TLP290-4(GB-TP,E)"" - TOSHIBA

TLP290-4

1

Photocouplers GaAs Infrared LED & Photo Transistor

TLP290-4

1.

1. Applications

Applications

• Programmable Logic Controllers (PLCs)

• Switching Power Supplies

• Simplex/Multiplex Data Transmission

2.

2. General

General

The Toshiba TLP290-4 consists of phototransistors optically coupled to gallium arsenide infrared emitting diodes.

The TLP290-4 Photocoupler is housed in the very small and thin SO16 package.

Since the TLP290-4 is guaranteed over a wide operating temperature range (Ta = -55 to 110), it is suitable for

high-density surface mount applications such as programmable controllers.

3.

3. Features

Features

(1) Collector-emitter voltage: 80 V (min)

(2) Current transfer ratio: 50% (min)

GB Rank: 100% (min)

(3) Isolation voltage: 2500 Vrms (min)

(4) Operating temperature: -55 to 110

(5) Safety standards

UL-approved UL1577 File No.E67349

cUL-approved CSA Component Acceptance Service No.5A File No.E67349

VDE approved EN60747-5-2 Certificate No. 40009347 (Note)

Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4)

Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4).

4.

4. Packaging and Pin Configuration

Packaging and Pin Configuration

1, 3, 5, 7: Cathode, anode

2, 4, 6, 8: Anode, cathode

9, 11, 13, 15: Emitter

10, 12, 14, 16: Collector

11-11F1

2012-03-22

Rev.4.0

TLP290-4

2

5.

5. Principle of Operation

Principle of Operation

5.1.

5.1. Mechanical Parameters

Mechanical Parameters

Characteristics

Creepage distances

Clearance

Internal isolation thickness

Min

5.0

0.1

Unit

mm

6.

6. Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta

a

a = 25

= 25

= 25



)

)

LED

Detector

Common

Characteristics

R.M.S. forward current

Input forward current derating

Input forward current (pulsed)

Junction temperature

Collector-emitter voltage

Emitter-collector voltage

Collector current

Collector power dissipation

derating (1 circuit)

Junction temperature

Operating temperature

Storage temperature

Lead soldering temperature

Total power dissipation

(1 circuit)

Input power dissipation

derating(1 circuit)

Isolation voltage

(Ta ≥ 50)

(Ta ≥ 25)

(10 s)

(Ta ≥ 25)

AC, 1min, R.H. ≤ 60%

Symbol

IF(RMS)

∆IF/∆Ta

IFP

Tj

VCEO

VECO

IC

PC

∆PC/∆Ta

Tj

Topr

Tstg

Tsol

PT

∆PD/∆Ta

BVS

Note

(Note 1)

(Note 2)

Rating

±50

-0.67

±1

125

80

7

50

100

-1.0

125

-55 to 110

-55 to 125

260

170

-1.7

2500

Unit

mA

mA/

A



V

mA

mW

mW/



mW

mW/

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width (PW) ≤ 100 µs, f = 100 Hz

Note 2: This device is considered as a two-terminal device: Pins 1, 2, 3, 4, 5, 6, 7 and 8 are shorted together, and pins

9, 10, 11, 12, 13, 14, 15 and 16 are shorted together.

7.

7. Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25



)

)

LED

Detector

Characteristics

Input forward voltage

Input capacitance

Collector-emitter breakdown

voltage

Emitter-collector breakdown

voltage

Dark Current

Collector-emitter capacitance

Symbol

VF

Ct

V(BR)CEO

V(BR)ECO

IDARK

CCE

Note Test Condition

IF = ±10 mA

V = 0 V, f = 1 MHz

IC = 0.5 mA

IE = 0.1 mA

VCE = 48 V

VCE = 48 V, Ta = 85

V = 0 V, f = 1 MHz

Min

1.1



80

7



Typ.

1.20

30



0.01

2

10

Max

1.4



0.1

50



Unit

V

pF

V

µA

pF

2012-03-22

Rev.4.0

TLP290-4

3

8.

8. Coupled Electrical Characteristics (Unless otherwise specified, T

Coupled Electrical Characteristics (Unless otherwise specified, T

Coupled Electrical Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25



)

)

Characteristics

Current transfer ratio

Saturated current transfer ratio

Collector-emitter saturation

voltage

OFF-state collector current

Collector current ratio

Symbol

IC/IF

IC/IF(sat)

VCE(sat)

IC(off)

IC(ratio)

Note

(Note 1)

Test Condition

IF = ±5 mA, VCE = 5 V

IF = ±5 mA, VCE = 5 V, Rank GB

IF = ±1 mA, VCE = 0.4 V

IF = ±1 mA, VCE = 0.4 V, Rank GB

IC = 2.4 mA, IF = ±8 mA

IC = 0.2 mA, IF = ±1 mA

IC = 0.2 mA, IF = ±1 mA, Rank GB

VF = ±0.7 V, VCE = 48 V

See Fig. 8.1.

IC(IF = -5 mA)/ IC(IF = 5 mA)

Min

50

100



30



0.33

Typ.



60



0.2



Max

400



0.4



0.4

10

3

Unit

%

V

µA



Note 1: See Table 8.1 for current transfer ratio.

Table

Table 8.1

8.1

8.1 Current transfer ratio (CTR) Rank (Note) (Unless otherwise specified, T

Current transfer ratio (CTR) Rank (Note) (Unless otherwise specified, T

Current transfer ratio (CTR) Rank (Note) (Unless otherwise specified, Ta

a

a = 25

= 25

= 25



)

)

Rank

Blank

GB

Test Condition

IF = ±5 mA, VCE = 5 V

Current

transfer

ratio IC/IF

Min

50

100

Current

transfer

ratio IC/IF

Max

400

Marking of

Classification

Blank

GB

Unit

%

Note: Specify both the part number and a rank in this format when ordering.

Example: TLP290-4 (GB)

For safety standard certification, however, specify the part number alone.

Example: TLP290-4 (GB,E: TLP290-4

Fig.

Fig. 8.1

8.1

8.1 Collector Current Ratio Test Circuit

Collector Current Ratio Test Circuit

2012-03-22

Rev.4.0

TLP290-4

4

9.

9. Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25



)

)

Characteristics

Total capacitance (input to

output)

Isolation resistance

Isolation voltage

Symbol

CS

RS

BVS

Note Test Conditions

VS = 0 V, f = 1 MHz

VS = 500 V, R.H. ≤ 60%

AC, 1 min

AC, 1s in oil

DC, 1min in oil

Min



1 × 1012

2500



Typ.

0.8

1014



5000

Max



Unit

pF

Ω

Vrms

Vdc

10.

10. Switching Characteristics (Unless otherwise specified, T

Switching Characteristics (Unless otherwise specified, T

Switching Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25



)

)

Characteristics

Rise time

Fall time

Turn-on time

Turn-off time

Turn-on time

Storage time

Turn-off time

Symbol

tr

tf

ton

toff

ton

ts

toff

Note Test Condition

VCC = 10 V, IC = 2 mA,

RL = 100 Ω

See Figure 10.1

RL = 1.9 kΩ, VCC = 5 V,

IF = 16 mA

Min



Typ.

2

3

2

25

40

Max



Unit

µs

Fig.

Fig. 10.1

10.1

10.1 Switching Time Test Circuit

Switching Time Test Circuit

2012-03-22

Rev.4.0

TLP290-4

5

11.

11. Characteristics Curves (Note)

Characteristics Curves (Note)

Fig.

Fig. 11.1

11.1

11.1 I

I

IF

F

F - T

- T

- Ta

a

aFig.

Fig.

Fig. 11.2

11.2

11.2 P

P

PC

C

C - T

- T

- Ta

a

Fig.

Fig. 11.3

11.3

11.3 I

I

IFP

FP

FP - D

- D

- DR

R

RFig.

Fig.

Fig. 11.4

11.4

11.4 I

I

IF

F

F - V

- V

- VF

F

Fig.

Fig. 11.5

11.5

11.5 ∆

∆

∆V

V

VF

F

F/

/

/∆

∆

∆T

T

Ta

a

a - I

- I

- IF

F

FFig.

Fig.

Fig. 11.6

11.6

11.6 I

I

IFP

FP

FP - V

- V

- VFP

FP

2012-03-22

Rev.4.0

TLP290-4

6

Fig.

Fig. 11.7

11.7

11.7 I

I

IC

C

C - V

- V

- VCEO

CEO

CEO Fig.

Fig.

Fig. 11.8

11.8

11.8 I

I

IC

C

C - V

- V

- VCEO

CEO

Fig.

Fig. 11.9

11.9

11.9 I

I

IC

C

C - I

- I

- IF

F

FFig.

Fig.

Fig. 11.10

11.10

11.10 I

I

IDARK

DARK

DARK - T

- T

- Ta

a

Fig.

Fig. 11.11

11.11

11.11 I

I

IC

C

C/I

/I

/IF

F

F - I

- I

- IF

F

2012-03-22

Rev.4.0

TLP290-4

7

Fig.

Fig. 11.12

11.12

11.12 V

V

VCE(sat)

CE(sat)

CE(sat) - T

- T

- Ta

a

aFig.

Fig.

Fig. 11.13

11.13

11.13 I

I

IC

C

C - T

- T

- Ta

a

Fig.

Fig. 11.14

11.14

11.14 Switching Time - R

Switching Time - R

Switching Time - RL

L

LFig.

Fig.

Fig. 11.15

11.15

11.15 Switching Time - T

Switching Time - T

Switching Time - Ta

a

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

2012-03-22

Rev.4.0

TLP290-4

8

12.

12. Soldering and Storage

Soldering and Storage

12.1.

12.1. Precautions for Soldering

Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

• When using soldering reflow (See Fig. 12.1.1 and 12.1.2)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

Fig.

Fig. 12.1.1

12.1.1

12.1.1 An example of a temperature profile

An example of a temperature profile

when Sn-Pb eutectic solder is used

Fig.

Fig. 12.1.2

12.1.2

12.1.2 An example of a temperature profile

An example of a temperature profile

when lead(Pb)-free solder is used

• When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Apply preheating of 150 for 60 to 120 seconds.

Mounting condition of 260 within 10 seconds is recommended.

Flow soldering must be performed once.

• When using soldering Iron

Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not

exceeding 350

Heating by soldering iron must be done only once per lead.

12.2.

12.2. Precautions for General Storage

Precautions for General Storage

• Avoid storage locations where devices may be exposed to moisture or direct sunlight.

• Follow the precautions printed on the packing label of the device for transportation and storage.

• Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,

respectively.

• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

• When restoring devices after removal from their packing, use anti-static containers.

• Do not allow loads to be applied directly to devices while they are in storage.

• If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

2012-03-22

Rev.4.0

TLP290-4

9

13.

13. Land Pattern Dimensions for Reference Only

Land Pattern Dimensions for Reference Only

Fig.

Fig. 13.1

13.1

13.1 Land Pattern Dimensions for Reference Only (unit: mm)

Land Pattern Dimensions for Reference Only (unit: mm)

14.

14. Marking

Marking

Fig.

Fig. 14.1

14.1

14.1 Marking

Marking

2012-03-22

Rev.4.0

TLP290-4

10

15.

15. Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers

Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers

15.1.

15.1. Applicable Package

Applicable Package

Package Name

SO16

Product Type

Mini-Flat Coupler

15.2.

15.2. Product Naming Conventions

Product Naming Conventions

Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification

is as below.

Example) TLP290-4 (GB-TP, E

Part number: TLP290-4

CTR rank: (GB

Tape type: TP

[[G]]/RoHS COMPATIBLE: E (Note)

(Note)

Note: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the

restriction of the use of certain hazardous substances in electrical and electronics equipment.

15.3.

15.3. Tape Dimensions Specification

Tape Dimensions Specification

15.3.1.

15.3.1. Orientation of Device in Relation to Direction of Feed

Orientation of Device in Relation to Direction of Feed

Device orientation in the carrier cavities as shown in Figure 15.3.1.1.

Fig.

Fig. 15.3.1.1

15.3.1.1

15.3.1.1 Device Orientation

Device Orientation

15.3.2.

15.3.2. Packing Quantity

Packing Quantity

2000 pcs per reel

15.3.3.

15.3.3. Empty Cavities

Empty Cavities

Table

Table 15.3.3.1

15.3.3.1

15.3.3.1 Empty Cavities

Empty Cavities

Characteristics

Occurrences of 2 or more

successive empty cavities

Single empty cavity

Criterion

0

6 devices (max) per reel

Remarks

Within any given 40-mm section of tape, not including leader

and trailer

Not including leader and trailer

15.3.4.

15.3.4. Tape Leader and Trailer

Tape Leader and Trailer

The start end of the tape has 50 or more empty cavities. The hub end of the tape has 50 or more empty cavities

and two empty turns only for a cover tape.

2012-03-22

Rev.4.0

TLP290-4

11

15.3.5.

15.3.5. Tape Dimensions

Tape Dimensions

Tape material: Plastic (for protection against static electricity)

Fig.

Fig. 15.3.5.1

15.3.5.1

15.3.5.1 Tape Dimensions

Tape Dimensions

Table

Table 15.3.5.1

15.3.5.1

15.3.5.1 Tape Dimensions (unit: mm, unless oherwise specified:

Tape Dimensions (unit: mm, unless oherwise specified:

Tape Dimensions (unit: mm, unless oherwise specified: ±

±

±0.1)

0.1)

Symbol

A

B

D

E

F

G

K0

Dimension

7.5

10.5

7.5

1.75

12.0

4.0

2.2

Remark



Center line of embossed cavity and sprocket hole

Distance between tape edge and sprocket hole center

Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes

Cumulative error +0.1/-0.3 (max) per 10 sprocket holes

Internal space

2012-03-22

Rev.4.0

TLP290-4

12

15.3.6.

15.3.6. Reel specification

Reel specification

Material: Plastic

Fig.

Fig. 15.3.6.1

15.3.6.1

15.3.6.1 Reel Dimensions

Reel Dimensions

Table

Table 15.3.6.1

15.3.6.1

Reel Dimensions (unit: mm)

Symbol

A

B

C

E

U

W1

W2

Dimension

φ330 ± 2

φ80 ± 1

φ13 ± 0.5

2.0 ± 0.5

4.0 ± 0.5

17.5 ± 0.5

21.5 ± 1.0

15.4.

15.4. Packing

Packing

Either one reel or ten reels of photocouplers are packed in a shipping carton.

15.5.

15.5. Label Format

Label Format

The label on each carton provides the part number, quantity, lot number, the Toshiba logo, CTR rank, etc.

15.6.

15.6. Ordering Information

Ordering Information

When placing an order, please specify the part number, CTR rank, tape type and quantity as shown in the

following example.

Example) TLP290-4 (GB-TP, E 2000

Part number: TLP290-4

CTR rank: (GB

Tape type: TP

[[G]]/RoHS COMPATIBLE: E (Note)

(Note)

Quantity (must be a multiple of 2000)

Note: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the

restriction of the use of certain hazardous substances in electrical and electronics equipment.

2012-03-22

Rev.4.0

TLP290-4

13

Package Dimensions

Package Dimensions Unit: mm

Weight: 0.19 g (typ.)

Package Name(s)

TOSHIBA: 11-11F1

2012-03-22

Rev.4.0

TLP290-4

14

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product

is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/

or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact

("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace

industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,

equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and

equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.

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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

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intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange

and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology

are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

2012-03-22

Rev.4.0