SN54F245, SN74F245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SDFS010A – MARCH 1987 – REVISED OCTOBER 1993
Copyright 1993, Texas Instruments Incorporated
2–1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
•3-State Outputs Drive Bus Lines Directly
•Package Options Include Plastic
Small-Outline (SOIC) and Shrink
Small-Outline (SSOP) Packages, Ceramic
Chip Carriers, and Plastic and Ceramic
DIPs
description
These octal bus transceivers are designed for
asynchronous communication between data
buses. The devices transmit data from the A bus
to the B bus or from the B bus to the A bus
depending upon the logic level at the
direction-control (DIR) input. The output enable
(OE) input can be used to disable the device so the
buses are effectively isolated.
The SN74F245 is available in TI’s shrink
small-outline package (DB), which provides the
same I/O pin count and functionality of standard
small-outline packages in less than half the
printed-circuit-board area.
The SN54F245 is characterized for operation over
the full military temperature range of –55°C to
125°C. The SN74F245 is characterized for
operation from 0°C to 70°C.
FUNCTION TABLE
INPUTS
OPERATION
OE DIR
OPERATION
L L B data to A bus
L H A data to B bus
H X Isolation
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
SN54F245 ...J PACKAGE
SN74F245 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
3212019
910 11 12 13
4
5
6
7
8
18
17
16
15
14
B1
B2
B3
B4
B5
A3
A4
A5
A6
A7
A2
A1
DIR
B7
B6 OE
A8
GND
B8 VCC
SN54F245 . . . FK PACKAGE
(TOP VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN54F245, SN74F245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SDFS010A – MARCH 1987 – REVISED OCTOBER 1993
2–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol†logic diagram (positive logic)
A5 6
A6 7
A7 8
A8 9
A2 3
A3 4
A4 5
OE
A1 2
G3
19
3EN2[AB]
B5
14
B6
13
B7
12
B8
11
B1
18
B2
17
B3
16
B4
15
3EN1[BA]
1
DIR
DIR
OE
A1
B1
1
2
18
19
To Seven Other Channels
1
2
†This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (except I/O ports) (see Note 1) –1.2 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current range –30 mA to 5 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the disabled or power-off state –0.5 V to 5.5 V. . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state –0.5 V to VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the low state: SN54F245 (A1 thru A8) 40 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN54F245 (B1 thru B8) 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74F245 (A1 thru A8) 48 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74F245 (B1 thru B8) 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range: SN54F245 –55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74F245 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
SN54F245, SN74F245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SDFS010A – MARCH 1987 – REVISED OCTOBER 1993
2–3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
SN54F245 SN74F245
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
IIK Input clamp current –18 –18 mA
IOH
High level out
p
ut current
A1 thru A8 –3 –3
mA
I
OH
High
-
le
v
el
o
u
tp
u
t
c
u
rrent
B1 thru B8 –12 –15
mA
I
OL
Low level out
p
ut current
A1 thru A8 20 24
mA
I
OL
Lo
w-
le
v
el
o
u
tp
u
t
c
u
rrent
B1 thru B8 48 64
mA
TAOperating free-air temperature –55 125 0 70 °C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54F245 SN74F245
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP†MAX MIN TYP†MAX
UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 V
A1 thru A8
VCC =45V
IOH = – 1 mA 2.5 3.4 2.5 3.4
A1
thr
u
A8
V
CC =
4
.
5
V
IOH = – 3 mA 2.4 3.3 2.4 3.3
VOH
B1 thru B8
VCC =45V
IOH = – 12 mA 2 3.2 V
B1
thr
u
B8
V
CC =
4
.
5
V
IOH = – 15 mA 2 3.1
Any output VCC = 4.75 V, IOH = –1 mA to – 3 mA 2.7
A1 thru A8
VCC =45V
IOL = 20 mA 0.3 0.5
A1
thr
u
A8
V
CC =
4
.
5
V
IOL = 24 mA 0.35 0.5
V
OL
B1 thru B8
VCC =45V
IOL = 48 mA 0.38 0.55
V
B1
thr
u
B8
V
CC =
4
.
5
V
IOL = 64 mA 0.42 0.55
A and B
VCC =55V
VI = 5.5 V 1 1
mA
IDIR, OE
V
CC =
5
.
5
V
VI = 7 V 0.1 0.1
mA
A and B
VCC =55V
VI=27V
70 70
µA
IH
DIR, OE
V
CC =
5
.
5
V
,
V
I =
2
.
7
V
20 20 µ
A
A and B
VCC =55V
VI=05V
–0.65 –0.65
mA
IL
DIR, OE
V
CC =
5
.
5
V
,
V
I =
0
.
5
V
– 1.2 – 1.2
mA
A1 thru A8
VCC =55V
VO=0
–60 –150 –60 –150
mA
OS
B1 thru B8
V
CC =
5
.
5
V
,
V
O =
0
–100 –225 –100 –225
mA
Outputs high 70 90 70 90
ICC VCC = 5.5 V Outputs low 95 120 95 120 mA
Outputs disabled 85 110 85 110
†All typical values are at VCC = 5 V, TA = 25°C.
‡For I/O ports, the parameters IIH and IIL include the off-state output current.
§Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
SN54F245, SN74F245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SDFS010A – MARCH 1987 – REVISED OCTOBER 1993
2–4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics (see Note 2)
PARAMETER FROM
(
INPUT
)
TO
(
OUTPUT
)
VCC = 5 V,
CL = 50 pF,
RL = 500 Ω,
TA = 25°C
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500Ω,
TA = MIN to MAX†UNIT
(INPUT)
(OUTPUT)
′F245 SN54F245 SN74F245
MIN TYP MAX MIN MAX MIN MAX
tPLH
AorB
BorA
1.7 3.8 6 1.2 7.5 1.7 7
ns
tPHL
A
or
B
B
or
A
1.7 4.2 6 1.2 7.5 1.7 7
ns
tPZH
OE
AorB
2.2 4.9 7 1.7 9 2.2 8
ns
tPZL
OE
A
or
B
2.7 5.6 8 2.2 10 2.7 9
ns
tPHZ
OE
AorB
2.2 4.6 6.5 1.7 9 2.2 7.5
ns
tPLZ
OE
A
or
B
1.2 4.6 6.5 1.2 10 1.2 7.5
ns
†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 2: Load circuits and waveforms are shown in Section 1.
PACKAGE OPTION ADDENDUM
www.ti.com 21-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
85511012A ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 85511012A
SNJ54F
245FK
8551101RA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 8551101RA
SNJ54F245J
8551101SA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 8551101SA
SNJ54F245W
JM38510/34803B2A ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
34803B2A
JM38510/34803BRA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
34803BRA
JM38510/34803BSA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
34803BSA
M38510/34803B2A ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
34803B2A
M38510/34803BRA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
34803BRA
M38510/34803BSA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
34803BSA
SN54F245J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SN54F245J
SN74F245DBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F245
SN74F245DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F245
SN74F245DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F245
SN74F245N ACTIVE PDIP N 20 20 RoHS &
Non-Green NIPDAU N / A for Pkg Type 0 to 70 SN74F245N
SN74F245NE4 ACTIVE PDIP N 20 20 RoHS &
Non-Green NIPDAU N / A for Pkg Type 0 to 70 SN74F245N
SN74F245NSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74F245
SNJ54F245FK ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 85511012A
SNJ54F
PACKAGE OPTION ADDENDUM
www.ti.com 21-Jan-2021
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
245FK
SNJ54F245J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 8551101RA
SNJ54F245J
SNJ54F245W ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 8551101SA
SNJ54F245W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 21-Jan-2021
Addendum-Page 3
OTHER QUALIFIED VERSIONS OF SN54F245, SN74F245 :
•Catalog: SN74F245
•Military: SN54F245
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74F245DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74F245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74F245NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2020
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74F245DBR SSOP DB 20 2000 853.0 449.0 35.0
SN74F245DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74F245NSR SO NS 20 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2020
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
18X 0.65
2X
5.85
20X 0.38
0.22
8.2
7.4 TYP
SEATING
PLANE
0.05 MIN
0.25
GAGE PLANE
0 -8
2 MAX
B5.6
5.0
NOTE 4
A
7.5
6.9
NOTE 3
0.95
0.55
(0.15) TYP
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
4214851/B 08/2019
1
10 11
20
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
A 15
DETAIL A
TYPICAL
SCALE 2.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
20X (1.85)
20X (0.45)
18X (0.65)
(7)
(R0.05) TYP
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
4214851/B 08/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
10 11
20
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
20X (1.85)
20X (0.45)
18X (0.65)
(7)
(R0.05) TYP
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
4214851/B 08/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
10 11
20
www.ti.com
PACKAGE OUTLINE
C
TYP
10.63
9.97
2.65 MAX
18X 1.27
20X 0.51
0.31
2X
11.43
TYP
0.33
0.10
0 - 8
0.3
0.1
0.25
GAGE PLANE
1.27
0.40
A
NOTE 3
13.0
12.6
B7.6
7.4
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
120
0.25 C A B
11
10
PIN 1 ID
AREA
NOTE 4
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
(9.3)
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
20X (2)
20X (0.6)
18X (1.27)
(R )
TYP
0.05
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:6X
1
10 11
20
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(9.3)
18X (1.27)
20X (0.6)
20X (2)
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
10 11
20
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages,
costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either
on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s
applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated