INTEGRATED CIRCUITS DIVISION
Single Linear Optocoupler
www.ixysic.com
DS-LOC110-R09 1
LOC110
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Part Number Description
LOC110 8-Pin DIP (50/Tube)
LOC110P 8-Pin Flatpack (50/Tube)
LOC110PTR 8-Pin Flatpack (1000/Reel)
LOC110S 8-Pin Surface Mount (50/tube)
LOC110STR 8-Pin Surface Mount (1000/Reel)
Applications
Features
Description
Ordering Information
Pin Configuration
Modem Transformer Replacement With No
Insertion Loss
Digital Telephone Isolation
Power Supply Feedback Voltage/Current
Medical Sensor Isolation
Audio Signal Interfacing
Isolation of Process Control Transducers
0.01% Servo Linearity
THD -87dB Typical
Wide Bandwidth (>200kHz)
Couples Analog and Digital Signals
High Gain Stability
Low Input/Output Capacitance
Low Power Consumption
8-Pin Flatpack or DIP Package (PCMCIA
Compatible)
Machine Insertable, Wave Solderable
Surface Mount and Tape & Reel Versions Available
The LOC110 Single Linear Optocoupler features an
infrared LED optically coupled with two photodiodes.
One feedback (input) photodiode is used to generate
a control signal that provides a servomechanism
to the LED drive current, thus compensating
for the LED's nonlinear time and temperature
characteristics. The other (output) photodiode
provides an output signal that is linear with respect
to the servo LED current. The product features
wide bandwidth, high input to output isolation, and
excellent servo linearity.
Approvals
UL Recognized Component: File # E76270
CSA Certified Component: Certificate # 1175739
Certified to:
IEC 60950-1: 2005
EN 60950-1: 2006
TUV Certificate # B 09 07 49410 006
The LOC110 will be shipped using bins available at date of
order. Any bin (C - H) can be shipped. Each tube or reel will
contain one K3-sorted bin. Each device will be marked with the
designated bin.
K3 Sorted Bins
Bin C = 0.668 - 0.732
Bin D = 0.733 - 0.805
Bin E = 0.806 - 0.886
Bin F = 0.887 - 0.974
Bin G = 0.975 - 1.072
Bin H = 1.073 - 1.179
- LED
+ LED
C1
A1
N/C
N/C
C2
A2
1
2
3
4
8
7
6
5
Parameter Rating Units
LED Operating Range 2 - 10 mA
K3, Transfer Gain 0.668 - 1.179 -
Isolation, Input to Output 3750 Vrms
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R09
LOC110
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Reverse LED Voltage 5 V
Input Control Current 100 mA
Peak (10ms) 1 A
Input Power Dissipation1150 mW
Total Package Dissipation2500 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / °C
2 Derate linearly 6.67 mW / °C
Electrical Characteristics @ 25ºC
Parameter Conditions Symbol Min Typ Max Units
Input Characteristics
LED Voltage Drop IF = 2 - 10mA VF0.9 1.2 1.4 V
Reverse LED Current VR = 5V IR--10A
Coupler/Detector Characteristics
Dark Current IF=0mA, VC1-A1=VC2-A2=15V ID- 1 25 nA
K1, Servo Gain (IC1/IF)
IF=2 - 10mA, VC1-A1=VC2-A2=15V
K1 0.004 0.007 0.030 -
K2, Forward Gain (IC2/IF) K2 0.004 0.007 0.030 -
K3, Transfer Gain (K2/K1=IC2/IC1) K3 0.668 1 1.179 -
K3, Transfer Gain Linearity (non-servoed) IF=2 - 10mA K3 - - 1 %
K3 Temperature Coefficient IF=2 - 10mA, VC1-A1=VC2-A2= 5V K3/T - 0.005 - % / ºC
Common-Mode Rejection Ratio V=20VP-P , RL=2k, f=100Hz CMRR - 130 - dB
Total Harmonic Distortion f0=350Hz, 0dBm THD -96 -87 -80 dB
Frequency Response 1Photoconductive Configuration f-3dB -200 - kHz
Photovoltaic Configuration 40
Input/Output Capacitance - CI/O -3-pF
1 Refer to Application Note, AN-107, for LOC110 Configurations.
INTEGRATED CIRCUITS DIVISION
LOC110
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R09
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
LED Forward Voltage (V)
1.0 1.1 1.2 1.3 1.4 1.5
LED Current (mA)
0
10
20
30
40
50
60
LED Forward Current
vs. LED Forward Voltage
LED Forward Voltage (V)
1.0 1.1 1.2 1.3 1.4 1.5
LED Current (mA)
0.01
0.1
1
10
100
LED Forward Current
vs. LED Forward Voltage
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage Drop (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=5mA
IF=2mA
IF=1mA
IF=50mA
IF=20mA
IF=10mA
LED Current (mA)
024681012
Servo Gain
0.000
0.004
0.008
0.012
0.016
Servo Gain
vs. LED Current & Temperature
0ºC
25ºC
50ºC
70ºC
85ºC
LED Current (mA)
024681012
Servo-Photocurrent (PA)
0
20
40
60
80
100
120
140
Servo-Photocurrent
vs. LED Current & Temperature
0ºC
25ºC
50ºC
70ºC
85ºC
LED Current (mA)
024681012
Normalized Servo-Photocurrent
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Normalized Servo-Photocurrent
vs. LED Current & Temperature
0ºC
25ºC
50ºC
70ºC
85ºC
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R09
LOC110
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LOC110 / LOC110P / LOC110S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LOC110 / LOC110S 250ºC for 30 seconds
LOC110P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
LOC110
www.ixysic.com 5
R09
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
LOC110
LOC110P
LOC110S
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
6
LOC110
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LOC110-R09
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/19/2012
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
LOC110PTR Tape & Reel
LOC110STR Tape & Reel