SN54ALS174, SN54ALS175, SN54AS174, SN54AS175B
SN74ALS174, SN74ALS175, SN74AS174, SN74AS175B
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDAS207E - APRIL 1982 - REVISED MAY 2002
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
’ALS174 and ’AS174 Contain Six Flip-Flops
With Single-Rail Outputs
D
’ALS175 and ’AS175B Contain Four
Flip-Flops With Double-Rail Outputs
D
Buffered Clock and Direct-Clear Inputs
D
Applications Include:
– Buffer/Storage Registers
– Shift Registers
– Pattern Generators
D
Fully Buffered Outputs for Maximum
Isolation From External Disturbances
(’AS Only)
SN54ALS175 ...J OR W PACKAGE
SN54AS175B ...J PACKAGE
SN74ALS175, SN74AS175B . . . D, N, OR NS PACKAGE
(TOP VIEW)
SN54ALS174 ...J OR W PACKAGE
SN54AS174 ...J PACKAGE
SN74ALS174, SN74AS174 ...D , N, OR NS PACKAGE
(TOP VIEW)
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
6D
5D
NC
5Q
4D
1D
2D
NC
2Q
3D
SN54ALS174, SN54AS174 . . . FK PACKAGE
(TOP VIEW)
1Q
CLR
NC
CLK
4Q 6Q
3Q
GND
NC
NC – No internal connection
VCC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CLR
1Q
1D
2D
2Q
3D
3Q
GND
VCC
6Q
6D
5D
5Q
4D
4Q
CLK
3212019
910111213
4
5
6
7
8
18
17
16
15
14
4Q
4D
NC
3D
3Q
1Q
1D
NC
2D
2Q
SN54ALS175 . . . FK PACKAGE
(TOP VIEW)
1Q
CLR
NC
CLK
3Q 4Q
2Q
GND
NC VCC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CLR
1Q
1Q
1D
2D
2Q
2Q
GND
VCC
4Q
4Q
4D
3D
3Q
3Q
CLK
description
These positive-edge-triggered flip-flops utilize TTL circuitry to implement D-type flip-flop logic. All have a
direct-clear (CLR) input. The ’ALS175 and ’AS175B feature complementary outputs from each flip-flop.
Information at the data (D) inputs meeting the setup-time requirements is transferred to the outputs on the
positive-going edge of the clock pulse. Clock triggering occurs at a particular voltage level and is not directly
related to the transition time of the positive-going pulse. When the clock (CLK) input is at either the high or low
level, the D-input signal has no effect at the output.
These circuits are fully compatible for use with most TTL circuits.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54ALS174, SN54ALS175, SN54AS174, SN54AS175B
SN74ALS174, SN74ALS175, SN74AS174, SN74AS175B
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDAS207E - APRIL 1982 - REVISED MAY 2002
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
SN74ALS174N SN74ALS174N
PDIP N
Tube
SN74AS174N SN74AS174N
PDIP
–
N
Tube
SN74ALS175N SN74ALS175N
SN74AS175BN SN74AS175BN
Tube SN74ALS174D
ALS174
Tape and reel SN74ALS174DR
ALS174
Tube SN74AS174D
AS174
0
°
Cto70
°
C
SOIC D
Tape and reel SN74AS174DR
AS174
0°C
to
70°C
SOIC
–
D
Tube SN74ALS175D
ALS175
Tape and reel SN74ALS175DR
ALS175
Tube SN74AS175BD
AS175B
Tape and reel SN74AS175BDR
AS175B
SN74ALS174NSR ALS174
SOP NS
Ta
p
e and reel
SN74AS174NSR 74AS174
SOP
–
NS
Tape
and
reel
SN74ALS175NSR ALS175
SN74AS175BNSR 74AS175B
SNJ54ALS174J SNJ54ALS174J
CDIP J
Tube
SNJ54AS174J SNJ54AS174J
CDIP
–
J
Tube
SNJ54ALS175J SNJ54ALS175J
SNJ54AS175BJ SNJ54AS175BJ
–55°C to 125°C
CFP W
Tube
SNJ54ALS174W SNJ54ALS174W
CFP
–
W
Tube
SNJ54ALS175W SNJ54ALS175W
SNJ54ALS174FK SNJ54ALS174FK
LCCC – FK Tube SNJ54AS174FK‡SNJ54AS174FK
SNJ54ALS175FK SNJ54ALS175FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
‡This orderable is not recommended for new designs.
FUNCTION TABLE
(each flip-flop)
INPUTS OUTPUTS
CLR CLK D Q Q§
L X X L H
H↑HHL
H↑LLH
H L X Q0Q0
§’ALS175 and ’AS175B only
SN54ALS174, SN54ALS175, SN54AS174, SN54AS175B
SN74ALS174, SN74ALS175, SN74AS174, SN74AS175B
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDAS207E - APRIL 1982 - REVISED MAY 2002
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagrams (positive logic)
1D
C1
R
To Five Other Channels
1
9
3
2
CLR
CLK
1D
1Q 1Q
1
9
C1
1D
CLK
CLR
1D
R1Q
To Three Other Channels
42
3
’ALS174, ’AS174 ’ALS175, ’AS175B
Pin numbers shown are for the D, J, N, NS, and W packages.
absolute maximum ratings over operating free-air temperature range, SN54/74ALS174,
SN54/74ALS175 (unless otherwise noted)†
Supply voltage, VCC 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 1): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
SN54ALS174
SN54ALS175 SN74ALS174
SN74ALS175 UNIT
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
IOH High-level output current –0.4 –0.4 mA
IOL Low-level output current 4 8 mA
TAOperating free-air temperature –55 125 0 70 °C
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN54ALS174, SN54ALS175, SN54AS174, SN54AS175B
SN74ALS174, SN74ALS175, SN74AS174, SN74AS175B
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDAS207E - APRIL 1982 - REVISED MAY 2002
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS SN54ALS174
SN54ALS175 SN74ALS174
SN74ALS175 UNIT
MIN TYP†MAX MIN TYP†MAX
VIK VCC = 4.5 V, II = –18 mA –1.5 –1.5 V
VOH VCC = 4.5 V to 5.5 V, IOH = –0.4 mA VCC–2 VCC–2 V
VOL
VCC =45V
IOL = 4 mA 0.25 0.4 0.25 0.4
V
V
OL
V
CC =
4
.
5
V
IOL = 8 mA 0.35 0.5
V
IIVCC = 5.5 V, VI = 7 V 0.1 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA
IIL
All others
VCC =55V
VI=04V
–0.1 –0.1
mA
I
IL CLK
V
CC =
5
.
5
V
,
V
I =
0
.
4
V
–0.15
mA
IO‡VCC = 5.5 V, VO = 2.25 V –20 –112 –30 –112 mA
ICC
’ALS174
VCC =55V
See Note 3
11 19 11 19
mA
I
CC ’ALS175
V
CC =
5
.
5
V
,
See
Note
3
8 14 9 14
mA
†All typical values are at VCC = 5 V, TA = 25°C.
‡The output conditions have been chosen to produce a current that closely approximates one-half of the true short-circuit output current, IOS.
NOTE 3: ICC is measured with D inputs and CLR grounded, and CLK at 4.5 V.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
SN54ALS174
SN54ALS175 SN74ALS174
SN74ALS175 UNIT
MIN MAX MIN MAX
fclock Clock frequency 40 50 MHz
CLR low 15 10
twPulse duration CLK high 12.5 10 ns
CLK low 12.5 10
t
Set p time before CLK↑
Data 15 10
ns
t
su
S
e
t
up
ti
me
b
e
f
ore
CLK↑
CLR inactive 8 6
ns
thHold time, data after CLK↑0 0 ns
switching characteristics (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 Ω,
TA = MIN to MAX§
UNIT
(INPUT) (OUTPUT) SN54ALS174
SN54ALS175 SN74ALS174
SN74ALS175
UNIT
MIN MAX MIN MAX
fmax 40 50 MHz
tPLH
CLR
An
y
Q 3 20 5 18
ns
tPHL
CLR
y
(or Q, ’ALS175) 5 30 8 23
ns
tPLH
CLK
Any Q 3 20 3 15
ns
tPHL
CLK
y
(or Q, ’ALS175) 5 24 5 17
ns
§For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
SN54ALS174, SN54ALS175, SN54AS174, SN54AS175B
SN74ALS174, SN74ALS175, SN74AS174, SN74AS175B
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDAS207E - APRIL 1982 - REVISED MAY 2002
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range, SN54/74AS174,
SN54/74AS175B (unless otherwise noted)†
Supply voltage, VCC 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 1): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
SN54AS174
SN54AS175B SN74AS174
SN74AS175B UNIT
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
IOH High-level output current –2–2 mA
IOL Low-level output current 20 20 mA
TAOperating free-air temperature –55 125 0 70 °C
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS SN54AS174
SN54AS175B SN74AS174
SN74AS175B UNIT
MIN TYP‡MAX MIN TYP‡MAX
VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 V
VOH VCC = 4.5 V to 5.5 V, IOH = –2 mA VCC–2 VCC–2 V
VOL VCC = 4.5 V, IOL = 20 mA 0.35 0.5 0.35 0.5 V
IIVCC = 5.5 V, VI = 7 V 0.1 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA
IIL VCC = 5.5 V, VI = 0.4 V –0.5 –0.5 mA
IO§VCC = 5.5 V, VO = 2.25 V –30 –112 –30 –112 mA
ICC
’AS174
VCC =55V
See Note 4
30 45 30 45
mA
I
CC ’AS175B
V
CC =
5
.
5
V
,
See
Note
4
22.5 34 22.5 34
mA
‡All typical values are at VCC = 5 V, TA = 25°C.
§The output conditions have been chosen to produce a current that closely approximates one-half of the true short-circuit output current, IOS.
NOTE 4: ICC is measured with D inputs, CLR, and CLK grounded.
SN54ALS174, SN54ALS175, SN54AS174, SN54AS175B
SN74ALS174, SN74ALS175, SN74AS174, SN74AS175B
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDAS207E - APRIL 1982 - REVISED MAY 2002
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
SN54AS174
SN54AS175B SN74AS174
SN74AS175B UNIT
MIN MAX MIN MAX
fclock*Clock frequency 100 100 MHz
CLR low 5.5 5
t
*
Pulse duration
CLK high 4 4
ns
t
w
*
Pulse
duration
CLK low ’AS174 6 6
ns
CLK low ’AS175B 5 5
↑
Data
’AS174 4 4
tsu*Setup time before CLK
↑
Data
’AS175B 3 3 ns
CLR inactive 6 6
th*Hold time, data after CLK↑1 1 ns
* On products compliant to MIL-STD-883, Class B, this parameter is based on characterization data, but is not production tested.
switching characteristics (see Figure 1)
PARAMETER FROM
(
INPUT
)
TO
(
OUTPUT
)
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 Ω,
TA = MIN to MAX†UNIT
(INPUT)
(OUTPUT)
SN54AS174 SN74AS174
MIN MAX MIN MAX
fmax* 100 100 MHz
tPHL CLR Any Q 5 15 5 14 ns
tPLH
CLK
Any Q
3.5 9.5 3.5 8
ns
tPHL
CLK
Any
Q
4.5 11.5 4.5 10
ns
* On products compliant to MIL-STD-883, Class B, this parameter is based on characterization data, but is not production tested.
†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
switching characteristics (see Figure 1)
PARAMETER FROM
(
INPUT
)
TO
(
OUTPUT
)
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 Ω,
TA = MIN to MAX†UNIT
(INPUT)
(OUTPUT)
SN54AS175B SN74AS175B
MIN MAX MIN MAX
fmax* 100 100 MHz
tPLH
CLR
AQQ
4 10 4 9
ns
tPHL
CLR
A
ny
Q
or
Q
4.5 15 4.5 13
ns
tPLH
CLK
AnyQorQ
3 8.5 3 7.5
ns
tPHL
CLK
A
ny
Q
or
Q
311 3 10
ns
* On products compliant to MIL-STD-883, Class B, this parameter is based on characterization data, but is not production tested.
†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
SN54ALS174, SN54ALS175, SN54AS174, SN54AS175B
SN74ALS174, SN74ALS175, SN74AS174, SN74AS175B
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDAS207E - APRIL 1982 - REVISED MAY 2002
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
SERIES 54ALS/74ALS AND 54AS/74AS DEVICES
tPHZ
tPLZ
tPHL tPLH
0.3 V
tPZL
tPZH
tPLH tPHL
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
From Output
Under Test Test
Point
R1
S1
CL
(see Note A)
7 V
1.3 V
1.3 V1.3 V
3.5 V
3.5 V
0.3 V
0.3 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Timing
Input
Data
Input
1.3 V 1.3 V 3.5 V
3.5 V
0.3 V
0.3 V
High-Level
Pulse
Low-Level
Pulse
tw
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
Out-of-Phase
Output
(see Note C)
1.3 V 1.3 V
1.3 V1.3 V
1.3 V 1.3 V
1.3 V1.3 V
1.3 V
1.3 V
3.5 V
3.5 V
0.3 V
0.3 V
VOL
VOH
VOH
VOL
Output
Control
(low-level
enabling)
W aveform 1
S1 Closed
(see Note B)
W aveform 2
S1 Open
(see Note B) ≈0 V
VOH
VOL
≈3.5 V
In-Phase
Output
0.3 V
1.3 V 1.3 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
R2
VCC
RL
Test
Point
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT FOR
BI-STATE
TOTEM-POLE OUTPUTS
From Output
Under Test Test
Point
CL
(see Note A) RL
RL = R1 = R2
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9553701Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9553701Q2A
SNJ54AS
175BFK
5962-9553701QEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9553701QE
A
SNJ54AS175BJ
83019012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 83019012A
SNJ54ALS
174FK
8301901EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8301901EA
SNJ54ALS174J
8301901FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8301901FA
SNJ54ALS174W
83019022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 83019022A
SNJ54ALS
175FK
8301902EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8301902EA
SNJ54ALS175J
8301902FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8301902FA
SNJ54ALS175W
JM38510/37201B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
37201B2A
JM38510/37201BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
37201BEA
JM38510/37202B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
37202B2A
JM38510/37202BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
37202BEA
M38510/37201B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
37201B2A
M38510/37201BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
37201BEA
M38510/37202B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
37202B2A
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
M38510/37202BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
37202BEA
SN54ALS174J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54ALS174J
SN54ALS175J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54ALS175J
SN74ALS174D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS174
SN74ALS174DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS174
SN74ALS174DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS174
SN74ALS174DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS174
SN74ALS174DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS174
SN74ALS174DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS174
SN74ALS174N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS174N
SN74ALS174N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70
SN74ALS174NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS174N
SN74ALS174NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS174
SN74ALS174NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS174
SN74ALS174NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS174
SN74ALS175D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS175
SN74ALS175DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS175
SN74ALS175DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS175
SN74ALS175DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS175
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74ALS175DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS175
SN74ALS175DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS175
SN74ALS175N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS175N
SN74ALS175NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS175N
SN74ALS175NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS175
SN74ALS175NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS175
SN74ALS175NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS175
SN74AS174D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 AS174
SN74AS174DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 AS174
SN74AS174DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 AS174
SN74AS174N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74AS174N
SN74AS174NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74AS174N
SN74AS174NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74AS174
SN74AS174NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74AS174
SN74AS174NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74AS174
SN74AS175BD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AS175B
SN74AS175BDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AS175B
SN74AS175BDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AS175B
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74AS175BN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74AS175BN
SN74AS175BNE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74AS175BN
SN74AS175BNSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74AS175B
SN74AS175BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74AS175B
SN74AS175BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74AS175B
SNJ54ALS174FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 83019012A
SNJ54ALS
174FK
SNJ54ALS174J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8301901EA
SNJ54ALS174J
SNJ54ALS174W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8301901FA
SNJ54ALS174W
SNJ54ALS175FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 83019022A
SNJ54ALS
175FK
SNJ54ALS175J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8301902EA
SNJ54ALS175J
SNJ54ALS175W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8301902FA
SNJ54ALS175W
SNJ54AS174FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54AS
174FK
SNJ54AS174J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54AS174J
SNJ54AS175BFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9553701Q2A
SNJ54AS
175BFK
SNJ54AS175BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9553701QE
A
SNJ54AS175BJ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 5
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ALS174, SN54ALS175, SN54AS174, SN54AS175B, SN74ALS174, SN74ALS175, SN74AS174, SN74AS175B :
•Catalog: SN74ALS174, SN74ALS175, SN74AS174, SN74AS175B
•Military: SN54ALS174, SN54ALS175, SN54AS174, SN54AS175B
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 6
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ALS174DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74ALS174NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74ALS175DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74ALS175NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AS174NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AS175BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ALS174DR SOIC D 16 2500 333.2 345.9 28.6
SN74ALS174NSR SO NS 16 2000 367.0 367.0 38.0
SN74ALS175DR SOIC D 16 2500 333.2 345.9 28.6
SN74ALS175NSR SO NS 16 2000 367.0 367.0 38.0
SN74AS174NSR SO NS 16 2000 367.0 367.0 38.0
SN74AS175BNSR SO NS 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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