BAS16LD,315 - NEXPERIA

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1. Product profile

1.1 General description

Single high-speed switching diode, encapsulated in a SOD882D leadless ultra small

Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

1.2 Features and benefits

1.3 Applications

High-speed switching

General-purpose switching

1.4 Quick reference data

[1] Device mounted on an FR4 Printed-Circuit Board (PCB) with 60 μm copper strip line.

[2] When switched from IF= 10 mA to IR=10mA; R

L= 100 Ω; measured at IR=1mA.

BAS16LD

Single high-speed switching diode

Rev. 1 — 12 October 2010 Product data sheet

High switching speed: trr ≤4ns Low capacitance

Low leakage current Reverse voltage: VR≤100 V

Repetitive peak reverse voltage:

VRRM ≤100 V

Ultra small and leadless SMD plastic

package

AEC-Q101 qualified Solderable side pads

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

IFforward current [1] --215mA

IRreverse current VR=80V - - 0.5 μA

VRreverse voltage - - 100 V

trr reverse recovery time [2] --4ns

Product data sheet Rev. 1 — 12 October 2010 2 of 11

NXP Semiconductors BAS16LD

Single high-speed switching diode

2. Pinning information

[1] The marking bar indicates the cathode.

3. Ordering information

4. Marking

[1] For SOD882D binary marking code description, see Figure 1.

4.1 Binary marking code description

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 cathode [1]

2 anode

Transparent

top view

006aab04

Table 3. Ordering information

Type number Package

Name Description Version

BAS16LD - leadless ultra small plastic package; 2 terminals;

body 1.0 ×0.6 ×0.4 mm SOD882D

Table 4. Marking codes

Type number Marking code[1]

BAS16LD 1000

0000

Fig 1. SOD882D binary marking code description

VENDOR CODE

MARKING CODE

(EXAMPLE)

CATHODE BAR READING DIRECTION

READING DIRECTION

READING EXAMPLE:

0111

1011

006aac47

Product data sheet Rev. 1 — 12 October 2010 3 of 11

NXP Semiconductors BAS16LD

Single high-speed switching diode

5. Limiting values

[1] Device mounted on an FR4 PCB with 60 μm copper strip line.

[2] Tj=25°C prior to surge.

[3] Reflow soldering is the only recommended soldering method.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB with 60 μm copper strip line.

[2] Reflow soldering is the only recommended soldering method.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRRM repetitive peak reverse

voltage -100V

VRreverse voltage - 100 V

IFforward current [1] 215 mA

IFRM repetitive peak forward

current tp≤0.5 μs;

δ≤0.25 -500mA

IFSM non-repetitive peak forward

current square wave [2]

tp=1μs-4A

tp=1ms - 1 A

tp=1s - 0.5 A

Ptot total power dissipation Tamb ≤25 °C[1][3] -250mW

Tjjunction temperature - 150 °C

Tamb ambient temperature −55 +150 °C

Tstg storage temperature −65 +150 °C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1][2] - - 500 K/W

Product data sheet Rev. 1 — 12 October 2010 4 of 11

NXP Semiconductors BAS16LD

Single high-speed switching diode

7. Characteristics

[1] Pulse test: tp≤300 μs; δ≤0.02.

[2] When switched from IF= 10 mA to IR=10mA; R

L= 100 Ω; measured at IR=1mA.

[3] When switched from IF=10mA; t

r=20ns.

Table 7. Characteristics

Tamb =25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage [1]

IF= 1 mA - - 715 mV

IF= 10 mA - - 855 mV

IF=50mA --1V

IF=150mA --1.25V

IRreverse current VR=25V --30nA

VR=80V --0.5μA

VR=25V; T

j=150°C --30μA

VR=80V; T

j=150°C --50μA

Cddiode capacitance f = 1 MHz; VR=0V --1.5pF

trr reverse recovery time [2] --4ns

VFR forward recovery voltage [3] --1.75V

Product data sheet Rev. 1 — 12 October 2010 5 of 11

NXP Semiconductors BAS16LD

Single high-speed switching diode

(1) Tamb = 150 °C

(2) Tamb =85°C

(3) Tamb =25°C

(4) Tamb =−40 °C

Based on square wave currents.

Tj=25°C; prior to surge

Fig 2. Forward current as a function of forward

voltage; typical values Fig 3. No n-repetitive peak forward current as a

function of pulse duration; maximum values

(1) Tamb = 150 °C

(2) Tamb =85°C

(3) Tamb =25°C

(4) Tamb =−40 °C

f=1MHz; T

amb =25°C

Fig 4. Reverse current as a function of reverse

voltage; typical values Fig 5. Dio de ca pacitance as a function of reverse

voltage; typical values

006aab132

102

103

(mA)

10−1

VF (V)

0 1.41.00.4 0.80.2 1.20.6

(1) (2) (3) (4)

mbg704

102

IFSM

(A)

10−1

tp (μs)

110

103

10 102

006aab133

102

(μA)

VR (V)

0 1008040 6020

10−1

10−2

10−3

10−4

10−5

(1)

(2)

(3)

(4)

0816124

0.8

0.6

0.4

0.2

mbg446

(V)

(pF)

Product data sheet Rev. 1 — 12 October 2010 6 of 11

NXP Semiconductors BAS16LD

Single high-speed switching diode

8. Test information

(1) IR=1mA

Input signal: reverse pulse rise time tr= 0.6 ns; reverse voltage pulse duration tp= 100 ns; duty cycle δ=0.05

Oscilloscope: rise time tr=0.35ns

Fig 6. Re verse recovery time test circuit and wav eforms

Input signal: forward pulse rise time tr= 20 ns; forward current pulse duration tp≥100 ns; duty cycle δ≤0.005

Fig 7. F orward recovery voltage test circuit and waveforms

trr

(1)

+ I

output signal

10 %

90 %

input signal

V = V

= 50 ΩI

D.U.T.

= 50 Ω

SAMPLING

OSCILLOSCOPE

mga881

10 %

90 %

input signal

= 50 Ω

OSCILLOSCOPE

1 kΩ450 Ω

D.U.T.

mga88

VFR

output signal

Product data sheet Rev. 1 — 12 October 2010 7 of 11

NXP Semiconductors BAS16LD

Single high-speed switching diode

9. Package outline

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

11. Soldering

Fig 8. Package outline BAS16LD (SOD882D)

10-08-06Dimensions in mm

0.65

0.30

0.22

0.30

0.22

0.55

0.45

0.65

0.55

0.4

max

1.05

0.95

cathode marking on top side

Table 8. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

10000

BAS16LD SOD882D 2 mm pitch, 8 mm tape and reel -315

Reflow soldering is the only recommended soldering method.

Fig 9. Reflow soldering footprint BAS16LD (SOD882D)

solder lands

solder resist

solder paste

sod882d_

Dimensions in mm

1.4

0.2

0.3

0.4

1.3

0.8

(2×)

0.6

(2×)

0.7

(2×)

Product data sheet Rev. 1 — 12 October 2010 8 of 11

NXP Semiconductors BAS16LD

Single high-speed switching diode

12. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAS16LD v.1 20101012 Product data sheet - -

Product data sheet Rev. 1 — 12 October 2010 9 of 11

NXP Semiconductors BAS16LD

Single high-speed switching diode

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the shor t data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed be tween

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

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Notwithstanding any damages that customer might incur for any reason

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limitation specifications and product descriptions, at any time and without

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damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the applicatio n or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

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conveyance or implication of any license under any copyrights, patents or

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Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specif ication for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 1 — 12 October 2010 10 of 11

NXP Semiconductors BAS16LD

Single high-speed switching diode

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics se ctions of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BAS16LD

Single high-speed switching diode

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 12 October 2010

Document identifier: BAS16LD

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4.1 Binary marking code description. . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Packing information . . . . . . . . . . . . . . . . . . . . . 7

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

14 Contact information. . . . . . . . . . . . . . . . . . . . . 10

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11