SMAJ530, SMAJ550
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Revision: 10-Dec-13 1Document Number: 88391
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Surface Mount TRANSZORB® Transient Voltage Suppressors
APPLICATION NOTES
Respect thermal resistance (PCB Layout) - as the
temperature coefficient also contributes to the clamping
voltage
Select minimum breakdown voltage, so you get
acceptable power dissipation and PCB tie point
temperature
Devices with higher breakdown voltage will have a shorter
conduction time and will dissipate less power
Clamping voltage is influenced by internal resistance -
design approximation is 7 V per 100 mA slope
Keep temperature of TVS lower than TOPSwitch® as a
recommendation
Maximum current is determined by the maximum TJ and
can be higher than 300 mA
Contact supplier for different clamping voltage/
current arrangements
Minimum breakdown voltage can be customized for other
applications. Contact supplier
TOPSwitch is a registered trademark of Power
Integrations, Inc.
FEATURES
Glass passivated chip junction
Available in uni-directional polarity only
Excellent clamping capability
Very fast response time
Low incremental surge resistance
Meets MSL level 1, per J-STD-020, LF maximum peak of
260 °C
AEC-Q101 qualified
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
Use in sensitive electronics protection against voltage
transients induced by inductive load switching and lighting
on ICs, MOSFET, signal lines of sensor units for consumer,
computer, industrial, automotive, and telecommunication.
MECHANICAL DATA
Case: DO-214AC (SMA)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-E3 - RoHS-compliant and commercial grade
Base P/NHE3 - RoHS-compliant and AEC-Q101 qualified
Base P/NHE3_X - RoHS-compliant and AEC-Q101 qualified
(“_X” denotes revision code e.g. A, B, .....)
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
E3 suffix meets JESD 201 class 2 whisker test, HE3 suffix
meets JESD 201 class 2 whisker test
Polarity: Color band denotes cathode end
PRIMARY CHARACTERISTICS
VBR (uni-directional) 530 V to 550 V
VWM 477 V, 495 V
PPPM 300 W
PD2.5 W
IFSM (uni-directional only) 40 A
TJ max. 150 °C
Polarity Uni-directional
Package DO-214AC (SMA)
DO-214AC (SMA)
SMAJ530, SMAJ550
www.vishay.com Vishay General Semiconductor
Revision: 10-Dec-13 2Document Number: 88391
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
(1) Non-repetitive current pulse, per fig. 3 and derated above 25 °C per fig. 2.
(2) Mounted on 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pads to each terminal
(3) Lead temperature at TL = 75 °C
(4) Peak pulse power waveform is 10/1000 μs
Note
(1) Measured at 1 MHz
Note
(1) Mounted on minimum recommended pad layout
Note
(1) AEC-Q101 qualified
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL SMAJ530 SMAJ550 UNIT
Device marking code HD SB
Peak pulse power dissipation (1)(2)(4) (fig. 1) PPPM 300 W
Power dissipation on infinite heatsink (3) P
D2.5 W
Operating junction and storage temperature range TJ, TSTG - 55 to 150 °C
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
DEVICE TYPE
BREAKDOWN VOLTAGE
VBR AT IT
(V)
TEST CURRENT
IT
(μA)
STAND-OFF VOLTAGE
VWM
(V)
MIN.
SMAJ530 530 100 477
SMAJ550 550 100 495
ADDITIONAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER TEST CONDITIONS SYMBOL SMAJ530 SMAJ550 UNIT
Max. clamping voltage 400 mA, 10/1000 μs waveform VC760 V
Maximum DC reverse leakage current VWM ID1.0 μA
Typical temperature coefficient of VBR 650 mV/°C
Typical capacitance (1) 0 V CJ
90 pF
200 V 7.5
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL SMAJ530 SMAJ550 UNIT
Typical thermal resistance, junction to lead RJL 30 °C/ W
Typical thermal resistance, junction to ambient (1) RJA 120
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
SMAJ530-E3/61 0.064 61 1800 7" diameter plastic tape and reel
SMAJ530-E3/5A 0.064 5A 7500 13" diameter plastic tape and reel
SMAJ530HE3/61 (1) 0.064 61 1800 7" diameter plastic tape and reel
SMAJ530HE3/5A (1) 0.064 5A 7500 13" diameter plastic tape and reel
SMAJ530HE3_A/H (1) 0.064 H 1800 7" diameter plastic tape and reel
SMAJ530HE3_A/I (1) 0.064 I 7500 13" diameter plastic tape and reel
SMAJ530, SMAJ550
www.vishay.com Vishay General Semiconductor
Revision: 10-Dec-13 3Document Number: 88391
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
Fig. 1 - Peak Pulse Power Rating Curve
Fig. 2 - Pulse Power or Current vs. Initial Junction Temperature
Fig. 3 - Pulse Waveform
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
0.1
1
10
100
P
PPM
- Peak Pulse Power (kW)
td - Pulse Width (s)
Non-Repetitive Pulse
Waveform shown in Fig. 3
TA = 25 °C
0.1 µs 1.0 µs 10 µs 100 µs 1.0 ms 10 ms
0 255075100
100
75
50
25
0
125 150 175 200
TJ - Initial Temperature (°C)
Peak Pulse Power (P
PP
) or Current (I
PP
)
Derating in Percentage, %
0
50
100
150
t
r
= 10 µs
Peak Value
IPPM
Half Value -
IPPM
I
PP
2
t
d
10/1000 µs Waveform
as defined by R.E.A.
01.0 2.0 3.0 4.0
t - Time (ms)
I
PPM
- Peak Pulse Current, % I
RSM
T
J
= 25 °C
Pulse Width (t
d
)
is defined as the Point
where the Peak Current
decays to 50 % of I
PPM
0.008 (0.203)
0.194 (4.93)
0.208 (5.28)
0.157 (3.99)
0.177 (4.50)
0.100 (2.54)
0.110 (2.79)
0.078 (1.98)
0.090 (2.29)
0.006 (0.152)
0.012 (0.305)
0.049 (1.25)
0.065 (1.65)
Cathode Band
0 (0)
DO-214AC (SMA)
Mounting Pad Layout
0.074 (1.88)
MAX.
0.208 (5.28)
REF.
0.066 (1.68)
MIN.
0.060 (1.52)
MIN.
0.030 (0.76)
0.060 (1.52)
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Revision: 02-Oct-12 1Document Number: 91000
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