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FEATURES
Converts CMOS SRAM into nonvolatile
memory
Unconditionally write-protects SRAM when
VCC is out of tolerance
Automatically switches to battery backup
supply when VCC power failure occurs
Monitors voltage of a lithium cell and
provides advanced warning of impending
battery failure
Signals low-battery condition on active low
Battery Warning output signal
Automatic VCC power-fail detection for 3.0V
or 3.3V power supplies
Space-saving 8-pin DIP and SOIC packages
Optional 16-pin SOIC and 20-pin TSSOP
versions reset processor when power failure
occurs and hold processor in reset during
system power-up
Industrial temperature range of -40°C to
+85°C
PIN ASSIGNMENT
PIN DESCRIPTION
VCCI - Power Supply Input
VCCO - SRAM Power Supply Output
VBAT - Backup Battery Input
CEI
- Chip Enable Input
CEO
- Chip Enable Output
TOL - VCC Tolerance Select
BW
- Battery Warning Output
(Open Drain)
RST
- Reset Output (Open Drain)
GND - Ground
NC - No Connection
DESCRIPTION
The DS1314 Nonvolatile Controller with Battery Monitor is a CMOS circuit which solves the application
problem of converting CMOS RAM into nonvolatile memory. Incoming power is monitored for an out-
of-tolerance condition. When such a condition is detected, chip enable is inhibited to accomplish write
protection and the battery is switched on to supply the RAM with uninterrupted power. Special circuitry
uses a low-leakage CMOS process which affords precise voltage detection at extremely low battery
consumption.
DS1314
3V Nonvolatile Controller with Lithium Battery Monitor
1
2
3
4
20
19
18
17
5
6
7
8
9
10
11
12
13
14
15
16
V
CCI
RST
CEO
V
CCO
NC
V
BAT
TOL
NC
GND
DS1314E 20-Pin TSSOP
1
2
3
4
8
7
6
5
GND
TOL
V
BAT
V
CCO
V
CCI
BW
CEO
CEI
DS1314S-2 8-Pin SOIC
(150 mils)
1
2
3
4
8
7
6
5
GND
TOL
V
BAT
V
CCO
V
CCI
BW
CEO
CEI
DS1314 8-Pin DIP
(300 mils)
1
2
3
4
16
15
14
13
5
6
7
8
9
10
11
12
NC
VCCO
NC
VBAT
NC
TOL
NC
GND
NC
V
CCI
RST
NC
BW
CEO
NC
DS1314S 16-Pin SOIC
(300 mils)
19-6307; Rev 6/12
DS1314
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In addition to battery-backup support, the DS1314 performs the important function of monitoring the
remaining capacity of the lithium battery and providing a warning before the battery reaches end-of-life.
Because the open-circuit voltage of a lithium backup battery remains relatively constant over the majority
of its life, accurate battery monitoring requires loaded-battery voltage measurement. The DS1314
performs such measurement by periodically comparing the voltage of the battery as it supports an internal
resistive load with a carefully selected reference voltage. If the battery voltage falls below the reference
voltage under such conditions, the battery will soon reach end-of-life. As a result, the Battery Warning
pin is activated to signal the need for battery replacement.
MEMORY BACKUP
The DS1314 performs all the circuit functions required to provide battery-backup for an SRAM. First, the
device provides a switch to direct power from the battery or the system power supply (VCCI). Whenever
VCCI is less than the switch point VSW and VCCI is less than the battery voltage VBAT, the battery is
switched in to provide backup power to the SRAM. This switch has voltage drop of less than 0.2 volts.
Second, the DS1314 handles power failure detection and SRAM write protection. VCCI is constantly
monitored, and when the supply goes out of tolerance, a precision comparator detects power failure and
inhibits chip enable output (
CEO
) in order to write-protect the SRAM. This is accomplished by holding
CEO
to within 0.2 volts of VCCO when VCCI is out of tolerance. If
CEI
is (active) low at the time that
power failure is detected, the
CEO
signal is kept low until
CEI
is brought high again. Once
CEI
is
brought high,
CEO
is taken high and held high until after VCCI has returned to its nominal voltage level. If
CEI
is not brought high by 1.5 µs after power failure is detected,
CEO
is forced high at that time. This
specific scheme for delaying write protection for up to 1.5 µs guarantees that any memory access in
progress when power failure occurs will complete properly. Power failure detection occurs at 3.0V
nominal (3.3V supply) when the TOL pin is wired to GND or at 2.7V nominal (3.0V supply) when TOL
is connected to VCCO.
BATTERY VOLTAGE MONITORING
The DS1314 automatically performs periodic battery voltage monitoring at a factory-programmed time
interval of 24 hours. Such monitoring begins within tREC after VCCI rises above VCCTP, and is suspended
when power failure occurs.
After each 24-hour period (tBTCN) has elapsed, the DS1314 connects VBAT to an internal 1.2 MΩ test
resistor (RINT) for one second (tBTPW). During this one second, if VBAT falls below the factory-
programmed battery voltage trip point (VBTP), the battery warning output
BW
is asserted. While
BW
is
active battery testing will be performed with period tBTCW to detect battery removal and replacement.
Once asserted,
BW
remains active until the battery is physically removed and replaced by a fresh cell.
The battery is still re-tested after each VCC power-up, however, even if
BW
was active on power-down. If
the battery is found to be higher than VBTP during such testing,
BW
is deasserted and regular 24-hour
testing resumes.
BW
has an open-drain output driver.
Battery replacement following
BW
activation is normally done with VCCI nominal so that SRAM data is
not lost. During battery replacement, the minimum time duration between old battery detachment and
new battery attachment (tBDBA) must be met or
BW
will not deactivate following attachment of the new
DS1314
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battery. Should
BW
not deactivate for this reason, the new battery can be detached for tBDBA and then re-
attached to clear
BW
.
NOTE: The DS1314 cannot constantly monitor an attached battery because such monitoring would
drastically reduce the life of the battery. As a result, the DS1314 only tests the battery for one second out
of every 24 hours and does not monitor the battery in any way between tests. If a good battery (one that
has not been previously flagged with
BW
) is removed between battery tests, the DS1314 may not
immediately sense the removal and may not activate
BW
until the next scheduled battery test. If a battery
is then reattached to the DS1314, the battery may not be tested until the next scheduled test.
NOTE: Battery monitoring is only a useful technique when testing can be done regularly over the entire
life of a lithium battery. Because the DS1314 only performs battery monitoring when VCC is nominal,
systems which are powered-down for excessively long periods can completely drain their lithium cells
without receiving any advanced warning. To prevent such an occurrence, systems using the DS1314
battery monitoring feature should be powered-up periodically (at least once every few months) in order to
perform battery testing. Furthermore, anytime
BW
is activated on the first battery test after a power-up,
data integrity should be checked via checksum or other technique.
POWER MONITORING
DS1314S and DS1314E varieties have an additional reset pin. These varieties detect out-of-tolerance
power supply conditions and warn a processor-based system of impending power failure. When VCCI falls
below the trip point level defined by the TOL pin (VCCTP), the VCCI comparator activates the reset signal
RST
. Reset occurs at 3.0V nominal (3.3V supply) when the TOL pin is connected to GND or at 2.7V
nominal (3.0V supply) when TOL is connected to VCCO.
RST
also serves as a power-on reset during power-up. After VCCI exceeds VCCTP,
RST
will be held active
for 200 ms nominal (tRPU). This reset period is sufficiently long to prevent system operation during
power-on transients and to allow tREC to expire.
RST
has an open-drain output driver.
FRESHNESS SEAL MODE
When the battery is first attached to the DS1314 without VCC power applied, the device does not
immediately provide battery-backup power on VCCO. Only after VCCI exceeds VCCTP and later falls below
both VSW and VBAT will the DS1314 leave Freshness Seal Mode and provide battery-backup power. This
mode allows a battery to be attached during manufacturing but not used until after the system has been
activated for the first time. As a result, no battery energy is drained during storage and shipping.
DS1314
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FUNCTIONAL BLOCK DIAGRAM Figure 1
DS1314
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ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground -0.5V to +6.0V
Operating Temperature Range -40°C to +85°C
Storage Temperature Range -55°C to +125°C
Soldering Temperature (reflow, SO or TSSOP) +260°C
Lead Temperature (soldering, 10s) +300°C
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of
time may affect reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PDIP
Junction-to-Ambient Thermal Resistance (θJA).…………………...………………………....110°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………40°C/W
8 SO
Junction-to-Ambient Thermal Resistance (θJA).……………………………………………...132°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………38°C/W
16 SO
Junction-to-Ambient Thermal Resistance (θJA).…………………...………………………......71°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………23°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θJA).……………………………………………..73.8°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………20°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board for the SMT packages. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-
tutorial.
RECOMMENDED OPERATING CONDITIONS (-40°C to +85°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Supply Voltage TOL=GND
VCCI
3.0
3.3
3.6
V
2
Supply Voltage TOL=VCCO
VCCI
2.7
3.0
3.3
V
2
Battery Supply Voltage
VBAT
2.0
6.0
V
2
Logic 1 Input
VIH
2.0
VCCI+0.3
V
2, 13
Logic 0 Input
VIL
-0.3
+0.8
V
2, 13
DC ELECTRICAL CHARACTERISTICS (-40°C to +85°C; VCCI = ≥VCCTP)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Operating Current (TTL inputs)
ICC1
50
200
µA
3
Operating Current (CMOS inputs)
ICC2
30
100
µA
3, 6
RAM Supply Current
(VCCO ≥ VCCI -0.2V)
I
CCO1
80
mA
4
RAM Supply Current
(VCCO ≥ VCCI -0.3V)
I
CCO1
140
mA
5
VCC Trip Point (TOL=GND)
VCCTP
2.8
2.9
3.0
V
2
VCC Trip Point (TOL=VCCO)
VCCTP
2.5
2.6
2.7
V
2
DS1314
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VBAT Trip Point
VBTP
2.5
2.6
2.7
V
2
V
CC
/V
BAT
Switch Point
(TOL=GND)
V
SW
2.6
2.7
2.8
V
2
V
CC
/V
BAT
Switch Point
(TOL= VCCO)
V
SW
2.4
2.5
2.6
V
2
Output Current @ 2.2V
IOH
-1
mA
8, 11
Output Current @ 0.4V
IOL
4
mA
8, 11
Input Leakage
IIL
-1.0
+1.0
µA
Output Leakage
ILO
-1.0
+1.0
µA
Battery Monitoring Test Load
RINT
0.8
1.2
1.5
MΩ
DC ELECTRICAL CHARACTERISTICS (-40°C to +85°C; VCCI < VBAT; VCCI < VSW)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Battery Current
IBAT
100
nA
3
Battery-Backup Current
ICCO2
500
µA
7
Supply Voltage
VCCO
VBAT-0.2
V
2
CEO
Output
V
OHL
VBAT-0.2
V
2, 9
CAPACITANCE (TA = +25°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Input Capacitance (
CEI
, TOL)
C
IN
7
pF
Output Capacitance
(
CEO
,
BW
,
RST
)
C
OUT
7
pF
AC ELECTRICAL CHARACTERISTICS (-40°C to +85°C; VCCI ≥ VCCTP)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
CEI
to
CEO
Propagation Delay
t
PD
12
20
ns
CE
Pulse Width
t
CE
1.5
µs
12
V
CC
Valid to End of
Write Protection
t
REC
12
125
ms
10
VCC Valid to
CEI
Inactive
t
PU
2
ms
VCC Valid to
RST
Inactive
t
RPU
150
200
350
ms
11
VCC Valid to
BW
Valid
t
BPU
1
s
11
AC ELECTRICAL CHARACTERISTICS (-40°C to +85°C; VCCI < VCCTP)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
VCC Slew Rate
tF
150
µs
VCC Fail Detect to
RST
Active
t
RPD
5
15
µs
11
VCC Slew Rate
tR
150
µs
DS1314
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AC ELECTRICAL CHARACTERISTICS (-40°C to +85°C; VCCI ≥ VCCTP)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Battery Test to
BW
Active
t
BW
1
s
11
Battery Test Cycle-Normal
tBTCN
24
hr
Battery Test Cycle-Warning
tBTCW
5
s
Battery Test Pulse Width
tBTPW
1
s
Battery Detach to Battery Attach
tBDBA
7
s
Battery Attach to
BW
Inactive
t
BABW
1
s
11
TIMING DIAGRAM: POWER-UP
NOTE:
If VBAT < VSW, VCCO will begin to slew with VCCI when VCCI = VBAT.
DS1314
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TIMING DIAGRAM: POWER-DOWN
NOTE:
If VBAT < VSW, VCCO will slew down with VCCI until VCCI = VBAT.
DS1314
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TIMING DIAGRAM: BATTERY WARNING DETECTION
NOTE:
tBW is measured from the expiration of the internal timer to the activation of the battery warning output
BW
.
TIMING DIAGRAM: BATTERY REPLACEMENT
DS1314
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NOTES:
2. All voltages referenced to ground.
3. Measured with outputs open circuited.
4. ICCO1 is the maximum average load which the DS1314 can supply to attached memories at VCCO ≥
VCCI -0.2V.
5. ICCO1 is the maximum average load which the DS1314 can supply to attached memories at VCCO ≥
VCCI -0.3V.
6. All inputs within 0.3V of ground or VCCI.
7. ICCO2 is the maximum average load current which the DS1314 can supply to the memories in the
battery-backup mode.
8. Measured with a load as shown in Figure 2.
9. Chip Enable Output (
CEO
) can only sustain leakage current in the battery-backup mode.
10.
CEO
will be held high for a time equal to tREC after VCCI crosses VCCTP on power-up.
11.
BW
and
RST
are open drain outputs and as such cannot source current. External pull-up resistors
should be connected to these pins for proper operation. Both
BW
and
RST
can sink 10 mA.
12. tCE maximum must be met to ensure data integrity on power-down.
13. In battery-backup mode, inputs must never be below ground or above VCCO.
DC TEST CONDITIONS
Outputs Open
All voltages are referenced to ground
AC TEST CONDITIONS
Output Load: See below
Input Pulse Levels: 0 - 3.0V
Timing Measurement Reference Levels
Input: 1.5V
Output: 1.5V
Input pulse Rise and Fall Times: 5 ns
OUTPUT LOAD Figure 2
* INCLUDING SCOPE AND JIG CAPACITANCE
DS1314
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ORDERING INFORMATION
PART
TEMP
RANGE
PIN-PACKAGE
DS1314+
-40°C to +85°C
8 PDIP
DS1314S-2+
-40°C to +85°C
8 SO
DS1314S+
-40°C to +85°C
16 SO
DS1314E+
-40°C to +85°C
20 TSSOP
+Denotes a lead(Pb)-free/RoHS-compliant package.
PACKAGE INFORMATION
For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND PATTERN NO.
8 PDIP
P8+2
21-0043
8 SO
S8+4
21-0041
90-0096
16 SO
W16+1
21-0042
90-0107
20 TSSOP
U20+1
21-0066
90-0116
DS1314
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Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim
reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, Inc. 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
© 2012 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
DATA SHEET REVISION SUMMARY
The following represent the key differences between 12/16/96 and 06/12/97 version of the DS1314 data
sheet. Please review this summary carefully.
1. Changed VBAT max to 6V.
2. Changed VCCTP values to 2.8 - 3.0V (TOL = GND) and 2.5 - 2.7V (TOL = VCC).
3. Changed tBABW from 7s to 1s max.
4. Changed block diagram to show U L compliance.
The following represent the key differences between 06/12/97 and 08/29/97 version of the DS1314 data
sheet. Please review this summary carefully.
1. Changed AC test conditions.
2. Changed tPD to 20 max & 12 typ.
The following represent the key differences between 08/29/97 and 12/16/97 version of the DS1314 data
sheet. Please review this summary carefully.
1. Changed VCCI mins from 3.05V to 3.0V (TOL=GND) and from 275V to 2.7V (TOL=VCCD) (this
should have been done on 06/12/97 revision but was overlooked).
2. Specified Input Capacitance as being only for
CEI
, TOL and Output Capacitance as being only for
CEO
,
BW
and
RST
. This is not a change but rather clarification.
3. Removed “preliminary” from title bar.
The following represent the key differences between 12/16/97 and 6/12 version of the DS1314 data sheet.
Please review this summary carefully.
1. Update soldering, ordering, package information, and notes.