2018 Microchip Technology Inc. DS20006029A-page 1
MIC94305
Features
1.8V to 3.6V Input Voltage Range
Active Noise Rejection Over a Wide Frequency
Band
- >60 dB from 40 kHz to 5 MHz
Rated to 500 mA Output Current
Current-Limit and Thermal-Limit Protected
1.6 mm × 1.6 mm 6-Pin Thin DFN
Logic-Controlled Enable Pin
–40°C to +125°C Junction Temperature Range
Applications
Smartphones
Tablet PC/Notebooks and Webcams
Digital Still and Video Cameras
Video Conferencing
Barcode Scanners
Global Positioning Systems
Automotive and Industrial Applications
General Description
The MIC94305 is an integrated load switch that
incorporates Microchip’s Ripple Blocker™ active filter
technology. The MIC94305 provides high-frequency
ripple attenuation (switching noise rejection) for
applications where switching noise cannot be tolerated
by sensitive downstream circuits, such as RF
applications. A low voltage logic enable pin
disconnects the pass element and puts the MIC94305
in a low current shutdown state when disabled.
The MIC94305 operates from an input voltage of 1.8V
to 3.6V, allowing true load switching of low voltage
power rails in any electronic device. The output voltage
(VOUT) is set at a fixed drop (typically 170 mV) from the
input voltage (VOUT = VIN – 170 mV). This maintains
high efficiency independent of given load conditions
and currents.
The MIC94305 is packaged in a 6-pin 1.6 mm x 1.6 mm
Thin DFN package and has a junction operating
temperature range of –40°C to +125°C.
Package Type
MIC94305
6-Pin TDFN (MT)
(Top View)
VOUT
VOUT
GND
VIN
VIN
EN
EP
1
2
34
5
6
500 mA Switch with Ripple Blocker™ Technology
MIC94305
DS20006029A-page 2 2018 Microchip Technology Inc.
Typical Application Circuit
Functional Block Diagram
MIC94305
1.6 x 1.6 TDFN
VIN
EN GND
VOUT
MIC94305YMT
C
IN
4.7μF
EN
C
OUT
4.7μF
LOAD
DC/DC
VIN
EN
DRIVER
CHARGE
PUMP
VOUT
BIAS AND
THERMAL
SHUTDOWN
GND
LPF
2018 Microchip Technology Inc. DS20006029A-page 3
MIC94305
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage (VIN) .................................................................................................................................... –0.3V to +4.0V
Output Voltage (VOUT) .............................................................................................................................. –0.3V to +4.0V
Enable Voltage (VEN) ............................................................................................................ –0.3V to VIN+0.3V or +4.0V
ESD Rating (Note 1) ................................................................................................................................................ +3 kV
Operating Ratings ††
Input Voltage (VIN) .................................................................................................................................... +1.8V to +3.6V
Enable Voltage (VEN) ..........................................................................................................................................0V to VIN
Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
†† Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 k in series
with 100 pF.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VEN = 3.6V; IOUT = 1 mA; COUT = 4.7 µF; TA = +25°C, bold values indicate –40°C
TJ +125°C, unless noted. Note 1
Parameter Sym. Min. Typ. Max. Units Conditions
Input Voltage VIN 1.8 3.6 V—
Voltage Drop VDROP 170 250 mV VIN – VOUT, –40°C TJ +85°C
VIN Ripple Rejection PSRR —45—dB f = 20 kHz, IOUT = 500 mA
55 f = 100 kHz to 5 MHz, IOUT = 500 mA
Total Output Noise eN—98—µV
RMS f = 10 Hz to 100 kHz
Current Limit ILIM 530 725 1100 mA VOUT = 0V
Turn-On Time tON —90150 µs EN controlled
Load Regulation 10 mV 100 µA to 100 mA
Ground Current IGND 150 200 µA IOUT = 100 µA
Shutdown Current ISHDN —0.2 5 µAV
EN = 0V
Enable
Input Logic Low 0.4 V—
Input Logic High 1.0 —— V
Input Current IIN —0.01 1 µA
Note 1: Specification for packaged product only.
MIC94305
DS20006029A-page 4 2018 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Junction Operating Temperature TJ–40 +125 °C
Lead Temperature +260 °C Soldering, 10 sec.
Storage Temperature Range TS–65 +150 °C
Package Thermal Resistances
Thermal Resistance, TDFN 6-Ld JA —92 °C/W
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 Microchip Technology Inc. DS20006029A-page 5
MIC94305
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: PSRR COUT = 4.7 µF.
FIGURE 2-2: PSRR COUT = 4.7 µF.
FIGURE 2-3: PSRR COUT = 4.7 µF.
FIGURE 2-4: PSRR COUT = 10 µF.
FIGURE 2-5: PSRR COUT = 10 µF.
FIGURE 2-6: PSRR COUT = 10 µF.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MIC94305
DS20006029A-page 6 2018 Microchip Technology Inc.
FIGURE 2-7: PSRR COUT = 22 µF.
FIGURE 2-8: PSRR COUT = 22 µF.
FIGURE 2-9: PSRR COUT = 22 µF.
.
FIGURE 2-10: Output Voltage vs. Output
Current.
FIGURE 2-11: Output Voltage vs. Output
Current.
FIGURE 2-12: Voltage Drop vs. Output
Current.
2018 Microchip Technology Inc. DS20006029A-page 7
MIC94305
FIGURE 2-13: Voltage Drop vs. Input
Current.
FIGURE 2-14: Ground Current vs. Output
Current.
FIGURE 2-15: Ground Current vs. Input
Voltage.
FIGURE 2-16: Output Noise Spectral
Density.
FIGURE 2-17: Load Transient.
FIGURE 2-18: Line Transient.
Time (1.00ms/div)
VIN
(1V/div)
VOUT
(1V/div)
CIN = COUT = 4.7μF
IOUT = 300mA
MIC94305
DS20006029A-page 8 2018 Microchip Technology Inc.
FIGURE 2-19: Enable Turn -O ff.
FIGURE 2-20: Enable Turn -O n .
VEN
(1V/div)
VOUT
(2V/div)
Time (400μs/div)
VIN = 2.8V
CIN = COUT = 4.7μF
IOUT = 500mA
VEN
(1V/div)
VOUT
(2V/div)
Time (400μs/div)
VIN = 2.8V
CIN = COUT = 4.7μF
2018 Microchip Technology Inc. DS20006029A-page 9
MIC94305
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin Number Pin Name Description
1, 2 VOUT Power switch output.
3 GND Ground.
4EN
Enable Input. A logic-high signal on this pin enables the part. Logic-low disables
the part. Do not leave floating.
5, 6 VIN Power switch input and chip supply.
ePad EP Exposed heatsink pad. Connect to Ground for best thermal performance.
MIC94305
DS20006029A-page 10 2018 Microchip Technology Inc.
4.0 APPLICATION INFORMATION
The MIC94305 uses Ripple Blocker technology to
integrate a load switch with a high-performance active
filter. The MIC94305 includes a low voltage logic
enable pin and is fully protected from damage caused
by fault conditions, offering linear current-limiting and
thermal shutdown.
4.1 Input Capacitor
The MIC94305 is a high-performance, high-bandwidth
device. An input capacitor of 0.47 µF is required from
the input to ground to provide stability. Low-ESR
ceramic capacitors provide optimal performance at a
minimum of space. Additional high-frequency
capacitors, such as small-valued NPO dielectric-type
capacitors, help filter out high-frequency noise and are
good practice in any RF-based circuit. X5R or X7R
dielectrics are recommended for the input capacitor.
Y5V dielectrics lose most of their capacitance over
temperature and are not recommended.
4.2 Output Capacitance
The MIC94305 requires an output capacitor of 4.7 µF
or greater to maintain stability. For optimal ripple
rejection performance, a 4.7 µF capacitor is
recommended. The design is optimized for use with
low-ESR ceramic-chip capacitors. High-ESR
capacitors are not recommended because they may
cause high-frequency oscillation. The output capacitor
can be increased, but performance has been optimized
for a 4.7 µF ceramic output capacitor and does not
improve significantly with larger capacitance.
X7R/X5R dielectric-type ceramic capacitors are
recommended because of their temperature
performance. X7R-type capacitors change capacitance
by 15% over their operating temperature range and are
the most stable type of ceramic capacitors. Z5U and
Y5V dielectric capacitors change value by as much as
50% and 60%, respectively, over their operating
temperature ranges. If you use a ceramic-chip
capacitor with a Y5V dielectric, the value must be much
higher than an X7R ceramic capacitor to ensure the
same minimum capacitance over the equivalent
operating temperature range.
4.3 No-Load Stability
The MIC94305 will remain stable with no load. This is
especially important in CMOS RAM keep-alive
applications.
4.4 Enable/Shutdown
The MIC94305 comes with an active-high enable pin
that allows the Ripple Blocker to be disabled. Forcing
the enable pin low disables the MIC94305 and sends it
into a “zero” off mode current state. In this state, current
consumed by the MIC94305 goes to nearly zero.
Forcing the enable pin high enables the output voltage.
The active-high enable pin uses CMOS technology and
cannot be left floating; a floating enable pin may cause
an indeterminate state on the output.
4.5 Thermal Considerations
The MIC94305 is designed to provide 500 mA of
continuous current in a very small package. Maximum
ambient operating temperature can be calculated
based on the output current and the voltage drop
across the part, which is fixed at 170 mV typical,
250 mV worst case. For example if the input voltage is
2.75V, the output voltage is 2.5V, and the output current
equals 500 mA. The actual power dissipation of the
Ripple Blocker™ can be determined using
Equation 4-1:
EQUATION 4-1:
Because this device is CMOS and the ground current
is typically <100 µA over the load range, the power
dissipation contributed by the ground current is <1%
and can be ignored for the calculation shown in
Equation 4-2.
EQUATION 4-2:
To determine the maximum ambient operating
temperature of the package, use the
junction-to-ambient thermal resistance of the device
and the Equation 4-3:
EQUATION 4-3:
Substituting PD for PD(MAX) and solving for the ambient
operating temperature will give the maximum operating
conditions for the regulator circuit.
For proper operation, the maximum power dissipation
must not be exceeded.
PDVIN VOUT
IOUT VINIGND
+=
PD2.75V2.5V500 mA=
PDMAX
TJMAX
TA
JA
--------------------------------


=
Where:
TJ(MAX) = +125°C; the max. junction temp. of the die.
θJA = 92°C/W for the 6-lead TDFN.
2018 Microchip Technology Inc. DS20006029A-page 11
MIC94305
For example, when operating the MIC94305YMT at a
2.75V input voltage and 500 mA load with a minimum
footprint layout, the maximum ambient operating
temperature TA can be determined as follows:
EQUATION 4-4:
It follows from this equation that the maximum ambient
operating temperature of 113.5°C is allowed in a
1.6 mm x 1.6 mm TDFN package. For a full discussion
of heat sinking and thermal effects on voltage
regulators, refer to the “Regulator Thermals” section of
Microchip’s Designing with Low-Dropout Voltage
Regulators handbook.
0.125W125CT
A
92C/W=
TA113.5C=
MIC94305
DS20006029A-page 12 2018 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Example6-Lead TDFN*
XX 2W
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
, , Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar () symbol may not be to scale.
3
e
3
e
2018 Microchip Technology Inc. DS20006029A-page 13
MIC94305
6-Lead 1.6 mm × 1.6 mm Thin DFN Package Outline & Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC94305
DS20006029A-page 14 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006029A-page 15
MIC94305
APPENDIX A: REVISION HIST OR Y
Revision A (May 2018)
Converted Micrel document MIC94305 to Micro-
chip data sheet template DS20006029A.
Minor grammatical text changes throughout.
Added soldering conditions to Lead Temperature
value in Temperature Specifications.
Added voltage drop information to Section 4.5
“Thermal Considerations”.
MIC94305
DS20006029A-page 16 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006029A-page 17
MIC94305
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) MIC94305YMT-T5: MIC94305, –40°C to +125°C
Temperature Range, 6-Lead
TDFN, 500/Reel
b) MIC94305YMT-TR: MIC94305, –40°C to +125°C
Temperature Range, 6-Lead
TDFN, 5,000/Reel
Device: MIC94305: 500 mA Switch with Ripple Blocker
Technology
Junction
Temperature
Range: Y = –40°C to +125°C, RoHS-Compliant
Package: MT = 6-Lead 1.6 mm x 1.6 mm TDFN
Media Type: T5 = 500/Reel
TR = 5,000/Reel
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
Device X XX -XX
Part No. Junction
Temp. Range
Package Media Type
MIC94305
DS20006029A-page 18 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006029A-page 19
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3068-1
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intended manner and under normal conditions.
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Microchip is willing to work with the customer who is concerned about the integrity of their code.
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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YSTEM
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DS20006029A-page 20 2018 Microchip Technology Inc.
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