TLP5214
2015-12-26
1
Unit: mm
Weight
: 0.37 g (typ.)
TOSHIBA
11-10M1
Photocou plers GaAAs Infrar ed LED & Phot o I C
TLP5214
Isolated IGBT/Power MOSFET gate drive
AC and brushless DC motor drives
Industrial Inverters and Uninterruptible Power Supply (UPS)
The TLP5214 is a highly integrated 4.0A output current IGBT gate drive photo-
coupler housed in a long creepage and clearance SO16L package.
The TLP5214, a smart gate driver photocoupler, includes functions of IGBT
desaturation detection, isolated fault status feedback, soft IGBT turn-off, active
Miller cramping and under voltage lockout (UVLO).
This photocoupler is suitable for driving IGBT and power MOSFET used in
inverter applications.
The T LP5214 con sis t s tw o GaA A s infrared lig ht-emitting diodes (LEDs) and two
high-gain and high-speed ICs. They realize high current, high-spee d output cont rol
and output fault status feedback.
Peak output curr ent: ±4.0 A ( max)
Guaranteed performance over temperature: 40°C to 110°C
Supply current: 3.5 mA (max)
Power supply voltage: 15 V to 30 V
Threshold input curre nt : IFLH = 6 mA (max)
Switching time (tpLH / tpHL) : 150 ns (max)
Common mode transient immunity: ±35 kV/μs (min)
Isolation voltage: 5000 Vrms (min)
UL approved : UL1577, File No.E67349
c-UL approved :CSA Component Acceptance Service
No. 5A, File No.E67349
Option (D4) VDE approved : DIN EN60747-5-5(Note)
EN60065 or EN60950-1,
EN62368-1
CQC-approved: GB4943.1, GB8898 Japan Factor y
Note : When a EN60747-5-5 approved type is needed, please designate “Option(D4)”
Truth Table
IF UVLO
(VCC2-VE)
DESAT
(14Pin DESAT Terminal Input)
FAULT
(3Pin FAULT Terminal Output) VO
OFF Not Active ( > VUVLO+) Not Active High Low
ON Not Active ( > VUVLO+) Low ( < VDESATth) High High
ON Not Active ( > VUVLO+) High ( > VDESATth) Low ( FAULT) Low
ON Active ( < VUVLO-) Not Active High Low
OFF
Acti ve ( < VUVLO-) Not Active High Low
Start of commercial production
2014-05
Construction mechanical rating
SO16L
Height
Creepage Distanc e
Clearance
Insulation T hickness
2.3 mm (max)
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
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Pin Configuration (top view)
Internal Circuit
1
:
V
S
2 : VCC1
3 : FAULT
4 : VS
5 : CATHODE
6 : ANODE
7 : ANODE
8 : CATHODE
9 : VEE
10
: VCLAMP
11
: VOUT
12
: VEE
13
: VCC2
14
: DESAT
15
: VLED
16
: VE
V
S
V
CC1
FAULT
V
S
CATHODE
ANODE
VE
VLED
DESAT
VCC2
V
EE
VOUT
V
CLAMP
V
EE
ANODE
CATHODE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCLAMP
VCC2
Vout
DESAT
VEE
VCLAMP
UVLO
VE
SHIELD
VLED
DESAT
ANODE
CATHODE
VCC1
Vs
FAULT
N
ote: A 1-μF bypass capacitor must be connected between pins 9 and 13, pins 13 and 16.
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Absolute Maximum Ratings (Note) (Ta = 25°C ,Unless otherwise specified)
Characteristics Symbol Rating Unit
LED
Input forward current IF 25 mA
Input forward current derating (Ta 95°C) IF/Ta 1 mA/°C
Peak transient input forward current (Note 1) IFPT 1 A
Peak transient input forward current derating (Ta 95°C) IFPT/Ta 25 mA/°C
Reverse Input Voltage VR 6 V
Input power dissipation PD 145 mW
Input power dissipat i on derating (Ta 95°C) PD /Ta 5.0 mW/°C
Detector Positive Input Supply Voltage VCC1 0.5 to 7 V
“H” peak output current Ta = 40 to 110 °C
(Note 2)
IOPH 4.0 A
“L” peak output current IOPL +4.0 A
FAULT Output Current IFAULT 8 mA
FAULT Pin Voltage VFAULT 0.5 to VCC1 V
Total Output Supply Volt age (VCC2VEE) 0.5 to 35 V
Negative Output Suppl y Voltage (VEVEE) -0.5 to 15 V
Positive Output Supply Voltage (VCC2VE) 0.5 to 35 (VEVEE) V
Output voltage VO 0.5 to VCC2 V
Peak Clamping Sinking Current IClamp 1.7 A
Miller Clamping Pin Voltage VClamp 0.5 to VCC2 V
DESAT Voltage VDESAT VE to VE + 10 V
Output power dissipat i on PO 410 mW
Output power dissipat i on (Ta 95°C) PO /Ta 14.0 mW/°C
Common Operating temperature range Topr 40 to 110 °C
Storage temperature range Tstg 55 to 125 °C
Lead soldering temperat ure (10 s) (Note 3) Tsol 260 °C
Isolation voltage (AC, 60 s, R.H. 60%) (Note 4) BVS 5000 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. oper at ing temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliabil ity test
report and estimated failure rate, etc).
Note: A ceramic capacitor (1 μF) should be connected between pins 9 and 13, pins 13 and 16 to stab iliz e the
operation of the high gain linear amplifier.Furthermore, in case VE-VEE > 0 V, a bypass cap acit or, which has
good high frequen cy characteristic, a ceram ic cap aci tor (1 μF) should be connected between pins 9 and 16.
Failure to provide the bypassing may impair the switching property. The total lead length between capacitor
and coupler should not exceed 1 cm.
Note 1: Pulse width PW 1 μs, 300 pps
Note 2: Exponential waveform pulse width PW 0.2 μs, f 15 k Hz, VCC = 15 V
Note 3: For the effective lead soldering area.
Note 4: This device considered a two-terminal devic e: All pins on the LED side are shorted together, and all
pin on the photodetector side are shorted together.
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Recommended Operating Conditions (Note)
Characteristics Symbol Min Typ. Max Unit
Total Output Supply Voltage (Note 5)
(VCC2VEE) 15 - 30 V
Negative Output Suppl y Voltage (VEVEE) 0 - 15 V
Positive Output Supply Voltage (VCC2VE) 15 - 30 (VEVEE) V
Input On-State Current (Note 6) IF(ON) 7.5 - 12 mA
Input Off-State Voltage VF(OFF) 0 - 0.8 V
Operating frequency (Note 7) f - - 50 kHz
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Note 5: If the Vcc rise slope is sharp, an internal circuit might not operate with stability. Please design the VCC rise
slope under 3.0 V / μs.
Note 6: Input signal rise time (fall time) 0.5 μs.
Note 7: Exponential w av ef orm. IOPH -4.0 A ( 90 ns), IOPL 4.0 A ( 90 ns), Ta = 110°C
Electrical Characteristics (Note) (Ta = 40 to 110 °C, unless otherwise specified)
Characteristics Symbol Test
Circuit Test Condition Min Typ.* Max Unit
Input Forward Voltage VF IF = 10 mA, Ta = 25°C 1.4 - 1.7 V
Input Reverse Current IR VR = 5 V - - 10 μA
Input Capacitance Ct V=0 V, f=1 MHz, Ta = 25°C - 95 - pF
FAULT Low Level Output Voltage VFAULTL IFAULT = 1.1 mA, VCC1=5.5 V - 0.2 0.4 V
IFAULT = 1.1 mA, VCC1=3.3 V - 0.2 0.4
FAULT High Level Output Current IFAULTH VFAULT = 5.5 V, VCC1 = 5.5 V, Ta = 25°C - - 0.5 μA
VFAULT = 5.5 V, VCC1 = 3.3 V, Ta = 25°C - - 0.3
High Level Output Current (Note 8) IOPH 1 VO = VCC2 4 V - 4.0 1.2
A
VO = VCC2 7 V - 6.5 3.0
Low Level Output Current (Note 8) IOPL 2 VO = VEE + 2.5 V 1.2 3.5 -
VO = VEE + 7 V 3 5.5 -
Low Level Output Current
During Fault Condition IOLF VO VEE = 14 V 90 150 230 mA
High Level Output Voltage VOH 3
IO = 100 mA VCC20.3 VCC20.2 -
V
Low Level Output Voltage VOL 4
IO = 100 mA - 0.1 0.2
Clamp Pin Threshold Voltage VtClamp
- 3.0 -
Clamp Low Level Sinking Current ICL
VO = VEE + 2.5 V 0.56 1.8 - A
High Level Supply Current ICC2H 5
IO = 0 mA - 2.4 3.5
mA
Low Level Supply Current ICC2L 6
IO = 0 mA - 2.3 3.5
Blanking Capacitor Charging Current ICHG 7 VDESAT = 2 V 0.13 0.24 0.33
Blanking Capacitor Discharge Current IDSCHG 8 VDESAT = 7 V 10 49 -
DESAT Threshold Voltage VDESAT VCC2-VEVUVLO- 6 6.5 7.5
V
UVLO Threshold Voltage VUVLO+ 9
VO5 V 10.5 11.6 13.5
VUVLO- 9
VO5 V 9.2 10.3 11.1
UVLO hysteresis UVLOHYS
- 1.3 -
(*): All typical values are at Ta = 25°C
Note 8: IO application time 50 μs, 1 pulse
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Electrical Characteristics (Note) (Ta = 40 to 110 °C, unless otherwise specified)
Characteristics Symbol Test
Circuit Test Condition Min Typ.* Max Unit
Threshold Input Current(L/H) IFLH 10 VCC = 30 V, VO < 5 V - 0.8 6 mA
Threshold Input Voltage (H/L) VFHL VCC = 30 V, VO > 5 V 0.8 - - V
(*): All typical values are at Ta = 25°C
Note: This product is more sens itiv e than conv en tion al pr odu ct s to electrostatic discharge (ESD) owing to its low
power consumption design.
It is therefore all the more necessary to observe general precautions regarding ESD when handling this
component.
Isolation Characteristics (Note) (Ta = 25 °C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Capacitance input t o output CS Vs = 0 V , f = 1 MHz - 1.0 -
pF
Isolation resist ance RS R.H. 60 %, VS = 500 V 1×10
12
10
14
-
Ω
Isolation voltage BVS
AC, 60 s 5000 - -
Vrms
AC, 1 s, in oil -
10000 -
DC, 60 s, in oil -
10000 -
Vdc
Note: This device considered a two-terminal device: All pins on the LED side are shorted together, and all
pin on the photodetector side are shorted together.
Switching Characteristics (Note) (Ta = 40 to 110 °C, unless otherwise specified)
Characteristics Symbol Test
Circuit
Test Condition Min Typ.* Max Unit
Propagation delay time
(Note 9)
L H tpLH
11
VCC2 = 30 V
Rg = 10 Ω
Cg = 25 nF
Duty = 50%
IF = 0 10 mA 50 85 150
ns
H L tpHL IF = 10 0 mA 50 90 150
Output rise time (1090 %) (Note 9) tr IF = 0 10 mA -
32 -
Output fall time (9010 %) (Note 9)
tf IF = 10 0 mA -
18 -
Pulse with distort ion (Note 9) | tpHLtpLH | I
F
= 0 10 mA - -
50
Propagation delay skew (Note
9
)
(device to device) (Note 10)
tpsk IF = 0 10 mA 80 - 80
DESAT Sense to 90% Delay tDESAT(90%)
12
CDESAT = 100 pF, Rg = 10 Ω
Cg = 25 nF, VCC2 = 30 V
RF = 2. 1 kΩ
- 180 500
DESAT Sense to 10% Delay tDESAT(10%) - 3.5 5 μs
DESAT Sense to Low Level
FAULT Signal Delay
tDESAT(FAULT) CDESAT = 100 pF, Rg = 10 Ω
Cg = 25 nF, VCC2 = 30 V
RF = 2. 1 kΩ
CF = Open
- 300 500 ns
DESAT Sense to Low Propagation
Delay
tDESAT(LOW) - 200 -
DESAT Input Mute tDESAT(MUTE) 7 14 -
μs
RESET to High Level FAULT
Signal Delay
tRESET(FAULT) VCC1 = 5.5 V 0.2 0.45 2
Common Mode Transient Immunity
at High Level Output
CMH 13 to
16
IF = 10 mA
VO (min) = 26 V ±35 - - kV/μs
Common Mode Transient Immunity
at Low Level Output
CML IF = 0 mA
VO (max) = 1 V ±35 - -
(*): All typical values are at Ta = 25 °C.
Note 9: Input sig nal (f = 10 kHz, duty = 50%, tr = tf = 5 ns or less)
CL is approximately 15 pF which includes probe and stray wiring capacitance.
Note 10: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or
tpLH that will be seen between units at the same given conditions (supply voltage, input current, temperature,
etc).
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Test Circuit
Test Circuit 1: I
OPH
Test Circuit 2: I
OPL
Test Circuit 3: V
OH
Test Circuit 4: V
OL
Test Circuit 5: I
CC2H
Test Circuit 6: I
CC2L
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Test Circuit 7: I
CHG
Test Circuit 9: VUVLO
Test Circuit 8: I
DSCHG
Test Circuit 10: IFLH
Test Circuit 11: tpLH, tpHL, tr, tf, | tpHL-tpLH |
Test Circui t 12: tDESAT(90%), tDESAT(10%), tDESAT(FAULT), tDESAT(Low), tDESAT(MUTE), tRESET(FAULT)
IF = 10 mA (P.G.)
(f =10 kHz, duty = 50%, tr = tf = 5 ns or less)
IF = 10 mA (P.G.)
(f =10 kHz, duty = 50%, tr = tf = 5 ns or less)
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Test Circuit 13: CMR_LED1 ON
Test Circuit 14: CMR_LED1 OFF
Test Circuit 15: CMR_LED2 ON
Test Circuit 16: CMR_LED2 OFF
CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output
voltage in the LOW (HIGH) sta te.
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Characteristics Curve
0
5
10
15
20
25
30
-40 -20 020 40 60 80 100 120 140
0.1
1
10
100
11.2 1.4 1.6 1.8 2
0
2
4
6
8
-40 -15 10 35 60 85 110
-8
-6
-4
-2
0-40 -15 10 35 60 85 110
0
2
4
6
8
10
0 1 2 3 4
20
22
24
26
28
30
-4-3-2-10
I
F
– V
F
I
F
– T
a
Input Forward voltage V
F
(V)
Ambient Temperature T
a
C)
Input Forward Current I
F
(mA)
I
OPH
– T
a
Ambient Temperature T
a
C)
T
a
= 40 °C
VOH – IOPH
High Level Output Current I
OPH
(A)
V
OL
– I
OPL
Low Level Output Current I
OPL
(A)
Low Level Output Voltage V
OL
(V)
Ambient Temperature T
a
C)
I
OPL
– T
a
Low Level Output Current I
OPL
(A)
High Level Output Voltage V
OH
(V)
High Level Output Current I
OPH
(A)
T
a
= 25 °C
T
a
= 110 °C
T
a
= 40 °C
T
a
= 25 °C
Ta = 110 °C
VO = VCC2 4 V
VO = VCC2 7 V
V
O
= V
EE
+2.5 V
V
O
= V
EE
+7 V
This curve shows the maximum
limit to the input forward current.
Ta = 110 °
C
100 °
C
75 °
C
50 °
C
Ta = 40 °
C
20 °
C
0 °
C
25 °
C
Input Forward Current I
F
(mA)
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Blanking Capa ci tor Charging Current I
CHG
(mA)
6
6.5
7
7.5
-40 -15 10 35 60 85 110
-0.35
-0.3
-0.25
-0.2
-40 -15 10 35 60 85 110
1.8
2
2.2
2.4
2.6
2.8
3
-40 -15 10 35 60 85 110
0
1
2
3
4
-40 -15 10 35 60 85 110
1.8
2
2.2
2.4
2.6
2.8
3
15 18 21 24 27 30
0
1
2
3
4
5
01234
I
CL
– T
a
(V
CLAMP
– V
EE
) - I
CL
Ambient Temperature T
a
C)
Clamp Low Level Sinking Current I
CL
(A)
(V
CLAMP
– V
EE
) (V)
I
CC2
L, I
CC2
H
– T
a
Ambient Temperature T
a
C)
ICCH2
VCC = 15 V
ICC2L, ICC2H – VCC2
Supply Voltage V
CC2
(V)
Supply Current I
CC2
L, I
CC2
H (mA)
V
DESAT
– T
a
Ambient Temperature T
a
C)
DESAT Threshold Voltage V
DESAT
(V)
Supply Current I
CC2
L, I
CC2
H (mA)
Ambient Temperature T
a
C)
I
CHG
– T
a
Clamp Low Level Sinking Current I
CL
(A)
V
O
= V
EE
+2.5 V
T
a
= 40 °C
T
a
= 25 °C
T
a
= 110 °C
I
CCL2
ICCH2
ICCL2
Ta = 25 °C
VDESAT = 2 V
VCC = 15 V VCC2 VE > VUVLO-
V
CC2
= 30 V
V
CC2
= 15 V
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0
0.2
0.4
0.6
0.8
1
-40 -15 10 35 60 85 110
-1
-0.8
-0.6
-0.4
-0.2
0
-40 -15 10 35 60 85 110
0
20
40
60
80
100
120
140
510 15 20
0
20
40
60
80
100
120
140
-40 -15 10 35 60 85 110
0
4
8
12
16
20
24
28
32
0 1 2 3 4 5
0
1
2
3
4
5
6
-40 -15 10 35 60 85 110
IFLH – Ta
VO – IF
Ambient Temperature T
a
C)
Input Forward Current I
F
(mA)
Output Voltage V
O
(V)
t
pHL
, t
pLH,
|t
pHL
-t
pLH
| – T
a
Ambient Temperature T
a
C)
IO = 100 mA
t
pHL
, t
pLH,
|t
pHL
-t
pLH
|
– I
F
Input Forward Current I
F
(mA)
Propagation delay time, Pulse width distortion
tpLH, tpHL, |tpHL – tpLH| (ns)
Threshold Input Current(L/H) I
FLH
(mA)
High Level Output Voltage V
OH
-V
CC2
(V)
Ambient Temperature T
a
C)
(V
OH
-V
CC2)
– T
a
Ambient Temperature T
a
C)
Low Level Output Voltage V
OL
(V)
V
OL
– T
a
IO =
100 mA
VCC2 = 15 V / 30 V
VCC2 = 30 V
Rg = 10 Ω, Cg = 25 nF
IF = 10 mA, VCC2 = 30 V Rg = 10 Ω, Cg = 25 nF
VCC2 = 30 V, Ta = 25 °C
Propagation delay time, Pulse width distortion
tpLH, tpHL, |tpHL – tpLH| (ns)
tPLH
t
PHL
|tPHL tPLH|
t
PLH
t
PHL
|tPHL tPHL|
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100
150
200
250
300
-40 -15 10 35 60 85 110
100
150
200
250
300
-40 -15 10 35 60 85 110
0
20
40
60
80
100
120
140
15 20 25 30
t
pHL
, t
pLH,
|t
pHL
-t
pLH
|
– V
CC2
DESAT Sense to Low Propagation Delay
tDESAT(Low) (ns)
t
DESAT(Low)
– T
a
Ambient Temperature T
a
C)
1
1.5
2
2.5
3
3.5
4
-40 -15 10 35 60 85 110
200
250
300
350
400
-40 -15 10 35 60 85 110
0
0.2
0.4
0.6
0.8
1
1.2
-40 -15 10 35 60 85 110
Ambient Temperature T
a
C)
Ambient Temperature T
a
C)
t
DESAT(FAULT)
– T
a
tRESET(FAULT) – Ta
t
DESAT(90%)
– T
a
t
DESAT(10%)
– T
a
Ambient Temperature T
a
C)
Ambient Temperature T
a
C)
DESAT Sense to 10% Delay
tDESAT(10%) (μs)
DESAT Sense to 90% Delay
tDESAT(90%) (ns)
RESET to High Level FAULT Signal Delay
tRESET(FAULT) (μs)
Supply Voltage V
CC2
(V)
Rg = 10 Ω, Cg = 25 nF
IF = 10 mA, Ta = 25 °C CDESAT = 100 pF, Rg = 10 Ω, Cg = 25 nF
VCC2 = 30 V, RF = 2.1 kΩ, CF = Open
CDESAT = 100 pF, Rg = 10 Ω,
Cg = 25 nF, VCC2 = 30 V,
CDESAT = 100 pF, Rg = 10 Ω,
Cg = 25 nF, VCC2 = 30 V,
CDESAT =100 pF, Rg = 10 Ω, Cg = 25 nF
VCC2 = 30 V, RF = 2.1 kΩ, CF = Open
CDESAT = 100 pF, Rg = 10 Ω, Cg = 25 nF
VCC2 = 30 V, RF = 2.1 kΩ, CF = Open
tpLH
t
pHL
|t
pHL
- t
pLH
|
V
CC1
=5V
V
CC1
=3.3V
V
CC1
=3.3V
V
CC1
=5V
DESAT Sense to Low Level FAULT Signal Delay
tDESAT(FAULT) (ns)
Propagation delay time, Pulse width distortion
tpLH, tpHL, |tpHL – tpLH| (ns)
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PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &
GENERAL STORAGE
(1) Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a solder ing iron or a refl ow soldering met hod is u sed.
1) When Using Soldering Reflow
An example of a temperature profile when lead(Pb)-free solder is use
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow
Apply preheating of 150 °C for 60 to 120 seconds.
Mounting condition of 260 °C or less within 10 seconds is recommended.
Flow soldering must be performed once
3) When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds not
exceeding 350 °C.
Heating by soldering iron must be only once per 1 lead
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(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 degree C
to 35 degree C, and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.
6) When repacking devices, use anti-st at ic contain ers.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
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Specifications for Embossed-Tape Packing
(TP) for SO16L Coupler
1. Applicabl e Package
Package Product T ype
SO16L Long creepage Coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example) TLP5214 (TP, E (O
Domestic ID (Country / Region of origin: Japan)
[[G]]/RoHS COMPATIBLE (Note)
Tape type
Device name
Note : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibi lity of Product.
The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on
the restricti on of the use of cert ain haz ar do us sub st a nce s in elec tric al and ele ctronics equi pmen t.
3. Tape Dimensions
3.1 Orientation of Devic e in Relation to D irection of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure 1 Device Orientation
3.2 Packing Quantity: 1500 per reel
Tape feed
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3.3 Empty Device Recesses Are as Shown in Table 1.
Table1 Empty Device Recesses
Standard Remarks
Occurrences of 2 or more
successi ve empty device
recesses 0 device Within any given 40-mm section of
tape, not including leader and trailer
Single empty devic e
recesses 6 device (m ax) per reel Not incl udi ng l eader and trail er
3.4 Start and End of Tape
The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and
more than 30mm only for a cover tape.
3.5 Tape Specification
(1) Material: Plastic (for protection against static electricity)
(2) Dimensions: The tape dimensions are shown in Figure 2 and Table 2.
Unit:mm
Figure 2 Tape Forms
Table 2 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol Dimension Remark
A 10.4
B 10.7
D 7.5 Center line of indented square hole and sprocket hole
E 1.75
Distance between tape edge and hole center
F 12.0
Cumulative error (m ax) per 10 feed holes
G 4.0 Cumulative error (max) per 10 feed holes
K0 2.4 Internal space
+0.1
-0.3
+0.1
-0.3
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3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Figure 3 Reel Forms
4. Packing
Either one reel or ten reels of photo cou pler are packe d in a shippin g carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard, the
quantity, the lot number and Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the CTR rank, the tape and the quantity as shown
in the following example.
(Example)
TLP5214 (TP, E (O 1500Pcs.
Quantity (must be a multi ple of 1500)
Domestic ID (Country / Region of origin: Japan)
[[G]]/RoHS COMPATIBLE (Note)
Tape type
Device name
Note : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibi lity of Product.
The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on
the restriction of the use of certain hazardo us sub st ances in elect ric al and ele ctro nic s equi pmen t.
Symbol Dimension
A Φ330 ± 2
B Φ100 ± 1
C Φ13 ± 0.5
E 2.0 ± 0.5
U 4.0 ± 0.5
W1 17.4 ± 1.0
W2 21.4 ± 1.0
Table 3 Reel Dimension
Unit: mm
W1
W2
A
B
C
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7. Packing Dimensions (
φ
330 mm)
30
334(In Size)
25(In Size)
337(In Size)
26
1 Reel/Carton
Unit: mm
Label
10Reel/Carton
[10Reel]
386
391
356
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8. Marking
Lot No.
Pin No.1
(the dent in the resin)
Part No.
(or abbreviati on code )
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RESTRICTIONS ON PRODUCT USE
Tos hi ba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collect i vely "Product " ) without notic e.
This document and any information herein may not be reproduced without pri or written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduct i on is permiss i bl e only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsibl e for compl ying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimi ze risk and avoid situations in which a malfunction or fai l ure of Product could cause loss of human life, bodily
injury or damage to property, i ncl uding data loss or corruption. Before cust omers use the Product, create designs including the
Product, or incorporat e the Product into thei r own applicati ons, c ustomers must also refer to and comply with (a) the l at est versi ons of
all relevant TOSHIBA informat i on, includi ng without limi tation, this document, the specif ications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instruct i ons for the applicati on with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, includi ng but not limit ed to (a) determini ng the appropri ateness of the use of this Product in such
design or applications; (b) evaluat ing and determ i ni ng the applic ability of any information contained in this document, or in charts,
diagrams, programs, al gorithms , sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILI TY FOR CUSTOMERS' PRODUCT DES IGN OR
APPLICATIONS.
PRODUCT IS NEI THE R INTENDE D NO R WARRANTED FOR US E IN EQUIPME NTS OR SYS TEMS TH AT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RE L IABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SE RIOUS PUBLIC IMPACT
("UNINTENDED USE"). E xcept for s peci fic applic at i ons as expressl y stated in this document, Unintended Use i ncludes, without
limitation, equipment used in nuclear fac ilities, equi pment used in the aerospace industry, medical equipment, equipment used for
automobiles, trai ns, ships and other transportation, traffic signaling equipment, equipment us ed to control combustions or explosions ,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTE NDE D USE, TOSHI BA ASSUMES NO LIABILI TY FOR PRODUCT. For details, please contact your
TOSHIBA s al es representati ve.
Do not disassemble, anal yze, reverse-engineer, alter, modify, translate or c opy Product, whether in whole or in part.
Product shall not be used for or incorporated int o any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulati ons.
The information contained herein is presented only as guidance for Product use. No responsi bili t y is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIM UM EXTENT ALLOWABL E BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WH ATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTI AL, S PE CIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCL UDING WITHOUT LIMITATION, LO S S OF PROFI TS, LOSS OF OPPORTUNITIES, BUSINESS I NTE RRUP TI O N AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIE D WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORM ATION, INCLUDING WARRANTIES OR CONDI TI ONS OF MERCHANTABILITY, FITNE S S
FOR A PARTICUL AR PURPOSE, ACCURACY OF INFORMATI O N, OR NONINF RINGEM E NT.
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handl e with c are and do not break, cut, crus h, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, includi ng without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biologic al weapons or missile
technology products (mass destruct i on weapons). Product and related software and technology may be controlled under the
applicable export laws and regulat ions i ncludi ng, without l imitation, t he Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of P roduct or relat ed software or technology are strictly prohibi ted
except in compliance with all applicable export laws and regulat i ons.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate
the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive.
TOSHIBA
ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE
WITH APPLICABLE LAWS AND REGULATIONS.