Dimensions are in inches [mm]
HDLP Series
3 / 21
www.hypertronics.com
High Density Low Profile
Connectors
• High density contact arrangement
• Light weight Low profile mated height
• Surface mount termination technology
• Miniature hyperboloid socket contacts
• Interfacial seal
• Polarized and scoop proof
• Pick and place compatible
General Specifications
Insulator Material Liquid crystal polymer (LCP)
Contact Material Copper alloy
Socket Wire Material Beryllium copper
Interfacial Seal Material Fluorosilicone
Guides Material Stainless steel
Contact Plating ASTM-488-B
(Type II, grade C, Class 1)
Contact Resistance 8 milliohms max.
Current Rating 2 Amps per contact
Contact Life Cycles 2,000+ operations
Extraction Forces 1.0 oz.
Temperature Range -55° C to 125° C
Voltage Rating 110 VDC or AC peak nomial
Contact Diameter 0.015 [0.39]
* PLATING THICKNESS
These values apply to mating surfaces.
Contact Plating Finishes
Connector Finish
Ordering Code Description Component Component Finish
Ordering Code Conforms To Plating Thickness*
UGold Plate
Socket -/9 ASTM-488-B
(Type II, Grade C, Class 1)
1.27 µm gold plate min.
50 µin gold plate min.
Pin -/7 ASTM-488-B
(Type II, Grade C, Class 1)
1.27 µm gold plate min.
50 µin gold plate min.
Current Rating
The Hypertac®contact design and manufacturing toler-
ances endow the product with the following attributes:
• Double the current rating of other contact designs
of similar size
• Low contact resistance in high current applications
minimizes temperature rise thereby enabling higher
density interconnects
HYP_08_3rec13.qxd:Layout 1 8/6/08 4:48 PM Page 21
HDLP Series
3 / 22 www.hypertronics.com
Dimensions are in inches [mm]
Straight Male
Number of Contacts 30 58 90 118
Single Double Single Double Single Double Single Double
Dimension A 0.657 [16.70] –1.070 [27.20] –1.543 [39.20] –1.957 [49.70] –
Dimension B 0.923 [23.45] –1.337 [33.95] –1.809 [45.95] –2.222 [56.45] –
Dimension C 0.090 [2.28] 0.270 [6.85] 0.090 [2.28] 0.270 [6.85] 0.090 [2.28] 0.270 [6.85] 0.090 [2.28] 0.270 [6.85]
Dimension D 0.243 [6.18] 0.423 [10.75] 0.243 [6.18] 0.423 [10.75] 0.243 [6.18] 0.423 [10.75] 0.243 [6.18] 0.423 [10.75]
Dimension E 0.795 [20.20] –1.209 [30.70] –1.681 [42.70] –2.094 [53.20] –
HDLP Insulators
Straight Male
HYP_08_3rec13.qxd:Layout 1 8/6/08 4:48 PM Page 22
Dimensions are in inches [mm]
HDLP Series
3 / 23
www.hypertronics.com
Straight Female
Number of Contacts 30 58 90 118
Dimension A 0.657 [16.70] 1.070 [27.20] 1.543 [39.20] 1.957 [49.70]
Dimension B 0.858 [21.80] 1.272 [32.30] 1.744 [44.30] 2.157 [54.80]
Dimension E 0.795 [20.20] 1.209 [30.70] 1.681 [42.70] 2.094 [53.20]
HDLP Insulators
Straight Female
HYP_08_3rec13.qxd:Layout 1 8/6/08 4:48 PM Page 23
HDLP Series
3 / 24 www.hypertronics.com
Dimensions are in inches [mm]
HDLP Insulators
90° Male
90° Male
Number of Contacts 30 58 90 118
Dimension A 0.657 [16.70] 1.070 [27.20] 1.543 [39.20] 1.957 [49.70]
Dimension B 0.923 [23.45] 1.337 [33.95] 1.809 [45.95] 2.222 [56.45]
HYP_08_3rec13.qxd:Layout 1 8/6/08 4:48 PM Page 24
Dimensions are in inches [mm]
HDLP Series
3 / 25
www.hypertronics.com
HDLP Contact Terminations
Termination Style Dimension A
H0.089 [2.26]
J0.124 [3.16]
K0.152 [3.86]
Termination Style Dimension A
C0.089 [2.26]
D0.124 [3.16]
E0.152 [3.86]
Termination Style Dimension A
C0.089 [2.26]
D0.124 [3.16]
E0.152 [3.86]
Male 90° Printed Circuit Board
Female SMTMale SMT
Female Vertical Printed Circuit BoardMale Vertical Printed Circuit Board
HYP_08_3rec13.qxd:Layout 1 8/6/08 4:48 PM Page 25
HDLP Series
3 / 26 www.hypertronics.com
Dimensions are in inches [mm]
HDLP Part Number Configurator
HDLP 1 1 F 0P0U H AA030
Series HDLP Standard
Variations
(Male and Female Printed Circuit
Board Variants)
0P0 = Back potted terminations
and fitted with interfacial
seal (preferred)
0PX = Tinned and back potted
and fitted with interfacial seal
0PC = Back potted, coated to
conformity and fitted with
interfacial seal
NP0 = Back potted terminations
(preferred)
NPX =Tinned and back potted
NPC =Back potted and coated
to conformity
Contact
Termination
C = Through board solder-Straight PC Tail – 2.26mm Long
D = Through board solder-Straight PC Tail – 3.16mm Long
E = Through board solder-Straight PC Tail – 3.86mm Long
H = Through board solder- 90° PC Tails – 2.26mm Long
J = Through board solder- 90° PC Tails – 3.16mm Long
K = Through board solder- 90° PC Tails – 3.86mm Long
Q = Surface Mount - Straight
(Contact factory for more details)
Alignment
Pips
1 = With
2 = Without
Default is 2 if insulator
style is 9
Contact
Plating
U = Standard gold plating
50µin gold plating over
50µin nickel plating over
10µin copper flash
S = Gold plate with tin dipped
terminations (PC tail only)
Contact
Gender
M = Male
F = Female
Number of
Contacts
030 = 30
058 = 58
090 = 90
118 = 118
Guide
Hardware
AA = No guide hardware
B- = Locking socket
C- = Not yet defined
D- = Locking post
E- = Not yet defined
F- = Polarizing socket
G- = Not yet defined
H- = Polarizing Pin
I- = Not yet defined
J- = Connector to board fixing
K- = Not yet defined
L- = Guide socket
M- = Not yet defined
O- = Guide Pin
P- = Not yet defined
Q- = Polarized transverse mounting
(Contact factory for more details)
Insulator
Height/Style
1 = Single
2 = Double
9 = 90°
Default is 9 for 90°
contact termination
(90° female not
currently available)
HYP_08_3rec13.qxd:Layout 1 8/6/08 4:48 PM Page 26
