Supplier : Samsung electro-mechanics Samsung P/N : CL21B682KB65PNC
Product : Multi-layer Ceramic Capacitor Description : CAP, 6.8, 50V, ±10%, X7R, 0805
AEC-Q 200 Specified
CL 21 B 682 K B 6 5 P N C
②③ ⑤⑥⑦⑧⑨⑩⑪
Series Samsung Multi-layer Ceramic Capacitor
Size 0805 (inch code) L: 2.0 ± 0.1 mm W: ± 0.1 mm
Dielectric X7R Inner electrode Ni , Open mode
Capacitance 6.8 Termination Cu , Ag-epoxy
Capacitance ±10 % Plating Sn 100% (Pb Free)
tolerance Product Automotive
Rated Voltage 50 V Grade code Standard
Thickness 0.6 ± 0.1 mm Packaging Cardboard Type, 7" reel
B. Reliablility Test and Judgement condition
High Temperature Unpowered, 1000hrs@T=150
Exposure Capacitance Change : Within ±10% Measurement at 24±2hrs after test conclusion
Tan δ : 0.03 max
IR : More than 10,000 or 500×
Whichever is Smaller
Temperature Cycling 1000Cycles
Capacitance Change : Within ±10% Measurement at 24±2hrs after test conclusion
Tan δ : 0.03 max 1 cycle condition :
IR : More than 10,000 or 500× -55+0/-3(15±3min) -> Room Temp(1min.)
Whichever is Smaller -> 125+3/-0(15±3min) -> Room Temp(1min.)
Destructive Physical No Defects or abnormalities Per EIA 469
Analysis
Moisture Resistance 10Cycles, t=24hrs/cycle
Capacitance Change : Within ±12.5% Heat (25~65) and humidity (80~98%), Unpowered
Tan δ : 0.03 max measurement at 24±2hrs after test conclusion
IR : More than 10,000 or 500×
Whichever is Smaller
Humidity Bias 1000hrs 85/85%RH, Rated Voltate and 1.3~1.5V,
Capacitance Change : Within ±12.5% Add 100kohm resistor
Tan δ : 0.035 max Measurement at 24±2hrs after test conclusion
IR : More than 500 or 25×The charge/discharge current is less than 50mA.
Whichever is Smaller
High Temperature 1000hrs @ TA=125, 200% Rated Voltage,
Operating Life Capacitance Change : Within ±12.5% Measurement at 24±2hrs after test conclusion
Tan δ : 0.035 max The charge/discharge current is less than 50mA.
IR : More than 1000 or 50×
Whichever is Smaller
Performance Test condition
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
1.25
Specification of Automotive MLCC
A. Samsung Part Number
Appearance : No abnormal exterior appearance
External Visual No abnormal exterior appearance Microscope (´10)
Physical Dimensions Within the specified dimensions Using The calipers
Mechanical Shock Three shocks in each direction should be applied along
Capacitance Change : Within ±10% 3 mutually perpendicular axes of the test specimen (18 shocks)
Tan δ, IR : initial spec.
Vibration 5g's for 20min., 12cycles each of 3 orientations,
Capacitance Change : Within ±10% Use 8"×5" PCB 0.031" Thick 7 secure points on one long side
Tan δ, IR : initial spec. and 2 secure points at corners of opposite sides. Parts mounted
within 2" from any secure point. Test from 10~2000.
Resistance to Solder pot : 260±5, 10±1sec.
Solder Heat Capacitance Change : Within ±10%
Tan δ, IR : initial spec.
Thermal Shock -55/+125.
Capacitance Change : Within ±10% Note: Number of cycles required-300,
Tan δ, IR : initial spec. Maximum transfer time-20 sec, Dwell time-15min. Air-Air
ESD AEC-Q200-002
Capacitance Change : Within ±10%
Tan δ, IR : initial spec.
Solderability 95% of the terminations is to be soldered a) Preheat at 155 for 4 hours, Immerse in solder for 5s at 245±5
evenly and continuously b) Steam aging for 8 hours, Immerse in solder for 5s at 245±5
c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5
solder : a solution ethanol and rosin
Electrical Capacitance : Within specified tolerance The Capacitance /D.F. should be measured at 25,
Characterization Tan δ (DF) : 0.025 max. 1±10%, 1.0±0.2Vrms
IR(25) : More than 10,000 or 500×I.R. should be measured with a DC voltage not exceeding
IR(125) : More than1,000 or 10×Rated Voltage @25, @125 for 60~120 sec.
Whichever is Smaller
Dielectric Strength Dielectric Strength : 250% of the rated voltage for 1~5 seconds
Board Flex Bending to the limit (2) for 5 seconds
Capacitance Change : Within ±10%
Terminal 18N, for 60±1 sec.
Strength(SMD) Capacitance Change : Within ±10%
Beam Load Destruction value should not be exceed Beam speed
Chip Length < 2.50.5±0.05/sec
a) Chip Thickness > 0.5 : 20N
b) Chip Thickness 0.5 : 8N
Temperature X7R
Characterisitcs (From -55 to 125, Capacitance change shoud be within ±15%)
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5, 10sec. Max )
Meet IPC/JEDEC J-STD-020 D Standard
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.
Velocity
Performance Test condition
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
Duration Wave
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
1,500G
Peakvalue
Appearance : No abnormal exterior appearance
0.5ms Half sine 4.7m/sec.
Appearance : No abnormal exterior appearance