1. General description
The ADC0806030/040/050 are a family of 8-bit high-speed, low-power Analog-to-Digital
Converters (ADC) for professional video and other applications. It converts the analog
input signal into 8-bit binary coded digital signals at a maximum sampling rate of 50 MHz.
All digital inputs and outputs are Transistor-Transistor Logic (TTL) and CMOS compatible,
although a low-level sine wave clock input signal can also be used.
The device requires an external source to drive its reference ladder. If the application
requires that the reference is driven via internal sources, NXP recommends you use one
of the ADC1003S030/040/050 family.
2. Features
n8-bit resolution
nSampling rate up to 50 MHz
nDC sampling allowed
nOne clock cycle conversion only
nHigh signal-to-noise ratio over a large analog input frequency range (7.8 effective bits
at 4.43 MHz full-scale input at fclk = 40 MHz)
nNo missing codes guaranteed
nIn-Range (IR) CMOS output
nTTL and CMOS levels compatible digital inputs
n3 V to 5 V CMOS digital outputs
nLow-level AC clock input signal allowed
nExternal reference voltage regulator
nPower dissipation only 175 mW (typical)
nLow analog input capacitance, no buffer amplifier required
nNo sample-and-hold circuit required
3. Applications
nVideo data digitizing
nRadar
nTransient signal analysis
nΣ∆ modulators
nMedical imaging
nBarcode scanner
nGlobal Positioning System (GPS) receiver
ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Rev. 02 — 14 August 2008 Product data sheet
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 2 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
nCellular base stations
4. Quick reference data
5. Ordering information
Table 1. Quick reference data
V
CCA
= V3 to V4 = 4.75 V to 5.25 V; V
CCD
= V11 to V12 and V28 to V27 = 4.75 V to 5.25 V;
V
CCO
= V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; T
amb
=0
°
Cto70
°
C;
typical values measured at V
CCA
=V
CCD
= 5 V and V
CCO
= 3.3 V, V
i(a)(p-p)
= 2.0 V; C
L
= 15 pF and
T
amb
=25
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VCCA analog supply voltage 4.75 5.0 5.25 V
VCCD digital supply voltage 4.75 5.0 5.25 V
VCCO output supply voltage 3.0 3.3 5.25 V
ICCA analog supply current - 18 24 mA
ICCD digital supply current - 16 21 mA
ICCO output supply current fclk = 40 MHz;
ramp input -12mA
INL integral non-linearity fclk = 40 MHz
ramp input -±0.2 ±0.5 LSB
DNL differential non-linearity fclk = 40 MHz
ramp input -±0.12 ±0.22 LSB
fclk(max) maximum clock
frequency ADC0804S030TS 30 - - MHz
ADC0804S040TS 40 - - MHz
ADC0804S050TS 50 - - MHz
Ptot total power dissipation fclk = 40 MHz;
ramp input - 175 247 mW
Table 2. Ordering information
Type number Package Sampling
frequency
(MHz)
Name Description Version
ADC0804S030TS SSOP28 plastic shrink small outline package; 28 leads;
body width 5.3 mm SOT341-1 30
ADC0804S040TS SSOP28 plastic shrink small outline package; 28 leads;
body width 5.3 mm SOT341-1 40
ADC0804S050TS SSOP28 plastic shrink small outline package; 28 leads;
body width 5.3 mm SOT341-1 50
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 3 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
6. Block diagram
Fig 1. Block diagram
12
DGND2
6
8
Rlad
7
9
RB
RM
RT
VI
11
VCCD2
3
26
VCCA
21
22
23
24
20 D2
D3
D4
D5
D6
19
18
25
2
D1
D0
D7
IN-RANGE LATCH
CMOS
OUTPUTS
LATCHES
CLOCK DRIVER
014aaa550
1
CLK
10
OE
TC
ADC0804S030
13 VCCO
4
AGND
analog ground digital ground digital ground
27
DGND1
14
OGND
output ground
analog
voltage input data outputs
LSB
MSB
28 VCCD1
IR
output
ANALOG - TO - DIGITAL
CONVERTER
CMOS OUTPUT
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 4 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
7. Pinning information
7.1 Pinning
7.2 Pin description
Fig 2. Pin configuration
ADC0804S
030TS
CLK VCCD1
TC DGND1
VCCA IR
AGND D7
n.c. D6
RB D5
RM D4
VI D3
RT D2
OE D1
VCCD2 D0
DGND2 n.c.
VCCO n.c.
OGND n.c.
014aaa551
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16
15
18
17
20
19
22
21
24
23
26
25
28
27
Table 3. Pin description
Symbol Pin Description
CLK 1 clock input
TC 2 two’s complement input (active LOW)
VCCA 3 analog supply voltage (5 V)
AGND 4 analog ground
n.c. 5 not connected
RB 6 reference voltage BOTTOM input
RM 7 reference voltage MIDDLE
VI 8 analog input voltage
RT 9 reference voltage TOP input
OE 10 output enable input (CMOS level input, active LOW)
VCCD2 11 digital supply voltage 2 (5 V)
DGND2 12 digital ground 2
VCCO 13 supply voltage for output stages (3 V to 5 V)
OGND 14 output ground
n.c. 15 not connected
n.c. 16 not connected
n.c. 17 not connected
D0 18 data output; bit 0 (Least Significant Bit (LSB))
D1 19 data output; bit 1
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 5 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
8. Limiting values
[1] The supply voltages VCCA, VCCD and VCCO may have any value between −0.3 Vand +7.0 V provided that
the supply voltage differences ∆VCC are respected.
9. Thermal characteristics
D2 20 data output; bit 2
D3 21 data output; bit 3
D4 22 data output; bit 4
D5 23 data output; bit 5
D6 24 data output; bit 6
D7 25 data output; bit 7 (Most Significant Bit (MSB))
IR 26 in-range data output
DGND1 27 digital ground 1
VCCD1 28 digital supply voltage 1 (5 V)
Table 3. Pin description
…continued
Symbol Pin Description
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCCA analog supply voltage [1] −0.3 +7.0 V
VCCD digital supply voltage [1] −0.3 +7.0 V
VCCO output supply voltage [1] −0.3 +7.0 V
∆VCC supply voltage difference VCCA − VCCD −1.0 +1.0 V
VCCD − VCCO −1.0 +4.0 V
VCCA − VCCO −1.0 +4.0 V
VIinput voltage referenced to AGND −0.3 +7.0 V
Vi(clk)(p-p) peak-to-peak clock input
voltage referenced to DGND - VCCD V
IOoutput current - 10 mA
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +85 °C
Tjjunction temperature - 150 °C
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction
to ambient in free air 110 K/W
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 6 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
10. Characteristics
Table 6. Characteristics
V
CCA
= V3 to V4 = 4.75 V to 5.25 V; V
CCD
= V11 to V12 and V28 to V27 = 4.75 V to 5.25 V;
V
CCO
= V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; T
amb
=0
°
Cto70
°
C; typical values measured at
V
CCA
=V
CCD
= 5 V and V
CCO
= 3.3 V, V
i(a)(p-p)
= 2.0 V; C
L
= 15 pF and T
amb
=25
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supplies
VCCA analog supply voltage 4.75 5.0 5.25 V
VCCD digital supply voltage 4.75 5.0 5.25 V
VCCO output supply voltage 3.0 3.3 5.25 V
∆VCC supply voltage
difference VCCA − VCCD −0.20 - +0.20 V
VCCA − VCCO −0.20 - +2.25 V
VCCD − VCCO −0.20 - +2.25 V
ICCA analog supply current - 18 24 mA
ICCD digital supply current - 16 21 mA
ICCO output supply current fclk = 40 MHz; ramp input - 1 2 mA
Ptot total power dissipation fclk = 40 MHz; ramp input - 175 247 mW
Inputs
Clock input CLK (referenced to DGND)[1]
VIL LOW-level input voltage 0 - 0.8 V
VIH HIGH-level input
voltage 2-V
CCD V
IIL LOW-level input current Vclk = 0.8 V −1-+1µA
IIH HIGH-level input current Vclk =2V - 2 10 µA
Ziinput impedance fclk = 40 MHz - 2 - kΩ
Ciinput capacitance - 2 - pF
OE and TC (referenced to DGND); see Table 8
VIL LOW-level input voltage 0 - 0.8 V
VIH HIGH-level input
voltage 2-V
CCD V
IIL LOW-level input current VIL = 0.8 V −1--µA
IIH HIGH-level input current VIH = 2.0 V - - 1 µA
VI (analog input voltage referenced to AGND)
IIL LOW-level input current VI = VRB = 1.3 V - 0 - µA
IIH HIGH-level input current VI = VRT = 3.67 V - 35 - µA
Ziinput impedance fi = 4.43 MHz - 8 - kΩ
Ciinput capacitance - 5 - pF
Reference voltages for the resistor ladder; see Table 7
VRB voltage on pin RB 1.2 1.3 2.45 V
VRT voltage on pin RT 3.2 3.67 VCCA − 0.8 V
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 7 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Vref(dif) differential reference
voltage VRT − VRB 2.0 2.37 3.0 V
Iref reference current VRT − VRB = 2.37 V - 9.7 - mA
Rlad ladder resistance - 245 - Ω
TCRlad ladder resistor
temperature coefficient - 456 - mΩ/K
Voffset offset voltage BOTTOM;
VRT −VRB = 2.37 V [2] - 175 - mV
TOP; VRT − VRB = 2.37 V [2] - 175 - mV
Vi(a)(p-p) peak-to-peak analog
input voltage [3] 1.7 2.02 2.55 V
Digital outputs D7 to D0 and IR (referenced to OGND)
VOL LOW-level output
voltage IOL = 1 mA 0 - 0.5 V
VOH HIGH-level output
voltage IOH =−1mA V
CCO −0.5 - VCCO V
Iooutput current in 3-state mode;
0.5 V < VO<V
CCO
−20 - +20 µA
Switching characteristics; Clock input CLK; see Figure 4[1]
fclk(max) maximum clock
frequency ADC0804S030TS 30 - - MHz
ADC0804S040TS 40 - - MHz
ADC0804S050TS 50 - - MHz
tw(clk)H HIGH clock pulse width full effective bandwidth 8.5 - - ns
tw(clk)L LOW clock pulse width full effective bandwidth 5.5 - - ns
Analog signal processing
Linearity
INL integral non-linearity fclk = 40 MHz; ramp input - ±0.2 ±0.5 LSB
DNL differential non-linearity fclk = 40 MHz; ramp input - ±0.12 ±0.22 LSB
Eoffset offset error middle code; VRB = 1.3 V;
VRT = 3.67 V -±0.25 - LSB
EGgain error from device to device;
VRB = 1.3 V; VRT = 3.67 V [4] -±0.1 - %
Bandwidth (fclk = 40 MHz)
B bandwidth full-scale sine wave [5] - 15 - MHz
75 % full-scale sine wave - 20 - MHz
small signal at mid-scale;
VI=±10 LSB at code 512 - 350 - MHz
ts(LH) LOW to HIGH settling
time full-scale square wave; see
Figure 6 [6] - 1.5 3.0 ns
ts(HL) HIGH to LOW settling
time - 1.5 3.0 ns
Table 6. Characteristics
V
CCA
= V3 to V4 = 4.75 V to 5.25 V; V
CCD
= V11 to V12 and V28 to V27 = 4.75 V to 5.25 V;
V
CCO
= V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; T
amb
=0
°
Cto70
°
C; typical values measured at
V
CCA
=V
CCD
= 5 V and V
CCO
= 3.3 V, V
i(a)(p-p)
= 2.0 V; C
L
= 15 pF and T
amb
=25
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 8 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Harmonics (fclk = 40 MHz); see Figure 7 and 8
α1H first harmonic level fi = 4.43 MHz - - 0 dB
α2H second harmonic level fi = 4.43 MHz - −75 −65 dB
α3H third harmonic level fi = 4.43 MHz - −72 −65 dB
THD total harmonic distortion fi = 4.43 MHz - −65 - dB
Signal-to-noise ratio; see Figure 7 and 8[7]
S/N signal-to-noise ratio full scale;
without harmonics;
fclk = 40 MHz; fi= 4.43 MHz
46 49 - dB
Effective number of bits[7]
ENOB effective number of bits ADC0804S030TS (fclk = 30 MHz)
fi= 4.43 MHz - 7.8 - bits
fi= 7.5 MHz - 7.8 - bits
ADC0804S040TS (fclk = 40 MHz)
fi= 4.43 MHz - 7.8 - bits
fi= 7.5 MHz - 7.8 - bits
fi= 10 MHz - 7.8 - bits
fi= 15 MHz - 7.4 - bits
ADC0804S050TS (fclk = 50 MHz)
fi= 4.43 MHz - 7.8 - bits
fi= 7.5 MHz - 7.8 - bits
fi= 10 MHz - 7.8 - bits
fi= 15 MHz - 7.3 - bits
Two-tone intermodulation[8]
αIM intermodulation
suppression fclk = 40 MHz - −69 - dB
Bit error rate
BER bit error rate fclk = 40 MHz;
fi= 4.43 MHz; VI=±16 LSB
at code 512
-10
−13 - times/
samples
Differential gain[9]
Gdif differential gain fclk = 40 MHz;
PAL modulated ramp - 0.8 - %
Table 6. Characteristics
V
CCA
= V3 to V4 = 4.75 V to 5.25 V; V
CCD
= V11 to V12 and V28 to V27 = 4.75 V to 5.25 V;
V
CCO
= V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; T
amb
=0
°
Cto70
°
C; typical values measured at
V
CCA
=V
CCD
= 5 V and V
CCO
= 3.3 V, V
i(a)(p-p)
= 2.0 V; C
L
= 15 pF and T
amb
=25
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 9 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
[1] In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must not be less
than 0.5 ns.
[2] Analog input voltages producing code 0 up to and including code 255:
a) Voffset BOTTOM is the difference between the analog input which produces data equal to 00 and the reference voltage on pin RB
(VRB) at Tamb = 25 °C.
b) Voffset TOP is the difference between the reference voltage on pin RT (VRT) and the analog input which produces data outputs equal
to code 255 at Tamb = 25 °C.
[3] To ensure the optimum linearity performance of such a converter architecture the lower and upper extremities of the converter reference
resistor ladder are connected to pins RB and RT via offset resistors ROB and ROT as shown in Figure 3.
a) The current flowing into the resistor ladder is and the full-scale input range at the converter, to cover code 0
to 255 is
b) Since RL, ROB and ROT have similar behavior with respect to process and temperature variation, the ratio
will be kept reasonably constant from device to device. Consequently, the variation of the output codes at a given input voltage
depends mainly on the difference VRT − VRB and its variation with temperature and supply voltage. When several ADCs are
connected in parallel and fed with the same reference source, the matching between each of them is optimized.
[4]
[5] The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device. No glitches greater
than 0.5 LSB, neither any significant attenuation are observed in the reconstructed signal.
[6] The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square
wave signal) in order to sample the signal and obtain correct output data.
Differential phase[9]
ϕdif differential phase fclk = 40 MHz;
PAL modulated ramp - 0.4 - deg
Timing (fclk = 40 MHz; Ci = 15 pF); see Figure 4[10]
td(s) sampling delay time - 3 - ns
th(o) output hold time 4 - - ns
td(o) output delay time VCCO = 4.75 V - 10 13 ns
VCCO = 3.15 V - 12 15 ns
CLload capacitance - - 15 pF
3-state output delay times; see Figure 5
tdZH float to active HIGH
delay time - 5.5 8.5 ns
tdZL float to active LOW
delay time -1215ns
tdHZ active HIGH to float
delay time -1924ns
tdLZ active LOW to float
delay time -1215ns
Table 6. Characteristics
V
CCA
= V3 to V4 = 4.75 V to 5.25 V; V
CCD
= V11 to V12 and V28 to V27 = 4.75 V to 5.25 V;
V
CCO
= V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; T
amb
=0
°
Cto70
°
C; typical values measured at
V
CCA
=V
CCD
= 5 V and V
CCO
= 3.3 V, V
i(a)(p-p)
= 2.0 V; C
L
= 15 pF and T
amb
=25
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
IVRT VRB
–
ROB RLROT
++
----------------------------------------
=
VIRLIL
×RL
ROB RLROT
++
---------------------------------------- VRT VRB
+()×0.852 VRT VRB
–()×== =
RL
ROB RLROT
++
----------------------------------------
EGV1023 V0
–()Vip p–()
–
Vip p–()
---------------------------------------------------------100×=
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 10 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
[7] Effective bits are obtained via a Fast Fourier transform (FFT) treatment taking 8000 acquisition points per equivalent fundamental
period. The calculation takes into account all harmonics and noise up to half the clock frequency (Nyquist frequency). Conversion to
SIgnal-to-Noise-And-Distortion (SINAD) ratio: SINAD = ENOB × 6.02 + 1.76 dB.
[8] Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two input signals have
the same amplitude and the total amplitude of both signals provides full-scale to the converter.
[9] Measurement carried out using video analyzer VM700A, where the video analog signal is reconstructed through a digital-to-analog
converter.
[10] Output data acquisition: the output data is available after the maximum delay time of td(0). For 50 MHz version NXP recommend the
lowest possible output load.
11. Additional information relating to Table 6
Fig 3. Explanation of Table 6 Table note 3
014aaa555
RT
RB
RM
Rlad
ROT
RL
RL
RL
RL
IL
ROB
code 255
code 0
Table 7. Output coding and input voltage (typical values; referenced to AGND, VRB = 1.3 V,
VRT = 3.67 V)
Code Vi(a)(p-p)
(V) IR Binary outputs D7 to D0 Two’s complement
outputs D7 to D0
Underflow < 1.475 0 0000 0000 10 0000 00
0 1.475 1 0000 0000 10 0000 00
1 - 1 0000 0001 10 0000 01
↓-↓↓ ↓
254 - 1 1111 1110 01 1111 10
255 3.495 1 1111 1111 01 1111 11
Overflow > 3.495 0 1111 1111 01 1111 11
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 11 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Table 8. Mode selection
TC OE D7 to D0 IR
X 1 high impedance high impedance
0 0 active; two’s complement active
1 0 active; binary active
Fig 4. Timing diagram
014aaa556
CLK
VI
DATA
N − 2
DATA
D0 to D7 DATA
N − 1 DATA
NDATA
N + 1
sample N + 2sample N + 1
VCCO
sample N
sample N + 2
sample N + 1sample N
tw(clk)H
tw(clk)L
td(s)
td(o)
th(o)
50 %
0 V
VCCO
50 %
0 V
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 12 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
frequency on pin OE = 100 kHz
Fig 5. Timing diagram and test conditions of 3-state output delay time
Fig 6. Analog input settling time diagram
LOW
HIGH
HIGH
LOW
ADC0804S030
VCCD
VCCD
S1
OE
OE
output
data
output
data
10 %
50 %
50 %
90 %
50 %
tdLZ tdZL
tdHZ tdZH
15 pF
3.3 kΩ
S1
TEST
VCCD
tdLZ
VCCD
tdZL
DGND
tdZH
tdHZ DGND
014aaa552
014aaa400
code 255
code 0
50 % 50 %
CLK
VI
ts(LH) ts(HL)
50 % 50 %
2 ns 2 ns
0.5 ns 0.5 ns
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 13 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Effective bits: 7.84; THD = −71.8 dB.
Harmonic levels (dB): 2nd = −83.19; 3rd = −78.09; 4th = −78.72; 5th = −78.33; 6th = −77.55.
Fig 7. Typical fast Fourier transform (fclk = 40 MHz; fi = 4.43 MHz)
014aaa328
−60
−100
−20
+20
amplitude
(dB)
−140
f (MHz)
0 20.015.05.00 10.0
Effective bits: 7.79; THD = −62.96 dB.
Harmonic levels (dB): 2nd = −71.38; 3rd = −71.54; 4th = −74.14; 5th = −65.15; 6th = −77.16.
Fig 8. Typical fast Fourier transform (fclk = 50 MHz; fi = 10 MHz)
0f (MHz)
20.0 25.015.05.0 10.0
014aaa329
−60
−100
−20
+20
amplitude
(dB)
−140
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 14 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Fig 9. CMOS data and in-range outputs Fig 10. Analog inputs
Fig 11. OE and TC input Fig 12. RB, RM and RT
014aaa557
VCCO
D7 to D0
IR
OGND
VCCA
VI
AGND
014aaa526
014aaa553
VCCO
OGND
OE
TC
VCCA
RT
RM
RB
AGND
014aaa331
RL
RL
RL
RL
Fig 13. CLK input
VCCD
CLK 1.5 V
DGND
014aaa399
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 15 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
12. Application information
12.1 Alternative parts
The following alternative parts are also available:
[1] Pin to pin compatible
The analog and digital supplies should be separated and well decoupled
A user manual is available that describes the demonstration board that uses the version ADC0804S030/040/050/ family with an
application environment.
(1) RB, RM and RT are decoupled to AGND.
(2) Pin 15 may be connected to DGND in order to prevent noise influence.
(3) Decoupling capacitor for supplies; must be placed close to the device.
Fig 14. Application diagram
ADC0804S030
CLK VCCD1
TC DGND1
VCCA IR
AGND D7
n.c. D6
RB(1) D5
RM(1) D4
VI D3
RT(1) D2
OE D1
VCCD2 D0
DGND2 n.c.
VCCO n.c.
OGND n.c.(2)
014aaa554
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16
15
18
17
20
19
22
21
24
23
26
25
28
27 100 nF
100 nF 100 nF
100 nF
100 nF
100 nF
100 nF
(3)
(3)
(3)
(3)
AGND
AGND
AGND
Table 9. Alternative parts
Type number Description Sampling frequency
ADC1004S030 Single 10 bits ADC [1] 30 MHz
ADC1004S040 Single 10 bits ADC [1] 40 MHz
ADC1004S050 Single 10 bits ADC [1] 50 MHz
ADC1003S030 Single 10 bits ADC [1] 30 MHz, with internal reference
regulator
ADC1003S040 Single 10 bits ADC [1] 40 MHz, with internal reference
regulator
ADC1003S050 Single 10 bits ADC [1] 50 MHz, with internal reference
regulator
ADC1005S060 Single 10 bits ADC [1] 60 MHz
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 16 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
13. Package outline
Fig 15. SOT341-1 (SSOP28)
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 10.4
10.0 5.4
5.2 0.65 1.25
7.9
7.6 0.9
0.7 1.1
0.7 8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT341-1 MO-150 99-12-27
03-02-19
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
114
28 15
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
A
max.
2
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 17 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
14. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change
notice Supersedes
ADC0804S030_040_050_2 20080814 Product data sheet - ADC0804S030_040_050_1
Modifications: •Paragraph added to Section 1.
•Corrections to descriptions of rows RB and RM in Table 3.
•Corrections to Table 6.
•Corrections to Figure 9,10 and 12.
ADC0804S030_040_050_1 20080616 Product data sheet - -
ADC0804S030_040_050_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 August 2008 18 of 19
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors ADC0804S030/040/050
Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 August 2008
Document identifier: ADC0804S030_040_050_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Additional information relating to Table 6. . . 10
12 Application information. . . . . . . . . . . . . . . . . . 15
12.1 Alternative parts . . . . . . . . . . . . . . . . . . . . . . . 15
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16 Contact information. . . . . . . . . . . . . . . . . . . . . 18
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
