ISD1100 SERIES SINGLE-CHIP, VOICE RECORD / PLAYBACK DEVICES 10- AND 12-SECOND DURATION -1- Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 1. GENERAL DESCRIPTION Winbond's ChipCorder(R) ISD1100 series provide high-quality, single-chip, Record/Playback solutions to 10- and 12-second messaging applications. The CMOS devices include an on-chip oscillator, microphone preamplifier, automatic gain control, anti-aliasing filter, smoothing filter, and speaker amplifier. A minimum Record/Playback subsystem can be configured with a microphone, a speaker, several passive components, two push buttons and a power source. Recordings are stored into onchip nonvolatile memory cells, providing zero-power message storage. This unique, single-chip solution is made possible through Winbond's patented Multi-Level Storage (MLS) technology. Voice and audio signals are stored directly into memory in their natural form, providing high-quality, solidstate voice reproduction. 2. FEATURES * Single 5 volt power supply * Single-Chip with 10 and 12 seconds duration * Easy-to-use single-chip, voice record/playback solution * Push-button interface o Playback can be edge- or level-activated * Fully addressable to handle multiple messages * Automatic power-down * o Enters into standby mode automatically following a record or playback operation o 0.5 A Standby current (typical) Zero-power message storage o Eliminates battery backup circuits * High-quality, natural voice/audio reproduction * On-chip oscillator * No programmer or development system needed * 100,000 record cycles (typical) * 100-year message retention (typical) * Available in die, PDIP, and SOIC * Packaged type: leaded and lead-free * Temperature: Commercial - Packaged unit : 0C to 70C, Die : 0C to 50C -2- ISD1100 SERIES 3. BLOCK DIAGRAM Internal Clock Timing XCLK Sampling Clock Amp 5-Pole Active Antialiasing Filter ANA OUT MIC MIC REF Analog Transceivers 64K Cell Nonvolatile Multilevel Storage Array Decoders ANA IN PreAmp 5-Pole Active Smoothing Filter SP + Amp SP - Automatic Gain Control (AGC) AGC Power Conditioning VCCA VSSA VSSD VCCD Device Control Address Buffers A0 A1 A2 A3 A4 A5 A6 A7 -3- REC PLAYE PLAYL RECLED Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 4. TABLE OF CONTENTS 1. GENERAL DESCRIPTION.................................................................................................................. 2 2. FEATURES ......................................................................................................................................... 2 3. BLOCK DIAGRAM............................................................................................................................... 3 4. TABLE OF CONTENTS ...................................................................................................................... 4 5. PIN CONFIGURATION ....................................................................................................................... 5 6. PIN DESCRIPTION ............................................................................................................................. 6 7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10 7.1. Detailed Description.................................................................................................................... 10 8. TIMING DIAGRAMS.......................................................................................................................... 12 9. ABSOLUTE MAXIMUM RATINGS [1] ................................................................................................ 13 9.1 Operating Conditions ................................................................................................................... 14 10. ELECTRICAL CHARACTERISTICS ............................................................................................... 15 10.1. Parameters For Packaged Parts .............................................................................................. 15 10.1.1. Typical Parameter Variation with Voltage and Temperature ............................................. 18 10.2. Parameters For DIE.................................................................................................................. 19 10.2.1. Typical Parameter Variation with Voltage and Temperature ............................................. 22 11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 23 12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 26 12.1. 28-Lead 300mil Plastic Small Outline IC (SOIC) ...................................................................... 26 12.2. 28-Lead 600mil Plastic Dual Inline Package (PDIP) ................................................................ 27 12.3. Die Physical Layout [1] ............................................................................................................... 28 13. ORDERING INFORMATION........................................................................................................... 30 14. VERSION HISTORY ....................................................................................................................... 31 -4- ISD1100 SERIES 5. PIN CONFIGURATION A0 1 28 VCCD A1 2 27 REC A2 3 26 XCLK A3 4 25 RECLED A4 5 24 PLAYE A5 6 23 PLAYL NC 7 22 NC NC 8 21 ANA OUT A6 9 20 ANA IN A7 10 19 AGC NC 11 18 MIC REF VSSD 12 17 MIC VSSA 13 16 VCCA SP+ 14 15 SP- SOIC / PDIP -5- Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 6. PIN DESCRIPTION PIN NAME PIN NO. FUNCTION A0-A7 1-6, 9, 10 Address Inputs: The address inputs have two functions, depending on the level of the two Most Significant Bits (MSB) of the address (A6 and A7). If either or both of the two MSBs are LOW, all inputs are interpreted as address bits and are used as the start address for the current record or playback cycle. The address pins are inputs only and do not output internal address information as the operation progresses. Address inputs are latched by the falling edge of PLAYE , PLAYL , or REC . If both A6 & A7 are HIGH, then the device is in a special operational mode for looping. Please refer to looping capability section for details. A0, A1, A2, A3, A4 and A5 have internal pull-down resistors, while A6 and A7 have internal pull-up resistors. They can be floating if not used. Each of these internal pull-up or pull-down devices have a value of 50 K to 100 K . VSSA, VSSD 12, 13 Ground: Similar to VCCA and VCCD, separate analog and digital ground rails provide independent analog and digital ground buses internally to minimize noise. These pins should be tied together as close as possible to the device. SP+, SP- 14, 15 Speaker Outputs: The differential SP+ and SP- pins are designed to drive a 16 speaker directly. Conversely, with single-ended connection, a coupling capacitor is needed between the SP pin and the speaker. Besides, the output power is about a quarter of that from differential output. The speaker outputs are in high-impedance state during recording and at VSSA during power down. VCCA, VCCD 16, 28 Supply Voltages: Separate analog and digital powers provide power to internal analog and digital circuits respectively to minimize internal noises. These power buses are brought out to separate pads and should be tied together as close to the supply source as possible. It is important that the power supplies are decoupled as close to the device as possible. MIC 17 Microphone: The microphone input transfers its signal to the on-chip preamplifier. An on-chip Automatic Gain Control (AGC) circuit controls the gain of this preamplifier from -15 to 24dB. An external microphone should be AC coupled to this pin via a series capacitor. The capacitor value, together with the internal 10 K resistance on this pin, determines the lowfrequency cutoff for the device passband. See Winbond's Application Information for additional information on lowfrequency cutoff calculation. -6- ISD1100 SERIES PIN NAME PIN NO. FUNCTION MIC REF 18 Microphone Reference: The MIC REF input is the inverting input to the microphone preamplifier. This provides a noisecanceling or common-mode rejection input to the device when connected to a differential microphone. AGC 19 Automatic Gain Control (AGC): The AGC input dynamically adjusts the gain of the preamplifier to compensate for the wide range of microphone input levels. The AGC allows the full range of sound, from whispers to loud sounds, to be recorded with minimal distortion. The "attack" time is determined by the time constant of a 5 K internal resistance and an external capacitor (C6 of Figure 5 in Section 11) connected from the AGC pin to VSSA. The "release" time is determined by the time constant of an external resistor (R5) and an external capacitor (C6) connected in parallel between the AGC pin and VSSA pin. Nominal values of 470 K and 4.7 F give satisfactory results in most cases. Tying this to ground gives maximum gain, while tying it to VCCA gives minimum gain for the AGC amplifier. ANA IN 20 Analog Input: The ANA IN transfers an input signal to the chip for recording. For microphone usage, this ANA IN pin should be connected via an external capacitor to the ANA OUT pin. This capacitor value, together with the 3 K input impedance of ANA IN, is selected to give additional cutoff at the low-frequency end of the voice passband. If the desired input is derived from a source other than a microphone, the signal can be capacitively coupled into the ANA IN pin directly. ANA OUT 21 Analog Output: This pin provides the preamplifier output to the user. The voltage gain of the preamplifier is determined by the voltage level at the AGC pin. 23 Playback, Level-Activated: When this input signal is held LOW, a playback cycle is initiated, and playback continues PLAYL [2][3] until PLAYL is pulled HIGH, or an EOM marker is detected. The device automatically powers down and enters into standby mode upon completion of a playback cycle. This pin has an internal pull-up resistor. PLAYE [2][3] 24 Playback, Edge-Activated: When a LOW-going transition is detected on this pin, a playback cycle begins. Taking PLAYE HIGH during a playback cycle will not terminate the current cycle. Playback continues until an EOM is encountered. Upon completion of a playback cycle, the device automatically powers down and enters into standby mode. This pin has an internal pull-up device. -7- Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES PIN NAME PIN NO. FUNCTION RECLED 25 Record LED: The RECLED output is LOW during a record cycle. It can be used to drive an LED to indicate a record cycle is in progress. In addition, RECLED pulses LOW momentarily when an end-of-message is encountered in a playback operation. XCLK 26 External Clock: The external clock input has an internal pulldown resistor. The ISD1100 is configured at the factory with an internal sampling clock frequency that guarantees its minimum nominal record/playback time. For instance, an ISD1110 operating within specification will be observed to always have a minimum of 10 seconds of recording time. The sampling frequency is then maintained to a variation of 2.25 percent over the commercial temperature and operating voltage ranges while still maintaining the minimum duration specified. As a result some devices will have a few percent more than nominal recording time. If greater precision is required, the device can be clocked through the XCLK pin as follows: EXTERNAL CLOCK SAMPLE RATES Part Number Sample Rate Required Clock ISD1110 6.4 kHz 819.2 kHz ISD1112 5.3 kHz 682.7 kHz These recommended clock rates should not be varied because the anti-aliasing and smoothing filters are fixed, and aliasing problems can occur if the sample rate differs from the one recommended. The duty cycle on the input clock is not critical, as the clock is immediately divided by two. If the XCLK is not used, this pin must be grounded. Please see Application Information for the ISD1100 series for more details on external clocking. -8- ISD1100 SERIES PIN NAME REC [1][3] PIN NO. FUNCTION 27 Record: The REC input is an active-LOW signal. The device records whenever REC is LOW. This signal must remain LOW for the duration of the recording. A record cycle is completed when REC is pulled HIGH or the memory space is filled up. REC takes precedence over either playback ( PLAYE or PLAYL ) signal. If REC is pulled LOW during a playback cycle, the playback immediately ceases and recording begins. An end-of-message (EOM) marker is internally recorded, enabling a subsequent playback cycle to terminate appropriately. The device automatically powers down into standby mode when REC goes HIGH. This pin has an internal pull-up resistor. NC 11 NC: No connect Notes: [1] The REC signal is debounced for 50 ms on the rising edge to prevent a false retriggering from a pushbutton switch. [2] During playback, if either PLAYE or PLAYL is held LOW during EOM or OVF, the device will still enter into standby mode and the internal oscillator and timing generator will stop. However, the rising edge of PLAYE and PLAYL are not debounced and any subsequent falling edge (particularly switch bounce) present on the input pins will initiate another playback. [3] REC , PLAYL and PLAYE have internal pull-ups to VCC. Holding on these pins LOW wil increase standby current consumption. -9- Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 7. FUNCTIONAL DESCRIPTION 7.1. DETAILED DESCRIPTION Speech/Sound Quality Winbond's patented ChipCorder(R) technology provides natural audio record and playback. The ISD1100 series include devices of 5.3 kHz and 6.4 kHz sampling frequencies, allowing the user a choice of speech quality options. The input voice signals are stored directly into non-volatile EEPROM cells and are reproduced without the synthetic effect often heard with digital solid-state speech solutions. A complete sample is stored in a single cell, minimizing the memory necessary to store a recording of a given duration. Duration The ISD1100 series offer single-chip solutions of 10 and 12 seconds duration. TABLE 1: ISD1100 SERIES PRODUCT SUMMARY Part Number Duration (Seconds) Input Sample Rate (kHz) Typical Filter Pass Band* (kHz) ISD1110 10 6.4 2.6 ISD1112 12 5.3 2.2 * 3dB roll-off-point.... EEPROM Storage One of the benefits of Winbond's ChipCorder(R) technology is the use of on-chip non-volatile memory, providing zero-power message storage. The message is retained for up to 100 years typically without power. In addition, the device can be re-recorded typically over 100,000 times. Basic Operation The ISD1100 ChipCorder(R) series are controlled by a single signal, REC , or one of two playback control signals, PLAYE (edge-activated playback), and PLAYL (level-activated playback). The ISD1100 series parts are configured for simplicity of design in a single/multiple-message application. Using the address lines will allow multiple message applications. Automatic Power-Down Mode At the end of a playback or record operation, the ISD1100 series automatically enters into a standby mode, with typically 0.5 A current. During a playback cycle, the device powers down automatically at the end of the message. During a record cycle, the device powers down immediately after REC is released HIGH. - 10 - ISD1100 SERIES Addressing In addition to single-message application, the ISD1100 series provides a full addressing capability for multiple message application. The memory array of ISD1100 series has 80 distinct addressable rows, providing the below resolutions per row. See Application Information for address tables of ISD1100 series. TABLE 2: DEVICE PLAYBACK/RECORD DURATIONS Part Number Minimum Duration (per ROW) ISD1110 125 msec ISD1112 150 msec Looping Capability The ISD1100 series device has a built-in looping function enabling it to continuously repeat a single message. This mode is accomplished by taking A3, A6 and A7 pins HIGH simultaneously to continuously loop from the end of the message to the beginning of the message. Looping is initiated by a negative transition on PLAYE pin with A3, A6 and A7 held HIGH, then PLAYE is brought back to HIGH. Looping will continue indefinitely with all three control pins ( PLAYE , PLAYL , REC ) remaining HIGH, until PLAYL is pulsed to LOW, which ends the looping. - 11 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 8. TIMING DIAGRAMS TREC TREC REC TLED1 TLED2 RECLED TSET TSET THOLD THOLD A0-A7 MIC ANA IN TRPUD TRPDD FIGURE 1: RECORD [1] REC TPLAY PLAYL PLAYE TSET THOLD TSET THOLD TSET THOLD A0-A7 SP+/TPPUD TPPDD TPPDD TPPUD [2] RECLED TEOM [1] [2] REC must be HIGH for the entire duration of a playback cycle. RECLED functions as an EOM playback. FIGURE 2: PLAYBACK - 12 - TEOM ISD1100 SERIES 9. ABSOLUTE MAXIMUM RATINGS [1] TABLE 3: ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) CONDITIONS VALUES Junction temperature 150C Storage temperature range -65C to +150C Voltage applied to any pin (VSS - 0.3V) to (VCC + 0.3V) Voltage applied to any pins (Input current limited to 20 mA) (VSS - 1.0V) to (VCC + 1.0V) Lead temperature (Soldering - 10sec) 300C VCC - VSS -0.3V to +7V TABLE 4: ABSOLUTE MAXIMUM RATINGS (DIE) CONDITIONS VALUES Junction temperature 150C Storage temperature range -65C to +150C Voltage applied to any pad (VSS - 0.3V) to (VCC + 0.3V) Voltage applied to any pad (Input current limited to 20mA) (VSS - 1.0V) to (VCC + 1.0V) VCC - VSS -0.3V to +7V [1] Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability and performance. Functional operation is not implied at these conditions. - 13 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 9.1 OPERATING CONDITIONS TABLE 5: OPERATING CONDITIONS (PACKAGED PARTS) CONDITIONS VALUES Commercial operating temperature range (Case temperature) Supply voltage (VCC) [1] +4.5V to +5.5V [2] Ground voltage (VSS) 0C to +70C 0V TABLE 6: OPERATING CONDITIONS (DIE) CONDITIONS VALUES 0C to +50C Commercial operating temperature range Supply voltage (VCC) [1] Ground voltage (VSS) [1] VCC = VCCA = VCCD [2] VSS = VSSA = VSSD +4.5V to +6.5V [2] 0V - 14 - ISD1100 SERIES 10. ELECTRICAL CHARACTERISTICS 10.1. PARAMETERS FOR PACKAGED PARTS TABLE 7: DC PARAMETERS PARAMETERS SYMBOLS MIN[2] TYP[1] Input Low Voltage VIL Input High Voltage VIH Output Low Voltage VOL Output High Voltage VOH VCC Current (Operating) ICC 15 VCC Current (Standby) ISB 0.5 Input Leakage Current IIL Input Current LOW w/ Pull Up MAX[2] UNITS 0.8 V 2.4 CONDITIONS V 0.4 V IOL = 4.0 mA V IOH = -1.6 A 30 mA VCC = 5.5V[3], REXT = 2 A [3] [4] 1 A IILPU -130 A Force VSS [5] Input Current HIGH w/ Pull Down IILPD 130 A Force VCC [6] Output Load Impedance REXT Speaker Load Preamp Input Resistance RMIC 10 K ANA IN Input Resistance RANA IN 3 K Preamp Gain 1 APRE1 24 dB AGC = 0.0V Preamp Gain 2 APRE2 -45 dB AGC = 2.5V ANA IN to SP+/- Gain AARP 22 dB AGC Output Resistance RAGC 5 K Preamp Out Source IPREH -2 mA @ VOUT = 1.0V Preamp In Sink IPREL 0.5 mA @ VOUT = 2.0V 2.4 16 -15 Pins 17, 18 Notes: [1] Typical values @ TA = 25 and VCC = 5.0V. [2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all specifications are 100 percent tested. [3] VCCA and VCCD connected together. [4] REC , PLAYL , and PLAYE must be at VCCD. [5] XCLK pin only. [6] A0-A5, XCLK. - 15 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES TABLE 8: AC PARAMETERS - Packaged parts MAX[2] UNITS ISD1110 6.4 kHz [5] ISD1112 5.3 kHz [5] CHARACTERISTIC Sampling Frequency Filter Pass Band SYMBOLS MIN[2] TYP[1] CONDITIONS FS FCF ISD1110 2.6 kHz 3 dB Roll-Off Point [3][6] ISD1112 2.2 kHz 3 dB Roll-Off Point [3][6] Record Duration TREC ISD1110 10 sec ISD1112 12 sec ISD1110 10 sec [5] ISD1112 12 sec [5] Playback Duration TPLAY RECLED ON Delay TLED1 RECLED OFF Delay TLED2 ISD1110 ISD1112 5 sec 40 48.5 100 msec 50 58.3 105 msec A0-A7 Setup Time TSET 300 nsec A0-A7 Hold Time THOLD 0 nsec Record Power-Up Delay TRPUD ISD1110 32 msec ISD1112 39 msec ISD1110 32 msec ISD1112 39 msec ISD1110 32 msec ISD1112 39 msec ISD1110 8.1 msec ISD1112 9.7 msec Record Power-Down Delay Play Power-Up Delay Play Power-Down Delay TRPDD TPPUD TPPDD - 16 - ISD1100 SERIES TABLE 8 (cont'd) CHARACTERISTIC EOM Pulse Width SYMBOL MIN[2] TYP[1] MAX[2] UNITS CONDITIONS TEOM ISD1110 ISD1112 15.625 msec 18.75 msec Total Harmonic Distortion THD 1 % @ 1 kHz Speaker Output Power POUT 12.2 mW REXT = 16 Voltage Across Speaker Pins VOUT 1.25 2.5 mVp-p REXT = 600 MIC Input Voltage VIN1 20 mV Peak-to-Peak [4] ANA IN Input Voltage VIN2 50 mV Peak-to-Peak Notes: [1] Typical values @ TA = 25 and VCC = 5.0V. [2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all specifications are 100 percent tested. [3] Low-frequency cutoff depends upon the value of external capacitors (see Pin Descriptions) [4] With 5.1 K series resistor at ANA IN. [5] Sampling Frequency and playback Duration can vary as much as 2.25 percent over the commercial temperature and voltage ranges. All devices will meet the maximum sampling frequency and minimum playback duration parameters. For greater stability, an external clock can be utilized (see Pin Descriptions) [6] Filter specification applies to the antialiasing filter and the smoothing filter. Typical Parameter Variation with Voltage and Temperature. This parameter is not checked during production testing and may vary due to process variations and other factors. Therefore, the customer should not rely upon this value for testing purposes. - 17 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 10.1.1. Typical Parameter Variation with Voltage and Temperature Chart 3: Standby Current (ISB) 0.40 12 Standby Current (mA) Operating Current (mA) 14 Chart 1: Record Mode Operating Current (ICC) 10 8 6 4 2 0 0.35 0.30 0.25 0.20 0.15 0.10 0 -40 25 70 85 -40 Temperature (C) 5.5 Volts 4.5 Volts 5.5 Volts Chart 2: Total Harmonic Distortion 70 85 4.5 Volts Chart 4: Oscillator Stability 0.40 0.35 0.30 0.25 0.5 Percent Change (%) Percent Distortion (%) 25 Temperature (C) 0.20 0.15 0.10 0.05 0 0 -0.5 -1.0 -1.5 -2.0 -2.5 -40 25 70 85 -40 Temperature (C) 5.5 Volts 25 70 Temperature (C) 4.5 Volts 5.5 Volts - 18 - 4.5 Volts 85 ISD1100 SERIES 10.2. PARAMETERS FOR DIE TABLE 9: DC PARAMETERS PARAMETERS SYMBOLS MIN[2] TYP[1] Input Low Voltage VIL Input High Voltage VIH Output Low Voltage VOL Output High Voltage VOH VCC Current (Operating) ICC 15 VCC Current (Standby) ISB 0.5 Input Leakage Current IIL Input Current HIGH w/ Pull Up MAX[2] UNITS 0.8 V 2.4 CONDITIONS V 0.4 V IOL = 4.0 mA V IOH = -1.6 A 30 mA VCC = 5.5V [3], REXT = 2 A [3][4] 1 A IILPU -130 A Force VCC [5] Input Current HIGH w/ Pull Down IILPD 130 A Force VCC [6] Output Load Impedance REXT Speaker Load Preamp Input Resistance RMIC 10 K ANA IN Input Resistance RANA IN 3 K Preamp Gain 1 APRE1 24 dB AGC = 0.0V Preamp Gain 2 APRE2 -45 dB AGC = 2.5V ANA IN to SP+/- Gain AARP 22 dB AGC Output Resistance RAGC 5 K Preamp Out Source IPREH -2 mA @ VOUT = 1.0V Preamp In Sink IPREL 0.5 mA @ VOUT = 2.0V 2.4 16 -15 Pads 17,18 Notes: [1] Typical values @ TA = 25 and VCC = 5.0V. [2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all specifications are 100 percent tested. [3] VCCA and VCCD connected together. [4] REC , PLAYL , and PLAYE must be at VCCD. [5] XCLK pin only. [6] A0-A5, XCLK. - 19 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES TABLE 10: AC PARAMETERS MAX[2] UNITS ISD1110 6.4 kHz [5] ISD1112 5.3 kHz [5] CHARACTERISTIC Sampling Frequency Filter Pass Band SYMBOL MIN[2] TYP[1] CONDITIONS FS FCF ISD1110 2.6 kHz 3 dB Roll-Off Point [3][6] ISD1112 2.2 kHz 3 dB Roll-Off Point [3][6] Record Duration TREC ISD1110 10 sec ISD1112 12 sec ISD1110 10 sec [5] ISD1112 12 sec [5] Playback Duration TPLAY RECLED ON Delay TLED1 RECLED OFF Delay TLED2 ISD1110 ISD1112 5 sec 40 48.5 100 msec 50 58.3 105 msec Address Setup Time TSET 300 nsec Address Hold Time THOLD 0 nsec Power-Up Delay TRPUD ISD1110 32 msec ISD1112 39 msec ISD1110 32 msec ISD1112 39 msec ISD1110 32 msec ISD1112 39 msec ISD1110 8.1 msec ISD1112 9.7 msec PD Pulse Width (Record) Play Power-Up Delay Play Power-Down Delay TRPDD TPPUD TPPDD - 20 - ISD1100 SERIES TABLE 10 (cont'd) CHARACTERISTIC EOM Pulse Width SYMBOL MIN[2] TYP[1] MAX[2] UNITS CONDITIONS TEOM ISD1110 ISD1112 16.625 msec 18.75 msec Total Harmonic Distortion THD 1 % @ 1 kHz Speaker Output Power POUT 12.2 mW REXT = 16 [4] Voltage Across Speaker Pins VOUT 1.25 2.5 mVp-p REXT = 600 MIC Input Voltage VIN1 20 mV Peak-to-Peak [4] ANA IN Input Voltage VIN2 50 mV Peak-to-Peak Notes: [1] Typical values @ TA = 25 and VCC = 5.0V. [2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all specifications are 100 percent tested. [3] Low-frequency cutoff depends upon the value of external capacitors (see Pin Descriptions) [4] With 5.1 K series resistor at ANA IN. [5] Sampling Frequency and playback Duration can vary as much as 2.25 percent over the commercial temperature and voltage ranges. All devices will meet the maximum sampling frequency and minimum playback duration parameters. For greater stability, an external clock can be utilized (see Pin Descriptions) [6] Filter specification applies to the antialiasing filter and the smoothing filter. Typical Parameter Variation with Voltage and Temperature. This parameter is not checked during production testing and may vary due to process variations and other factors. Therefore, the customer should not rely upon this value for testing purposes. - 21 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 10.2.1. Typical Parameter Variation with Voltage and Temperature Chart 7: Standby Current (ISB) 0.6 Standby Current (mA) Operating Current (mA) 15 Chart 5: Record Mode Operating Current (ICC) 10 5 0 0.5 0.4 0.3 0.2 0.1 0 0 25 50 0 Temperature (C) 6.5 Volts 5.5 Volts 4.5 Volts 6.5 Volts Chart 6: Total Harmonic Distortion 50 5.5 Volts 4.5 Volts Chart 8: Oscillator Stability 0.5 0.4 Percent Change (%) Percent Distortion (%) 25 Temperature (C) 0.3 0.2 0.1 0 2.0 1.5 1.0 0.5 0 -0.5 -1.0 -1.5 -2.0 0 25 50 0 Temperature (C) 6.5 Volts 5.5 Volts 25 50 Temperature (C) 4.5 Volts 6.5 Volts - 22 - 5.5 Volts 4.5 Volts ISD1100 SERIES 11. TYPICAL APPLICATION CIRCUIT VCC D1 REC LED C2 0.001 VCCD 28 ISD1100 F R1 1K C2 0.1 F VCCA 16 VSSD 12 13 V SSA SP+ SP- 15 20 ANA IN PLAYL 23 PLAYE 24 27 RECORD 25 R7 1 K 26 PLAYL ANA OUT PLAYE REC RECLED 16 SPEAKER 14 21 MIC REF 18 17 MIC 19 AGC XCLK R5 470 K R2 5.1 K C3 0.1 F R3 10 K C4 0.1 F C6 4.7 F C5 0.1 F C1 220 F ELECTRET MICROPHONE R4 10 K FIGURE 5: APPLICATION EXAMPLE - 23 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES Functional Description Example The following operating sequence example demonstrates the functionality of the ISD1100 series. 1. Record a message: Pulling the REC signal LOW initiates a record cycle from current location. When REC is held LOW, the recording continues. Until the memory array is filled up or when REC is pulled HIGH, recording ceases. An EOM marker is written at the end of message. Then the device will automatically power down. 2. Edge-activated playback: Pulling the PLAYE signal LOW initiates a playback cycle from the beginning of the message until the entire message is played. The rising edge of PLAYE has no effect on operation. When the EOM marker is encountered, the device automatically powers down. A subsequent falling edge on PLAYE initiates a new playback operation from the beginning of the message. 3. Level-activated playback: Holding the PLAYL signal LOW initiates a playback cycle from the beginning of the message, until PLAYL is pulled HIGH or when the EOM marker is encountered, playback operation stops and the device automatically powers down. 4. Record (interrupting playback). The REC signal takes precedence over playback operation. Holding REC LOW initiates a new record operation from current location, regardless of any current operation in progress. 5. RECLED operation. During record, the RECLED output pin provides an active-LOW signal, which can be used to drive an LED as a "record-in-progress" indicator. It returns to a HIGH state when the REC pin is pulled HIGH or when the recording is completed due to the memory being filled. However, during playback, this pin also pulses LOW to indicate an EOM at the end of a message. - 24 - ISD1100 SERIES Applications Note Some users may experience an unexpected recording taking place when their circuit is powered up, or the batteries are changed, and VCC rises faster than REC . This undesired recording prevents playback of the previously recorded message. A spurious EOM marker appears at the very beginning of the memory, preventing access to the original message, and nothing is played. To prevent this occurrence, install a capacitor (approx. 0.001 F) between the REC and VCC pins. This pulls the control pin voltage up with VCC as it rises. Once the voltage is HIGH, the pull-up device will keep the pin HIGH until intentionally pulled LOW, preventing the false EOM marker. Since this condition is dependent upon factors such as the capacitance of the user's printed circuit board, not all circuit designs will exhibit the spurious marker. It is recommended, however, that the capacitor is included for design reliability. A more detailed explanation and resolution of this occurrence is described in Application Information. - 25 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 12. PACKAGE DRAWING AND DIMENSIONS 12.1. 28-LEAD 300MIL PLASTIC SMALL OUTLINE IC (SOIC) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A G C B D E H F INCHES MILLIMETERS Min Nom Max Min Nom Max A 0.701 0.706 0.711 17.81 17.93 18.06 B 0.097 0.101 0.104 2.46 2.56 2.64 C 0.292 0.296 0.299 7.42 7.52 7.59 D 0.005 0.009 0.0115 0.127 0.22 0.29 E 0.014 0.016 0.019 0.35 0.41 0.48 F 0.050 1.27 G 0.400 0.406 0.410 10.16 10.31 10.41 H 0.024 0.032 0.040 0.61 0.81 1.02 Note: Lead coplanarity to be within 0.004 inch. - 26 - ISD1100 SERIES 12.2. 28-LEAD 600MIL PLASTIC DUAL INLINE PACKAGE (PDIP) INCHES A MILLIMETERS Min Nom Max Min Nom Max 1.445 1.450 1.455 36.70 36.83 36.96 B1 0.150 B2 0.065 C1 0.600 C2 0.530 0.070 0.540 D 3.81 0.075 1.65 0.625 15.24 0.550 13.46 1.78 15.88 13.72 0.19 D1 0.015 E 0.125 F 0.015 G 0.055 H 1.91 13.97 4.83 0.38 0.135 3.18 0.018 0.022 0.38 0.46 0.56 0.060 0.065 1.40 1.52 1.62 0.100 3.43 2.54 J 0.008 0.010 0.012 0.20 0.25 0.30 S 0.070 0.075 0.080 1.78 1.91 2.03 q 0 15 0 15 Note: Lead coplanarity to be within 0.005 inch. - 27 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 12.3. DIE PHYSICAL LAYOUT [1] A3 ISD1100X o X: 172.2 1 mils Y: 138.2 1 mils o A2 Die Dimensions VCCD A1 A0 XCLK RECLED REC A4 PLAYE A5 PLAYL Die Thickness [2] 17.5 .1 mils ISD1100X o Pad Opening 88 x 112 microns 3.46 x 4.41 mils A6 A7 NC ANA OUT ANA IN VSSD VSSA SPSP+ MIC VCCA AGC MIC REF Notes: [1] The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or damage may occur. [2] Die thickness is subject to change, please contact Winbond factory for status. - 28 - ISD1100 SERIES ISD1100 SERIES PAD DESIGNATIONS (with respect to die center) PAD PAD Name X Axis (m) Y Axis (m) A0 Address 0 -1364.0 1589.6 A1 Address 1 -1648.4 1589.6 A2 Address 2 -1816.4 1589.6 A3 Address 3 -2013.6 1515.6 A4 Address 4 -2013.6 1337.6 A5 Address 5 -2013.6 1129.6 A6 Address 6 -2013.6 -831.2 A7 Address 7 -2013.6 -1022.0 NC No Connect -2013.6 -1361.6 VSSD Digital Ground -1893.6 -1588.0 VSSA Analog Ground -357.6 -1588.0 SP+ Speaker Output + -17.2 -1512.8 SP- Speaker Output - 412.4 -1512.8 VCCA Analog Power Supply 780.0 -1552.4 MIC Microphone Input 992.0 -1590.0 MIC REF Microphone Reference 1169.2 -1590.0 AGC Automatic Gain Control 1978.4 -1590.0 ANA IN Analog Input 2005.6 -1196.4 ANA OUT Analog Output 1991.2 -995.2 PLAYL Level-Activated Playback 2014.4 1224.4 PLAYE Edge-Activated Playback 2014.4 1392.8 RECLED Record LED Output 2012.4 1587.6 XCLK External Clock 1581.5 1589.6 REC Record 752.8 1589.6 VCCD Digital Power Supply -48.0 1545.2 - 29 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES 13. ORDERING INFORMATION Product Number Descriptor Key ISD1 1 _ Special Temperature Field: Blank = Commercial Packaged (0C to +70C) ISD1100 Series Duration: or Commercial Die (0C to +50C) 10 = 10 seconds 12 = 12 seconds Package Option: Y = Lead-free Blank = Leaded Package Type: P = S = X = 28-Lead 600mil Plastic Dual Inline Package (PDIP) 28-Lead 300mil Small Outline Integrated Circuit (SOIC) Die When ordering ISD1110/1112 products, please refer to the following part numbers. Also, please contact the local Winbond Sales Representative or Distributor for availability on the lead-free parts. Type Lead Lead-Free Die / Package 10-Second 12-Second Product P/N Ordering P/N Product P/N Ordering P/N Die ISD1110X I1110X ISD1112X I1112X PDIP ISD1110P I1110P ISD1112P I1112P SOIC ISD1110S I1110S ISD1112S I1112S PDIP ISD1110PY I1110PY ISD1112PY I1112PY SOIC ISD1110SY I1110SY ISD1112SY I1112SY For the latest product information, access Winbond's worldwide website at http://www.winbond-usa.com - 30 - ISD1100 SERIES 14. VERSION HISTORY VERSION DATE DESCRIPTION 0 Before 2004 Initial issue 1.0 March 2004 Reformat the document. Add footnote to Filter Passband in Tables 1, 8 & 10. Revise Functional Description Example section. Revise die info. Revise ordering information. 1.1 Apr 2005 Revise the disclaim section. 1.2 Apr 2006 Add lead-free option. - 31 - Publication Release Date: April 25, 2006 Revision 1.2 ISD1100 SERIES Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. The contents of this document are provided "AS IS", and Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this documents, even if Winbond has been advised of the possibility of such damages. Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only and Winbond makes no representation or warranty that such applications shall be suitable for the use specified. The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates SuperFlash(R). Information contained in this ISD(R) ChipCorder(R) datasheet supersedes all data for the ISD ChipCorder products published by ISD(R) prior to August, 1998. This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD(R) ChipCorder(R) product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is subject to change without notice. Copyright(c) 2005, Winbond Electronics Corporation. All rights reserved. ChipCorder(R) and ISD(R) are trademarks of Winbond Electronics Corporation. SuperFlash(R) is the trademark of Silicon Storage Technology, Inc. All other trademarks are properties of their respective owners. Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd. No. 4, Creation Rd. III Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/ 2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441797 http://www.winbond-usa.com/ 27F, 299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62356998 Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd. 9F, No. 480, Pueiguang Rd. Neihu District Taipei, 114 Taiwan TEL: 886-2-81777168 FAX: 886-2-87153579 7F Daini-ueno BLDG. 3-7-18 Shinyokohama Kohokuku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800 Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Please note that all data and specifications are subject to change without notice. All the trademarks of products and companies mentioned in this datasheet belong to their respective owners. This product incorporates SuperFlash(R) technology licensed From SST. - 32 -