LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DSingle Supply or Dual Supplies
DWide Range of Supply Voltage
− Max Rating ...2 V to 36 V
− Tested to 30 V . . . Non-V Devices
− Tested to 32 V ...V-Suffix Devices
DLow Supply-Current Drain Independent of
Supply Voltage . . . 0.4 mA Typ Per
Comparator
DLow Input Bias Current . . . 25 nA Typ
DLow Input Offset Current ...3 nA Typ
(LM193)
DLow Input Offset Voltage ...2 mV Typ
DCommon-Mode Input Voltage Range
Includes Ground
DDifferential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . ±36 V
DLow Output Saturation Voltage
DOutput Compatible With TTL, MOS, and
CMOS
description/ordering information
These devices consist of two independent voltage
comparators that are designed to operate from a
single power supply over a wide range of voltages.
Operation from dual supplies also is possible as
long as the difference between the two supplies is
2 V to 36 V, and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is
independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve
wired-AND relationships.
The LM193 is characterized for operation from −55°C to 125°C. The LM293 and LM293A are characterized for
operation from −25°C to 85°C. The LM393 and LM393A are characterized for operation from 0°C to 70°C. The
LM2903 is characterized for operation from −40°C to 125°C.
Copyright 2010, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND
VCC
2OUT
2IN−
2IN+
LM193 ...D OR JG PACKAGE
LM293 . . . D, DGK, OR P PACKAGE
LM293A ...D OR DGK PACKAGE
LM393, LM393A . . . D, DGK, P, PS, OR PW PACKAGE
LM2903 . . . D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN−
NC
NC
1IN−
NC
1IN+
NC
LM193 ... FK PACKAGE
(TOP VIEW)
NC
1OUT
NC
2IN+
NC
V
NC
NC
GND
NC
CC
NC − No internal connection
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ORDERING INFORMATION{
TA
VIOmax
AT 25°CMAX VCC PACKAGE}ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (P) Tube of 50 LM393P LM393P
Tube of 75 LM393D
SOIC (D) Reel of 2500 LM393DR LM393
SOIC
(D)
Reel of 2500 LM393DRG3
LM393
5 mV 30 V SOP (PS) Reel of 2000 LM393PSR L393
5
mV
30
V
Tube of 150 LM393PW
TSSOP (PW) Reel of 2000 LM393PWR L393
0°C to 70°C
TSSOP
(PW)
Reel of 2000 LM393PWRG3
L393
0 C
to
70 C
MSOP/VSSOP (DGK) Reel of 2500 LM393DGKR M9_§
PDIP (P) Tube of 50 LM393AP LM393AP
SOIC (D)
Tube of 75 LM393AD
LM393A
2mV
30 V
SOIC (D) Reel of 2500 LM393ADR LM393A
2 mV 30 V SOP (PS) Reel of 2000 LM393APSR L393A
TSSOP (PW) Reel of 2000 LM393APWR L393A
MSOP/VSSOP (DGK) Reel of 2500 LM393ADGKR M8_§
PDIP (P) Tube of 50 LM293P LM293P
Tube of 75 LM293D
5 mV 30 V SOIC (D) Reel of 2500 LM293DR LM293
25°Cto85°C
5
mV
30
V
SOIC
(D)
Reel of 2500 LM293DRG3
LM293
−25°C to 85°CMSOP/VSSOP (DGK) Reel of 2500 LM293DGKR MC_§
SOIC (D)
Tube of 75 LM293AD
LM293A
2 mV 30 V SOIC (D) Reel of 2500 LM293ADR LM293A
2
mV
30
V
MSOP/VSSOP (DGK) Reel of 2500 LM293ADGKR MD_§
PDIP (P) Tube of 50 LM2903P LM2903P
Tube of 75 LM2903D
SOIC (D) Reel of 2500 LM2903DR LM2903
7V
30 V
SOIC
(D)
Reel of 2500 LM2903DRG3
LM2903
7 mV 30 V SOP (PS) Reel of 2000 LM2903PSR L2903
40°C to 125°C
TSSOP (PW)
Reel of 2000 LM2903PWR
L2903
−40°C to 125°CTSSOP (PW) Reel of 2000 LM2903PWRG3 L2903
MSOP/VSSOP (DGK) Reel of 2500 LM2903DGKR MA_§
7mV
32 V
SOIC (D) Reel of 2500 LM2903VQDR L2903V
7 mV 32 V TSSOP (PW) Reel of 2000 LM2903VQPWR L2903V
2mV
32 V
SOIC (D) Reel of 2500 LM2903AVQDR L2903AV
2 mV 32 V TSSOP (PW) Reel of 2000 LM2903AVQPWR L2903AV
CDIP (JG) Tube of 50 LM193JG LM193JG
−55°C to 125°C5 mV 30 V LCCC (FK) Tube of 55 LM193FK LM193FK
SOIC (D) Reel of 2500 LM193DR LM193
†For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web
site at www.ti.com.
‡Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
§The actual top-side marking has one additional character that designates the wafer fab/assembly site.
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
symbol (each comparator)
IN+
IN− OUT
schematic (each comparator)
80-µA
Current Regulator
80 µA
60 µA10 µA
VCC
10 µA
OUT
GND
IN+
IN−
Epi-FET
Diodes
Resistors
Transistors
Current values shown are nominal.
COMPONENT COUNT
1
2
2
30
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) ±36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (either input) −0.3 V to 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, VO 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, IO 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short-circuit to ground (see Note 3) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 4 and 5): D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGK package 172°C/W. . . . . . . . . . . . . . . . . . . . . . . .
P package 85°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PS package 95°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 149°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJC (see Notes 6 and 7): FK package 5.61°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
JG package 14.5°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 60 seconds: FK package 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG package 300°C. . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to GND.
2. Differential voltages are at IN+, with respect to IN−.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) − TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
7. The package thermal impedance is calculated in accordance with MIL-STD-883.
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS T
A
†LM193 LM293
LM393 UNIT
PARAMETER
TEST
CONDITIONS
TA†
MIN TYP MAX MIN TYP MAX
UNIT
V
Input offset voltage
VCC = 5 V to 30 V,
V14V
25°C 2 5 2 5
mV
VIO Input offset voltage VO = 1.4 V,
VIC = VIC(min) Full range 9 9
mV
I
Input offset current
V14V
25°C 3 25 5 50
nA
IIO Input offset current VO = 1.4 V Full range 100 250 nA
I
Input bias current
V14V
25°C −25 −100 −25 −250
nA
IIB Input bias current VO = 1.4 V Full range −300 −400 nA
V
Common-mode 25°C0 to
VCC − 1.5
0 to
VCC − 1.5
V
VICR
Common mode
input voltage range‡
Full range 0 to
VCC − 2
0 to
VCC − 2
V
AVD
Large-signal
differential-voltage
amplification
VCC = 15 V,
VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
25°C 50 200 50 200 V/mV
I
Hi
g
h-level VOH = 5 V, VID = 1 V 25°C 0.1 0.1 50 nA
IOH
High level
output current VOH = 30 V, VID = 1 V Full range 1 1 µA
V
Low-level
V1V
25°C 150 400 150 400
mV
VOL
Low level
output voltage IOL = 4 mA, VID = −1 V Full range 700 700 mV
IOL
Low-level
output current VOL = 1.5 V, VID = −1 V 25°C 6 6 mA
I
Supply current
VCC = 5 V 25°C 0.8 1 0.8 1
mA
ICC Supply current RL = ∞VCC = 30 V Full range 2.5 2.5 mA
†Full range (MIN or MAX) for LM193 is −55°C to 125°C, for LM293 is 25°C to 85°C, and for LM393 is 0°C to 70°C. All characteristics are measured
with zero common-mode input voltage, unless otherwise specified.
‡The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is VCC+ − 1.5 V for the inverting input (−), and the non-inverting input (+) can exceed the VCC level; the comparator provides a proper output
state. Either or both inputs can go to 30 V without damage.
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS T
A
†
LM293A
LM393A UNIT
PARAMETER
TEST
CONDITIONS
TA†
MIN TYP MAX
UNIT
V
Input offset voltage
V
CC
= 5 V to 30 V, V
O
= 1.4 V, 25°C 1 2
mV
VIO Input offset voltage
VCC
=
5
V
to
30
V
,
VO
=
1
.
4
V
,
VIC = VIC(min) Full range 4mV
I
Input offset current
V14V
25°C 5 50
nA
IIO Input offset current VO = 1.4 V Full range 150 nA
I
Input bias current
V14V
25°C −25 −250
nA
IIB Input bias current VO = 1.4 V Full range −400 nA
V
Common-mode input volta
g
e25°C0 to
VCC − 1.5
V
VICR
Common mode
input
voltage
range§
Full range 0 to
VCC − 2
V
AVD
Large-signal differential-voltage
amplification
VCC = 15 V, VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC 25°C 50 200 V/mV
I
High level output current
VOH = 5 V, VID = 1 V 25°C 0.1 50 nA
IOH High-level output current VOH = 30 V, VID = 1 V Full range 1µA
V
Low level output voltage
I4mA
V1V
25°C 150 400
mV
VOL Low-level output voltage IOL = 4 mA, VID = −1 V Full range 700 mV
IOL Low-level output current VOL = 1.5 V, VID = −1 V 25°C 6 mA
I
Supply current
R = ∞
VCC = 5 V 25°C 0.8 1
mA
ICC Supply current RL = ∞VCC = 30 V Full range 2.5 mA
†Full range (MIN or MAX) for LM293A is 25°C to 85°C, and for LM393A is 0°C to 70°C. All characteristics are measured with zero common-mode
input voltage, unless otherwise specified.
§The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is VCC+ − 1.5 V, but either or both inputs can go to 30 V without damage.
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
T†
LM2903 LM2903A
UNIT
PARAMETER TEST CONDITIONS TA†
MIN TYP MAX MIN TYP MAX UNIT
V
Input offset voltage
VCC = 5 V to MAX‡,
V14V
25°C 2 7 1 2
mV
VIO Input offset voltage VO = 1.4 V,
VIC = VIC(min) Full range 15 4
mV
I
Input offset current
V14V
25°C 5 50 5 50
nA
IIO Input offset current VO = 1.4 V Full range 200 200 nA
I
Input bias current
V14V
25°C −25 −250 −25 −250
nA
IIB Input bias current VO = 1.4 V Full range −500 −500 nA
V
Common-mode 25°C0 to
VCC − 1.5
0 to
VCC − 1.5
V
VICR
Common mode
input voltage range§
Full range 0 to
VCC − 2
0 to
VCC − 2
V
AVD
Large-signal
differential-voltage
amplification
VCC = 15 V,
VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
25°C 25 100 25 100 V/mV
I
Hi
g
h-level VOH = 5 V, VID = 1 V 25°C 0.1 50 0.1 50 nA
IOH
High level
output current VOH = VCC MAX, VID = 1 V Full range 1 1 µA
V
Low-level
V1V
25°C 150 400 150 400
mV
VOL
Low level
output voltage IOL = 4 mA, VID = −1 V Full range 700 700 mV
IOL
Low-level
output current VOL = 1.5 V, VID = −1 V 25°C 6 6 mA
I
Supply current
VCC = 5 V 25°C 0.8 1 0.8 1
mA
ICC Supply current RL = ∞VCC = MAX Full range 2.5 2.5 mA
†Full range (MIN or MAX) for LM2903 is −40°C to 125°C. All characteristics are measured with zero common-mode input voltage, unless otherwise
specified.
‡VCC MAX = 30 V for non-V devices and 32 V for V-suffix devices.
§The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is VCC+ − 1.5 V, but either or both inputs can go to 30 V (32 V for V-suffix devices) without damage.
switching characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS
LM193
LM293, LM293A
LM393, LM393A
LM2903
UNIT
TYP
Response time
RL connected to 5 V throu
g
h 5.1 kΩ,100-mV input step with 5-mV overdrive 1.3
µs
Response time
RL
connected
to
5
V
through
5
.
1
kΩ
,
CL = 15 pF, See Note 8 TTL-level input step 0.3 µs
CL includes probe and jig capacitance.
NOTE 8: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
5962-9452601Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 5962-
9452601Q2A
LM193FKB
5962-9452601QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI -55 to 125 9452601QPA
LM193
JM38510/11202BPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510
/11202BPA
LM193DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM193
LM193DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM193
LM193FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9452601Q2A
LM193FKB
LM193JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM193JG
LM193JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9452601QPA
LM193
LM2903AVQDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV
LM2903AVQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV
LM2903AVQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV
LM2903AVQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV
LM2903D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (MAP ~ MAS ~ MAU)
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM2903DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (MAP ~ MAS ~ MAU)
LM2903DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU
CU SN
Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DRG3 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903
LM2903P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 LM2903P
LM2903PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 LM2903P
LM2903PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903
LM2903PSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903
LM2903PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125
LM2903PWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903
LM2903PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903
LM2903PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 L2903
LM2903PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903
LM2903QD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q
LM2903QDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q
LM2903QDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q
LM2903QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q
LM2903QP OBSOLETE PDIP P 8 TBD Call TI Call TI -40 to 125
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM2903VQDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V
LM2903VQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V
LM2903VQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V
LM2903VQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V
LM293AD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293ADE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293ADG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MDP ~ MDS ~ MDU)
LM293ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MDP ~ MDS ~ MDU)
LM293ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
LM293DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
LM293DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
LM293DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MCP ~ MCS ~ MCU)
LM293DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MCP ~ MCS ~ MCU)
LM293DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM293DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
LM293DRG3 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -25 to 85 LM293
LM293DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
LM293P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -25 to 85 LM293P
LM293PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -25 to 85 LM293P
LM393AD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393ADE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393ADG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M8P ~ M8S ~ M8U)
LM393ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M8P ~ M8S ~ M8U)
LM393ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393AP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 LM393AP
LM393APE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 LM393AP
LM393APSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
LM393APSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
LM393APSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 5
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM393APWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI 0 to 70
LM393APWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
LM393APWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
LM393APWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
LM393D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M9P ~ M9S ~ M9U)
LM393DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M9P ~ M9S ~ M9U)
LM393DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393DRG3 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM 0 to 70 LM393
LM393DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 LM393P
LM393PE3 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU SN N / A for Pkg Type 0 to 70 LM393P
LM393PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 LM393P
LM393PSLE OBSOLETE SO PS 8 TBD Call TI Call TI 0 to 70
LM393PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 6
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM393PW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI 0 to 70
LM393PWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM 0 to 70 L393
LM393PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
M38510/11202BPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510
/11202BPA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 7
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM2903, LM293 :
•Automotive: LM2903-Q1
•Enhanced Product: LM293-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM193DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903QDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM293ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Mar-2013
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393APSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM393APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM393PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Mar-2013
Pack Materials-Page 2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM193DR SOIC D 8 2500 367.0 367.0 35.0
LM2903DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM2903DR SOIC D 8 2500 367.0 367.0 35.0
LM2903DR SOIC D 8 2500 340.5 338.1 20.6
LM2903DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2903DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2903PSR SO PS 8 2000 367.0 367.0 38.0
LM2903PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM2903PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM2903QDR SOIC D 8 2500 367.0 367.0 35.0
LM2903QDRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2903VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM293ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM293ADR SOIC D 8 2500 340.5 338.1 20.6
LM293ADR SOIC D 8 2500 367.0 367.0 35.0
LM293ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM293ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM293DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM293DR SOIC D 8 2500 340.5 338.1 20.6
LM293DR SOIC D 8 2500 367.0 367.0 35.0
LM293DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM293DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM393ADR SOIC D 8 2500 340.5 338.1 20.6
LM393ADR SOIC D 8 2500 367.0 367.0 35.0
LM393ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM393APSR SO PS 8 2000 367.0 367.0 38.0
LM393APWR TSSOP PW 8 2000 364.0 364.0 27.0
LM393DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM393DR SOIC D 8 2500 340.5 338.1 20.6
LM393DR SOIC D 8 2500 367.0 367.0 35.0
LM393DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM393PSR SO PS 8 2000 367.0 367.0 38.0
LM393PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM393PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Mar-2013
Pack Materials-Page 3
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM193DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903QDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM293ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Oct-2013
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM293DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393APSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM393APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM393PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Oct-2013
Pack Materials-Page 2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM193DR SOIC D 8 2500 367.0 367.0 35.0
LM2903DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM2903DR SOIC D 8 2500 340.5 338.1 20.6
LM2903DR SOIC D 8 2500 367.0 367.0 35.0
LM2903DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM2903DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2903DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2903PSR SO PS 8 2000 367.0 367.0 38.0
LM2903PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM2903PWR TSSOP PW 8 2000 367.0 367.0 35.0
LM2903PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM2903QDRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2903VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM293ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM293ADR SOIC D 8 2500 367.0 367.0 35.0
LM293ADR SOIC D 8 2500 340.5 338.1 20.6
LM293ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM293ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM293DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM293DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Oct-2013
Pack Materials-Page 3
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM293DR SOIC D 8 2500 367.0 367.0 35.0
LM293DR SOIC D 8 2500 364.0 364.0 27.0
LM293DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM293DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM293DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM393ADR SOIC D 8 2500 367.0 367.0 35.0
LM393ADR SOIC D 8 2500 340.5 338.1 20.6
LM393ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM393ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393APSR SO PS 8 2000 367.0 367.0 38.0
LM393APWR TSSOP PW 8 2000 364.0 364.0 27.0
LM393DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM393DR SOIC D 8 2500 340.5 338.1 20.6
LM393DR SOIC D 8 2500 367.0 367.0 35.0
LM393DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM393DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM393PSR SO PS 8 2000 367.0 367.0 38.0
LM393PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM393PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Oct-2013
Pack Materials-Page 4
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated