TLP5214 Photocouplers GaAAs Infrared LED & Photo IC TLP5214 Isolated IGBT/Power MOSFET gate drive AC and brushless DC motor drives Industrial Inverters and Uninterruptible Power Supply (UPS) Unit: mm The TLP5214 is a highly integrated 4.0A output current IGBT gate drive photocoupler housed in a long creepage and clearance SO16L package. The TLP5214, a smart gate driver photocoupler, includes functions of IGBT desaturation detection, isolated fault status feedback, soft IGBT turn-off, active Miller cramping and under voltage lockout (UVLO). This photocoupler is suitable for driving IGBT and power MOSFET used in inverter applications. The TLP5214 consists two GaAAs infrared light-emitting diodes (LEDs) and two high-gain and high-speed ICs. They realize high current, high-speed output control and output fault status feedback. * Peak output current: 4.0 A (max) * Guaranteed performance over temperature: -40C to 110C * Supply current: 3.5 mA (max) * Power supply voltage: 15 V to 30 V * Threshold input current: IFLH = 6 mA (max) TOSHIBA * Switching time (tpLH / tpHL) : 150 ns (max) Weight: 0.37 g (typ.) * Common mode transient immunity: 35 kV/s (min) * Isolation voltage: 5000 Vrms (min) * UL approved : UL1577, File No.E67349 * c-UL approved :CSA Component Acceptance Service No. 5A, File No.E67349 * Construction mechanical rating SO16L Option (D4) VDE approved : DIN EN60747-5-5(Note) EN60065 or EN60950-1, EN62368-1 * * 11-10M1 Height Creepage Distance Clearance Insulation Thickness 2.3 mm (max) 8.0 mm (min) 8.0 mm (min) 0.4 mm (min) CQC-approved: GB4943.1, GB8898 Japan Factory Note : When a EN60747-5-5 approved type is needed, please designate "Option(D4)" Truth Table IF UVLO DESAT FAULT (14Pin DESAT Terminal Input) (3Pin FAULT Terminal Output) VO (VCC2-VE) OFF Not Active ( > VUVLO+) Not Active High Low ON Not Active ( > VUVLO+) Low ( < VDESATth) High High ON ON OFF + Not Active ( > VUVLO ) High ( > VDESATth) Low ( FAULT) Low - Not Active High Low - Not Active High Low Active ( < VUVLO ) Active ( < VUVLO ) Start of commercial production 2014-05 1 2015-12-26 TLP5214 Pin Configuration (top view) VE 16 VLED 15 DESAT 14 VCC2 13 VEE 12 ANODE VOUT 11 7 ANODE VCLAMP 10 8 CATHODE 1 VS 2 VCC1 3 FAULT 4 VS 5 CATHODE 6 VEE 9 1 : VS 2 : VCC1 3 : FAULT 4 : VS 5 : CATHODE 6 : ANODE 7 : ANODE 8 : CATHODE 9 : VEE 10 : VCLAMP 11 : VOUT 12 : VEE 13 : VCC2 14 : DESAT 15 : VLED 16 : VE Internal Circuit VCC2 UVLO ANODE Vout DESAT CATHODE DESAT VEE SHIELD VCLAMP VCLAMP VE VCC1 FAULT Vs VLED Note: A 1-F bypass capacitor must be connected between pins 9 and 13, pins 13 and 16. 2 2015-12-26 TLP5214 Absolute Maximum Ratings (Note) (Ta = 25C ,Unless otherwise specified) Characteristics LED Input forward current Input forward current derating (Ta 95C) Peak transient input forward current (Note 1) Unit IF 25 mA IF/Ta -1 mA/C IFPT 1 A IFPT/Ta -25 mA/C VR 6 V Input power dissipation PD 145 mW PD /Ta -5.0 mW/C VCC1 -0.5 to 7 V IOPH -4.0 A IOPL +4.0 A FAULT Output Current IFAULT 8 mA FAULT Pin Voltage VFAULT -0.5 to VCC1 V (VCC2-VEE) -0.5 to 35 V Negative Output Supply Voltage (VE-VEE) -0.5 to 15 V Positive Output Supply Voltage (VCC2-VE) -0.5 to 35 - (VE-VEE) V VO -0.5 to VCC2 V Peak Clamping Sinking Current IClamp 1.7 A Miller Clamping Pin Voltage VClamp -0.5 to VCC2 V DESAT Voltage VDESAT VE to VE + 10 V PO 410 mW PO /Ta -14.0 mW/C Topr -40 to 110 C Input power dissipation derating (Ta 95C) Positive Input Supply Voltage "H" peak output current Ta = -40 to 110 C (Note 2) "L" peak output current Total Output Supply Voltage Output voltage Output power dissipation Output power dissipation (Ta 95C) Common Rating Reverse Input Voltage Peak transient input forward current derating (Ta 95C) Detector Symbol Operating temperature range Tstg -55 to 125 C Lead soldering temperature (10 s) (Note 3) Tsol 260 C Isolation voltage (AC, 60 s, R.H. 60%) (Note 4) BVS 5000 Vrms Storage temperature range Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note: A ceramic capacitor (1 F) should be connected between pins 9 and 13, pins 13 and 16 to stabilize the operation of the high gain linear amplifier.Furthermore, in case VE-VEE > 0 V, a bypass capacitor, which has good high frequency characteristic, a ceramic capacitor (1 F) should be connected between pins 9 and 16. Failure to provide the bypassing may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. Note 1: Pulse width PW 1 s, 300 pps Note 2: Exponential waveform pulse width PW 0.2 s, f 15 kHz, VCC = 15 V Note 3: For the effective lead soldering area. Note 4: This device considered a two-terminal device: All pins on the LED side are shorted together, and all pin on the photodetector side are shorted together. 3 2015-12-26 TLP5214 Recommended Operating Conditions (Note) Characteristics Symbol Min Typ. Max Unit Total Output Supply Voltage (Note 5) (VCC2-VEE) 15 - 30 V Negative Output Supply Voltage (VE-VEE) 0 - 15 V Positive Output Supply Voltage (VCC2-VE) 15 - 30 - (VE-VEE) V IF(ON) 7.5 - 12 mA VF(OFF) 0 - 0.8 V f - - 50 kHz Input On-State Current (Note 6) Input Off-State Voltage Operating frequency (Note 7) Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Note 5: If the Vcc rise slope is sharp, an internal circuit might not operate with stability. Please design the VCC rise slope under 3.0 V / s. Note 6: Input signal rise time (fall time) 0.5 s. Note 7: Exponential waveform. IOPH -4.0 A ( 90 ns), IOPL 4.0 A ( 90 ns), Ta = 110C Electrical Characteristics (Note) (Ta = -40 to 110 C, unless otherwise specified) Symbol Test Circuit Input Forward Voltage VF IF = 10 mA, Ta = 25C Input Reverse Current IR Input Capacitance Ct Characteristics FAULT Low Level Output Voltage FAULT High Level Output Current High Level Output Current (Note 8) VFAULTL IFAULTH IOPH 1 Test Condition Min Typ.* Max Unit 1.4 - 1.7 V VR = 5 V - - 10 A V=0 V, f=1 MHz, Ta = 25C - 95 - pF IFAULT = 1.1 mA, VCC1=5.5 V - 0.2 0.4 IFAULT = 1.1 mA, VCC1=3.3 V - 0.2 0.4 VFAULT = 5.5 V, VCC1 = 5.5 V, Ta = 25C - - 0.5 VFAULT = 5.5 V, VCC1 = 3.3 V, Ta = 25C - - 0.3 VO = VCC2 - 4 V - -4.0 -1.2 VO = VCC2 - 7 V - -6.5 -3.0 VO = VEE + 2.5 V 1.2 3.5 - VO = VEE + 7 V 3 5.5 - 90 150 230 V A A Low Level Output Current (Note 8) IOPL 2 Low Level Output Current IOLF VO - VEE = 14 V VOH 3 IO = -100 mA VCC2-0.3 VCC2-0.2 - VOL 4 IO = 100 mA - 0.1 0.2 VtClamp ICL VO = VEE + 2.5 V High Level Supply Current ICC2H 5 Low Level Supply Current ICC2L Blanking Capacitor Charging Current During Fault Condition High Level Output Voltage Low Level Output Voltage Clamp Pin Threshold Voltage - 3.0 - 0.56 1.8 - IO = 0 mA - 2.4 3.5 6 IO = 0 mA - 2.3 3.5 ICHG 7 VDESAT = 2 V -0.13 -0.24 -0.33 Blanking Capacitor Discharge Current IDSCHG 8 VDESAT = 7 V 10 49 - DESAT Threshold Voltage VDESAT VCC2-VEVUVLO- 6 6.5 7.5 VUVLO+ 9 VO5 V 10.5 11.6 13.5 - 9 VO5 V 9.2 10.3 11.1 - 1.3 - Clamp Low Level Sinking Current UVLO Threshold Voltage VUVLO UVLO hysteresis UVLOHYS mA V A mA V (*): All typical values are at Ta = 25C Note 8: IO application time 50 s, 1 pulse 4 2015-12-26 TLP5214 Electrical Characteristics (Note) (Ta = -40 to 110 C, unless otherwise specified) Symbol Test Circuit Threshold Input Current(L/H) IFLH 10 Threshold Input Voltage (H/L) VFHL Characteristics Test Condition Min Typ.* Max Unit VCC = 30 V, VO < 5 V - 0.8 6 mA VCC = 30 V, VO > 5 V 0.8 - - V (*): All typical values are at Ta = 25C Note: This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low power consumption design. It is therefore all the more necessary to observe general precautions regarding ESD when handling this component. Isolation Characteristics (Note) (Ta = 25 C) Characteristic Symbol Capacitance input to output Test Condition CS Isolation resistance Vs = 0 V, f = 1 MHz Typ. Max Unit - 1.0 - pF 14 10 - 5000 - - AC, 1 s, in oil - 10000 - DC, 60 s, in oil - 10000 - R.H. 60 %, VS = 500 V RS Min AC, 60 s 12 1x10 Vrms Isolation voltage BVS Vdc Note: This device considered a two-terminal device: All pins on the LED side are shorted together, and all pin on the photodetector side are shorted together. Switching Characteristics (Note) (Ta = -40 to 110 C, unless otherwise specified) Characteristics Symbol Propagation delay time (Note 9) LH tpLH HL tpHL Test Circuit Test Condition Min Typ.* Max IF = 0 10 mA 50 85 150 IF = 10 0 mA 50 90 150 IF = 0 10 mA - 32 - Cg = 25 nF IF = 10 0 mA - 18 - Duty = 50% IF = 0 10 mA - - 50 IF = 0 10 mA -80 - 80 VCC2 = 30 V Output rise time (10-90 %) (Note 9) Output fall time (90-10 %) (Note 9) tf (Note 9) | tpHL-tpLH | (Note 9) (Note 10) tpsk Pulse with distortion Propagation delay skew (device to device) tr 11 Rg = 10 tDESAT(90%) CDESAT = 100 pF, Rg = 10 - 180 500 DESAT Sense to 10% Delay tDESAT(10%) Cg = 25 nF, VCC2 = 30 V RF = 2.1 k - 3.5 5 DESAT Sense to Low Level FAULT Signal Delay tDESAT(FAULT) CDESAT = 100 pF, Rg = 10 - 300 500 DESAT Sense to Low Propagation Delay tDESAT(LOW) RF = 2.1 k - 200 - DESAT Input Mute tDESAT(MUTE) CF = Open 7 14 - RESET to High Level FAULT Signal Delay tRESET(FAULT) VCC1 = 5.5 V 0.2 0.45 2 IF = 10 mA VO (min) = 26 V 35 - - IF = 0 mA VO (max) = 1 V 35 - - DESAT Sense to 90% Delay 12 Common Mode Transient Immunity at High Level Output CMH Common Mode Transient Immunity at Low Level Output CML ns s ns Cg = 25 nF, VCC2 = 30 V 13 to 16 Unit s kV/s (*): All typical values are at Ta = 25 C. Note 9: Input signal (f = 10 kHz, duty = 50%, tr = tf = 5 ns or less) CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 10: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc). 5 2015-12-26 TLP5214 Test Circuit Test Circuit 1: IOPH Test Circuit 2: IOPL Test Circuit 3: VOH Test Circuit 4: VOL Test Circuit 5: ICC2H Test Circuit 6: ICC2L 6 2015-12-26 TLP5214 Test Circuit 7: ICHG Test Circuit 8: IDSCHG Test Circuit 9: VUVLO Test Circuit 10: IFLH Test Circuit 11: tpLH, tpHL, tr, tf, | tpHL-tpLH | IF = 10 mA (P.G.) (f =10 kHz, duty = 50%, tr = tf = 5 ns or less) Test Circuit 12: tDESAT(90%), tDESAT(10%), tDESAT(FAULT), tDESAT(Low), tDESAT(MUTE), tRESET(FAULT) IF = 10 mA (P.G.) (f =10 kHz, duty = 50%, tr = tf = 5 ns or less) 7 2015-12-26 TLP5214 Test Circuit 13: CMR_LED1 ON Test Circuit 14: CMR_LED1 OFF Test Circuit 15: CMR_LED2 ON Test Circuit 16: CMR_LED2 OFF CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output voltage in the LOW (HIGH) state. 8 2015-12-26 TLP5214 Characteristics Curve I F - Ta 30 (mA) Input Forward Current IF Input Forward Current IF (mA) I F - VF 100 Ta = 110 C 100 C 75 C 50 C 10 Ta = -40 C -20 C 0 C 25 C 1 0.1 25 20 15 10 5 This curve shows the maximum limit to the input forward current. 0 1 1.2 1.4 1.6 1.8 2 -40 -20 0 20 Input Forward voltage VF (V) High Level Output Voltage VOH (V) IOPH (A) High Level Output Current 80 100 120 140 30 VO = VCC2 - 4 V -6 VO = VCC2 - 7 V -4 -2 Ta = 110 C 28 26 Ta = -40 C Ta = 25 C 24 22 20 0 -40 -15 10 35 60 85 0 110 Ambient Temperature Ta (C) -1 -2 -3 High Level Output Current IOPL - Ta -4 IOPH (A) VOL - IOPL 8 10 6 Low Level Output Voltage VOL (V) IOPL (A) 60 VOH - IOPH IOPH - Ta -8 Low Level Output Current 40 Ambient Temperature Ta (C) VO = VEE +7 V 4 VO = VEE +2.5 V 2 0 8 Ta = 25 C 6 Ta = -40 C 4 2 Ta = 110 C 0 -40 -15 10 35 60 85 110 0 Ambient Temperature Ta (C) 1 2 Low Level Output Current 9 3 4 IOPL (A) 2015-12-26 ICL - Ta (VCLAMP - VEE) - ICL 5 4 (VCLAMP - VEE) (V) Clamp Low Level Sinking Current ICL (A) TLP5214 3 VO = VEE +2.5 V 2 1 4 Ta = 25 C Ta = -40 C 3 2 1 Ta = 110 C 0 0 -40 -15 35 10 60 85 0 110 Ambient Temperature Ta (C) 3 4 Clamp Low Level Sinking Current 1 ICL (A) ICC2L, ICC2H - VCC2 (mA) VCC = 15 V ICC2L, ICC2H 2.8 2.6 2.4 ICCH2 Supply Current Supply Current ICC2L, ICC2H (mA) ICC2L, ICC2H - Ta 3 2.2 2 ICCL2 1.8 3 Ta = 25 C 2.8 2.6 ICCH2 2.4 2.2 ICCL2 2 1.8 -40 -15 10 35 60 85 110 15 18 VDESAT = 2 V VCC = 15 V -0.25 -0.3 -0.35 -40 -15 10 35 27 30 VDESAT - Ta (V) ICHG - Ta -0.2 24 21 Supply Voltage VCC2 (V) DESAT Threshold Voltage VDESAT ICHG (mA) Ambient Temperature Ta (C) Blanking Capacitor Charging Current 2 60 85 110 7.5 VCC2 - VE > VUVLO- 7 VCC2 = 30 V 6.5 VCC2 = 15 V 6 -40 Ambient Temperature Ta (C) -15 10 35 60 85 110 Ambient Temperature Ta (C) 10 2015-12-26 (VOH -VCC2) - Ta 0 VOL - Ta 1 IO = -100 mA Low Level Output Voltage VOL (V) High Level Output Voltage VOH -VCC2 (V) TLP5214 -0.2 -0.4 -0.6 -0.8 -1 IO = 100 mA 0.8 0.6 0.4 0.2 0 -40 -15 10 35 60 85 110 -40 Ambient Temperature Ta (C) -15 10 35 110 VO - IF 6 32 VCC2 = 30 V 28 5 Output Voltage VO (V) (mA) Threshold Input Current(L/H) IFLH 85 Ambient Temperature Ta (C) IFLH - Ta 4 3 VCC2 = 15 V / 30 V 2 1 24 20 16 12 8 4 0 0 -40 -15 10 35 60 85 110 0 Rg = 10 , Cg = 25 nF IF = 10 mA, VCC2 = 30 V 120 tPLH 100 tPHL 80 60 40 |tPHL - tPLH| 20 0 -40 -15 10 35 60 85 110 Propagation delay time, Pulse width distortion tpLH, tpHL, |tpHL - tpLH| (ns) tpHL, tpLH, |tpHL-tpLH| - Ta 140 1 2 3 Input Forward Current Ambient Temperature Ta (C) Propagation delay time, Pulse width distortion tpLH, tpHL, |tpHL - tpLH| (ns) 60 Ambient Temperature Ta (C) 5 (mA) tpHL, tpLH, |tpHL-tpLH| - IF 140 Rg = 10 , Cg = 25 nF VCC2 = 30 V, Ta = 25 C 120 tPLH 100 tPHL 80 60 40 |tPHL - tPHL| 20 0 5 10 Input Forward Current 11 4 IF 20 15 IF (mA) 2015-12-26 tpHL, tpLH, |tpHL-tpLH| - VCC2 140 tDESAT(Low) - Ta DESAT Sense to Low Propagation Delay tDESAT(Low) (ns) Propagation delay time, Pulse width distortion tpLH, tpHL, |tpHL - tpLH| (ns) TLP5214 Rg = 10 , Cg = 25 nF IF = 10 mA, Ta = 25 C 120 tpLH 100 tpHL 80 60 40 20 |tpHL - tpLH| 0 15 20 25 300 CDESAT = 100 pF, Rg = 10 , Cg = 25 nF VCC2 = 30 V, RF = 2.1 k, CF = Open 250 200 150 100 30 -40 Supply Voltage VCC2 (V) -15 tDESAT(90%) - Ta CDESAT = 100 pF, Rg = 10 , Cg = 25 nF, VCC2 = 30 V, 250 200 150 60 85 110 CDESAT = 100 pF, Rg = 10 , Cg = 25 nF, VCC2 = 30 V, 3.5 3 2.5 2 1.5 1 100 -40 -15 10 35 60 85 -40 110 -15 RESET to High Level FAULT Signal Delay tRESET(FAULT) (s) CDESAT = 100 pF, Rg = 10 , Cg = 25 nF VCC2 = 30 V, RF = 2.1 k, CF = Open 350 VCC1=5V 300 VCC1=3.3V 250 200 -40 -15 10 35 60 35 60 85 110 tRESET(FAULT) - Ta tDESAT(FAULT) - Ta 400 10 Ambient Temperature Ta (C) Ambient Temperature Ta (C) DESAT Sense to Low Level FAULT Signal Delay tDESAT(FAULT) (ns) 35 tDESAT(10%) - Ta 4 DESAT Sense to 10% Delay tDESAT(10%) (s) DESAT Sense to 90% Delay tDESAT(90%) (ns) 300 10 Ambient Temperature Ta (C) 85 1.2 CDESAT =100 pF, Rg = 10 , Cg = 25 nF VCC2 = 30 V, RF = 2.1 k, CF = Open 1 VCC1=3.3V 0.8 0.6 VCC1=5V 0.4 0.2 0 -40 110 Ambient Temperature Ta (C) -15 10 35 60 85 110 Ambient Temperature Ta (C) 12 2015-12-26 TLP5214 PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING & GENERAL STORAGE (1) Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. 1) When Using Soldering Reflow An example of a temperature profile when lead(Pb)-free solder is use An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering Flow Apply preheating of 150 C for 60 to 120 seconds. Mounting condition of 260 C or less within 10 seconds is recommended. Flow soldering must be performed once 3) When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 C or within 3 seconds not exceeding 350 C. Heating by soldering iron must be only once per 1 lead 13 2015-12-26 TLP5214 (2) Precautions for General Storage 1) Do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) When transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 degree C to 35 degree C, and relative humidity should be maintained at between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices while they are in storage. 8) If devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used. 14 2015-12-26 TLP5214 Specifications for Embossed-Tape Packing (TP) for SO16L Coupler 1. Applicable Package Package Product Type SO16L Long creepage Coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP5214 (TP, E (O Domestic ID (Country / Region of origin: Japan) [[G]]/RoHS COMPATIBLE (Note) Tape type Device name Note : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. 3. Tape Dimensions 3.1 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Tape feed Figure 1 Device Orientation 3.2 Packing Quantity: 1500 per reel 15 2015-12-26 TLP5214 3.3 Empty Device Recesses Are as Shown in Table 1. Table1 Empty Device Recesses Standard Occurrences of 2 or more successive empty device recesses Single empty device recesses 0 device 6 device (max) per reel Remarks Within any given 40-mm section of tape, not including leader and trailer Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and more than 30mm only for a cover tape. 3.5 Tape Specification (1) Material: Plastic (for protection against static electricity) (2) Dimensions: The tape dimensions are shown in Figure 2 and Table 2. Unit:mm Figure 2 Tape Forms Table 2 Tape Dimensions Unit: mm Unless otherwise specified: 0.1 Symbol Dimension Remark A 10.4 B 10.7 D 7.5 Center line of indented square hole and sprocket hole E 1.75 Distance between tape edge and hole center F 12.0 Cumulative error +0.1 (max) per 10 feed holes G 4.0 Cumulative error -0.3 (max) per 10 feed holes K0 2.4 Internal space -0.3 +0.1 16 2015-12-26 TLP5214 3.6 Reel (1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3. Table 3 Reel Dimension A B C Unit: mm Symbol Dimension A 330 2 B 100 1 C 13 0.5 E 2.0 0.5 U 4.0 0.5 W1 17.4 1.0 W2 21.4 1.0 W1 W2 Figure 3 Reel Forms 4. Packing Either one reel or ten reels of photocoupler are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the CTR rank, the tape and the quantity as shown in the following example. (Example) TLP5214 (TP, E (O 1500Pcs. Quantity (must be a multiple of 1500) Domestic ID (Country / Region of origin: Japan) [[G]]/RoHS COMPATIBLE (Note) Tape type Device name Note : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. 17 2015-12-26 TLP5214 7. Packing Dimensions (330 mm) 26 Unit: mm 1 Reel/Carton 30 25(In Size) 334(In Size) 337(In Size) Label 10Reel/Carton [10Reel] 356 391 386 18 2015-12-26 TLP5214 8. Marking Lot No. Part No. (or abbreviation code) Pin No.1 (the dent in the resin) 19 2015-12-26 TLP5214 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 20 2015-12-26