferred to the primary side of the transformer

with the factor N (determined by the turns ratio of the transformer). It shows that the

system switches exactly at minimum drain voltage for rin ging frequencies of 480 kHz, thus

reducing the switch-on losses to a minim um. At 200 kHz, the next primary stroke is started

at 33 before the valley. The switch-on losses are still reduced significantly.

A: Start of new cycle with valley switching.

B: Start of new cycle in a classical PWM system.

Fig 6. Signals for valley switching, flyback configuration

014aaa572

drain

valley

secondary

ringing

secondary

stroke

primary

stroke

secondary

stroke

oscillator regulation level

Product data sheet Rev. 4.1 — 5 December 2011 9 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

8.6 Demagnetization

The system operates in discontinuous conduction mode if the AUX pin is connected. As

long as the secondary stroke has not ended, the oscillator will not start a new primary

stroke. During the first tsup(xfmr_ring) seconds, demagnetization recognition is suppressed.

This suppression may be necessary in applications where the transformer has a large

leakage inductance and at low output voltages.

8.7 Overcurrent protection

The cycle-by-cycle pea k drain current limit cir cuit uses the external source resistor RSENSE

to measure the current. The circuit is activate d after the leading edge blanking time tleb.

The protection cir cuit limit s the source voltag e over the R SENSE1 resistor to Vth(ocp)SOURCE,

and thus limits the primary peak current.

8.8 Short-winding protection

The short-winding protection circuit is also activated after the leading edge blanking time.

If the source voltage exceeds the short-winding protection threshold voltage

Vth(swp)SOURCE, the IC stops switching. Only a power-on reset will restart normal operation.

The short-winding protection also protects in case of a secondary diode short circuit.

8.9 Overtemperature protection

Accurate temperatur e protection is provided in the device. Whe n the junction temperature

exceeds the thermal shut-down temperature, the IC stops switching. During thermal

protection, the IC cu rr ent is lowere d to th e start-up cur rent . Th e IC con tin u es nor ma l

operation as soon as the overtemperature situation has disappeared.

Fig 7. Typical phase of drain ringing at switch-on (at N Vo=80V)

0 200 400 800

f (kHz)

phase

(°)

−20

−40

014aaa573

600

1. RSENSE is the resistor between the SOURCE pin and GND

Product data sheet Rev. 4.1 — 5 December 2011 10 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

9. Limiting values

Table 4: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured

with respect to ground; positive currents flow into the device; pins VCC and RC cannot be current

driven. Pins ISENSE and AUX cannot be voltage driven.

Symbol Parameter Conditions Min Max Unit

Voltages

VCC supply voltage continuous 0.4 +40 V

VRC voltage on pin RC 0.4 +3 V

VRC2 voltage on pin RC2 0.4 +3 V

VBRIGHTNESS voltage on pin BRIGHTNESS 0.4 +5 V

VPWMLIMIT voltage on pin PWMLIMIT 0.4 +5 V

VSOURCE voltage on pin SOURCE 0.4 +5 V

VDRAIN voltage on pin DRAIN DMOS power

transistor;

Tamb =25C

0.4 +600 V

VSBLEED voltage on pin SBLEED off-state;

Tj= 125 C0.4 +600 V

on-state;

VVCC >8.5V;

Tj< 125 C

0.4 +16 V

VWBLEED voltage on pin WBLEED off-state;

Tj< 125 C0.4 +600 V

on-state;

VVCC >8.5V;

Tj< 125 C

0.4 +12 V

Currents

IISENSE current on pin ISENSE 20 +5 mA

IAUX current on pin AUX 10 +5 mA

ISOURCE current on pin SOURCE 2+2A

IDRAIN current on pin DRAIN 2+2A

General

Ptot total power dissipation Tamb =70C-1W

Tstg storage temperature 55 +150 C

Tamb ambient temp erature 40 +100 C

Tjjunction temperature 40 +150 C

Product data sheet Rev. 4.1 — 5 December 2011 11 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

[1] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.

[2] Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10  series

resistor.

[3] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each

pin down to 0 V over a 1  resistor.

10. Thermal characteristics

The heat sink in the application with the SSL2101 is made with the copper on the

Printed-Circuit Board (PCB). The SSL2101 uses thermal leads (pins 4, 5, 13, 14 and 15)

for heat transfer from die to PCB.

Enhanced thermal lead connection may drastically reduce thermal resistance.

The following equation shows the relationship between the maximum allowable power

dissipation P and the thermal resistance from junction to ambient.

Where:

Rth(j-a) = thermal resistance from junction to ambient

Tj(max) = maximum junction temperature

Tamb = ambient temperature

P = power dissipation

The thermal resist an ce as a fun ction of the PCB ar ea (Boar d: 0.8 mm thickne ss, 2 laye rs,

Bottom Cu coverage 90 %, Cu thickness 70 m

(390 W/mK), Core material conductivity: 0.5 W/mK, 10 vias dia 0.3 mm) is shown in

Figure 8

VESD electrostatic discharge voltage human body

model; [1]

Pins 16, 1, 2 1000 +1000 V

All other pins 2000 +2000 V

machine mode l [2] 200 +200 V

charged device

model [3] 500 +500 V

Table 4: Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured

with respect to ground; positive currents flow into the device; pins VCC and RC cannot be current

driven. Pins ISENSE and AUX cannot be voltage driven.

Symbol Parameter Conditions Min Max Unit

Rth j a– Tjmax

Tamb

–P=

Product data sheet Rev. 4.1 — 5 December 2011 12 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

[1] Measured on a JEDEC test board (standard EIA/JESD 51-3) in free air with natural convection.

11. Characteristics

(1) Top Cu coverage 20 %

(2) Top Cu coverage 50 %

(3) Top Cu coverage 100 %

Fig 8. SSL2101 core material conductivity

Table 5: Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from junction to ambient [1] 90 KW

PCB area (mm2)

0 1000080004000 60002000

014aaa811

100

120

Rth(j-a)

(°C/W)

(1)

(3)

(2)

Table 6: Characteristics

Tamb =25



C; no overtemperature; all voltages are measured with respect to ground; currents are

positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless

otherwise specified. Typical frequency 100 kHz.

Symbol Parameter Conditions Min Typ Max Unit

Supply

ICC supply current normal operation;

VDRAIN =60V;

VCC =20V

-1.72mA

ICC(ch) charge supply

current VDRAIN >60V;

VCC =0V -6 4.5 - mA

VCC supply voltage 8.5 - 40 V

VCC(startup) start-up supply

voltage 9.75 10.25 10.75 V

VCC(UVLO) undervoltage

lockout supply

voltage

L7.98.28.5V

Product data sheet Rev. 4.1 — 5 December 2011 13 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

IDRAIN current on pi n

DRAIN VDRAIN >60V;

no auxiliary supply -- 2.2mA

VDRAIN >60V;

with auxiliary supply - 30 125 A

VDRAIN voltage on pin

DRAIN 40 - 600 V

Pulse width modulator

min minimum duty

factor -0- %

max maximum duty

cycle f = 100 kHz - 75 - %

SOPS

Vdet(demag) demagnetization

detection voltage 50 100 150 mV

tsup(xfmr_ring) transformer

ringing

suppression time

at start of secondary

stroke 1.0 1.5 2.0 s

RC oscillator

VRC(min) minimum voltage

on pin RC 60 75 90 mV

VRC(max) maximum voltage

on pin RC 2.4 2.5 2.6 V

tch(RC) charge time on pin

RC -1- s

VBRIGHTNESS voltage on pin

BRIGHTNESS 2.5 V RC2 trip level - 0.5 - V

180 mV RC2 trip level - 1.25 - V

75 mV RC2 trip level - 2.3 - V

fosc oscillator

frequency 10 100 200 kHz

IBRIGHTNESS current on pin

BRIGHTNESS VBRIGHTNESS =0V 20 24 28 A

Bleeder

Vth(SBLEED) threshold voltage

on pin SBLEED 46 52 56 V

Vth(low)ISENSE low threshold

voltage on pin

ISENSE

-250 - mV

Vth(high)ISENSE high threshold

voltage on pin

ISENSE

-100 - mV

RDSon(SBLEED) drain-source

on-state

resistance on pin

SBLEED

ISBLEED =25 mA

Tj=25C 140 170 200 

Tj=125C 220 270 320 

Table 6: Characteristics …continued

Tamb =25



C; no overtemperature; all voltages are measured with respect to ground; currents are

positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless

otherwise specified. Typical frequency 100 kHz.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 4.1 — 5 December 2011 14 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

RDSon(WBLEED) drain-source

on-state

resistance on pin

WBLEED

IWBLEED = 10 mA

Tj=25C 250 310 350 

Tj=125C 400 500 600 

Duty factor regulator: pi n P WML IMI T

IPWMLIMIT current on pin

PWMLIMIT 25 - 18 A

VPWMLIMIT voltage on pin

PWMLIMIT maximum duty cycle =

3V -3- V

minimum duty factor

threshold -0.45- V

Valley switching

(V/t)vrec valley recognition

voltage change

with time

minimum absolute

value [1] -100- V/s

fring ringing frequency N VO= 100 V 200 550 800 kHz

td(vrec-swon) valley recognition

to switch-on delay

time

-150- ns

Current and short circuit winding protection

Vth(ocp)SOURCE overcurrent

protection

threshold voltage

on pin SOURCE

dV/dt = 0.1 V/s 0.47 0.50 0.53 V

Vth(swp)SOURCE short-winding

protection

threshold voltage

on pin SOURCE

dV/dt = 0.1 V/s-1.5-V

td(ocp-swoff) delay time from

overcurrent

protection to

switch-off

dV/dt = 0.5 V/s - 160 185 ns

tleb leading edge

blanking time 250 350 450 ns

FET output stage

IL(DRAIN) leakage current on

pin DRAIN VDRAIN = 600 V - - 125 A

VBR(DRAIN) breakdown

voltage on pin

DRAIN

Tamb =25C600--V

RDSon drain-source

on-state

resistance

power switch;

ISOURCE =0.50 A

Tj=25C4.506.57.5

ISOURCE =0.20 A

Tj=125C-9.510

Table 6: Characteristics … continued

Tamb =25



C; no overtemperature; all voltages are measured with respect to ground; currents are

positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless

otherwise specified. Typical frequency 100 kHz.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 4.1 — 5 December 2011 15 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

[1] Voltage change in time for valley recognition.

tf(DRAIN) fall time on pin

DRAIN input voltage: 300 V;

no external capacitor at

drain

-75- ns

Temperature protection

Totp overtemperature

protection trip junction temperature 150 160 170 C

Totp(hys) overtemperature

protection trip

hysteresis

junction temperature - 2 - C

Fig 9. Typical frequency as a function of voltage on pin BRIGHTNESS

Table 6: Characteristics …continued

Tamb =25



C; no overtemperature; all voltages are measured with respect to ground; currents are

positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless

otherwise specified. Typical frequency 100 kHz.

Symbol Parameter Conditions Min Typ Max Unit

BRIGHTNESS

(V)

0 321

014aaa664

100

osc

(kHz)

max

min

Product data sheet Rev. 4.1 — 5 December 2011 16 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

VBRIGHTNESS = 3 V

Fig 10. Turn-on time as a function of voltage on pin PWML IM IT

VBRIGHTNESS = 1 V

Fig 11. Turn-on time as a function of voltage on pin PWML IM IT

PWMLIMIT

(V)

0 321

014aaa665

(μs)

VPWMLIMIT (V)

ton

(μs)

0 321

014aaa666

120

Product data sheet Rev. 4.1 — 5 December 2011 17 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

12. Application information

Fig 12. Buck configuration for SSL2101

ISENSE

AUX

SRC

DRAIN

SBLEED

RC2

GND

VCC

WBLEED

BRIGHTNESS

PWMLIMIT

VCC

SSL2101

MAINS

VCC

TLM

Dim range

014aaa569

Product data sheet Rev. 4.1 — 5 December 2011 18 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

Further application information can be found in the SSL2101 application notes.

Fig 13. Flyback configuration for SSL2101

ISENSE

AUX

SRC

DRAIN

SBLEED

RC2

GND

VCC

WBLEED

BRIGHTNESS

PWMLIMIT

SSL2101

Mains

Precision current 014aaa570

Product data sheet Rev. 4.1 — 5 December 2011 19 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

13. Package outline

Fig 14. Package outline SOT109-1 (SO16)

detail X

vMA

(A )

pin 1 index

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 10.0

9.8 4.0

3.8 1.27 6.2

5.8 0.7

0.6 0.7

0.3 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0

0.4

SOT109-1 99-12-27

03-02-19

076E07 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.39

0.38 0.16

0.15 0.05

1.05

0.041

0.244

0.228 0.028

0.020 0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

0 2.5 5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

Product data sheet Rev. 4.1 — 5 December 2011 20 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

14. Revision history

Table 7: Revis ion history

Document ID Release date Data sheet status Change notice Supersedes

SSL2101 v.4.1 20111205 Product data sheet - SSL2101 v.4

Modifications: •GreenChip trademark has been added .

•Section 1 “General description” has been updated.

•Section 2 “Features and benefits” has been updated.

•Section 3 “Applications” has been updated.

SSL2101 v.4 20090828 Product data sheet - SSL2101 v.3

SSL2101 v.3 20090525 Product data sheet - SSL2101 v.2

SSL2101 v.2 20090511 Preliminary da ta sheet - SSL2101 v.1

SSL2101 v. 1 20090109 Preliminary data sheet - -

Product data sheet Rev. 4.1 — 5 December 2011 21 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

15. Legal information

15.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyon d those described in the

Product data sheet.

15.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative li ability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconduct ors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descripti ons, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suit able for use in life support, life-crit ical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the appl ication or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from competent authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the obj ective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 4.1 — 5 December 2011 22 of 23

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for automo tive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed produ ct claims result ing from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

15.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

GreenChip — is a trademark of NXP B.V.

16. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors SSL2101

Dimmable Greenchip driver for LED lighting

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 5 December 2011

Document identifier: SSL2101

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

17. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 5

8.1 Start-up and UnderVoltage LockOut (UVLO) . . 5

8.2 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3 Duty factor control . . . . . . . . . . . . . . . . . . . . . . 6

8.4 Bleeder for dimming applications . . . . . . . . . . . 7

8.5 Valley switching . . . . . . . . . . . . . . . . . . . . . . . . 7

8.6 Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 9

8.7 Overcurrent protection . . . . . . . . . . . . . . . . . . . 9

8.8 Short-winding protection. . . . . . . . . . . . . . . . . . 9

8.9 Overtemperature protection . . . . . . . . . . . . . . . 9

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10

10 Thermal characteristics . . . . . . . . . . . . . . . . . 11

11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12

12 Application information. . . . . . . . . . . . . . . . . . 17

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19

14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20

15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21

15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21

15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 21

15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22

16 Contact information. . . . . . . . . . . . . . . . . . . . . 22

17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23