TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Ultrafast Operation . . . 7.6 ns (Typ)
D
Low Positive Supply Current
10.6 mA (Typ)
D
Operates From a Single 5-V Supply or From
a Split ±5-V Supply
D
Complementary Outputs
D
Low Offset Voltage
D
No Minimum Slew Rate Requirement
D
Output Latch Capability
D
Functional Replacement to the LT1016
description
The TL3016 is an ultrafast comparator designed
to interface directly to TTL logic while operating
from either a single 5-V power supply or dual
±5-V supplies. It features extremely tight offset
voltage and high gain for precision applications. It
has complementary outputs that can be latched
using the LATCH ENABLE terminal. Figure 1
shows the positive supply current of this
comparator. The TL3016 only requires 10.6 mA
(typical) to achieve a propagation delay of 7.6 ns.
The TL3016 is a pin-for-pin functional replace-
ment for the LT1016 comparator, offering higher
speed operation but consuming half the power.
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TASMALL
OUTLINE†
(D)
TSSOP
(PW)
CHIP
FORM‡
(Y)
0°C to 70°C TL3016CD TL3016CPWLE TL3016Y
–40°C to 85°C TL3016ID TL3016IPWLE —
†The PW packages are available left-ended taped and reeled only.
‡Chip forms are tested at TA = 25°C only.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
8
7
6
5
VCC+
IN+
IN–
VCC–
Q OUT
Q OUT
GND
LATCH ENABLE
D AND PW PACKAGE
(TOP VIEW)
Figure 1
– 50 – 25 0 25 50 75 100 125
9
7
6
13
14
POSITIVE SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
15
12
11
8
5
10
– Positive Supply Current – mA
ICC
TA – Free-Air Temperature – °C
symbol (each comparator)
IN+
IN– Q OUT
Q OUT
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 2000, Texas Instruments Incorporated
TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL3016Y chip information
This chip displays characteristics similar to the TL3016C. Thermal compression or ultrasonic bonding may be
used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon
preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJ max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
TERMINALS 1 AND 6 CAN BE
CONNECTED TO MULTIPLE PADS.
Q OUT
IN–
IN+
LATCH ENABLE
Q OUT
(5)
(2)
(3)
(1)
(6)
VCC+
GND
(7)
(8)
+
–
55
63
VCC–
(4)
(1)
(4)
(3)
(2)
(5)
(1) (1) (8)
(7)
(6)
(6)
(6)
COMPONENT COUNT
Bipolars 53
MOSFETs 49
Resistors 46
Capacitors 14
TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) – 7 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (LATCH ENABLE) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, IO ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA –40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg – 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to network ground.
2. Differential voltages are at IN+ with respect to IN–.
DISSIPATION RATING TABLE
PACKAGE TA ≤ 25°C
POWER RATING DERATING FACTOR
ABOVE TA = 25°CTA = 70°C
POWER RATING
D725 mW 5.8 mW/°C464 mW
PW 525 mW 4.2 mW/°C336 mW
TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified operating free-air temperature, VDD = ±5 V, VLE = 0 (unless
otherwise noted)
PARAMETER
TEST CONDITIONS†
TL3016C TL3016I
UNIT
PARAMETER
TEST
CONDITIONS†
MIN TYP‡MAX MIN TYP‡MAX
UNIT
VIO
In
p
ut offset voltage
TA = 25°C 0.5 3 0.5 3
mV
V
IO
Inp
u
t
offset
v
oltage
TA = full range 3.5 3.5
mV
αVIO Temperature coefficient of
input offset voltage –4.8 –4.5 µV/°C
IIO
In
p
ut offset current
TA = 25°C 0.1 0.6 0.1 0.6
µA
I
IO
Inp
u
t
offset
c
u
rrent
TA = full range 0.9 1.3 µ
A
IIB
In
p
ut bias current
TA = 25°C 6 10 6 10
µA
I
IB
Inp
u
t
bias
c
u
rrent
TA = full range 10 10 µ
A
VICR
Common-mode input VDD = ±5 V –3.75 3.5 –3.75 3.5
V
V
ICR voltage range VDD = 5 V 1.25 3.5 1.25 3.5
V
CMRR Common-mode rejection
ratio –3.75 ≤ VIC ≤ 3.5 V, TA = 25°C 80 97 80 97 dB
kSVR
Suppl
y
-volta
g
e rejection Positive supply: 4.6 V ≤ +VDD ≤ 5.4 V,
TA = 25°C60 72 60 72
dB
k
SVR
ygj
ratio Negative supply: –7 V ≤ –VDD ≤ –2 V,
TA = 25°C80 100 80 100
dB
VOL
Low level out
p
ut voltage
I(sink) = 4 mA,
TA = 25°CV+ ≤ 4.6 V, 500 600 500 600
mV
V
OL
Lo
w-
le
v
el
o
u
tp
u
t
v
oltage
I(sink) = 10 mA,
TA = 25°CV+ ≤ 4.6 V, 750 750
mV
VOH
High level out
p
ut voltage
V+ ≤ 4.6 V,
TA = 25°CIO = 1 mA, 3.6 3.9 3.6 3.9
V
V
OH
High
-
le
v
el
o
u
tp
u
t
v
oltage
V+ ≤ 4.6 V,
TA = 25°CIO = 10 mA, 3.4 3.7 3.4 3.7
V
IDD
Positive supply current
TA= full range
10.6 12.5 10.6 12.5
mA
I
DD Negative supply current
T
A =
f
u
ll
range
–1.8 –1.3 –2.4 –1.3
mA
VIL Low-level input voltage
(LATCH ENABLE) 0.8 0.8 V
VIH High-level input voltage
(LATCH ENABLE) 2 2 V
IIL
Low-level input current VLE = 0 0 1 0 1
µA
IIL
(LATCH ENABLE) VLE = 2 V 24 39 24 45
µA
†Full range for the TL3016C is TA = 0°C to 70°C. Full range for the TL3016I is TA = –40°C to 85°C.
‡All typical values are measures with TA = 25°C.
TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics, VDD = ±5 V, VLE = 0 (unless otherwise noted)
PARAMETER
TL3016C TL3016I
UNIT
PARAMETER
MIN TYP MAX MIN TYP MAX
UNIT
‡
∆V
I
= 100 mV, TA = 25°C 7.8 10 7.8 10
td1
Propagation dela time‡
I,
VOD = 5 mV TA = full range 7.8 11.2 7.8 12.2
ns
t
pd1
P
ropagat
i
on
d
e
l
ay t
i
me
‡
∆V
I
= 100 mV, TA = 25°C 7.6 10 7.6 10
ns
I,
VOD = 20 mV TA = full range 7.6 11.2 7.6 12.2
tsk(p) Pulse skew (|tpd+ – tpd–|) ∆VI = 100 mV,
TA = 25°CVOD = 5 mV, 0.5 0.5 ns
tsu Setup time, LATCH ENABLE 2.5 2.5 ns
†Full range for the TL3016C is 0°C to 70°C. Full range for the TL3016I is –40°C to 85°C.
‡tpd1 cannot be measured in automatic handling equipment with low values of overdrive. The TL3016 is 100% tested with a 1-V step and 500-mV
overdrive at T A = 25°C only . Correlation tests have shown that tpd1 limits given can be ensured with this test, if additional dc tests are performed
to ensure that all internal bias conditions are correct. For low overdrive conditions, VOS is added to the overdrive.
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
vs Input voltage 2
ICC Positive supply current vs Frequency 3
vs Free-air temperature 4
ICC Negative supply current vs Free-air temperature 5
vs Overdrive voltage 6
vs Supply voltage 7
tpd Propagation delay time vs Input impedance 8
vs Load capacitance 9
vs Free-air temperature 10
VIC Common-mode input voltage vs Free-air temperature 11
Input threshold voltage (LATCH ENABLE) vs Free-air temperature 12
VO
Out
p
ut voltage
vs Output source current 13
V
O
O
u
tp
u
t
v
oltage
vs Output sink current 14
IIInput current (LATCH ENABLE) vs Input voltage 15
TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 2
POSITIVE SUPPLY CURRENT
vs
INPUT VOLTAGE
– Positive Supply Current – mA
ICC
20
18
16
14
12
10
8
6
4
2
012345678
TA = –40°C
TA = 85°C
TA = 25°C
VI – Input Voltage – V
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
VCC = ±5 V
TA = 25°C
Figure 3
18
16
12
10
8
22
14
– Positive Supply Current – mA
20
f – Frequency – MHz
POSITIVE SUPPLY CURRENT
vs
FREQUENCY
010
1102
ICC
TA = –40°C
TA = 85°C
TA = 25°C
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
TA = 25°C
Figure 4
– 50 – 25 0 25 50 75 100 125
9
7
6
13
14
POSITIVE SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
15
12
11
8
5
10
– Positive Supply Current – mA
ICC
TA – Free-Air Temperature – °C
ÎÎÎÎÎ
VCC = ±5 V
Figure 5
– 1.5
– 2.5
– 3
– 50 – 25 0 25 50
– 1
NEGATIVE SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
0
75 100 125
– 0.5
– 2
– Negative Supply Current – mA
ICC
TA – Free-Air Temperature – °C
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 6
4
3
1
00102030
– Propagation Delay Time – ns
6
7
Overdrive Voltage – mV
PROPAGATION DELAY TIME
vs
OVERDRIVE VOLTAGE
8
40 50
5
2
tpd
9
10
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
TA = 25°C
Figure 7
Falling Edge
Rising Edge
6
4
04.4 4.6 4.8 5
8
10
PROPAGATION DELAY TIME
vs
SUPPLY VOLTAGE
12
5.2 5.4 5.6
– Propagation Delay Time – nstpd
VCC – Supply Voltage – V
2
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
TA = 25°C
Figure 8
5 mV
20 mV
10
6
4
00 50 100 150
14
18
PROPAGATION DELAY TIME
vs
INPUT IMPEDANCE
20
200 250 300
16
12
8
2
– Propagation Delay Time – nstpd
ZO – Input Impedance – Ω
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
TA = 25°C
Figure 9
tPDHL tPDLH
CL – Load Capacitance – pF
5
4
2
0010 2030
7
9
PROPAGATION DELAY TIME
vs
LOAD CAPACITANCE
10
40 50
8
6
3
1
– Propagation Delay Time – nstpd
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
TA = 25°C
TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 10
TA – Free-Air Temperature – °C
Rising Edge
Falling Edge
10
5
0
– 50 – 25 0 25 50
– Propagation Delay Time – ns
15
20
PROPAGATION DELAY TIME
vs
FREE-AIR TEMPERATURE
25
75 100 125
tpd
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
Figure 11
0
–2
–4
–6
– 50 – 25 0 25 50
– Common-Mode Input Voltage – V
2
4
COMMON-MODE INPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
6
75 100 125
TA – Free-Air Temperature – °C
VIC
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = 5 V (Upper Limit)
VCC = ±5 V (Upper Limit)
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = 5 V (Lower Limit)
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = ±5 V (Lower Limit)
Figure 12
TA – Free-Air Temperature – °C
1
0.6
0.4
0
–50 –25 0 25 50
1.6
1.8
2
75 100 125 150
1.4
1.2
0.8
0.2
ÎÎÎÎ
VCC = ±5 V
INPUT THRESHOLD VOLTAGE (LATCH ENABLE)
vs
FREE-AIR TEMPERATURE
– Input Threshold Voltage (LATCH ENABLE) – V
VIT
Figure 13
3.8
0510
4.6
4.8
5
15 20
– Output Voltage – V
OUTPUT VOLTAGE
vs
OUTPUT SOURCE CURRENT
VO
IO(source) – Output Source Current – mA
TA = –40°C
TA = 85°CTA = 25°C
4.4
4.2
4
3.6
3.4
3.2
3
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
TA = 25°C
TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 14
TA = –40°CTA = 25°C
TA = 85°C
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
TA = 25°C
1
0.6
0.4
00510
– Output Voltage – V
1.4
1.6
OUTPUT VOLTAGE
vs
OUTPUT SINK CURRENT
2
15 20
1.8
1.2
0.8
0.2
VO
IO(sink) – Output Sink Current – mA Figure 15
5
– 5
– 10
– 20
– 0.5 0 0.5 1
15
25
INPUT CURRENT (LATCH ENABLE)
vs
INPUT VOLTAGE
30
1.5 2
20
10
0
– 15
VI – Input Voltage – V
– Input Current (LATCH ENABLE) –IIAµ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = ±5 V
TA = 25°C
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TL3016CD ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016CDG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016CDR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016CPW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016CPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016CPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TL3016CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016CPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016ID ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016IDG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016IDR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016IPW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TL3016IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL3016IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
PACKAGE OPTION ADDENDUM
www.ti.com 23-Apr-2010
Addendum-Page 1
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 23-Apr-2010
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TL3016CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL3016CPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TL3016IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL3016IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Aug-2010
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TL3016CDR SOIC D 8 2500 346.0 346.0 29.0
TL3016CPWR TSSOP PW 8 2000 346.0 346.0 29.0
TL3016IDR SOIC D 8 2500 346.0 346.0 29.0
TL3016IPWR TSSOP PW 8 2000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Aug-2010
Pack Materials-Page 2
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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