DATA SHEET GaAs INTEGRATED CIRCUIT PG2179TB L, S-BAND MEDIUM POWER SPDT SWITCH DESCRIPTION The PG2179TB is a GaAs MMIC L, S-band SPDT (Single Pole Double Throw) switch for mobile phone and other L, S-band applications. This device operates with dual control voltages of 2.5 to 5.3 V. This device can operate from 0.05 to 3.0 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package, and is suitable for high-density surface mounting. FEATURES * Switch control voltage : Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.) : Vcont (L) = -0.2 to +0.2 V (0 V TYP.) * Low insertion loss : Lins1 = 0.25 dB TYP. @ f = 0.05 to 1.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins3 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins4 = 0.40 dB TYP. @ f = 2.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V * High isolation : ISL1 = 27 dB TYP. @ f = 0.05 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 24 dB TYP. @ f = 2.0 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V * Power handling : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +32.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V * High-density surface mounting : 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) APPLICATIONS * L, S-band digital cellular or cordless telephone * PCS, W-LAN, WLL and BluetoothTM etc. ORDERING INFORMATION Part Number PG2179TB-E4-A Package 6-pin super minimold Marking G4C Supplying Form * Embossed tape 8 mm wide * Pin 4, 5, 6 face the perforation side of the tape * Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PG2179TB-A Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Document No. PG10454EJ02V0DS (2nd edition) Date Published March 2004 CP(K) The mark shows major revised points. PG2179TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 2 3 G4C 1 (Top View) (Bottom View) 6 1 6 6 1 5 2 5 5 2 4 3 4 4 3 Pin No. Pin Name 1 OUTPUT1 2 GND 3 OUTPUT2 4 Vcont2 5 INPUT 6 Vcont1 TRUTH TABLE Vcont1 Vcont2 INPUT-OUTPUT1 INPUT-OUTPUT2 Low High ON OFF High Low OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) Parameter Switch Control Voltage Symbol Ratings Vcont 6.0 Unit V Note Input Power Pin +33 dBm Operating Ambient Temperature TA -45 to +85 C Storage Temperature Tstg -55 to +150 C Note Vcont1 - Vcont2 6.0 V RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit Switch Control Voltage (H) Vcont (H) 2.5 3.0 5.3 V Switch Control Voltage (L) Vcont (L) -0.2 0 0.2 V 2 Data Sheet PG10454EJ02V0DS PG2179TB ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit - 0.25 0.45 dB Insertion Loss 1 Lins1 f = 0.05 to 1.0 GHz Insertion Loss 2 Lins2 f = 1.0 to 2.0 GHz - 0.30 0.50 dB Insertion Loss 3 Lins3 f = 2.0 to 2.5 GHz - 0.35 0.55 dB Insertion Loss 4 Lins4 f = 2.5 to 3.0 GHz - 0.40 0.60 dB Isolation 1 ISL1 f = 0.05 to 2.0 GHz 23 27 - dB Isolation 2 ISL2 f = 2.0 to 3.0 GHz Input Return Loss RLin Output Return Loss RLout 0.1 dB Loss Compression Input Power Pin (0.1 dB) Note2 Note1 Note1 20 24 - dB f = 0.05 to 3.0 GHz Note1 15 20 - dB f = 0.05 to 3.0 GHz Note1 15 20 - dB f = 2.0 GHz +25.5 +29.0 - dBm f = 2.5 GHz +25.5 +29.0 - dBm f = 0.5 to 3.0 GHz - +29.0 - dBm Switch Control Current Icont No signal - 4 20 A Switch Control Speed tsw 50%CTL to 90/10%RF - 50 500 ns Note1. DC blocking capacitor = 1 000 pF at f = 0.05 to 0.5 GHz. 2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified) Parameter Symbol 1 dB Loss Compression Pin (1 dB) Input Power Test Conditions MIN. TYP. MAX. Unit f = 0.5 to 3.0 GHz - +32.0 - dBm f = 0.5 to 3.0 GHz, 2 tone, - +60.0 - dBm Note 3rd Order Intermodulation Intercept Point IIP3 5 MHz spicing Note Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear range. Caution When using this IC, a DC coupling capacitor must be externally attached to the I/O pins. A DC coupling capacitor with a capacitance of 100 pF or lower is recommended when using a frequency of 0.5 GHz or higher, and one with a capacitance of 1,000 pF is recommended when using a frequency of less than 0.5 GHz. The ideal value changes depending on the frequency and bandwidth used, so select a capacitor with a suitable capacitance according to the usage conditions. Data Sheet PG10454EJ02V0DS 3 PG2179TB EVALUATION CIRCUIT OUTPUT2 OUTPUT1 CO CO 3 2 1 4 5 6 CO 1 000 pF Vcont2 1 000 pF INPUT Vcont1 Remark CO : 0.05 to 0.5 GHz 1 000 pF 0.5 to 3.0 GHz 100 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10454EJ02V0DS PG2179TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont2 6pin SMM SPDT SW Vc2 OUTPUT2 2 C2 C C 4 OUT 2 INPUT C1 IN G4C C1 C3 C1 C C 5 C2 1 OUT 1 OUTPUT1 Vc1 Vcont1 USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 100 pF 1 000 pF Data Sheet PG10454EJ02V0DS 5 PG2179TB TYPICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified) 0.5 0.4 0.4 0.3 0.3 Insertion Loss Lins (dB) Insertion Loss Lins (dB) 0.5 INPUT-OUTPUT1 INSERTION LOSS vs. FREQUENCY 0.2 0.1 0 -0.1 -0.2 -0.3 -0.5 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 0.1 0 -0.1 -0.2 -0.3 -0.5 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Frequency f (GHz) INPUT-OUTPUT1 ISOLATION vs. FREQUENCY INPUT-OUTPUT2 ISOLATION vs. FREQUENCY 50 40 30 30 20 20 Isolation ISL (dB) 40 10 0 -10 -20 10 0 -10 -20 -30 -30 -40 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Frequency f (GHz) INPUT-OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY INPUT-OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 50 50 40 40 Input Return Loss RLin (dB) Isolation ISL (dB) Input Return Loss RLin (dB) 0.2 -0.4 -0.4 50 30 20 10 0 -10 -20 -30 30 20 10 0 -10 -20 -30 -40 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. 6 INPUT-OUTPUT2 INSERTION LOSS vs. FREQUENCY Data Sheet PG10454EJ02V0DS PG2179TB INPUT-OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY INPUT-OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 40 40 50 Output Return Loss RLout (dB) Output Return Loss RLout (dB) 50 30 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 30 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) 33 OUTPUT POWER vs. INPUT POWER 33 f = 1.0 GHz 29 27 25 23 21 19 17 15 13 15 17 OUTPUT POWER vs. INPUT POWER 31 Output Power Pout (dBm) Output Power Pout (dBm) 31 Frequency f (GHz) f = 2.5 GHz 29 27 25 23 21 19 17 15 19 21 23 25 27 29 31 33 35 13 15 17 Input Power Pin (dBm) 19 21 23 25 27 29 31 33 35 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PG10454EJ02V0DS 7 PG2179TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.10.1 0.2+0.1 -0.05 0.65 0.65 1.3 2.00.2 1.250.1 8 Data Sheet PG10454EJ02V0DS 0.15+0.1 -0.05 0 to 0.1 0.7 0.90.1 0.1 MIN. PG2179TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Preheating time at 120 to 180C : 12030 seconds Maximum chlorine content of rosin flux (% mass) : 3 times : 0.2%(Wt.) or below : 215C or below Preheating time at 120 to 150C : 30 to 60 seconds Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Time at temperature of 200C or higher Peak temperature (molten solder temperature) IR260 : 60 seconds or less Peak temperature (package surface temperature) Maximum number of reflow processes Wave Soldering : 260C or below : 10 seconds or less Maximum number of reflow processes VPS Condition Symbol Time at peak temperature Time at temperature of 220C or higher For soldering : 25 to 40 seconds VP215 : 3 times : 260C or below Time at peak temperature : 10 seconds or less Maximum number of flow processes : 1 time Peak temperature (pin temperature) : 350C or below Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Preheating temperature (package surface temperature) : 120C or below Maximum chlorine content of rosin flux (% mass) Partial Heating Soldering time (per side of device) : 0.2%(Wt.) or below : 3 seconds or less HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10454EJ02V0DS 9 PG2179TB Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. * The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. 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The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 10 Data Sheet PG10454EJ02V0DS PG2179TB Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. 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