CREAT BY ART
- Glass passivated chip junction
- Ideal for automated placement
- Super fast recovery time for high efficiency
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Part No. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
V
RRM
50 100 150 200 300 400 500 600 V
V
RMS
35 70 105 140 210 280 350 420 V
V
DC
50 100 150 200 300 400 500 600 V
I
F(AV)
A
t
rr
ns
C
J
pF
T
J
°C
T
STG
°C
Document Number: DS_D1410033 Version: K15
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
ES
3H
0.95 1.3 1.7
45 30
°C/W
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
Note 1: Pulse test with PW=300μs, 1% duty cycle
Maximum reverse recovery time (Note 2) 35
Typical junction capacitance (Note 3)
Typical thermal resistance R
θJL
R
θJA
12
47
A
Maximum instantaneous forward voltage (Note 1)
I
F
= 3 A V
F
V
I
R
10 μA
500
Maximum reverse current @ rated V
R
Maximum DC blocking voltage
Maximum average forward rectified current 3
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
100
Maximum repetitive peak reverse voltage
Maximum RMS voltage
PARAMETER SYMBOL ES
3A
ES
3B
DO-214AB (SMC)
Polarity: Indicated by cathode band
Weight: 0.21 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
ES
3J Unit
ES
3C
ES
3D
ES
3F
ES
3G
T
J
=25°C
T
J
=100°C
ES3A - ES3J
Taiwan Semiconductor
3A, 50V - 600V Surface Mount Su
p
er Fast Rectifiers
FEATURES
Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: DO-214AB (SMC)
PART NO.
PART NO.
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25°C unless otherwise noted)
Document Number: DS_D1410033 Version: K15
ES3A - ES3J
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
SUFFIX PACKING CODE PACKING CODE
SUFFIX PACKAGE PACKING
H
R7
G
SMC 850 / 7" Plastic reel
R6 SMC 3,000 / 13" Paper reel
M6 SMC 3,000 / 13" Plastic reel
Note 1: "xx" defines voltage from 50V (ES3A) to 600V (ES3J)
EXAMPLE
PREFERRED
PART NO.
PART NO.
SUFFIX PACKING CODE PACKING CODE
SUFFIX DESCRIPTION
ES3x
(Note 1)
AEC-Q101 qualified
Green compound
ES3JHR7G ES3J H R7 G
0
0.5
1
1.5
2
2.5
3
3.5
0 255075100125150
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (°C)
FIG.1 MAXIMUM FORWARD CURRENT
DERATING CURVE
0
10
20
30
40
50
60
70
80
90
100
110100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Half Sin Wave
0.1
1
10
100
1000
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
TJ=125°C
TJ=25°C
TJ=75°C
0.1
1
10
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
INSTANTANEOUS FORWARD CURRENT
(A)
FORWARD VOLTAGE (V)
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
ES3H-3J
ES3F-3G
ES3A-3D
Min Max Min Max
A 2.90 3.20 0.114 0.126
B 6.60 7.11 0.260 0.280
C 5.59 6.22 0.220 0.245
D 2.00 2.62 0.079 0.103
E 1.00 1.60 0.039 0.063
F 7.75 8.13 0.305 0.320
G 0.10 0.20 0.004 0.008
H 0.15 0.31 0.006 0.012
Document Number: DS_D1410033 Version: K15
ES3A - ES3J
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
DO-214AB (SMC)
0
15
30
45
60
75
90
105
1 10 100
JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
ES3A-3D
ES3F-3J
f=1.0MHz
Vsig=50mVp-p
0.1
1
10
100
0.01 0.1 1 10 100
TRANSIENT THERMAL IMPEDANCE A
(°C/W)
HEATING TIME (s)
FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE
P/N = Specific Device Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1410033 Version: K15
C 6.8 0.268
MARKING DIAGRAM
D 4.4 0.173
E 9.4 0.370
A 3.3 0.130
B 2.5 0.098
ES3A - ES3J
Taiwan Semiconductor
SUGG ESTED PAD LAYO UT
Symbol Unit (mm) Unit (inch)
CREAT BY ART
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1410033 Version: K15
ES3A - ES3J
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
