(P-KAB-E003)
Type KAB micro fuse is designed for circuit protection against excessive current in portable electronic equipment, electronic circuit
around battery, etc. because the demand for high capacity batteries is increasing.
Further miniaturization and low profile with extended rated range can be used for wider application.
Also, the ecology design of Type KAB is friendly to environment due to complete lead free.
1. New type fuses were developed by our original technology. They show no variation in fusing characteristics and have excellent
fast-blow capability.
2. Surface temperature rise is 75°C or less when applying rated current. This offers less influence on the peripheral units.
3. The fuses come in ultra-small size 1608 (1.6×0.8×0.45 mm) and 2012 (2.0×1.25×0.5 mm).
4. Suitable for automatic mounting
5. Precise dimensions allows high-density mounting and symmetrical construction of terminals provide “Self-Alignment”.
6. Resistance to soldering heat : Reflow or flow soldering 10 seconds at 260°C
7. High accuracy carrier tape by using pressed pocket paper ensures excellent mounting.
8. LEAD-FREE and RoHS Compliant
ORDERING INFORMATION
RATING
K A B 3 2 0 2 1 0 2 N A 2 9 0 1 0
FEATURES
TYPE
KAB
Item
Category Temperature Range
1.6×0.8 0.2-0.25-0.315-0.4-0.5-0.63-0.8-1.0-1.25-1.6-2.0-2.5-3.15-4.0-5.0-6.3A
2.0×1.25 0.2-0.25-0.315-0.4-0.5-0.63-0.8-1.0-1.25-1.6-2.0-2.5-3.15-4.0-5.0A
Rated Voltage
Voltage Drop
Insulation Resistance
Fusing Characteristics
　 Breaking voltage：24V, 32V, 50V
Clearing Characteristics 　 Breaking current：50A
24VDC, 32VDC, 50VDC
Rating
　　-40 ～ +125℃
　 Fusing within 1 min if the current is 200% of rated current.
Rated Current
Refer to CATALOG NUMBERS AND RATING
1000MΩ or more
Type Code Voltage Code Rated current Code Rated current Code Packaging type Code Case size Special product code
KAB 2402 24V 201 0.2 A 132 1.25 A NA φ180 Real 29 1.6 × 0.8
3202 32V 251 0.25 A 162 1.6 A 31 2.0 × 1.25
5002 50V 321 0.315 A 202 2.0 A
401 0.4 A 252 2.5 A
501 0.5 A 322 3.15 A
631 0.63 A 402 4.0 A
801 0.8 A 502 5.0 A
102 1.0 A 632 6.3 A
※
The special product code 010 indicates lead-free terminals.
010※
1
CONSTRUCTION
CATALOG NUMBERS AND RATING
MARKING
RECOMMENDED PAD
DIMENSIONS
STANDARD TEST BOARD
DIMENSIONS
100 mm
33 mm
5 mm
a mm
C
a
b
1
WL
PP
T
P P
Code : Rated current Code : Rated current
P : 0.2 A W : 1.25 A
Q : 0.25 A X : 1.6 A
R : 0.315A 2 : 2.0 A
S : 0.4 A Y : 2.5 A
T : 0.5 A 3 : 3.15 A
U : 0.63 A 4 : 4.0 A
V : 0.8 A 5 : 5.0 A
1 : 1.0 A 6 : 6.3 A
Name Material
Fuse element Copper alloy
Body Alumina ceramic
Protective coating Silicone resin
Terminal Tin plating
Fuse
element
Protective
coating
Terminal
Body
Size 1608 Size 2012
a 1.0 1.4
b 1.2 1.65
c 1.0 1 .2
(mm)
Case size Size a
1608 1.2
2012 1.5
(mm)
Glass epoxy on one side
Copper layer : 35
m
m
Board thickness : 1.6mm
Main Body : Alumina ceramic
Terminal：Tin plating
(mm)
Case size Case code L W T max. P
1608 29 1.6 ± 0.1 0.8 ± 0.1 0.45 0.3 ± 0.2
2012 31 2.0 ± 0.1 1.25 ± 0.1 0.5 0.3 ± 0.2
January, 2013
Catalog number Case size Rated current
A
Internal resistance
mΩ
（Typical）
Voltage drop
mV
(Max.)
Rated voltage
VDC Breaking current
A
KAB　5002　201　□□29　010※1.6×0.8 0.2 1260 405
KAB　5002　251　□□29　010 1.6×0.8 0.25 825 355
KAB　5002　321　□□29　010 1.6×0.8 0.315 530 275
KAB　5002　401　□□29　010 1.6×0.8 0.4 320 180
KAB　5002　501　□□29　010 1.6×0.8 0.5 210 140
KAB　3202　631　□□29　010 1.6×0.8 0.63 135 115
KAB　3202　801　□□29　010 1.6×0.8 0.8 100 110
KAB　3202　102　□□29　010 1.6×0.8 1.0 80 110
KAB　3202　132　□□29　010 1.6×0.8 1.25 60 110
KAB　3202　162　□□29　010 1.6×0.8 1.6 46 110
KAB　3202　202　□□29　010 1.6×0.8 2.0 35 110
KAB　2402　252　□□29　010 1.6×0.8 2.5 27 110
KAB　2402　322　□□29　010 1.6×0.8 3.15 20 110
KAB　2402　402　□□29　010 1.6×0.8 4.0 15 110
KAB　2402　502　□□29　010 1.6×0.8 5.0 13 110
KAB　2402　632　□□29　010 1.6×0.8 6.3 10 110
KAB　2402　201　□□31　010 2.0×1.25 0.2 1740 480
KAB　2402　251　□□31　010 2.0×1.25 0.25 1280 475
KAB　2402　321　□□31　010 2.0×1.25 0.315 800 375
KAB　2402　401　□□31　010 2.0×1.25 0.4 440 255
KAB　2402　501　□□31　010 2.0×1.25 0.5 260 170
KAB　2402　631　□□31　010 2.0×1.25 0.63 175 150
KAB　2402　801　□□31　010 2.0×1.25 0.8 120 145
KAB　2402　102　□□31　010 2.0×1.25 1.0 90 135
KAB　2402　132　□□31　010 2.0×1.25 1.25 67 130
KAB　2402　162　□□31　010 2.0×1.25 1.6 48 120
KAB　2402　202　□□31　010 2.0×1.25 2.0 36 115
KAB　2402　252　□□31　010 2.0×1.25 2.5 28 110
KAB　2402　322　□□31　010 2.0×1.25 3.15 21 105
KAB　2402　402　□□31　010 2.0×1.25 4.0 16 95
KAB　2402　502　□□31　010 2.0×1.25 5.0 10 60
※For taping specification, the package code (NA) is entered □□. One reel contains 5000 pcs.
UL/cUL approved File No.E17021
50
50
24 50
24
32
2
No.
Item Performance Test method
1 Temperature rise Temperature rise shall not exceed 75°C. Apply rated current.
2 Current-carrying capacity Shall not open within 1 hour. Apply rated current.
3 Clearing characteristics Arc shall not be continued.
Marking shall be legible. Breaking voltage : Rated voltage
Breaking current : 50 A
4 Voltage drop Voltage drop is below the value specified in CATALOG
NUMBERS AND RATING. Apply rated current.
5 Fusing characteristics Fusing within 1 min. Apply 200% of rated current.
(Ambient temperature : 10 ~ 30°C)
6 Insulation resistance 1000 MΩ or more Insulation resistance between terminals and case
(alumina ceramic)
7 Electrode strength
(Bending) No mechanical damage.
Resistance change after the test shall be within ± 20%
Board supporting width : 90 mm
Bending speed : Approx. 0.5 mm/sec
Duration : 30 sec
Bending : 3 mm
8 Shear test No mechanical damage.
Resistance change after the test shall be within ± 20%
Applied force : 20 N (2.04 kgf)
Duration : 10 sec
Tool : R0.5
Direction of the press : side face
9 Substrate bending test No mechanical damage.
Resistance change after the test shall be within ± 20%
Supporting dimension : 1.2 mm (size 2012)
0.8 mm (size 1608)
Applied force : 10 N (1.02 kgf)
Tool : R0.5
Direction of the press : thickness direction of product
10
Solderability
(Solder Wetting time) Solder Wetting time : within 3sec.
Solder : Sn–3Ag–0.5Cu
Temperature : 245 ± 3°C
meniscograph method
Solder : JISZ3282 H60A, H60S, H63A
Temperature : 230 ± 2°C
meniscograph method
11
Solderability
(new uniform coating of solder) The dipping surface of the terminals shall be covered
more than 95% with new solder.
Solder : Sn–3Ag–0.5Cu
Temperature : 245 ± 3°C
Dipping : 3 sec.
Solder : JISZ3282 H60A, H60S, H63A
Temperature : 230 ± 2°C
Dipping : 3 sec.
12
Resistance to soldering heat Marking shall be legible.
No mechanical damage.
Resistance change after the test shall be within ± 20%
Dipping (1 cycle)
Preconditioning : 100 ~ 150°C, 60 sec
Temperature : 265 ± 3°C /6 ~ 7 sec
Reflow soldering (2 cycles)
Preconditioning : 1 ~ 2 min, 180°C or less
Peak : 260°C max, 5 sec
Holding : 230 ~ 250°C, 30 ~ 40 sec
Cooling : more than 2 min
Manual soldering
Temperature : 400 ± 10°C
Duration : 3 ~ 4 sec
Measure after 1 hour left under room temp. and humidity.
13
Solvent resistance Marking shall be legible.
No mechanical damage.
Resistance change after the test shall be within ± 20%
Dipping rinse
Solvent : Isopropyl alcohol
Duration : 90 sec
14
Ultrasonic Cleaning Marking shall be legible.
No mechanical damage.
Resistance change after the test shall be within ± 20%
Ultrasonic : 20mW/cm
2
28kHz
Solvent : Isopropyl alcohol
Duration : 60 sec
15
Vibration No mechanical damage.
Resistance change after the test shall be within ± 20%
Frequency range : 10 ~ 55 ~ 10 Hz/min
Vibration amplitude : 1.5 mm
Duration : 2 hours in each of XYZ directions (total : 6 hours)
16
Shock No mechanical damage.
Resistance change after the test shall be within ± 20%
Peak value : 490 m/s
2
(50 G)
Duration : 11 m sec
6 aspects × 3 times (total : 18 times)
17
Thermal shock No mechanical damage.
Resistance change after the test shall be within ± 20%
–55 ± 3°C : 30 min
Room temperature : 2 ~ 3 min or les
125 ± 2°C : 30 min
Room temperature : 2 ~ 3 min or less
Repeat above step for 10 cycles.
18
Atomizing salt water No mechanical damage.
Resistance change after the test shall be within ± 20%
Temperature : 35 ± 2°C
Concentration (weight ratio) : 5 ± 1%
Duration : 24 hours
19
Moisture resistance No mechanical damage.
Resistance change after the test shall be within ± 20%
Temperature : 85 ± 3°C
Humidity : 85 ± 5% RH
Duration : 1000 hours
20
Load life No mechanical damage.
Resistance change after the test shall be within ± 20%
Temperature : 85 ± 2°C
Applied current : Rated current × 70%
Duration : 1000 hours
21
Stability No mechanical damage.
Resistance change after the test shall be within ± 20% Temperature : 125 ± 2°C
Duration : 1000 hours
22
Accelerated damp heat
steady state No mechanical damage.
Resistance change after the test shall be within ± 20%
Temperature : 85 ± 3°C
Humidity : 85 ± 5% RH
Applied current : Rated current × 70%
Duration : 1000 hours
PERFORMANCE
3
FUSING CHARACTERISTICS
Reference
Size 1608
0.50A
0.80A
1.00A
1.25A
1.60A
2.00A
2.50A
3.15A
4.00A
0.20A
0.25A
0.315A
0.40A
0.63A
5.00A
6.30A
0.0001
0.001
0.01
0.1
1
10
100
0.1 1 10 100
Applied current (A)
Fusing time (sec)
Size 2012
0.50A
0.80A
1.00A
1.25A
1.60A
2.00A
2.50A
3.15A
4.00A
0.20A
0.25A
0.315A
0.40A
0.63A
5.00A
0.0001
0.001
0.01
0.1
1
10
100
0.1 1 10 100
Applied current (A)
Fusing time (sec)
4
I
2
T
–
T CHARACTERISTICS
Referen
ce
Size 1608
0.50A
0.80A
1.00A
1.25A
1.60A
2.00A
2.50A
3.15A
4.00A
0.20A
0.25A
0.315A
0.40A
0.63A
5.00A
6.30A
0.0001
0.001
0.01
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10
Fusing time(sec)
Joule integral (Ａ２ｓ)
Size 2012
0.50A
0.80A
1.00A
1.25A
1.60A
2.00A
2.50A
3.15A
4.00A
0.20A
0.25A
0.315A
0.40A
0.63A
5.00A
0.0001
0.001
0.01
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10
Fusing time (sec)
Joule integral (A２ｓ)
5
DISTRIBUTION OF FUSING CHARACTERISTICS
DISTRIBUTION OF FUSING TIME
KAB 2402 102 n：1158 pcs.
KAB 2402 102 n：100 pcs.
0.0001
0.001
0.01
0.1
1
0 20 40 60 80 100
Number of pieces
Fusing time (sec)
4 00 % o f rat ed c urr en t l s applle d.
200% of rated current ls applled.
0.0001
0.001
0.01
0.1
1
10
100
0.1 1 10 100
Applied current（A)
Fusing time (sec)
6
Determine the rated value of the micro fuse, and select the correct micro fuse for your circuit. If you select the correct micro fuse,
safety of your circuit can be ensured.
How to determine the rated value of the micro fuse is described below :
■ Flow for fuse selection
1. Measurement of circuit values using acute device
Measure the circuit values, such as operating current of the circuit.
2. Calculation from operating current
From the obtained operating current and the category temperature, calculate the minimum rated value to determine the
applicable fuse.
3. Calculation from overload current
From the obtained overload current, calculate the maximum rated value to determine the applicable fuse.
4. Calculation from inrush current
From the inrush current, calculate the minimum rated value to determine the applicable fuse.
5. Final determination of rated value
From the calculation results of steps 2 through 4, determine the rated value.
6. Operation check using actual device
After selecting the rating, confirm if the device works properly under the pre-determined conditions.
■ Fuse selection
1. Measurement of circuit values using actual device
Before determining the rated value of the fuse, preliminarily measure the following using the actual device.
1–1 Operating current
Using an oscilloscope or equivalents, measure the operating current of the circuit.
1–2 Overload current
Using an oscilloscope or equivalents, measure the overload current that needs to break the circuit.
1–3 Inrush current
Using an oscilloscope or equivalents, measure the inrush current of the circuit at power-on or power-off. In addition, determine
the number of inrush current applied.
1–4 Category temperature
Measure the ambient temperature of the fuse circuit.
EXAMPLE TO SELECT RATINGS OF TYPE KAB
<Fuse selection>
Effective operating current : 1.2 A
Effective overload current : 6.0 A
Inrush current waveform : Fig. A
(Pulse width : 1 ms, Wave height : 6.0 A)
Numbers to withstand inrush current : 100,000 times
Category temperature : 85°C
2. Calculation from operating current
2–1 Measurement of operating current
Using an oscilloscope or equivalents, measure operating current (effective current) of the actual circuit.
Example : Effective operating current = 1.2 A
2–2 Derating
①Temperature derating factor
Using Fig. B, find the temperature derating factor correspond to the temperature.
②Rated derating factor
Rated derating factor = 0.75
Use Formula 1 to calculate the rated current of the fuse to be used for the circuit.
Rated current of fuse ≥ Operating current/ (①×②) ... Formula 1）
Example : Category temperature = 85°C, Operating current = 1.2 A
①Temperature derating factor = 0.90 (Refer to Fig. B.)
②Rated derating factor = 0.75
Calculation using Formula 1 :
Rated current ≥ 1.2/ (0.90×0.75) = 1.78 A
The above calculation result shows that the fuse with rated current of 1.78 A or more should be selected for this circuit.
Type KAB with rated current of 2.0 A or more can be selected.
DETERMINATION OF RATED VALUE AND SELECTION OF
MICRO FUSE (TYPE KAB)
Fig. B
Fig. A : Inrush current waveform
1ms
6.0Ａ
0
20
40
60
80
100
120
140
-50 -25 0 25 50 75 100 125
Temperature（℃）
Derating factor (%)
KAB temperature derating
7
3. Calculation from overload current
3–1 Measurement of overload current
Using an oscilloscope or equivalents, measure the overload current that needs to break the circuit.
Example : Effective overload current = 6.0 A
3–2 Calculation from overload current
Determine the rated current so that the overload current can be 2 times larger than the rated current.
Use Formula 2 to calculate the rated current of the fuse.
Rated current of fuse ≤ Overload current/2.0 ... Formula 2
Example : Overload current = 6.0 A
Use Formula 2 to calculate the rated current.
Rated current ≤ 6.0/2.0 = 3.0 A
The above calculation result shows that the fuse with rated current of 3.0 A or less should be selected for this circuit.
Type KAB, with rated current of 2.5 A or less can be selected.
4. Calculation from inrush current
4–1 Measurement of inrush current waveform
Using an oscilloscope or equivalent, measure the waveform of the inrush
current of the actual circuit.
4–2 Creation of approximate waveform
Generally, the waveform of inrush current is complicated. For this reason,
create the approximate waveform of inrush current as shown on Fig. C to
simplify calculation.
4–3 Calculation of I2t of inrush current
Calculate I2t (Joule integral) of the approximate waveform.
The formula for this calculation depends on the approximate waveform.
Refer to Table A.
Example : Pulse applied = 1 ms, Peak value = 6.0 A,
Approximate waveform = Triangular wave
Since the approximate waveform is a triangular wave, use the
following formula for calculation
I2t of rush current = 1/3×Im2 × t ... Formula 3
(Im : Peak value, t : Pulse applying time)
Use Formula 3 to calculate the I2t of the rush current :
I2t = 1/3×6×6×0.001 = 0.012 (A2s)
* Following formula is generally used for calculation of I2t as i(t) equal to current.
I 2 t＝∫0ｔｉ2（t）dt
Name Waveform I 2 t Name Waveform I 2 t
Sine wave
(1 cycle )
Trapezoidal
wave
Sine wave
(half cycle) Various
wave 1
Triangular
wave Various
wave 2
Rectangular
wave
Charge/
discharge
waveform
JOULE
-
INTEGRAL VALUES FOR EACH WAVEFORM
Fig. C : Inrush current waveform
Red line : Actual measurement waveform
Black line : Approximate waveform
1ms
6A
1
3
I m2 t1 + I m2 (t2-t1) +
I m2 (t3-t2)
1
3
I m
t
0
1
2
t
I m
0
0
t
I m
0
t
I m
0
-t τ
i (t) = I m e-t/
τ
I m
0.368 I m
I2
1t1+{I1I2+ (I1-I2) 2}
(t2-t1)+ I2
2(t3-t2)
1
3
1
3
1
3
1
3
I
m
2
t
I
m
2
t
1
2
I
m
2
t
1
2
I
m
2
t
t2
t3
I m
0
t1
t
I 2
0
I 1
t2
0 t1 t3
I 2
I 1
I
m
2
τ
1
2
I
1
I
2 t + (
I
1-
I
2)
2
t
1
3
Table A
8
4–4 Search of load ratio
①Set up the number of cycles to withstand. (generally
100,000 times)
②Obtain the load ratio from Pulse resistance characteristics.
(Fig. D)
Example : 100,000 times is required against inrush current
applied.
Determine the load ratio using Fig. D.
If the rated current is 0.2 ~ 2.0 A : 30% or less
If the rated current is 2.5 ~ 4.0 A : 26% or less
If the rated current is 5.0 ~ 6.3 A : 22% or less
4–5 Calculation from Joule integral and load ratio
Use Formula 4 to calculate the standard I2t for the fuse to be
used.
Standard I2t of fuse > (I2t of inrush current/load ratio) ..........
..........Formula 4
Example : I2t of pulse = 0.012 A2s,
Required load ratio = 30% (at 0.2 ~ 2.0 A Fuse),
26% (at 2.5 ~ 4.0 A Fuse) or
22% (at 5.0 ~ 6.3 A Fuse)
Example of 2.0 A Fuse : Use Formula 4 to calculate the
standard I2t of fuse.
Standard I2t of fuse > 0.012/0.3 = 0.04 (A2s)
The standard I2t of the fuse should be 0.04 (A2s) or more.
Since the rush pulse applied is 1 ms, obtain the intersection
of 1 ms (horizontal axis) and 0.04 A2s (vertical axis) from
Fig. E (refer to the arrow shown on Fig. E).
*Fig. E shows the Joule integral curves for size 1608. For
size 2012, use 2012 Joule integral curves(c.f.Page5) .
Select a fuse whose curve is above the intersection. Type
KAB, with rated current of 1.6 A or more should be selected.
5. Final determination of rated value
Determine the rated current of the micro fuse. The rated
current should meet all the above calculation results.
Example : Rated current of 2.0 A and 2.5 A meet the all
requirements.
6. Operation check using actual device
After selecting the rating, confirm if the device works properly
under the pre-determined conditions.
PU
LSE RESISTANCE CHARACTERISTCS
JOULE INTEGRAL VS. FUSING TIME
Fig. D
Fig. E
Joule Integral Curves for size 1608
0.50A
0.80A
1.00A
1.25A
1.60A
2.00A
2.50A
3.15A
4.00A
0.20A
0.25A
0.315A
0.40A
0.63A
5.00A
6.30A
0.0001
0.001
0.01
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10
Fusing time(sec)
Joule integral (Ａ２ｓ)
10
100
1000
10000
100000
1000000
0 10 20 30 40 50 60 70 80 90 100
Numbers of pulse resistance (cycle)
Load ratio (%)
0.2A～2.0A
2.5A
～
4.0A
5.0A
～
6.3A
9
Application Notes for Micro Fuse
1. Circuit Design
Micro Fuse should be designated only after confirming operating
conditions and Micro Fuse performance characteristics.
When determining the rated current, be sure to observe the following
items :
(1) Micro Fuse should always be operated below the rated current
(the value considered in the temperature derating rate) and voltage
specifications. According to item 2,2-2 in page 7.
(2) Micro Fuse should always be operated below the rated voltage.
(3) Micro Fuse should be selected with correct rated value to be fused
at overload current.
(4) When Micro Fuse are used in inrush current applications, please
confirm sufficiently inrush resistance of Micro Fuse.
(5) Please do not apply the current exceeding the breaking current to
Micro Fuse.
(6) Use Micro Fuse under the condition of category temperature.
(7) Micro Fuse should not be used in the primary power source.
Micro Fuse should be selected by determining the operating
conditions that will occur after final assembly, or estimating potential
abnormalities through cycle testing.
2. Assembly and Mounting
During the entire assembly process, observe Micro Fuse body
temperature and the heating time specified in the performance table.
In addition, observe the following items :
(1) Mounting and adjusting with soldering irons are not recommended
since temperature and time control is difficult.
In case of emergency for using soldering irons, be sure to observe
the conditions specified in the performance table.
(2) Micro Fuse body should not contact a soldering iron directly.
(3) Once Micro Fuse mounted on the board, they should never be
remounted on boards or substrates.
(4) During mounting, be careful not to apply any excessive
mechanical stresses to the Micro Fuse.
3. Solvents
For cleaning of Micro Fuse, immersion in isopropyl alcohol for 90
seconds (at 20 ~ 30°C liquid temp.) will not be damaged.
If organic solvents (Pine AlphaTM, Techno CareTM, Clean ThroughTM,
etc.) will be applied to the Micro Fuse, be sure to preliminarily check
that the solvent will not damage Micro Fuse.
4. Ultrasonic Cleaning
Ultrasonic cleaning is not recommended for Micro Fuse. This may
cause damage to Micro Fuse such as broken terminals which results
in electrical characteristics effects, etc. depending on the conditions.
If Ultrasonic cleaning process must be used, please evaluate the
effects sufficiently before use.
5. Caution During Usage
(1) Micro Fuse with electricity should never be touched. Micro Fuse
with electricity may cause burning due to Micro Fuse high
temperature. Also, in case of touching Micro Fuse without
electricity, please check the safety temperature of Micro Fuse.
(2) Protective eyeglasses should always be worn when performing
fusing tests. However, there is a fear that Micro Fuse will
explode during test. During fusing tests, please cover particles
not to fly outward from the board or testing fixture. Caution is
necessary during usage at all times.
6. Environmental Conditions
(1) Micro Fuse should not be operated in acid or alkali corrosive
atmosphere.
(2) Micro Fuse should not be vibrated, shocked, or pressed
excessively.
(3) Micro Fuse should not be operated in a flammable or explosive
atmosphere.
(4) Please do not use Micro fuse in the environment where dew
condensation occurs.
In case Micro fuse has to be used under the dew condensation
condition, please apply moisture-proof coating over Micro fuse.
Covering Micro fuse with moisture-proof coating may affect
electrical characteristics, please evaluate the effects sufficiently
before use.
7. Emergency
In case of fire, smoking, or offensive odor during operation, please
cut off the power in the circuit or pull the plug out.
8. Storage
(1) Micro Fuse should be stored at room temperature (-10°C ~
+40°C) without direct sunlight or corrosive atmosphere such as
H2S(hydrogen sulfide) or SO2(sulfur dioxide).
Direct sunlight may cause decolorization and deformation of the
exterior and taping.
Also, solderability will be remarkably lower in high humidity.
(2) If the products are stored for an extended period of time, please
contact Matsuo Sales Department for recommendation. The
longer storage term causes packages and tapings to worsen. If
the products will be stored for longer term, please contact us for
advice.
(3) The products in taping, package, or box should not be given
any kind of physical pressure. Deformation of taping or package
may affect automatic mounting.
9. Disposal
When Micro Fuse are disposed of as waste or “scrap”, they should
be treated as “industrial waste”. Micro Fuse contain various kinds
of metals and resins.
10. Samples
Micro Fuse received as samples should not be used in any
products or devices in the market. Samples are provided for a
particular purpose such as configuration, confirmation of electrical
characteristics, etc.
Please feel free to ask our sales department for more information on Micro Fuse.
Overseas Sales Dep： 5-3, 3-Chome, Sennari-cho, Toyonaka-shi, Osaka 561-8558, Japan Tel : 06-6332-0883 Fax : 06-6332-0920
Head Office： 5-3, 3-Chome, Sennari-cho, Toyonaka-shi, Osaka 561-8558, Japan Tel : 06-6332-0871 Fax : 06-6331-1386
URL： http://www.ncc-matsuo.co.jp/
The specifications on this catalog are subject to change without prior notice. Please inquire of our Sales
Department to confirm the specifications prior to use.
R
MATSUO
M A T S U O E L E C T R I C C O . , L T D .
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