This document is subject to change without notice
Document No: 0011-00-07-00-000 (Issue H)
Date Published: October 18, 2013 Page 1
MeshConnect™ EM357 Mini Modules
DESCRIPTION
The MeshConnect™ EM357 Mini Modules from
California Eastern Laboratories (CEL) combine high
performance RF solutions with the market's premier
ZigBee® stack. Available in low and high output
power options (+8dBm and +20dBm), these modules
can accommodate variable range and performance
requirements. The mini module footprint makes them
suitable for a wide range of ZigBee applications. The
MeshConnect EM357 Mini Modules are certied and
qualied, enabling customers to accelerate time to
market by greatly reducing the design and certication
phases of development.
CEL's MeshConnect EM357 Mini Modules
(ZICM357SP0 and ZICM357SP2) are based on the
Ember EM357 ZigBee compliant SoC radio IC. The
IC is a single-chip solution, compliant with ZigBee
specications and IEEE 802.15.4, a complete
wireless solution for all ZigBee applications. The
IC consists of an RF transceiver with the baseband
modem, a hardwired MAC and an embedded 32-
bit ARM® Cortex™-M3 microcontroller with internal
RAM (12kB) and Flash (192kB) memory. The device
provides numerous general-purpose I/O pins and
peripheral functions such as timers and UARTs.
Integrated Transceiver Modules for ZigBee / IEEE 802.15.4
Development Kit available: ZICM-EM35X-DEV-KIT-2
MeshConnect
™ EM357 Mini Modules
ZICM357SP0, ZICM357SP2
EmberTM EM357 Transceiver Based Modules
•High RF Performance:
Up to 123dB RF Link Budget
RX Sensitivity:
-100dBm (ZICM357SP0)
-103dBm (ZICM357SP2)
•Data Rate: 250kbps
•Advanced Cortex-M3 Processor
•Advanced Power Management
•16 RF Channels
•Industry's Premier ZigBee Pro
Stack: EmberZNet PRO™
FEATURES
•Mini Footprint:
- 0.940" x 0.655"
(23.9mm x 16.6mm)
•Antenna Options
1) Integrated PCB Trace Antenna
or
2) RF Port for External Antenna
•Supports Mesh Networks
•AES Encryption
•FCC, CE and IC Certications
•ROHS Compliant
APPLICATIONS
•Smart Energy/ Grid Markets
- Thermostats
- In-Home Displays
- Smart Plugs
•Home Automation and Control
- Energy Management
- Security Devices
- HVAC Control
•Building Automation
and Control
•Commercial and Residential
Lighting
- Fixtures and Control
•Solar Inverters and Control
•General ZigBee Wireless
Sensor Networking
ZICM357SP0 ZICM357SP2
+8dBm +20dBm
-100dBm -103dBm
+108dB +123dB
Tx:
Rx:
Link Budget:
DATASHEET
• 192 kB FLASH
• 12 kB SRAM
• 32-bit ARM® Cortex™-M3
• Up to 23 GPIO Pins
• SPI (Master/Slave), TWI, UART
• Timers, Serial Wire/JTAG Interface
• 5-channel 14-bit ADC
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
Introduction and Overview
Description..............................................................................................................................................................................................
1
Features
.................................................................................................................................................................................................. 1
Applications
............................................................................................................................................................................................ 1
Ordering Information.............................................................................................................................................................................
3
Module Block Diagram...........................................................................................................................................................................
3
Development Tools
................................................................................................................................................................................. 3
System Level Function
Transceiver IC.........................................................................................................................................................................................
4
Antenna
................................................................................................................................................................................................... 4
Power Amplier
...................................................................................................................................................................................... 4
Software/Firmware
................................................................................................................................................................................. 5
Electrical Specication
Absolute Maximum Ratings
................................................................................................................................................................... 6
Recommended (Operating Condition)..................................................................................................................................................
6
DC Characteristics..................................................................................................................................................................................
6
RF Characteristics
.................................................................................................................................................................................. 6
Pin Signal and Interfaces
Pin Signals I/O Conguration
................................................................................................................................................................ 7
I/O Pin Assignment
................................................................................................................................................................................ 7
Module Dimensions
................................................................................................................................................................................ 9
Module Land Footprint
........................................................................................................................................................................... 10
Processing
......................................................................................................................................................................................... 11
Agency Certications
................................................................................................................................................................... 13
Shipment, Storage and Handling
............................................................................................................................................. 16
Quality
.................................................................................................................................................................................................. 16
References
......................................................................................................................................................................................... 17
Revision History
.............................................................................................................................................................................. 17
TABLE OF CONTENTS
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
ORDERING INFORMATION
Part Number Order Number Description Min/
Multiple
ZICM357SPx
ZICM357SP0-1 +8dBm Output Power, PCB Trace antenna; tray package 330/330
ZICM357SP0-1-R +8dBm Output Power, PCB Trace antenna; tape and reel package 600/600
ZICM357SP0-1C +8dBm Output Power, with Castellation pin for external antenna;
tray package 330/330
ZICM357SP0-1C-R +8dBm Output Power, with Castellation pin for external antenna;
tape and reel package 600/600
ZICM357SP2-1 +20dBm Output Power, PCB Trace antenna; tray package 330/330
ZICM357SP2-1-R +20dBm Output Power, PCB Trace antenna; tape and reel package 600/600
ZICM357SP2-1C +20dBm Output Power, with Castellation pin for external antenna;
tray package 330/330
ZICM357SP2-1C-R +20dBm Output Power, with Castellation pin for external antenna;
tape and reel package 600/600
ZICM-EM35X-DEV-KIT ZICM-EM35X-DEV-KIT-2 MeshConnect EM35x Ember Companion Kit for Ember EM35x
Development Kit (See below for kit content and details) 1/1
Note: All packages come in Trays unless a part number has a "-R" designation; part numbers with the "-R" indicate a Tape and Reel
Package Option.
MODULE BLOCK DIAGRAMS
Radio
Micro
Balun LPF
Castellation
Edge Connector
Ember EM357
24MHz
XTAL
EM357 Mini Module (ZICM357SP0)
Radio
Micro
PA
LNA
LPF
TX/RX
Switch
Castellation
Edge Connector
Ember EM357
24MHz
XTAL
EM357 Mini Module (ZICM357SP2)
DEVELOPMENT TOOLS
Ember Companion Kit:
CEL's MeshConnect EM35x Ember Companion Kit
is designed to work with the Ember development kit
(EM35X-DEV and EM35X-DEV-IAR). Each module in
this CEL kit is soldered on a carrier board making it pin-
for-pin compatible with the Ember Development Board.
For more information regarding the MeshConnect
Development Kit, refer to the respective
Development Kit User Guides documents, or visit
www.cel.com/MeshConnect.
Kit Contents:
• ZICM357SP2-1 Modules (2)
• ZICM357SP2-1C Module (1)
• ZICM357SP0-1 Modules (2)
• ZICM357SP0-1C Module (1)
• Online Documentation
EM35x Ember Companion Kit
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
TRANSCEIVER IC
CEL’s MeshConnect EM357 Mini Modules use the Ember EM357 transceiver IC. This IC incorporates the RF
transceiver with the baseband modem, a hardwired MAC, and an embedded ARM® Cortex™-M3 microcontroller,
offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications. For more
information about the EM357 IC, visit www.silabs.com.
ANTENNA
CEL’s MeshConnect EM357 Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna. An
optional conguration which uses a castellation pin on the module allows the user to connect an external antenna. The
ZICM357SP0 has been certied with the PCB trace antenna only while the ZICM357SP2 has been certied with the
PCB trace antenna and a Nearson half-wave dipole antenna (part number: S181AH-2450S) on a 4 inch cable using
the castellation pin of the module. Please refer to the document ZICM357SP2-1C External Antenna Implementation
for details describing the requirements that must be followed to take advantage of the CEL certication.
The PCB antenna employs a topology that is compact and highly efcient. To maximize range, an adequate
ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will
contribute signicantly to the antenna performance (it should not be directly under the module PCB Antenna).
The position of the module on the host board and overall design of the product enclosure contribute to antenna
performance. Poor design affects radiation patterns and can result in reection, diffraction and/or scattering of
the transmitted signal.
For optimum antenna performance, the MeshConnect Modules should be mounted with the PCB trace antenna
overhanging the edge of the host board. To further improve performance, a ground plane should be placed on
the host board under the module, up to the antenna (a minimum of 1.5" x 1.5" is recommended). The installation
of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under
this layer. CEL can provide assistance with your PCB layout.
The following are some design guidelines to help ensure antenna performance:
• Never place the ground plane or route copper traces directly underneath the antenna portion of the module
• Never place the antenna close to metallic objects
• In the overall design, ensure that wiring and other components are not placed near the antenna
• Do not place the antenna in a metallic or metalized plastic enclosure
• Keep plastic enclosures 1cm or more away from the antenna in any direction
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and
maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference
to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power
(e.i.r.p.) is not more than that necessary for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une
antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans
le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le
type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas
l'intensité nécessaire à l'établissement d'une communication satisfaisante.
POWER AMPLIFIER
CEL’s MeshConnect EM357 High Power Module (ZICM357SP2) includes a Power Amplier (PA). This PA
delivers high efciency, high gain, and high output power (Pout = +20.0dBm TYP) to provide an extended range
and reliable transmission for fewer nodes in a network. For the ZICM357SP2, Power Mode 2 with Power Setting
-2 is the maximum setting allowed for FCC compliance. Operating in Power Mode 3 at higher power settings may
damage the PA.
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
SOFTWARE/FIRMWARE
CEL’s MeshConnect EM357 Mini Modules are ideal platforms for EmberZNet PRO™, the industry’s most
deployed and eld proven ZigBee compliant stack supporting the ZigBee PRO feature Set. EmberNet PRO
is a complete ZigBee protocol software package containing all the elements required for mesh networking
applications. For more information regarding the software development for this IC, visit www.silabs.com.
CEL provides reference software that runs multiple functions and executes various commands. The rmware
allows the execution of IEEE 802.15.4 communication, validation and manufacturing tests. For example,
users can setup a simple ZigBee Point-to-Point network to perform Range and Packet Error Rate (PER) tests.
The software can also place the module in various operating modes, which allows for setting and/or testing
various parameters.
The ZICM357SP0 uses the transceiver's Primary RF ports for transmitting and should use Power Mode 1. The
ZICM357SP2 uses the transceiver's Alternate RF ports for transmitting and should use Power Mode 2.
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
ABSOLUTE MAXIMUM RATINGS
Description MeshConnect ZICM357SPx Module Unit
Min Max
Power Supply Voltage (VDD) -0.3 3.6 VDC
Voltage on any I/O Line -0.3 VDD + 0.3 VDC
RF Input Power ZICM357SP0
ZICM357SP2
–
–
+15
+5 dBm
Storage Temperature Range -40 125 °C
Reow Soldering Temperature –260 °C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description MeshConnect ZICM357SPx Module Unit
Min Typ Max
Power Supply Voltage (VDD)2.1 3.3 3.6 VDC
Input Frequency 2405 –2480 MHz
Ambient Temperature Range -40 25 85 °C
DC CHARACTERISTICS (@ 25⁰ C, VDD = 3.3V, ZICM357SP0 TX Power Mode 1, ZICM357SP2 TX Power Mode 2)
Description MeshConnect ZICM357SPx Module Unit
Min Typ Max
Transmit Mode Current @ 8dBm
ZICM357SP0
–44 – mA
Transmit Mode Current @ 0dBm – 31 – mA
Receive Mode Current – 30 – mA
Transmit Mode Current @ 20dBm
ZICM357SP2
–150 – mA
Transmit Mode Current @ 0dBm – 58 – mA
Receive Mode Current – 34 – mA
Sleep Mode Current – 1– µA
RF CHARACTERISTICS (@ 25⁰ C, VDD = 3.3V, ZICM357SP0 TX Power Mode 1, ZICM357SP2 TX Power Mode 2)
Description MeshConnect ZICM357SPx Module Unit
Min Typ Max
General Characteristics
RF Frequency Range 2405 –2480 MHz
RF Channels 11 –26 –
Frequency Error Tolerance -96.2 –96.2 kHz
Transmitter
Maximum Output Power
ZICM357SP0
– 8 – dBm
Minimum Output Power – -40 – dBm
Offset Error Vector Magnitude – 5 35 %
Maximum Output Power
(using Power Mode 2, Power Setting -2)
ZICM357SP2
– 20 21 dBm
Minimum Output Power – -40 – dBm
Offset Error Vector Magnitude – 5 35 %
Receiver
Sensitivity (1% PER, boost mode) ZICM357SP0 –-100 -94 dBm
Saturation (maximum input level) 0 – – dBm
Sensitivity (1% PER, normal mode) ZICM357SP2 –-103 -97 dBm
Saturation (maximum input level) -10 – – dBm
Note: For the ZICM357SP2 Module, Power Mode 2 with Power Setting -2 is the maximum setting allowed for FCC
Compliance. Operating in Power Mode 3 at higher power settings may damage the PA.
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
PIN SIGNALS I/O PORT CONFIGURATION
CEL’s MeshConnect Module has 33 edge I/O interfaces for connection to the user’s host board. The MeshConnect
Module Dimensions shows the layout of the 33 edge castellations.
MESHCONNECT I/O PIN ASSIGNMENTS
CEL MeshConnect
ZICM357SPx Module
Pin Number
Ember EM357
IC Pin Number Name Notes
1, 2, 12, 31, 33 49 GROUND
3 11 PC5
Digital I/O
TX_ACTIVE - Logic-level control for PA. The EM35x baseband controls TX_
ACTIVE and drives it high when in TX mode
Applies only to the ZICM357SP0. PC5 is a NC on the ZICM357SP2
4 12 RESET Acve Low chip reset (Input)
5 13 PC6
Digital I/O
OSC32B - 32.768 kHz crystal oscillator
nTX_ACTIVE - Inverted TX_ACTIVE signal
6 14 PC7
Digital I/O
OSC32A - 32.768 kHz crystal oscillator
OSC32_EXT - Digital 32.768 kHz clock input source
718 PA7
Digital I/O
TIM1C4 - Timer 1 Channel 4 input/output
REG_EN - External regulator open drain output
819 PB3
Digital I/O
TIM2C3 - Timer 2 Channel 3 input/output
SC1nCTS - UART CTS handshake of Serial Controller 1
SC1SCLK - SPI master/slave clock of Serial Controller 1
920 PB4
Digital I/O
TIM2C4 - Timer 2 Channel 4 input/output
SC1nRTS - UART RTS handshake of Serial Controller 1
SC1nSSEL - SPI slave select of Serial Controller 1
10 21 PA0
Digital I/O
TIM2C1 - Timer 2 Channel 1 input/output
SC2MOSI - SPI master data out/slave data in of Serial Controller 2
11 22 PA1
Digital I/O
TIM2C3 - Timer 2 Channel 3 input/output
SC2SDA - TWI data of Serial Controller 2
SC2MISO - SPI master data in/slave data out of Serial Controller 2
13 16, 23, 28, 37 VCC
14 24 PA2
Digital I/O
TIM2C4 - Timer 2 Channel 4 input/output
SC2SCL - TWI clock of Serial Controller 2
SC2SCLK - SPI master/slave clock of Serial Controller 2
15 25 PA3
Digital I/O
TIM2C2 - Timer 2 channel 2 input/output
SC2nSSEL - SPI slave select of Serial Controller 2
TRACECLK - Synchronous CPU trace clock
16 26 PA4
Digital I/O
ADC4 - ADC Input 4
PTI_EN - Frame signal of Packet Trace Interface (PTI)
TRACEDATA2 - Synchronous CPU trace data bit 2
17 27 PA5
Digital I/O
ADC5 - ADC Input 5
PTI_DATA - Data signal of Packet Trace Interface (PTI)
nBOOTMODE - Embedded serial bootloader acvaon out of reset
TRACEDATA3 - Synchronous CPU trace data bit 3
18 29 PA6 Digital I/O
TIM1C3 - Timer 1 channel 3 input/output
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
MESHCONNECT I/O PIN ASSIGNMENTS (Continued)
CEL MeshConnect
ZICM357SPx Module
Pin Number
Ember EM357
IC Pin Number Name Notes
19 30 PB1
Digital I/O
SC1MISO - SPI slave data out of Serial Controller 1
SC1MOSI - SPI master data out of Serial Controller 1
SC1SDA - TWI data of Serial Controller 1
SC1TXD - UART transmit data of Serial Controller 1
TIM2C1 - Timer 2 channel 1 input/output
20 31 PB2
Digital I/O
SC1MISO - SPI master data in of Serial Controller 1
SC1MOSI - SPI slave data in of Serial Controller 1
SC1SCL - TWI clock of Serial Controller 1
SC1RXD - UART receive data of Serial Controller 1
TIM2C2 - Timer 2 channel 2 input/output
21 32 JTCK JTAG clock input from debugger
SWCLK - Serial Wire clock input/output with debugger
22 33 PC2
Digital I/O
JTD0 - JTAG data out to debugger
SWO - Serial Wire Output asynchronous trace output to debugger
23 34 PC3 Digital I/O
JTDI - JTAG data in from debugger
24 35 PC4
Digital I/O
JTMS - JTAG mode select from debugger
SWDIO - Serial Wire bidireconal data to/from debugger
25 36 PB0
Digital I/O
VREF - ADC reference input/output
IRQA - External interrupt source A
TRACECLK - Synchronous CPU trace clock
TIM1CLK - Timer 1 external clock input
TIM2MSK - Timer 2 external clock mask input
26 38 PC1
Digital I/O
ADC3 - ADC Input 3
SWO - Serial Wire Output asynchronous trace output to debugger
TRACEDATA0 - Synchronous CPU trace data bit 0
27 40 PC0
Digital I/O
JRST - JTAG reset input from debugger
IRQD - Default external interrupt source D
TRACEDATA1 - Synchronous CPU trace data bit 1
28 41 PB7
Digital I/O
ADC2 - ADC Input 2
IRQC - Default external interrupt source C
TIM1C2 - Timer 1 channel 2 input/output
29 42 PB6
Digital I/O
ADC1 - ADC Input 1
IRQB - External interrupt source B
TIM1C1 - Timer 1 channel 1 input/output
30 43 PB5
Digital I/O
ADC0 - ADC Input 0
TIM2CLK - Timer 2 external clock input
TIM1MSK - Timer 1 external clock mask input
32 NC RF Out Castellaon Pin for external Antenna
Note: PC5 Applies only to the ZICM357SP0; PC5 is a NC on the ZICM357SP2.
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
MODULE DIMENSIONS
Note: All dimensions are +/- 0.005" (0.12mm) unless otherwise specied.
MeshConnect EM357 Mini Modules.
0.655” [16.63mm]
0.940” [23.87mm]
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
0.062” [1.57mm]
0.152” [3.86mm] MA
X
EM357
Series
ARM
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
EM357
Series
ARM
0000-00-00-00-000
EM300 Series Module
ZICM35xSPx
P
in 1
P
in 11 Pin 22
Pin 33
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
MODULE LAND FOOTPRINT
Note: Refer to the Antenna Section in this document for layout recommendations which will yield optimal antenna performance.
Dimensions are shown in inches, with millimeter conversions in brackets.
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
PROCESSING
Recommended Reow Prole
Parameter Values
Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max
Minimum Soak Temperature 150ºC
Maximum Soak Temperature 200ºC
Soak Time 60-120 sec
TLiquidus 217ºC
Time above TLiquidus 60-150 sec
Tpeak 250ºC
Time within 5º of Tpeak 20-30 sec
Time from 25º to Tpeak 8 min max
Ramp down rate 6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet the appropriate IPC
Specication. See the Castellated Terminations Section in the latest IPC-A-610 Acceptability of Electronic Assemblies document.
Cleaning
In general, cleaning the populated module is strongly discouraged. Residuals under the module cannot be easily
removed with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host
board and the module. The combination of soldering ux residuals and encapsulated water could lead to
short circuits between neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two
housings, which is not accessible for post-washing inspection. The solvent could also damage any
stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads
• Proper solder joints on all pads
• Excessive solder or contacts to neighboring pads or vias
Repeating Reow Soldering
Only a single reow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a
single wave soldering process is encouraged.
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711).
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be
programmable and the solder joint and module should not exceed the maximum peak reow temperature
of 250ºC.
Caution
If temperature ramps exceed the reow temperature prole, module and component damage may occur due to
thermal shock. Avoid overheating.
Warning
Never attempt a rework on the module itself (i.e., replacing individual components); such actions will terminate
warranty coverage.
Additional Grounding
Attempts to improve the module or the system grounding by soldering braids, wires or cables onto the module
RF shield cover is done at the customer's own risk. The ground pins at the module perimeter should be sufcient
for optimum immunity to external RF interference.
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
AGENCY CERTIFICATIONS
The following Part Numbers are Certied as shown below:
Part Number Certications Antenna
ZICM357SP0-1 FCC, IC, CE PCB
ZICM357SP2-1 FCC, IC PCB
ZICM357SP2-1C FCC, IC Nearson S181AH-2450S
FCC Compliance Statement Part 15.19, Section 7.15 of RSS-GEN
This device complies with Part 15 of the FCC Rules and with Industry Canada licence-exempt RSS Standards.
Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
Warning (Part 15.21)
Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment.
20cm Separation Distance
To comply with FCC /IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be
co-located or operated in conjunction with any other antenna or transmitter.
OEM Responsibility to the FCC and IC Rules and Regulations
The MeshConnect Mini Module has been certied per FCC Part 15 Rules and to Industry Canada license-
exempt RSS Standards for integration into products without further testing or certication. To fulll the FCC and
IC Certication requirements, the OEM of the MeshConnect Module must ensure that the information provided
on the MeshConnect label is placed on the outside of the nal product. The MeshConnect Mini Module is labeled
with its own FCC ID Number and IC ID Number. If the FCC ID and the IC ID are not visible when the module is
installed inside another device, then the outside of the device into which the module is installed must also display
a label referring to the enclosed module. The exterior label can use wording such as the following:
“Contains Transmitter Module FCC ID: W7Z-ZICM357SP0” or “Contains FCC ID: W7Z-ZICM357SP0”
“Contains Transmitter Module IC: 8254A-ZICM357SP0" or "Contains IC: 8254A-ZICM357SP0”
or
“Contains Transmitter Module FCC ID: W7Z-ZICM357SP2” or “Contains FCC ID: W7Z-ZICM357SP2”
“Contains Transmitter Module IC: 8254A-ZICM357SP2" or "Contains IC: 8254A-ZICM357SP2”
The OEM of the MeshConnect Mini Module may only use the approved antennas (PCB Trace Antenna and
external antenna (part number: S181AH-2450S)) that have been certied with this module. The OEM of the
MeshConnect Mini Module must test their nal product conguration to comply with Unintentional Radiator Limits
before declaring FCC Compliance per Part 15 of the FCC Rules.
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
IC Certication — Industry Canada Statement
The term "IC" before the certication/registration number only signies that the Industry Canada technical
specications were met.
Certication IC — Déclaration d'Industrie Canada
Le terme "IC" devant le numéro de certication/d'enregistrement signie seulement que les spécications techniques
Industrie Canada ont été respectées.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit
RF eld in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from
Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php
L'article 14 du CNR-210
Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou
orientée de telle sorte qu'il ne pas émettre de champ RF au-delà des limites de Santé Canada pour
la population générale. Consulter le Code de sécurité 6, disponible sur le site Web de Santé Canada:
http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php
CE Certication — Europe
The MeshConnect ZICM35xSP0 Module has been tested and certied for use in the European Union.
OEM Responsibility to the European Union Compliance Rules
If the MeshConnect Module is to be incorporated into a product, the OEM must verify compliance of the nal
product to the European Harmonized EMC and Low-Voltage/Safety Standards. A Declaration of Conformity must
be issued for each of these standards and kept on le as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required to
make a submission to the notied body for compliance testing.
OEM Labeling Requirements
The CE mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials
CE with the following form:
· If the CE marking is reduced or enlarged, the proportions given in the CE
graduated drawing (to the right) must be adhered to
· The CE mark must be a minimum of 5mm in height
· If the use of the module is subject to restrictions in the end application, the CE
marking on the OEM product should also include the alert sign as shown in the
image to the right
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
Software Compliance
The MeshConnect Mini Modules require software restrictions to meet agency certication requirements.
These restrictions have been implemented in the sample application included with the Software Development Kit.
If a customer is not starting with the CEL Software Development Kit, they must implement the following output
power restrictions to use the FCC, IC or CE Certications:
Certication RF Channel Valid TX
Power Steps
Typical Max
Output Power
ZICM357SP0-1 FCC/IC 11 - 25 -43 to 8 8dBm
26 -43 to 0 1 dBm
ETSI 11 - 26 -43 to 8 8 dBm
ZICM357SP2-1 FCC/IC
11 - 24 -43 to -2 20dBm
25 -43 to -6 17dBm
26 -43 to -26 -3dBm
ZICM357SP2-1C FCC/IC
11 - 24 -43 to -2 20dBm
25 -43 to -12 9dBm
26 -43 to -38 -5dBm
Note: The ZICM357SP2, Power Mode 2 with Power Setting -2 is the maximum setting allowed for FCC Compliance.
Operating in Power Mode 3 at higher power settings may damage the PA.
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
Shipment
The MeshConnect Modules have two delivery options (see Ordering Information on page 3):
1. Trays (in bundles) of 330 units. Each tray contains 66 units
2. Tape and Reel for easy assembly in a manufacturing environment. The reel diameter is 12.992
inches (330mm) and contains 600 modules
Tape and Reel Dimensions
Measurements are in inches [mm]
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
Warning
The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection
may destroy or damage the module permanently.
Warning
The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions
are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at < 40°C and < 90% relative humidity.
QUALITY
CEL Modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with
the IPC-A-610 specication, Class II. Our modules go through JESD22 qualication processes which include
high temperature operating life tests, mechanical shock, temperature cycling, humidity and reow testing. CEL
conducts RF and DC factory testing on 100% of all production parts.
CEL builds the quality into our products, giving our customers condence when integrating our products into
their systems.
SHIPMENT, HANDLING AND STORAGE
0.079±0.004 [2.00±0.10]
0.071±0.004 [1.75±0.10]
0.795±0.006 [20.20±0.15]
1.732±0.011 [44.00±0.30]
0.014±0.002 [0.35±0.05]
0.957±0.004 [24.30±0.10]
0.169±0.004 [4.30±0.10] 0.945±0.004 [24.00±0.10]
0.669±0.004 [17.00±0.10]
SECTION A-A
A
A
0.157 [4.00] PITCH
SECTION B-B
B B
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
REFERENCES
Reference Documents Download
120-035X-000 - Silicon Labs/Ember EM35x SoC Datasheet Link
0011-02-17-00-000 - CEL EM35x Ember Mini Module Companion Kit Technical User Guide Link
0011-00-16-11-000 - CEL ZICM357SP2-1C External Antenna Implementation Link
REVISION HISTORY
Previous Versions Changes to Current Version Page(s)
0011-00-07-00-000
March 29, 2012 Initial preliminary datasheet N/A
0011-00-07-00-000
(Issue A) April 11, 2012 Added FCC certication and shipping information; edited "Features" Section 1, 13
0011-00-07-00-000
(Issue B) May 4, 2012 Updated Min/Multiple values 1, 13
0011-00-07-00-000
(Issue C) June 22, 2012 Updated Software Compliance table 13
0011-00-07-00-000
(Issue D) July 31, 2012 Updated land pattern; added note about operating in Boost Mode on SP2 9
0011-00-07-00-000
(Issue E) February 28, 2013 Removed "Preliminary" from rst page 1
0011-00-07-00-000
(Issue F) July 19, 2013 Updated Antenna Section, Software Compliance Section, Shipment Section 4, 13, 14
0011-00-07-00-000
(Issue G) July 31, 2013 Updated Formatting All
0011-00-07-00-000
(Issue H) October 18, 2013 Updated Photo; updated Tape and Reel Packaging MOQ 1, 3, 16
EM357 Mini Modules
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Document No: 0011-00-07-00-000 (Issue H)
The information in this document is current as of the published date. The information is subject to change without notice. For actual
design-in, refer to the latest publications of CEL Data Sheets or Data Books, etc., for the most up-to-date specications of CEL
products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and
additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL.
CEL assumes no responsibility for any errors that may appear in this document.
CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising
from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express,
implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor
product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s
equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the
possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons
arising from defects in CEL products, customers must incorporate sufcient safety measures in their design, such as redundancy, re-
containment and anti-failure features.
Disclaimer
For More Information
For more information about CEL MeshConnect products and solutions, visit our website at:
www.cel.com/MeshConnect.
Technical Assistance
For Technical Assistance, visit www.cel.com/MeshConnectHelp.
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
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ZICM357SP0-1-R ZICM357SP2-1C-R