Product Specification - Jan. 16, 2003 V.03 Supersedes Date of Oct. 21, 2002 DATA SHEET CHIP RESISTORS RJ Series 1%; TC50 2 h Chip Resistor Surface Mount RJ 9 SERIES SCOPE This specification describes RJ series chip resistors made by thin film process. ORDERING INFORMATION Part number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and resistance value. RJ XXXX X X E XX XXXX (1) (2) (3) (4) (5) MARKING RJ0805 / RJ1206 / RJ1210 / RJ2010 / RJ2512 Either resistance in E-24 or E-96: 4 digits (1) SIZE (INCH) 0201=0.024x0.012 0402=0.040x0.020 First three digits for significant figure and 4th digit for number of zeros ynsc004 Fig. 1 Value=10K 0603=0.063x0.033 0805=0.083x0.051 RJ0603 1206=0.122x0.063 E-24 series: 3 digits 1210=0.122x0.102 First two digits for significant figure and 3rd digit for number of zeros ynsc015 2010=0.197x0.098 2512=0.250x0.126 Fig. 2 Value=12K (2) TOLERANCE F = 1% (3) PACKAGING TYPE R = Paper taping reel K = Embossed Plastic Tape Reel C = Bulk case (4) SPECIAL TYPE 07 = 7 inch dia. Reel 10 = 10 inch dia. Reel 13 = 13 inch dia. Reel (5) RESISTANCE VALUE: 5R6, 56R, 560R, 5K6, 56K, 56M. E-96 series: 3 digits for 06031% EIA-96 marking method. See Table 1 10C ynsc002 Fig. 3 Value=12.4K RJ0201 / RJ0402 No value marking ynsc007 Fig. 4 EIA - 96 MARKING RULE Table 1 shows the first two digits of the three-digit EIA-96 part-marking scheme. Code Value Code Value Code Value Code Value Code Value Code Value Code Value Code Value 01 02 03 04 05 06 07 08 09 10 11 12 100 102 105 107 110 113 115 118 121 124 127 130 13 14 15 16 17 18 19 20 21 22 23 24 133 137 140 143 147 150 154 158 162 165 169 174 25 26 27 28 29 30 31 32 33 34 35 36 178 182 187 191 196 200 205 210 215 221 226 232 37 38 39 40 41 42 43 44 45 46 47 48 237 243 249 255 261 267 274 280 287 294 301 309 49 50 51 52 53 54 55 56 57 58 59 60 316 324 332 340 348 357 365 374 383 392 402 412 61 62 63 64 55 66 67 68 69 70 71 72 422 432 442 453 464 475 487 499 511 523 536 549 73 74 75 76 77 78 79 80 81 82 83 84 562 576 590 604 619 634 649 665 681 698 715 732 85 86 87 88 89 90 91 92 93 94 95 96 750 768 787 806 825 845 866 887 909 931 953 976 The third character is a letter multiplier: X=10 -1 , Y=10 -2 , A=10 0, B=10 1, C=10 2, D=10 3, E=10 4, F=10 5 www.yageo.com Jan. 16, 2003 V.03 3 h Chip Resistor Surface Mount RJ 9 SERIES CONSTRUCTION The resistors are constructed out of protective coat a high-grade ceramic body. Internal handbook, 4 columns resistor layer metal electrodes are added at each end and connected by a resistive inner electrode H layer. The resistive layer is adjusted end termination to give the approximate required ceramic substrate I2 resistance and laser cutting of this resistive layer that achieves Fig. 5 Chip resistor construction tolerance trims the value. The resistive layer is covered with a protective coat and printed with the resistance value. Finally, the two external terminations are added. See fig.5 MBE940_a DIMENSION Table 2 For dimension see Table 2 protective coat I1 TYPE L (mm) W (mm) H (mm) I1 (mm) I2 (mm) RJ0201 0.60.10 0.300.05 0.250.05 0.150.10 0.150.10 RJ0402 1.000.10 0.500.05 0.300.05 0.200.10 0.250.10 RJ0603 1.600.10 0.800.10 0.450.10 0.250.15 0.250.15 W RJ0805 2.000.10 1.250.10 0.500.10 0.350.20 0.350.20 MBE940_a RJ1206 3.100.10 1.600.10 0.550.10 0.450.20 0.400.20 RJ1210 3.100.10 2.600.15 0.550.10 0.500.20 0.500.20 L RJ2010 5.000.10 2.500.15 0.550.10 0.600.20 0.500.20 Fig. 6 Chip resistor dimension RJ2512 6.350.10 3.200.15 0.550.10 0.600.20 0.500.20 POWER RATING RATED POWER AT 70C: RJ0201=1/20W, RJ0402=1/16W, RJ0603=1/16W, RJ0805=1/10W, RJ1206=1/8W, RJ1210=1/4W, RJ2010=1/2W, RJ2512=3/4W RATED VOLTAGE: ndbook, P halfpage MLB206 max (%Prated ) 100 The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V=(P X R) 50 Where 0 55 0 50 70 100 125 o Tamb ( C) Fig. 7 Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient temperature (Tamb) V=Continuous rated DC or AC (rms) working voltage (V) P=Rated power (W) R=Resistance value (X) www.yageo.com Jan. 16, 2003 V.03 4 h Chip Resistor Surface Mount RJ 9 SERIES ELECTRICAL CHARACTERISTICS Table 2 OPERATING TEMPERATURE RANGE DERATED TO 0 LOAD AT MAXIMUM WORKING VOLTAGE DIELECTRIC WITHSTAND VOLTAGE MAXIMUM OVERTOAD VOLTAGE RESISTANCE RANGE TEMPERATURE COEFFICIENT RJ0201 -55C to +125C +125C 15V 50V 50V 10~30K 50ppm/C RJ0402 -55C to +125C +125C 25V 100V 100V 10~121K 50ppm/C RJ0603 -55C to +125C +125C 50V 100V 100V 3~681K 50ppm/C RJ0805 -55C to +125C +125C 100V 250V 200V 3~1.5M 50ppm/C RJ1206 -55C to +125C +125C 150V 250V 250V 3~1.5M 50ppm/C RJ1210 -55C to +125C +125C 150V 400V 300V 1~1M 50ppm/C RJ2010 -55C to +125C +125C 150V 400V 300V 10~1M 50ppm/C RJ2512 -55C to +125C +125C 150V 400V 300V 10~1M 50ppm/C CHARACTERISTICS www.yageo.com Jan. 16, 2003 V.03 5 h Chip Resistor Surface Mount RJ 9 SERIES TAPING REEL Table 4 DIMENSION RJ0201 RJ0402 RJ0603 RJ0805 RJ1206 RJ1210 RJ2010 For dimension see Table 4 RJ2512 T idth PACKAGING Paper Paper Paper Paper Paper Paper Embossed Embossed TAPE WIDTH 8mm 8mm 8mm 8mm 8mm 8mm OA (mm) 12mm 12mm 180+0/-3 180+0/-3 180+0/-3 180+0/-3 180+0/-3 180+0/-3 180+0/-3 180+0/-3 OB (mm) 60+1/-0 OC (mm) 13.00.2 13.00.2 13.00.2 13.00.2 13.00.2 13.00.2 13.00.2 13.00.2 60+1/-0 60+1/-0 60+1/-0 60+1/-0 60+1/-0 60+1/-0 21 0.8 C B A 60+1/-0 W (mm) 9.00.3 9.00.3 9.00.3 9.00.3 9.00.3 9.00.3 13.00.3 13.00.3 T (mm) 11.41 11.41 11.41 11.41 11.41 11.41 15.41 MSA284_a W 15.41 Fig. 8 Reel dimension PAPER TAPE SPECIFICATION Table 5 DIMENSION RJ0201 RJ0402 RJ0603 RJ0805 RJ1206 RJ1210 A (mm) 0.450.1 0.650.1 1.100.1 1.650.1 1.900.1 2.800.1 B (mm) 0.750.1 1.150.1 1.900.1 2.400.1 3.500.1 3.500.1 W (mm) 8.00.2 8.00.2 8.00.2 8.00.2 8.00.2 8.00.2 E (mm) 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 1.750.1 F (mm) 3.50.05 3.50.05 3.50.05 3.50.05 3.50.05 3.50.05 P0 (mm) 4.00.1 4.00.1 4.00.1 4.00.1 4.00.1 4.00.1 P1 (mm) 2.00.05 4.00.05 4.00.05 4.00.05 4.00.05 4.00.05 P2 (mm) 2.00.05 2.00.05 2.00.05 2.00.05 2.00.05 2.00.05 OD0 (mm) T (mm) 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 0.350.10 0.530.10 0.700.10 0.850.10 0.850.10 0.850.10 For dimension see Table 5 P0 P2 D0 E F W B T A MBD123_a P1 Fig. 9 Paper tape dimension EMBOSSED TAPE SPECIFICATION Table 6 DIMENSION RJ2010 A (mm) 2.800.2 3.50.2 B (mm) 5.40.2 6.70.2 W (mm) 12.00.3 120.3 E (mm) 1.750.1 1.750.1 F (mm) 5.50.05 5.50.05 P0 (mm) 4.00.1 4.00.1 P1 (mm) 4.00.1 4.00.1 P2 (mm) OD0 (mm) OD1 (mm) Tmax (mm) P0 RJ2512 2.00.05 2.00.05 1.5+0.1/-0 1.5+0.1/-0 1.50.25 1.50.25 4.5 4.5 D0 P2 E F cover tape W B MBG516_a A T D1 P1 direction of unreeling Fig. 10 Embossed tape dimension For dimension see Table 6 www.yageo.com Jan. 16, 2003 V.03 6 h Chip Resistor Surface Mount RJ 9 SERIES PACKING METHOD LEADER/TRAILER TAPE SPECIFICATION BULK CASSETTE handbook, 4 columns leader end empty compartments with cover tape (min. 240 mm) trailer end slider shutter coupled portion cover tape only leader 400 mm trailer (max. 260 mm) MGB377 CCB325 Fig. 11 Leader and trailer tape dimension Fig.12 Bulk case outline Table 7 Packing style and packaging quantity PACKING STYLE Paper Taping Reel (R) Embossed Taping Reel (K) Bulk Cassette (C) REEL DIMENSION RJ0201 RJ0402 7" (178 mm) 10,000 10,000 5,000 5,000 10" (254 mm) 13" (330 mm) 7" (178 mm) 20,000 40,000 --- 20,000 40,000 --- 10,000 20,000 --- 10,000 20,000 --- 50,000 50,000 25,000 10,000 --- RJ0603 RJ0805 RJ1206 RJ1210 RJ2010 RJ2512 5,000 5,000 --- --- 10,000 20,000 --- 10,000 20,000 --- ----4,000 ----4,000 --- --- --- www.yageo.com Jan. 16, 2003 V.03 7 h Chip Resistor Surface Mount TYPE RJ 9 SERIES TEST METHOD Temperature Coefficient of Resistance (T.C.R.) ACCEPTANCE STANDARD Measure resistance at +25C or specified room temperature as R1, then measure at -55C or +125C respectively as R2. Determine the temperature coefficient of resistance from the following formula: Thermal Shock Formula 50ppm/C R2-R1 T.C.R.= ------------------------- x106 (ppm/C) R1(t2-t1) Where t1=+25C or specified room temperature t2=-55C or +125C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms At -553C for 2 minutes and at +1252C for 2 minutes as one cycle. After 25 cycles, the specimen shall be stabilized at room temperature. (0.5%+0.05) Measure the resistance to determine R/R(%) after one more hour. Low Temperature Operation Place the specimen in a test chamber maintained at -65 (+0/-5)C. After one hour stabilization at this temperature, full rated working voltage shall be applied for 45 (+5/-0) minutes. Have15 (+5/-0) minutes after remove the voltage, the specimen shall be removed from the chamber and stabilized at room temperature for 24 hrs. (0.5%+0.05) No mechanical damage Measure the resistance to determine R/R(%). Short Time Overload Apply 2.5 times of rated voltage but not exceeding the maximum overload voltage for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. Measure the resistance to determine R/R(%). Insulation Resistance Place the specimen in the jig and apply a rated continues overload voltage (R.C.O.V) for one minute. (1.0%+0.05) for 1.0% tolerance No evidence of mechanical damage 10,000M Measure the insulation resistance. Type RJ0201 RJ0402 RJ0603 RJ0805 RJ1206 RJ1210 RJ2010 RJ2512 Voltage 50V 100V 100V 200V 250V 300V 300V 300V Dielectric Withstand Voltage Place the specimen in the jig and apply a specified value continuous overload voltage as shown for one minute. Type Voltage Resistance To Soldering Heat RJ0201 RJ0402 RJ0603 RJ0805 RJ1206 RJ1210 RJ2010 RJ2512 50V 100V 100V 200V 250V 300V 300V Breakdown voltage> specification and without open/short 300V Immerse the specimen in the solder pot at 2605C. for 101 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. (0.5%+0.05) No visible damage Measure the resistance to determine R/R(%). www.yageo.com Jan. 16, 2003 V.03 8 h Chip Resistor Surface Mount TYPE Moisture Resistance RJ 9 SERIES TEST METHOD ACCEPTANCE STANDARD Place the specimen in the test chamber and subject to 42 damp heat cycles. Each one of which consists of the steps 1 to 7 as figure 14. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for 24 hours after testing. (0.5%+0.05) No visible damage Measure the resistance to determine R/R(%). Life Place the specimen in the oven at 702C. Apply the rated voltage to the specimen at the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for one hour minimum after testing. (1%+0.05) for 1% tolerance Measure the R/R(%). Solderability Bending Strength Immerse the specimen in the solder pot at 2305C for 5 sec. At least 95% solder coverage on the termination Mount the specimen on a test board as shown in the figure 13. Slowly apply the force till the board is bent for 51 sec. (1.0%+0.05) for 1% tolerance No visible damage Measure the R/R(%) at this position. Fig. 13 Principle of the bending test Type Spec RJ0201 RJ0402 RJ0603 RJ0805 RJ1206 RJ1210 RJ2010 RJ2512 2mm 2mm 3mm 3mm 2mm 2mm 2mm 2mm www.yageo.com Jan. 16, 2003 V.03 9 h Chip Resistor Surface Mount 75 RJ 80 - 98% RH 90 - 98% RH temperature [C] 9 SERIES 90 - 98% RH 80 - 98% RH 90 - 98% RH initial drying 24 hours rate of change of temperature is unspecified, however, specimens shall not be subjected to radiant heating from chamber conditioning processes 50 end of final cycle; measurements as specified in 2.7 +10 C (+18 F) -2 C (-3.6 F) 25 initial measurements as specified in 2.2 0 temperature tolerance 2 C (3.6 F) unless otherwise specified voltage applied as specified in 2.4 STEP1 STEP2 prior to first cycle only HBK073 optional sub-cycle if specified (2.3); sub-cycle performed during any 5 of the first 9 cycles; humidity uncontrolled during sub-cycle circulation of conditioning air shall be at a minimum cubic rate per minute equivalent to 10 times the volume of the chamber STEP3 STEP4 STEP5 STEP6 STEP7 one cycle 24 hours; repeat as specified in 2.5 0 5 10 15 20 25 time [h] Fig. 14 Conditions by change of temperature www.yageo.com Jan. 16, 2003 V.03