© 2008 Microchip Technology Inc. DS70329B
MRF24J40MA
Data Sheet
2.4 GHz IEEE Std. 802.15.4
RF Transceiver Module
DS70329B-page ii © 2008 Microchip Technology Inc.
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Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
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Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Prog ra m ming , IC SP, ICEPIC, Min d i , MiWi, MPASM, MP L AB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail , PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
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All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of th e code protectio n feature on Microchip devices:
Microchip products meet the specification contained in their particular M icrochip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
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© 2008 Microchip Technology Inc. DS70329B-page 1
MRF24J40MA
Features:
IEEE Std. 802.15.4™ Compliant RF Transceiver
Supports ZigBee®, MiWi™ , Mi Wi™ P 2P and
Proprietary Wireless Networking Protocols
Small Size: 0.7” x 1.1” ( 17.8 mm x 27.9 mm),
Surface Mountable
Integrated Crystal, Internal Voltage Regulator,
Matching Circuitry and PCB Antenna
Easy Integration into Final Product – Minimize
Product Development, Quicker Time to Market
Radio Regulation Certification for United States
(FCC), Canada (IC) and Europe (ETSI)
Compatible with Microchip Microcontroller
Families (PIC16F, PIC18F, PIC24F/H, dsPIC33
and PIC32)
Up to 400 ft. Range
Operational:
Operating Voltage: 2.4-3.6V (3.3V typical)
Temperature Range: -40°C to +85°C Industrial
Simple, F our- Wire SPI Int erface
Low-Current Consumption:
- RX mode: 19 mA (typical)
- TX mode: 23 mA (typical)
- Sleep: 2 μA (typic al)
RF/Analog Features:
ISM Band 2.405-2.48 GHz Operation
Data Rate: 250 kbps
-94 dBm Typical Sensi tivity with +5 dBm
Maximum Input Level
+0 dBm Typical Output Power with
36 dB TX Power Control Range
Integrated Low Phase Noise VCO, Frequency
Synthesizer and PLL Loop Filter
Digital VCO and Filter Calibration
Integrated RSSI ADC and I/Q DACs
Integrated LDO
High Receiver and RSSI D ynamic Range
MAC/Baseband Features:
Hardware CSMA-CA M echanism, Automa tic ACK
Response and FCS Check
Independent Beacon, Transmit and GTS FIFO
Supports all CCA modes and RSS/LQI
Autom ati c Packet Re tran sm it Cap able
Hardware Security Engine (AES-128) with CTR,
CCM and CBC-MAC modes
Supports Encryption and Decryption for MAC
Sublayer and Upper Layer
FIGURE 1: PIN DIAGRAM
2
3
4
5
6
1
7
VIN
GND
8
9
10
RESET
WAKE
SDO
SDI
SCK CS
NC
GND
INT
12
11 GND
2.4 GHz IEEE Std. 802.15.4
RF Transceiver Module
MRF24J40MA
DS70329B-page 2 © 2008 Microchip Technology Inc.
Table of C o ntents
1.0 Device Overview .......................................................................................................................................................................... 3
2.0 Circuit Desc r i p tion ....................... ................... ................... ................... ................... ..................................................................... 7
3.0 Regulatory Approval.................................................. .... .... .... ......... .... .... .... ......... .... .... .. ... .......................................................... 15
4.0 Electrical Characteristics............................................................................................................................................................ 19
Appendix A: Revision History............... ............................................ .................................................................................................... 21
Index .................................................................................................................................................................................................... 23
The Micro chip Web Site....................................... .................................... ............................................................................................ 25
Customer Change Notification Service ............................................................ ..................... ............................................................... 25
Customer Support........................................................................... ................. ...... .............................................................................. 25
Reader Response......................................................... ................................................... .................................................................... 26
Product Identification System ............................................................................................................................................................... 27
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© 2008 Microchip Technology Inc. DS70329B-page 3
MRF24J40MA
1.0 DEVICE OVERVIEW
The MRF24J40MA is a 2.4 GHz IEEE Std. 802.15.4™
compliant, surface mount module with integrated
crystal, internal voltage regulator, matching circuitry
and PCB antenna. The MRF24J40MA module oper-
ates in the non-licensed 2.4 GHz frequency band and
is FCC, IC and ETSI comp liant. The integrat ed modul e
design frees the integrator from extensive RF and
antenna design, and regulatory compliance testing,
allowing quicker time to market.
The MRF24J40MA module is compatible with
Microchip’s ZigBee®, MiWi™ and MiWi P2P software
stacks. Each software stack is available as a free
download, including source code, from the Microchip
web site http://www.microchip.com/wireless.
The MRF24J40MA module has received regulatory
approvals for modular devices in the United States
(FCC), Canada (IC) and Europe (ETSI). Modular
approval removes the need for expensive RF and
antenna design and allows the end user to place the
MRF24J40MA module inside a finished product and
not require reg ul atory testin g for an in tentional radiator
(RF transmitter). See Section 3.0 “Regulatory
Approval” for specific requirements to be followed by
the integrator.
1.1 Interface Description
Figure 1-1 shows a simplified block diagram of the
MRF24J40MA module. The module is based on the
Microchip Technology MRF24J40 IEEE 802.15.4™
2.4 GHz RF Transceiver IC. The module interfaces to
many popular Microchip PIC® microcontrollers via a
4-wire serial SPI interface, interrupt, wake, Reset,
power and groun d, as sh own in Fi gure 1-2 . Table 1- 1
prov ides the pin descriptions.
Data communications with the MRF24J40MA module
are documented in the “MRF24J40 IEEE 802.15.4™
2.4 GHz RF T ransceiver Data Sheet” (DS39776). Refer
to the MRF24J40 Data Sheet for specific serial
interface protocol and register definitions.
FIGURE 1-1: MRF24J40MA BLOCK DIAGRAM
PCB
Antenna Matching
Circuitry Physical MAC
Interface
Power
Management
SPI
20 MHz
Crystal
Digital
I/O
Power
MRF24J40MA IEEE Std. 802.15.4™ Module
MRF24J40
MRF24J40MA
DS70329B-page 4 © 2008 Microchip Technology Inc.
TABLE 1-1: PIN DESCRIPTION
FIGURE 1-2: MICROCONTROLLER TO MRF24J40MA INTERFACE
Pin Symbol Type Description
1 GND Power Ground
2 RESET DI Global hardware Reset pin
3 WAKE DI External wake-up trigger
4 INT DO Interrupt pin to microcontroller
5 SDI DI Serial interfac e data input
6 SCK DI Serial interface clock
7 SDO DO Serial in terface data output from MRF24J40
8CS DI Serial interface enable
9 NC N o connection (allow pin to float; do not connect signal)
10 VIN Power Power supply
11 GND Ground Ground
12 GND Ground Ground
Legend: Pin type abbreviation: D = Digital, I = Input, O = Output
SDO
I/O
SDI
SCK
INTx
MRF24J40MA
CS
SDI
SDO
SCK
INT
I/O WAKE
VIN
GND
PIC® MCU
I/O RESET
© 2008 Microchip Technology Inc. DS70329B-page 5
MRF24J40MA
1.2 Mounting Details
The MRF24J40MA is a surface mountable module.
Module dimensions are shown in Figure 1-3. The
module Printed Circuit Board (PCB) is 0.032" thick with
castellated mounting points on the edge. Figure 1-4 is
a recommended host PCB footprint for the
MRF24J40MA.
The MRF24J40MA has an integrated PCB antenna.
For the best performance, follow the mounting details
shown in Figure 1-5. It is recommended that the
module be mounted on the edge of the host PCB, and
an area around the antenna, approximately 1.2", be
kept clear of metal objects. A host PCB ground plane
around the MRF24J40MA act s as a counterpoise to the
PCB antenn a. It is reco mmended to extend the ground
plane at least 0.4" around the module.
FIGURE 1-3: MODULE DETAILS
FIGURE 1-4: RECOMMENDED PCB
FOOTPRINT
MRF24J40MA
DS70329B-page 6 © 2008 Microchip Technology Inc.
FIGURE 1-5: MOUNTING DETAILS
0.470”
Edge of PCB
Keep area around antenna
(approximately 1.2 inches)
clear of metallic structures
for best performance
PCB Ground Plane (Counterpoise)
Extend as far as possible to
the sides and below the module
(at least 0.4 inches on each side)
for best performance
0.4”
0.4” 0.4”
1.2”
1.2”
© 2008 Microchip Technology Inc. Advance Information DS70329B-page 7
MRF24J40MA
2.0 CIRCUIT DESCRIPTION
The MRF24J40MA is a complete 2.4 GHz IEEE
Std. 802.15.4™ compliant surface mount module with
integrated crystal, internal voltage regulator, matching
circuitry and PCB antenna. The MRF24J40MA module
interfaces to many popular Microchip PIC micro-
controllers via a 4-wire serial SPI interface, interrupt,
wake, Reset, power and ground. Data communications
with the MRF24J40MA module are documented in the
MRF24J40 IEEE 802.15.4™ 2.4 GHz RF Transceiver
Data Sheet” (DS39776). Refer to the MRF24J40 Data
Sheet for specific serial interface protocol and register
definitions.
2.1 Schematic
A schematic diagram of the module is shown in
Figure 2-1 and the Bill of Materials (BOM) is shown in
Table 2-1.
The MRF24J40MA module is based on the Microchip
Technology MRF24J40 IEEE 802.15.4™ 2.4 GHz RF
Transceiver IC. The serial I/O (SCK, SDI, SDO and
CS), RESET, WAKE and INT pins are brought out to
the mod ule pins. T he SDO si gnal is tri-st ate buf fered by
IC2 to solve a silicon errata, where the SDO signal
does not release to a high-impedance state, after the
CS pin returns to its inactive state. Crystal, X1, is a
20 MHz crystal with a frequency tolerance of
±10 ppm @ 25°C to meet the IEEE Std. 802.15.4
symbol rate tolerance of ±40 ppm . A balun is formed by
components: L1, L3, C2 and C14. L2 is an RF choke
and pull-up for the RFP and RFN pins on the
MRF24J40. C15 is a DC block capacitor. A low-pass
filter is formed by components: L4, C16 and C17. The
remaining capacitors provide RF and digital bypass.
MRF24J40MA
DS70329B-page 8 Advance Information © 2008 Microchip Technology Inc.
FIGURE 2-1: MRF2 4J40 MA SCHE MATIC
VDD
1RFP
2RFN
3VDD
4VDD
5GND
6GPIO0
7GPIO1
8GPIO5
9GPIO4
10
NC 30
NC 29
LPOSC1 28
LPOSC2 27
NC 26
GND 25
GND 24
NC 23
GND 22
VDD 21
IC1
GPIO2
11 GPIO3
12 RESET
13 GND
14 WAKE
15 INT
16 SDO
17 SDI
18 SCK
19 CS
20
40
39
38
37
36
35
34
33
32
31
LCAP
VDD
NC
VDD
GND
VDD
OSC1
OCS2
VDD
VDD
MRF24J40/ML
NC
NC
NC
NC
NC
NC
C10
47 pF
VIN
C11
0.1 μF
VIN
L2
3.3 nH
L1
8.2 nH
VIN
C2
1.0 pF
L3
5.6 nH
C14
0.5 pF
C13
47 pF
C12
0.1 μF
C15
0.5 pF
C16
NP
C17
1.0 pF
PCB
Antenna L4
6.8 nH
VIN
2 RESET
4 INT
3 WAKE
5 SDI
6 SCK
8 CS
NC
OE
A
VIN
GND
Y
VCC
1
2
IC2
NC7SZ125P5X
7 SDO
3
5
4
C3
0.01 μF
VIN
R1
NP
12 GND
1 GND
11 GND
10 VIN
VIN
C1
1 μF
C6
47 pF
VIN
C4
47 pF
VIN C5
47 pF
VIN
C18
18 pF
C19
18 pF
X1 20.00 MHz
C9
100 pF
C7
0.01 μF
VIN
C8
1 μF
VIN
Note: NP = Not Placed.
© 2008 Microchip Technology Inc. Advance Information DS70329B-page 9
MRF24J40MA
TABLE 2-1: MRJ24J40MA BILL OF MATERIALS
Designator Description Manufacturer Part Number
C1 Chip Capacitor 0402 X5R 1U Murata GRM155R60J105ME19D
C2 Chip Capacitor 0402 COG 1.0P Murata GRM1555C1H1R0CZ01D
C3 Chip Capacitor 0402 X7R 10N Murata GRM15 5R71 E103KA01D
C4 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D
C5 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D
C6 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D
C7 Chip Capacitor 0402 X7R 10N Murata GRM15 5R71 E103KA01D
C8 Chip Capacitor 0402 X5R 1U Murata GRM155R60J105ME19D
C9 Chip Capacitor 0402 COG 100P Murata GRM1555C1H101JZ01D
C10 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D
C11 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D
C12 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D
C13 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D
C14 Chip Capacitor 0402 COG 0.5P Murata GRM1555C1HR50CZ01D
C15 Chip Capacitor 0402 COG 0.5P Murata GRM1555C1HR50CZ01D
C16 Not Placed
C17 Chip Capacitor 0402 COG 1.0P Murata GRM1555C1H1R0CZ01D
C18 Chip Capacitor 0402 COG 18P Murata GRM1555C1H180JZ01D
C19 Chip Capacitor 0402 COG 18P Murata GRM1555C1H180JZ01D
IC1 IEEE 802.15.4™ RF Transceiver Microch ip MRF24J40-I/ML
IC2 Buffer, SC70 Package Fairchild NC7SZ125P5X
L1 Chip Inductor 0402 8.2N Panasonic ELJ-RF8N2JFB
L2 Chip Inductor 0402 3.3N Panasonic ELJ-RF3N3DFB
L3 Chip Inductor 0402 5.6N Panasonic ELJ-RF5N6DFB
L4 Chip Inductor 0402 6.8N Panasonic ELJ-RF6N8JFB
R1 No t Placed
X1 20 MHz Crystal Abracon ABM8-156-20.0000MHZ-T
MRF24J40MA
DS70329B-page 10 Advance Information © 2008 Microchip Technology Inc.
2.2 Printed Circuit Board
The MR F24J4 0MA m odule printe d circuit bo ard is co n-
structed with FR4 material, four layers and
0.032 inches thick. The layers are shown in Figure 2-2
through Figure 2-6. The stack up of the PCB is shown
in Figure 2-7.
FIGURE 2-2: TOP SILK SCREEN
FIGURE 2-3: TOP COPPER
FIGURE 2-4: LAYER 2 – GROUND
PLANE
FIGURE 2-5: LAYER 3 – POWER
PLANE
FIGURE 2-6: BOTTOM COPPER
Note: Top view negative Gerber.
Note: Top view negative Gerber.
Note: Top view.
© 2008 Microchip Technology Inc. Advance Information DS70329B-page 11
MRF24J40MA
FIGURE 2-7: PCB LAYER STACK UP
Top Copper
Ground Plane
Power Plane
Bottom Copper
1/2 oz. Copper
1/2 oz. Copper
1/2 oz. Copper
1/2 oz. Copper
8 mil FR4
12 mil FR4
8 mil FR4
0.032”
+/- 0.005”
MRF24J40MA
DS70329B-page 12 Advance Information © 2008 Microchip Technology Inc.
2.3 PCB Antenna
The PCB antenna is fabricated on the top copper trace.
Figure 2-8 shows the trace dimensions. The layers
below the antenna have no cop per traces . The gr ound
and power planes under the components serve as a
counterpoise to the PCB antenna. Additional ground
plane on the host PCB will substantially enhance the
performance of the module. For best performance,
place the module on the host PCB following the
recommendations in Section 1.2 “Mounting Details.
The Printed Circuit Board (PCB) antenna was designed
and simulated using Ansoft Designer® and HFSS™ 3D
full-wave solver software by Ansoft Corporation
(www.ansoft.com). The design goal was to create a
compact, low-cost antenna with the best radiation
pattern. Figure 2-9 shows the simulation drawing and
Figure 2-10 and Figure 2-11 show the 2D and 3D
radiation patterns, respectively. As shown by the
radiation patterns, the performance of the antenna is
dependant upon the orientation of the module.
Figure 2-12 shows the impedance simulation and
Figure 2-13 shows the actual impedance meas urement.
The discrete matching circuitry matches the impedance
of the antenna with the MRF24J40 transc eiver IC .
FIGURE 2-8: PCB ANTENNA
DIMENSIONS
FIGURE 2-9: PCB ANTENNA SIMULATION DRAWING
4.0 mm
16.5 mm
11.0 mm
2.5 mm
2.0 mm
5.0 mm
X
Y
Z
© 2008 Microchip Technology Inc. Advance Information DS70329B-page 13
MRF24J40MA
FIGURE 2-10: SIMULATED 2D RADIATION PATTERN
FIGURE 2-11: SIMULATED 3D RADIATION PATTERN
dB (Gain Tot a l)
2.0921e+000
1.1359e-001
-1.8649e+000
-3.8435e+000
-5.8220e+000
-7.8005e+000
-9.7791e+000
-1.1758e-001
-1.3736e+001
-1.5715e+001
-1.7693e+001
-1.9672e+001
-2.1650e+001
-2.3629e-001
-2.5607e+001
-2.7586e+001
-2.9564e+001
Theta
Phi
Z
Y
X
MRF24J40MA
DS70329B-page 14 Advance Information © 2008 Microchip Technology Inc.
FIGURE 2-12: SIMULATED PCB ANTENNA IMPEDANCE
FIGURE 2-13: MEASURED PCB ANTENNA IMPED ANCE
© 2008 Microchip Technology Inc. DS70329B-page 15
MRF24J40MA
3.0 REGULATORY APPROVAL
The MRF24J40MA module has received regulatory
approvals for modular devices in the United States,
Canada and European countries. Modular approval
allow s the end user to pl ace the MRF 24J40MA mo dule
inside a finished product and not require regulatory
testing for an intentional radiator (RF transmitter), pro-
vided no changes or modifications are made to the
module circuitry. Changes or modifications could void
the user’s auth orit y to operate the equipm ent . The end
user must comply with all of the instructions provided
by the Grantee, which indicate installation and/or
operating conditions necessary for compliance.
The integrator may still be responsible for testing the end
product for any additional compliance requirements
required with this module installed (for example: digital
device emission, PC peripheral requirements, etc.) in
the specific country that the end device will be marketed.
Annex F of the IEEE S td. 802.15.4 document has a good
summary of regulatory requirements in various countries
concerning IEEE Std. 802.15.4 devices. The standard
can be dow nloaded from the IEEE S tandards w eb page:
http://standards.ieee.org/getieee802/802.15.html.
Refer to the specific country radio regulations for
details on regulatory compliance.
3.1 United States
The MRF24J40MA has received Federal Communica-
tions Commission (FCC) CFR47 Telecommunications,
Part 15 Subpart C “Intentional Radiators” 15.247 and
modular approval in accordance with FCC Public
Notice DA 00-1407 Released: June 26, 2000, Part 15
Unlicensed Modular Transmitter Approval. The
MRF24 J40MA module c an be integrat ed into a fini shed
product without obtaining subsequent and separate
FCC approv als.
The MRF24J40MA module has been labeled with its
own FCC ID number, and if the FCC ID is not visible
when the module is installed inside another device,
then the outside of the finished product into which the
module is instal led must als o display a label referr ing to
the enclosed module. This exterior label can use
wording such as the following:
The user’s manual should include the following
statement:
3.1.1 RF EXPOSURE
All trans mitte rs reg ulated by FCC m ust com ply wi th RF
exposure requirements. OET Bulletin 65 “Evaluating
Compliance with FCC Guidelines for Human Exposure
to Radio Frequency Electromagnetic Fields” provides
assistance in determining whether proposed or existing
transmitting facilities, operations or devices comply
with limits for human exposure to Radio Frequency
(RF) fields adopted by the Federal Communications
Commission (FCC). The bulletin offers guidelines and
suggestions for eval uating compliance.
If appr opriate , comp lianc e with ex posure guidel ines for
mobile and unlicensed devices can be accomplished
by the use of warning labels and by providing users
with information concerning minimum separation
distances from transmitting structures and proper
installation of antenna s.
Cont ai ns Transm itte r Module FC C ID:
OA3MRF24J40MA
-or-
Contains FCC ID: OA3MRF24J40MA
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful
interference in a residential installation. This
equipment generates, uses and can radiate radio
frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However, there
is no guarantee that interference will not occur in a
particular installation. If this equipment does cause
harmful interference to radio or television reception,
which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the
interference by one or more of the following measu res:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment
and receiver.
Connect the equipment into an outlet on a
circuit dif ferent f rom tha t to which t he rece iver i s
connected.
Consult the dealer or an experienced radio/TV
technician for help.
MRF24J40MA
DS70329B-page 16 © 2008 Microchip Technology Inc.
The following statement must be included as a
CAUTION statement in manuals and OEM products to
alert users of FCC RF Exposure compliance:
If the MRF24J40MA module is used in a portable
application (antenna is less than 20 cm from persons
during operation), the integrator is responsible for
performing Specific Absorption Rate (SAR) testing in
acco rdan ce with FC C rules 2.1091.
3.1. 2 HELPFUL WEB SITES
Federal Communications Commission (FCC):
http://www.fcc.gov
3.2 Canada
The MRF24J40MA module has been certified for use in
Canada under Industry Canada (IC) Radio Standards
Specification (RSS) RSS-210 and RSS-Gen.
From Section 7.1.1, RSS-Gen, Issue 2, June 2007,
Modular Transmitter Approval:
Host devices which contain separately certified
modules do not need to be recertified, provided that
they meet the fol low i ng con dit ion s:
a) The host device, as a stand-alone unit
without any separately certified modules,
complies with all applicable Radio S tandards
Specifications.
b) The host device and all the separately
certifie d modules it c ontains j ointly meet th e
RF exposure compliance requirements of
RSS-102, if applicable.
c) The host device complies with the
certification labeling requiremen t s of each of
the modules it cont ains .
From Section 5.2, RSS-Gen, Issue 2, June 2007,
Equipment La bels:
All Category I radio equipment intended for use in
Canada shall permanently display on each transmitter,
receiver or inseparable combination thereof, the
applicant’s name (i.e., manufacturer’s name, trade
name or brand name), model number and certification
number. This information shall be affixed in such a
manner as to not be removable ex cept by destruc tion or
defacement. The size of the lettering shall be legible
without the aid of m agnification, but is not required to be
larger than 8-point font size. If the device is too small to
meet this condition, the information can be included in
the user manual upon agreement with Ind ustry Canada.
Label:
From Section 7.1.6, RSS-Gen, Issue 2, June 2007,
Digital Circuits:
If the device contains digital circuitry that is not directly
associated with the radio transmitter, the device shall
also have to comply with ICES-003, Class A or B as
appropriate, except for ICES-003 labeling
requirem ents. The tes t data obta ined (for the ICES-003
tests) shall be kept by the manufacturer or importer
whose name appears on the equipment label, and
made available to Industry Canada on request, for as
long as the model is being marketed in Canada.
3.2. 1 HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
Note: Compliance of a module in its final
configuration is the responsibility of the
applicant. A host device will not be
considered certified if the instructions
regarding antenna configuration provided
in the original description, of one or more
separately certified modules it contains,
were not followed
To satisfy FCC RF Ex posu re requi rement s fo r mobile
and base station transmission devices, a separation
distance of 20 cm or more should be maintained
between the antenna of this device and persons
during op erat ion. To ensure co mplia nce, op eratio n at
closer than this distance is not recommended.
The antenna(s) used for this transmitter must not be
co-located or operating in conjunction with any other
antenna or transmitter.
Cont ai ns IC : 7693 A-24J 40 MA
© 2008 Microchip Technology Inc. DS70329B-page 17
MRF24J40MA
3.3 Europe
The MRF24J40MA module has been certified for use in
European countries. The following testing has been
completed:
Te st standard ETSI EN 300 328 V1.7.1 (2006-10):
Maximum Transmit Power
Maximum EIRP Spectral Density
Frequ enc y R ang e
Radia ted Emi ss io ns
Test standards ETSI EN 301 489-1:2008 and ETSI
EN 301 489 -17: 200 8:
Radia ted Emi ss io ns
Ele ctro-Static Discharg e
Radia ted RF Susce pti bil ity
A helpful document that can be used as a starting point
in underst anding the use of Short Range Devices (SR D)
in Europe is the European Radio Communications Com-
mittee (ERC) Recommendation 70-03 E, downloadable
from the European Radio Communications Office
(ERO): http://www.ero.dk.
The end user is responsible for ensuring compliance
with harmonized frequencies and labeling
requirements for each country the end device is
marketed and sold.
3.3.1 HELPFUL WEB SITES:
Radio and Telecommunications Terminal Equipment
(R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
European Conference of Postal and T elecommunications
Admi ni strations ( CEPT): http :/ /www.cept. o rg /
European Telecommunications Standards Institute
(ETSI): http://www.etsi.org/
European Radio Communications Office (ERO):
http://www.ero.dk/
MRF24J40MA
DS70329B-page 18 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70329B-page 19
MRF24J40MA
4.0 ELECTRICAL CHARACTERISTICS
TABLE 4-1: RECOMMENDED OPERATING CONDITIONS
TABLE 4-2: CURRENT CONSUMPTION
(TA = 25°C, VDD = 3.3V)
TABLE 4-3: RECEIVER AC CHARACTERISTICS
Ty pical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz
Parameters Min Typ Max Units
Ambient Op era ting Temperature -40 +85 °C
Supply Voltage for RF, Analog and
Digital Circuits 2.4 3.6 V
Supply Voltage for Digital I/O 2.4 3 .3 3.6 V
Input High Voltage (VIH) 0.5 x VDD —VDD + 0.3 V
Input Low Voltage (VIL) -0.3 0.2 x VDD V
Chip Mode Condition Min Typ Max Units
Sleep Sleep Clock Disabled 2 μA
TX At Maximum Output Power 23 mA
RX 19 mA
Parameters Condition Min Typ Max Units
RF Input Frequency Compatible to
IEEE Std. 802.15.4™, 2003 2.405 2.480 GHz
RF Sensitivity -94 dBm
Maximum RF Input +5 dBm
LO Leakage Measured at Balun Matching
Network Inpu t at
Frequency, 2.405-2.48 GHz
—-60—dBm
Input Return Loss External ly Matched to 50 ohm Source
by a Balun Matching Network -8 -12 dB
Noise Figure
(including matching) —8—dB
Adjacent Channel
Rejection @ +/-5 MHz 30 dB
Alternate C han nel
Rejection @ +/-10 MHz 40 dB
RSSI Range 50 dB
RSSI Error -5 5 dB
MRF24J40MA
DS70329B-page 20 © 2008 Microchip Technology Inc.
TABLE 4-4: TRANSMITTER AC CHARACTERISTICS
Ty pical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz
Parameters Condition Min Typ Max Units
RF Carrier Freque nc y 2.405 2.480 GHz
Maximu m RF Output
Power —0—dBm
RF Output Power
Control Range —36—dB
TX Gain Control
Resolution Programmed by Register 1.25 dB
Carrier Suppres sion -30 dBc
TX Spectrum Mask for
O-QPSK Signal Offset Frequency > 3.5 MHz,
at 0 d Bm Output Power -33 dBm
TX EVM 15 %
© 2008 Microchip Technology Inc. DS70329B-page 21
MRF24J40MA
APPENDIX A: REVISI ON HISTORY
Revision A (June 2008)
Original data sheet for the MRF24J40MA device.
Revision B (November 2008)
Changed C17 to 1.0 pF and removed CLKOUT signal.
MRF24J40MA
DS70329B-page 22 © 2008 Microchip Technology Inc.
NOTES:
DS70329B-page 23 © 2008 Microchip Technology Inc.
MRF24J40MA
INDEX
A
AC Characteristics
Receiver......................................................................19
Transmitter..................................................................20
Antenna Impedance
Measure d PCB........................................... .................14
Simula te d PCB.......................... ........................... .......14
B
Block Diagrams
Micr o co n troller to MRF2 4J4 0 MA Interface................ ....4
MRF24J40MA ...............................................................3
C
Circuit Description.................................................................7
Customer Change Notification Service ...............................24
Customer Notification Service.............................................24
Customer Notification System.... ...........................................2
Customer Support...............................................................24
E
Electrical Character i stics......................... ............................19
Curren t Co nsu m p tio n.... .................. ................... .........19
Recommended Operating Conditions.........................19
Errata.....................................................................................2
European Radio Communications (ERC)............................17
F
FCC ID Number..................... ........................... ...................15
FCC RF Exposure Compliance... ................... .....................16
H
Helpful We b Si te s............. ................... ................... .......16, 17
I
Inter face Description............... ................... ...........................3
Inter net Address....... ........................... ................................24
M
MAC/Baseband Features......................................................1
Micr o chi p Internet Web Site.............. ..................................24
MiWi P2P. ............................................ ..................................3
MiWi Protocol............................................. ...........................3
More Information...................................................................2
Customer Notification System.......................................2
Errata ............................................................................2
Mounting Details............................ .... .. .. .. ....... .... .. .. .. .... ....... ..5
MRF24J40 Data Sheet................... ...................................3, 7
MRF24J40MA Bill of Materials (BOM) ......... .........................9
MRF24J40MA Schematic......................................................8
O
Overview...............................................................................3
P
PCB Antenna....................................... ......... ......................12
Dimensions................................................................. 12
Simul atio n Drawin g........... ........... .......... ........... ..........12
PCB Layers
Bottom Copper......................................... .. ....... .... .. ....10
Layer 2 – Ground Plane..............................................10
Layer 3 – Power Plane ............................................... 10
Stack Up .....................................................................11
Top Copper.................................. .... .. .. .. .. .. ....... .. .. .... ..10
Top Silk Screen ...... ................................... .................10
Pin Description......................................................................4
Pin Diagram..........................................................................1
Print e d Cir cuit Bo a r d ( PCB)... ...... .. ..... ...... .. ...... ..... .. ...... ..... 10
R
Radiation Pattern
2D............................................................................... 13
3D............................................................................... 13
Reader Response........................................... ....................25
Regulatory Approval ....................... ......... .... .... .... ......... .. ....15
Canada.......................................................................16
Europe ........................................................................ 17
United States .............................................................. 15
Revi si o n H i s tory.... .. ..... ...... ...... ...... ..... ...... ...... ......... ...... ..... 21
RF Exposure........ .................................... ...........................15
RF/Analog Features.............................................................. 1
S
Serial I/O
SCK, SDI , SDO , CS......................................................7
Short Range Devices (SRD)...............................................17
Specific Absorption Rate (SAR)..........................................16
SPI........................................................................................ 7
W
WWW Addr ess....................................................................24
WWW, On-Line Support .......................................................2
Z
ZigBee Protocol ... ............................................ ..................... 3
MRF24J40MA
DS70329B-page 24 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70329B-page 25
MRF24J40MA
THE MICROCHIP WEB SITE
Microc hip pro vides onl ine s upport v ia our W WW site at
www.microchip.com . Thi s w eb si te i s us ed as a m ean s
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online dis cu ss io n gr oups, Microchip con sul tant
program member listing
Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specif ied produ ct family or develo pment tool of interes t.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical suppo rt is avail able throug h the web si te
at: http://support.microchip.com
MRF24J40MA
DS70329B-page 26 © 2008 Microchip Technology Inc.
READER RESP ONSE
It is ou r intention to provide you with the best do cumentation possible to e ns ure suc c es sfu l u se of y ou r M icr oc hip pro d-
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DS70329BMRF24J40MA
1. What are the best features of this document ?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subjec t?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
© 2008 Microchip Technology Inc. DS70329B-page 27
MRF24J40MA
PRODUCT ID ENTIFICATION SYSTEM
To order or obtain info rm ation, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. -XX T
Tape andModule Temperature
Range
Device
Device MRF24J40MA;
VDD range 2.4V to 3.6V
Temp erature Range I = -40°C to +85°C (Industrial)
Examples:
a) MRF24J40MA-I = Industrial temp. tray
b) MRF24J40MAT-I = Industrial temp., tape and
reel.
M
Module Type Reel
DS70329B-page 28 © 2008 Microchip Technology Inc.
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