SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DLow Supply Voltage Range 2.5 V to 5.5 V
DUltralow-Power Consumption:
− Active Mode: 330 µA at 1 MHz, 3 V
− Standby Mode: 1.5 µA
− Off Mode (RAM Retention): 0.1 µA
DWake-up From Standby Mode in less
than 6 µs
D16-Bit RISC Architecture, 200 ns Instruction
Cycle Time
DBasic Clock Module Configurations:
− Various Internal Resistors
− Single External Resistor
− 32 kHz Crystal
− High Frequency Crystal
− Resonator
− External Clock Source
D16-Bit Timer_A With Three
Capture/Compare Registers
DSerial Onboard Programming
DProgram Code Protection by Security Fuse
DFamily Members Include:
MSP430C111: 2k Byte ROM,128 Byte RAM
MSP430C112: 4k Byte ROM, 256 Byte RAM
MSP430P112: 4k Byte OTP, 256 Byte RAM
DEPROM Version Available for Prototyping:
− PMS430E112: 4k Byte EPROM, 256 Byte
RAM
DAvailable in a 20-Pin Plastic Small-Outline
Wide Body (SOWB) Package, 20-Pin
Ceramic Dual-In-Line (CDIP) Package
(EPROM Only)
DFor Complete Module Descriptions, Refer
to the MSP430x1xx Family User’s Guide,
Literature Number SLAU049
description
The Texas Instruments MSP430 family of ultralow
power microcontrollers consist of several devices
featuring different sets of peripherals targeted for
various applications. The architecture, combined
with five low power modes is optimized to achieve
extended battery life in portable measurement
applications. The device features a powerful
16-bit RISC CPU, 16-bit registers, and constant
generators that attribute to maximum code
efficiency. The digitally controlled oscillator (DCO)
allows wake-up from low-power modes to active
mode in less than 6µs.
The MSP430x11x series is an ultra low-power mixed signal microcontroller with a built in 16-bit timer and
fourteen I/O pins.
Typical applications include sensor systems that capture analog signals, convert them to digital values, and then
process the data and display them or transmit them to a host system. Stand alone RF sensor front-end is another
area of application.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
TEST/VPP
VCC
P2.5/ROSC
VSS
XOUT/TCLK
XIN
RST/NMI
P2.0/ACLK
P2.1/INCLK
P2.2/TA0
P1.7/TA2/TDO/TDI
P1.6/TA1/TDI
P1.5/TA0/TMS
P1.4/SMCLK/TCK
P1.3/TA2
P1.2/TA1
P1.1/TA0
P1.0/TACLK
P2.4/TA2
P2.3/TA1
DW PACKAGE
(TOP VIEW)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1998 − 2004, Texas Instruments Incorporated
!" #!$% &"'
&! #" #" (" " " !"
&& )*' &! #"+ &" ""%* %!&"
"+ %% #""'
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
TASOWB
20-Pin
(DW)
CDIP
20-Pin
(JL)
−40°C to 85°C
MSP430C111IDW
MSP430C112IDW
−40°C to 85°C MSP430C112IDW
MSP430P112IDW
25°C
—
PMS430E112JL
25
°
C
—
PMS430E112JL
functional block diagram
Oscillator ACLK
SMCLK
CPU
Incl. 16 Reg.
Bus
Conv
MCB
XIN XOUT/TCLK P2
MDB, 16 Bit
MAB, 16 Bit
MCLK
MAB,
4 Bit
VCC VSS RST/NMI
System
Clock
ROSC
P1
2/4KB
ROM
4KB OTP
256B RAM
128B RAM
Watchdog
Timer
15/16-Bit
Timer_A3
3 CC Reg
I/O Port 1
8 I/Os, with
Interrupt
Capability
I/O Port 2
6 I/Os, with
Interrupt
Capability
POR
MDB, 16-Bit
MAB, 16-Bit
JTAG
TEST/VPP
Test
JTAG
Emulation
Module
8 6
MDB, 8 Bit
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Terminal Functions
TERMINAL
TERMINAL
I/O
DESCRIPTION
NAME NO.
I/O
DESCRIPTION
P1.0/TACLK 13 I/O General-purpose digital I/O pin/Timer_A, clock signal TACLK input
P1.1/TA0 14 I/O General-purpose digital I/O pin/Timer_A, Capture: CCI0A input, Compare: Out0 output
P1.2/TA1 15 I/O General-purpose digital I/O pin/Timer_A, Capture: CCI1A input, Compare: Out1 output
P1.3/TA2 16 I/O General-purpose digital I/O pin/Timer_A, Capture: CCI2A input, Compare: Out2 output
P1.4/SMCLK/TCK 17 I/O General-purpose digital I/O pin/SMCLK signal output/Test clock, input terminal for device programming
and test
P1.5/TA0/TMS 18 I/O General-purpose digital I/O pin/Timer_A, Compare: Out0 output/test mode select, input terminal for
device programming and test.
P1.6/TA1/TDI 19 I/O General-purpose digital I/O pin/Timer_A, Compare: Out1 output/test data input terminal.
P1.7/TA2/TDO/TDI 20 I/O General-purpose digital I/O pin/Timer_A, Compare: Out2 output/test data output terminal or data input
during programming.
P2.0/ACLK 8 I/O General-purpose digital I/O pin/ACLK output
P2.1/INCLK 9 I/O General-purpose digital I/O pin/Timer_A, clock signal at INCLK
P2.2/TA0 10 I/O General-purpose digital I/O pin/Timer_A, Capture: CCI0B input, Compare: Out0 output
P2.3/TA1 11 I/O General-purpose digital I/O pin/Timer_A, Capture: CCI1B input, Compare: Out1 output
P2.4/TA2 12 I/O General-purpose digital I/O pin/Timer_A, Compare: Out2 output
P2.5/ROSC 3 I/O General-purpose digital I/O pin/Input for external resistor that defines the DCO nominal frequency
RST/NMI 7 I Reset or nonmaskable interrupt input
TEST/VPP 1 I Selects test mode for JTAG pins on Port1/programming voltage input during EPROM programming
VCC 2Supply voltage
VSS 4Ground reference
XIN 6 I Input terminal of crystal oscillator
XOUT/TCLK 5 I/O Output terminal of crystal oscillator or test clock input
General-Purpose Register
Program Counter
Stack Pointer
Status Register
Constant Generator
General-Purpose Register
General-Purpose Register
General-Purpose Register
PC/R0
SP/R1
SR/CG1/R2
CG2/R3
R4
R5
R12
R13
General-Purpose Register
General-Purpose Register
R6
R7
General-Purpose Register
General-Purpose Register
R8
R9
General-Purpose Register
General-Purpose Register
R10
R11
General-Purpose Register
General-Purpose Register
R14
R15
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short-form description
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions,
are performed as register operations in
conjunction with seven addressing modes for
source operand and four addressing modes for
destination operand.
The CPU is integrated with 16 registers that
provide reduced instruction execution time. The
register-to-register operation execution time is
one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register,
and constant generator respectively. The
remaining registers are general-purpose
registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled
with all instructions.
instruction set
The instruction set consists of 51 instructions with
three formats and seven address modes. Each
instruction can operate on word and byte data.
Table 1 shows examples of the three types of
instruction formats; the address modes are listed
in Table 2.
Table 1. Instruction Word Formats
Dual operands, source-destination e.g. ADD R4,R5 R4 + R5 −−−> R5
Single operands, destination only e.g. CALL R8 PC −−>(TOS), R8−−> PC
Relative jump, un/conditional e.g. JNE Jump-on-equal bit = 0
Table 2. Address Mode Descriptions
ADDRESS MODE S D SYNTAX EXAMPLE OPERATION
Register D D MOV Rs,Rd MOV R10,R11 R10 −−> R11
Indexed D D MOV X(Rn),Y(Rm) MOV 2(R5),6(R6) M(2+R5)−−> M(6+R6)
Symbolic (PC relative) D D MOV EDE,TONI M(EDE) −−> M(TONI)
Absolute D D MOV &MEM,&TCDAT M(MEM) −−> M(TCDAT)
Indirect DMOV @Rn,Y(Rm) MOV @R10,Tab(R6) M(R10) −−> M(Tab+R6)
Indirect
autoincrement DMOV @Rn+,Rm MOV @R10+,R11 M(R10) −−> R11
R10 + 2−−> R10
Immediate DMOV #X,TONI MOV #45,TONI #45 −−> M(TONI)
NOTE: S = source D = destination
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operating modes
The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the five low-power modes, service the request and restore back to
the low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
DActive mode AM;
− All clocks are active
DLow-power mode 0 (LPM0);
− CPU is disabled
ACLK and SMCLK remain active. MCLK is disabled
DLow-power mode 1 (LPM1);
− CPU is disabled
ACLK and SMCLK remain active. MCLK is disabled
DCO’s dc-generator is disabled if DCO not used in active mode
DLow-power mode 2 (LPM2);
− CPU is disabled
MCLK and SMCLK are disabled
DCO’s dc-generator remains enabled
ACLK remains active
DLow-power mode 3 (LPM3);
− CPU is disabled
MCLK and SMCLK are disabled
DCO’s dc-generator is disabled
ACLK remains active
DLow-power mode 4 (LPM4);
− CPU is disabled
ACLK is disabled
MCLK and SMCLK are disabled
DCO’s dc-generator is disabled
Crystal oscillator is stopped
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interrupt vector addresses
The interrupt vectors and the power-up starting address are located in the ROM with an address range of
0FFFFh-0FFE0h. The vector contains the 16-bit address of the appropriate interrupt handler instruction
sequence.
INTERRUPT SOURCE INTERRUPT FLAG SYSTEM INTERRUPT WORD ADDRESS PRIORITY
Power-up, external reset, watchdog WDTIFG (see Note1) Reset 0FFFEh 15, highest
NMI, oscillator fault NMIIFG, OFIFG (see Note 1) (non)-maskable,
(non)-maskable 0FFFCh 14
0FFFAh 13
0FFF8h 12
0FFF6h 11
Watchdog Timer WDTIFG maskable 0FFF4h 10
Timer_A3 TACCR0 CCIFG (see Note 2) maskable 0FFF2h 9
Timer_A3 TACCR1 and TACCR2
CCIFGs, TAIFG
(see Notes 1 and 2) maskable 0FFF0h 8
0FFEEh 7
0FFECh 6
0FFEAh 5
0FFE8h 4
I/O Port P2 (eight flags − see Note 3) P2IFG.0 to P2IFG.7
(see Notes 1 and 2) maskable 0FFE6h 3
I/O Port P1 (eight flags) P1IFG.0 to P1IFG.7
(see Notes 1 and 2) maskable 0FFE4h 2
0FFE2h 1
0FFE0h 0, lowest
NOTES: 1. Multiple source flags
2. Interrupt flags are located in the module
3. There are eight Port P2 interrupt flags, but only six Port P2 I/O pins (P2.0−5) are implemented on the ’11x devices.
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special function registers
Most in t e r r u p t a n d m o d ule enable bits are collected into the lowest address space. Special function register bits
that are not allocated to a functional purpose are not physically present in the device. Simple software access
is provided with this arrangement.
interrupt enable 1
7654 0
OFIE WDTIE
321
rw-0 rw-0 rw-0
Address
0h NMIIE
WDTIE: Watchdog Timer interrupt enable. Inactive if watchdog mode is selected. Active if W atchdog Timer
is configured in interval timer mode.
OFIE: Oscillator fault enable
NMIIE: (Non)maskable interrupt enable
interrupt flag register 1
7654 0
OFIFG WDTIFG
321
rw-0 rw-1 rw-(0)
Address
02h NMIIFG
WDTIFG: Set on Watchdog Timer overflow (in watchdog mode) or security key violation.
Reset on VCC power-up or a reset condition at RST/NMI pin in reset mode.
OFIFG: Flag set on oscillator fault
NMIIFG: Set via RST/NMI-pin
Legend rw:
rw-0,1: Bit can be read and written.
Bit can be read and written. It is Reset or Set by PUC
SFR bit is not present in device.
rw-(0,1): Bit can be read and written. It is Reset or Set by POR
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memory organization
Int. Vector
2 KB ROM
128B RAM
16b Per.
8b Per.
SFR
FFFFh
FFE0h
FFDFh
F800h
027Fh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
MSP430C111
Int. Vector
4 KB
EPROM
256B RAM
16b Per.
8b Per.
SFR
FFFFh
FFE0h
FFDFh
02FFh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
MSP430P112
PMS430E112
Int. Vector
4 KB ROM
256B RAM
16b Per.
8b Per.
SFR
FFFFh
FFE0h
FFDFh
F000h
02FFh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
MSP430C112
F000h
peripherals
Peripherals are connected to the CPU through data, address, and control busses and can be handled using
all instructions. For complete module descriptions, refer to the MSP430x1xx Family User ’s Guide, literature
number SLAU049.
oscillator and system clock
The clock system is supported by the basic clock module that includes support for a 32768-Hz watch crystal
oscillator, an internal digitally-controlled oscillator (DCO) and a high frequency crystal oscillator. The basic clock
module is designed to meet the requirements of both low system cost and low-power consumption. The internal
DCO provides a fast turn-on clock source and stabilizes in less than 6 µs. The basic clock module provides the
following clock signals:
DAuxiliary clock (ACLK), sourced from a 32768-Hz watch crystal or a high frequency crystal.
DMain clock (MCLK), the system clock used by the CPU.
DSub-Main clock (SMCLK), the sub-system clock used by the peripheral modules.
digital I/O
There are two 8-bit I/O ports implemented—ports P1 and P2 (only six P2 I/O signals are available on external
pins):
DAll individual I/O bits are independently programmable.
DAny combination of input, output, and interrupt conditions is possible.
DEdge-selectable interrupt input capability for all the eight bits of port P1 and six bits of port P2.
DRead/write access to port-control registers is supported by all instructions.
NOTE:
Six bits of Port P2, P2.0 to P2.5, are available on external pins − but all control and data bits for Port
P2 are implemented.
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watchdog timer
The primary function of the watchdog timer (WDT) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
timer_A3
Timer_A3 is a 16-bit timer/counter with three capture/compare registers. Timer_A3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Timer_A3 Signal Connections
Input Pin Number Device Input Signal Module Input Name Module Block Module Output Signal Output Pin Number
13 - P1.0 TACLK TACLK
ACLK ACLK
Timer
NA
SMCLK SMCLK Timer NA
9 - P2.1 INCLK INCLK
14 - P1.1 TA0 CCI0A 14 - P1.1
10 - P2.2 TA0 CCI0B
CCR0
TA0
18 - P1.5
DVSS GND CCR0 TA0 10 - P2.2
DVCC VCC
15 - P1.2 TA1 CCI1A 15 - P1.2
11 - P2.3 TA1 CCI1B
CCR1
TA1
19 - P1.6
DVSS GND CCR1 TA1 11 - P2.3
DVCC VCC
16 - P1.3 TA2 CCI2A 16 - P1.3
ACLK (internal) CCI2B
CCR2
TA2
20 - P1.7
DVSS GND CCR2 TA2 12 - P2.4
DVCC VCC
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10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
peripheral file map
PERIPHERALS WITH WORD ACCESS
Watchdog Watchdog/Timer Control WDTCTL 0120h
Timer_A Timer_A Interrupt Vector
Timer_A Control
Cap/Com Control
Cap/Com Control
Cap/Com Control
Reserved
Reserved
Reserved
Reserved
Timer_A Register
Cap/Com Register
Cap/Com Register
Cap/Com Register
Reserved
Reserved
Reserved
Reserved
TAIV
TACTL
TACCTL0
TACCTL1
TACCTL2
TAR
TACCR0
TACCR1
TACCR2
012Eh
0160h
0162h
0164h
0166h
0168h
016Ah
016Ch
016Eh
0170h
0172h
0174h
0176h
0178h
017Ah
017Ch
017Eh
PERIPHERALS WITH BYTE ACCESS
Basic Clock Basic Clock Sys. Control2
Basic Clock Sys. Control1
DCO Clock Freq. Control
BCSCTL2
BCSCTL1
DCOCTL
058h
057h
056h
EPROM EPROM Control EPCTL 054h
Port P2 Port P2 Selection
Port P2 Interrupt Enable
Port P2 Interrupt Edge Select
Port P2 Interrupt Flag
Port P2 Direction
Port P2 Output
Port P2 Input
P2SEL
P2IE
P2IES
P2IFG
P2DIR
P2OUT
P2IN
02Eh
02Dh
02Ch
02Bh
02Ah
029h
028h
Port P1 Port P1 Selection
Port P1 Interrupt Enable
Port P1 Interrupt Edge Select
Port P1 Interrupt Flag
Port P1 Direction
Port P1 Output
Port P1 Input
P1SEL
P1IE
P1IES
P1IFG
P1DIR
P1OUT
P1IN
026h
025h
024h
023h
022h
021h
020h
Special Function SFR Interrupt Flag1
SFR Interrupt Enable1 IFG1
IE1 002h
000h
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absolute maximum ratings†
Voltage applied at VCC to VSS −0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to any pin (see Note) −0.3 V to VCC+0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diode current at any device terminal ±2 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg (unprogrammed device) −55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg (programmed device) −40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE: All voltages referenced to V SS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied
to the TEST pin when blowing the JTAG fuse.
recommended operating conditions
MIN NOM MAX UNITS
MSP430C11x 2.5 5.5
V
Supply voltage, V
CC
MSP430P112 2.7 5.5 V
Supply voltage, VCC
PMS430E112 2.7 5.5 V
Supply voltage during programming, VCC
MSP430P112 4.5 5 5.5 V
Supply voltage during programming, VCC MSP430E112 4.5 5 5.5 V
MSP430C11x
−40
85
Operating free-air temperature range, T
A
MSP430P112 −4
0
85 °C
Operating free-air temperature range, TA
PMS430E112 25
C
XTAL frequency, f(XTAL),(ACLK signal) 32768 Hz
Processor frequency f(system) (PMS430P/E112) (MCLK signal)
VCC = 3 V dc 2
MHz
Processor frequency f
(system)
(PMS430P/E112) (MCLK signal)
VCC = 5 V dc 5.35
MHz
Processor frequency f(system) (MCLK signal) (MSP430C11x)
VCC = 3 V dc 2.73
MHz
Processor frequency f
(system)
(MCLK signal) (MSP430C11x)
VCC = 5 V dc 5.35
MHz
5
3
2
1
001 23
4
4567
2.2 MHz
at 2.5 V
Minimum
VCC − Supply Voltage − V
5.35 MHz
at 5 V
f(system) − Maximum Processor Frequency − MHz
Figure 1. C Version Frequency vs Supply Voltage
NOTE: Minimum processor frequency is defined by system clock.
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12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (continued)
5
3
2
1.1
001 23
4
4567
1.1 MHz
at 2.7 V
Minimum
VCC − Supply Voltage − V
5.35 MHz
at 5 V
f(system) − Maximum Processor Frequency − MHz
Figure 2. P/E Version Frequency vs Supply Voltage
NOTE: Minimum processor frequency is defined by system clock.
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electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
supply current (into VCC) excluding external current
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
TA = −40
°
C +85
°
C, f(MCLK) = f(SMCLK) = 1 MHz,
VCC = 3 V 330 400
µA
C11x
TA = −40 C +85 C, f(MCLK) = f(SMCLK) = 1 MHz,
f(ACLK) = 32,768 Hz VCC = 5 V 630 700 µ
A
C11x
TA = −40
°
C +85
°
C,
VCC = 3 V 3.4 4
µA
I
Active mode
TA = −40 C +85 C,
f(MCLK) = f(SMCLK) = f(ACLK) = 4096 Hz VCC = 5 V 7.8 10 µ
A
I(AM) Active mode TA = −40°C +85°C,
fMCLK = f(SMCLK) = 1 MHz,
VCC = 3 V 400 500
µA
P112
A
f
MCLK
= f
(SMCLK)
= 1 MHz,
f(ACLK)
= 32,768 Hz VCC = 5 V 730 900 µ
A
P112
TA = −40
°
C +85
°
C,
VCC = 3 V 3.4 4
µA
TA = −40 C +85 C,
f(MCLK) = f(SMCLK) = f(ACLK) = 4096 Hz VCC = 5 V 7.8 10 µ
A
C11x
TA = −40
°
C +85
°
C, fMCLK = 0 MHz,
VCC = 3 V 51 60
I(CPUOff)
Low power mode,
C11x
TA = −40 C +85 C, fMCLK = 0 MHz,
f(SMCLK) = 1 MHz, f(ACLK) = 32,768 Hz VCC = 5 V 120 150
µA
I
(CPUOff
)
Low power mode,
(LPM0)
P112
TA = −40
°
C +85
°
C, f(MCLK) = 0 MHz,
VCC = 3 V 70 85 µ
A
(LPM0)
P112
TA = −40 C +85 C, f(MCLK) = 0 MHz,
f(SMCLK) = 1 MHz, f(ACLK) = 32,768 Hz VCC = 5 V 125 170
I(LPM2)
Low power mode, (LPM2)
TA = −40°C +85°C,
f(MCLK) = f(SMCLK) = 0 MHz,
VCC = 3 V 8 22
µA
I
(LPM2)
Low power mode, (LPM2)
A
f
(MCLK)
= f
(SMCLK)
= 0 MHz,
f
(ACLK)
= 32,768 Hz, SCG0 = 0, Rsel = 3 VCC = 5 V 16 35 µ
A
TA = −40°C
f(MCLK) = f(SMCLK) = 0 MHz,
2 2.6
TA = 25°C
f(MCLK) = f(SMCLK) = 0 MHz,
f
(ACLK)
= 32,768 Hz,
SCG0 = 1
V
CC
= 3 V 1.5 2.2
I(LPM3)
Low power mode, (LPM3)
TA = 85°C
f(ACLK) = 32,768 Hz,
SCG0 = 1
VCC = 3 V
1.85 2.2
µA
I
(LPM3)
Low power mode, (LPM3)
TA = −40°C
f(MCLK) = f(SMCLK) = 0 MHz,
6.3 8 µ
A
TA = 25°Cf(MCLK) = f(SMCLK) = 0 MHz,
f(ACLK) = 32,768 Hz, SCG0 = 1
V
CC
= 5 V 5.1 7
TA = 85°C
f(ACLK) = 32,768 Hz, SCG0 = 1
VCC = 5 V
5.1 7
TA = −40°C
f(MCLK) = f(SMCLK) = 0 MHz,
VCC = 3 V/
0.1 0.8
I
(LPM4)
Low power mode, (LPM4) TA = 25°C
f(MCLK) = f(SMCLK) = 0 MHz,
f
(ACLK)
= 0 Hz,
SCG0 = 1
VCC = 3 V/
5 V
0.1 0.8 µA
I(LPM4)
Low power mode, (LPM4)
TA = 85°C
f(ACLK) = 0 Hz,
SCG0 = 1
5 V
0.4 1
µA
NOTE: All inputs are tied to VSS or VCC. Outputs do not source or sink any current.
current consumption of active mode versus system frequency
IAM = IAM[1 MHz] × fsystem [MHz]
current consumption of active mode versus supply voltage
IAM = IAM[3 V] + 175 µA/V × (VCC−3 V)
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
Schmitt-trigger inputs Port 1 to Port P2; P1.0 to P1.7, P2.0 to P2.5
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
VIT+
Positive-going input threshold voltage
VCC = 3 V 1.2 2.1
V
VIT+ Positive-going input threshold voltage VCC = 5 V 2.3 3.4 V
VIT−
Negative-going input threshold voltage
VCC = 3 V 0.7 1.5
V
VIT− Negative-going input threshold voltage VCC = 5 V 1.4 2.3 V
Vhys
Input voltage hysteresis, (VIT+ − VIT−)
VCC = 3 V 0.3 1
V
V
hys
Input voltage hysteresis, (V
IT+
− V
IT−
)
VCC = 5 V 0.6 1.4
V
standard inputs RST/NMI, TCK, TMS, TDI
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
VIL Low-level input voltage
VCC = 3 V/5 V
VSS VSS+0.8
V
VIH High-level input voltage
V
CC
= 3 V/5 V
0.7xVCC VCC
V
inputs Px.x, TAx
PARAMETER TEST CONDITIONS VCC MIN NOM MAX UNIT
Port P1, P2: P1.x to P2.x,
3 V/ 5 V 1.5 cycle
t
(int)
External Interrupt timing Port P1, P2: P1.x to P2.x,
External trigger signal for the interrupt flag, (see Note 1)
3 V 540
ns
t(int)
External Interrupt timing
External trigger signal for the interrupt flag, (see Note 1)
5 V 270 ns
3 V/ 5 V 1.5 cycle
t
(cap)
Timer_A, capture timing TA0, TA1, TA2. (see Note 2) 3 V 540
ns
t(cap)
Timer_A, capture timing
TA0, TA1, TA2. (see Note 2)
5 V 270 ns
NOTES: 1. The external signal sets the interrupt flag every time the minimum tint cycle and time parameters are met. It may be set even with
trigger signals shorter than tint. Both the cycle and timing specifications must be met to ensure the flag is set.
2. The external capture signal triggers the capture event every time when the minimum tcap cycles and time parameters are met. A
capture may be triggered with capture signals even shorter than tcap. Both the cycle and timing specifications must be met to ensure
a correct capture of the 16-bit timer value and to ensure the flag is set.
internal signals TAx, SMCLK at Timer_A
PARAMETER TEST CONDITIONS VCC MIN NOM MAX UNIT
f(IN)
Input frequency
Internal TA0, TA1, TA2, tH = tL
3 V dc 10
MHz
f(IN) Input frequency Internal TA0, TA1, TA2, tH = tL5 V dc 15 MHz
f(TAint) Timer_A clock frequency Internally, SMCLK signal applied 3 V/5 V dc fSystem
leakage current (see Note 1)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
Ilkg(Px.x)
High-impendance leakage current
Port P1: P1.x, 0 ≤ ×≤ 7
(see Note 2) VCC = 3 V/5 V, ±50
nA
Ilkg(Px.x) High-impendance leakage current Port P2: P2.x, 0 ≤ ×≤ 5
(see Note 2) VCC = 3 V/5 V, ±50 nA
NOTES: 1. The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
2. The leakage of the digital port pins is measured individually. The port pin must be selected for input and there must be no optional
pullup or pulldown resistor.
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
outputs P2x, TAx
PARAMETER TEST CONDITIONS VCC MIN NOM MAX UNIT
f(P20)
Output frequency
P2.0/ACLK, CL = 20 pF 3 V/5 V 1.1
MHz
f(TAx) Output frequency TA0, TA1, TA2, CL = 20 pF 3 V/5 V dc fSystem MHz
fP20 = 1.1 MHz 40% 60%
t
(Xdc)
P2.0/ACLK, C
L
= 20 pF fP20 = fXTCLK 3 V/ 5 V 35% 65%
t(Xdc)
Duty cycle of O/P frequency
P2.0/ACLK, CL = 20 pF
fP20 = fXTCLK/n
3 V/ 5 V
50%
t(TAdc)
Duty cycle of O/P frequency
TA0, TA1, TA2, CL = 20 pF,
Duty cycle = 50% 3 V/ 5 V 0±50 ns
outputs Port 1 to P2; P1.0 to P1.7, P2.0 to P2.5
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
VOH
High-level output voltage
I(OH) = − 1.5 mA, VCC = 3 V/5 V, See Note 1 VCC−0.4 VCC
V
VOH High-level output voltage I(OH) = − 4.5 mA, VCC = 3 V/5 V, See Note 2 VCC-0.6 VCC V
VOL
Low-level output voltage
I(OL) = 1.5 mA, VCC = 3 V/5 V, See Note 1 VSS VSS+0.4
V
V
OL
Low-level output voltage
I(OL) = 4.5 mA, VCC = 3 V/5 V, See Note 2 VSS VSS+0.6
V
NOTES: 1. The maximum total current, IOH and IOL, or all outputs combined, should not exceed ±12 mA to hold the maximum voltage drop
specified.
2. The maximum total current, IOH and IOL, or all outputs combined, should not exceed ±36 mA to hold the maximum voltage drop
specified.
optional resistors, individually programmable with ROM code (see Note 1)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
R(opt1) VCC = 3 V/5 V 2.1 4.1 6.2 kΩ
R(opt2) VCC = 3 V/5 V 3.1 6.2 9.3 kΩ
R(opt3) VCC = 3 V/5 V 6 12 18 kΩ
R(opt4) VCC = 3 V/5 V 10 19 29 kΩ
R(opt5)
Resistors, individually programmable with ROM code, all port pins,
VCC = 3 V/5 V 19 37 56 kΩ
R(opt6)
Resistors, individually programmable with ROM code, all port pins,
values applicable for pulldown and pullup VCC = 3 V/5 V 38 75 113 kΩ
R(opt7)
values applicable for pulldown and pullup
VCC = 3 V/5 V 56 112 168 kΩ
R(opt8) VCC = 3 V/5 V 94 187 281 kΩ
R(opt9) VCC = 3 V/5 V 131 261 392 kΩ
R(opt10) VCC = 3 V/5 V 167 337 506 kΩ
NOTE 1: Optional resistors Roptx for pulldown or pullup are not programmed in standard OTP or EPROM devices MSP430P112 or PMS430E112.
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
PUC/POR
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
t(POR_Delay) 150 250 µs
TA = −40°C 1.5 2.4 V
V
POR
POR TA = 25°C
VCC = 3 V/5 V
1.2 2.1 V
VPOR
POR
TA = 85°C
V
CC
= 3 V/5 V
0.9 1.8 V
V(min) 0 0.4 V
t(reset) PUC/POR Reset is accepted internally 2µs
VCC
POR
V
t
VPOR
V
(min) POR
No POR
Figure 3. Power-On Reset (POR) vs Supply Voltage
1.8
2.1
2.4
0.9
1.2
1.5
0
0.5
1
1.5
2
2.5
3
−40 −20 0 20 40 60 80
Temperature [°C]
25°C
V POR [V]
Figure 4. VPOR vs Temperature
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
17
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
wake-up from lower power modes (LPMx)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
t(LPM0)/
t(LPM2)
Delay time
VCC = 3 V/5 V 100 ns
t(LPM3) Delay time RSel = 4, DCO = 3, MOD = 0 VCC = 3 V/5 V 2.6 6 µs
t(LPM4) RSel = 4, DCO = 3, MOD = 0 VCC = 3 V/5 V 2.8 6 µs
RAM
PARAMETER MIN NOM MAX UNIT
V(RAMh) CPU halted (see Note 1) 1.8 V
NOTE 1: This parameter defines the minimum supply voltage VCC when the data in the program memory RAM remains unchanged. No program
execution should happen during this supply voltage condition.
DCO (MSP430P112)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
f(DCO03)
Rsel = 0, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.12
MHz
f(DCO03) Rsel = 0, DCO = 3, MOD = 0, DCOR = 0, TA = 25°CVCC = 5 V 0.13 MHz
f(DCO13)
Rsel = 1, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.19
MHz
f(DCO13) Rsel = 1, DCO = 3, MOD = 0, DCOR = 0, TA = 25°CVCC = 5 V 0.21 MHz
f(DCO23)
Rsel = 2, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.31
MHz
f
(DCO23)
R
sel
= 2, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 0.34
MHz
f(DCO33)
Rsel = 3, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.5
MHz
f
(DCO33)
R
sel
= 3, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 0.55
MHz
f(DCO43)
Rsel = 4, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.5 0.8 1.1
MHz
f
(DCO43)
R
sel
= 4, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 0.6 0.9 1.2
MHz
f(DCO53)
Rsel = 5, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.9 1.2 1.55
MHz
f
(DCO53)
R
sel
= 5, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 1.1 1.4 1.7
MHz
f(DCO63)
Rsel = 6, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 1.7 2 2.3
MHz
f
(DCO63)
R
sel
= 6, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 2.1 2.4 2.7
MHz
f(DCO73)
Rsel = 7, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 2.8 3.1 3.5
MHz
f
(DCO73)
R
sel
= 7, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 3.8 4.2 4.5
MHz
f(DCO47)
Rsel = 4, DCO = 7, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V/5 V
FDCO40
FDCO40
FDCO40
MHz
f
(DCO47)
R
sel
= 4, DCO = 7, MOD = 0, DCOR = 0, T
A
= 25
°
C
V
CC
= 3 V/5 V
FDCO40
x1.8
FDCO40
x2.2
FDCO40
x2.6
MHz
S(Rsel) SR = fRsel+1/fRsel VCC = 3 V/5 V 1.4 1.65 1.9
ratio
S(DCO) SDCO = fDCO+1/fDCO VCC = 3 V/5 V 1.07 1.12 1.16
ratio
Dt
Temperature drift, Rsel = 4, DCO = 3,
VCC = 3 V −0.31 −0.36 −0.40
%/°C
D
t
Temperature drift, Rsel = 4, DCO = 3,
MOD = 0 (see Note 1) VCC = 5 V −0.33 −0.38 −0.43
%/
°
C
DVDrift with VCC variation, Rsel = 4, DCO = 3,
MOD = 0 (see Note 1) VCC = 3 V to 5 V 0 5 10 %/V
NOTE 1: These parameters are not production tested.
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
DCO (MSP430C111, C112)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
f(DCO03)
Rsel = 0, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.04 0.07 0.10
MHz
f(DCO03) Rsel = 0, DCO = 3, MOD = 0, DCOR = 0, TA = 25°CVCC = 5 V 0.04 0.07 0.10 MHz
f(DCO13)
Rsel = 1, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.08 0.13 0.18
MHz
f(DCO13) Rsel = 1, DCO = 3, MOD = 0, DCOR = 0, TA = 25°CVCC = 5 V 0.08 0.13 0.18 MHz
f(DCO23)
Rsel = 2, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.15 0.22 0.30
MHz
f
(DCO23)
R
sel
= 2, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 0.15 0.22 0.30
MHz
f(DCO33)
Rsel = 3, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.26 0.36 0.47
MHz
f
(DCO33)
R
sel
= 3, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 0.26 0.36 0.47
MHz
f(DCO43)
Rsel = 4, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.4 0.6 0.8
MHz
f
(DCO43)
R
sel
= 4, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 0.4 0.6 0.8
MHz
f(DCO53)
Rsel = 5, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 0.8 1.1 1.4
MHz
f
(DCO53)
R
sel
= 5, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 0.8 1.1 1.4
MHz
f(DCO63)
Rsel = 6, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 1.3 1.7 2.1
MHz
f
(DCO63)
R
sel
= 6, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 1.5 1.9 2.3
MHz
f(DCO73)
Rsel = 7, DCO = 3, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V 2.4 2.9 3.4
MHz
f
(DCO73)
R
sel
= 7, DCO = 3, MOD = 0, DCOR = 0, T
A
= 25
°
C
VCC = 5 V 3.1 3.8 4.5
MHz
f(DCO47)
Rsel = 4, DCO = 7, MOD = 0, DCOR = 0, TA = 25°C
VCC = 3 V/5 V
FDCO40
FDCO40
FDCO40
MHz
f
(DCO47)
R
sel
= 4, DCO = 7, MOD = 0, DCOR = 0, T
A
= 25
°
C
V
CC
= 3 V/5 V
FDCO40
x1.8
FDCO40
x2.2
FDCO40
x2.6
MHz
S(Rsel) SR = fRsel+1/fRsel VCC = 3 V/5 V 1.4 1.65 1.9
ratio
S(DCO) SDCO = fDCO+1/fDCO VCC = 3 V/5 V 1.07 1.12 1.16
ratio
Dt
Temperature drift, Rsel = 4, DCO = 3,
VCC = 3 V −0.31 −0.36 −0.40
%/°C
D
t
Temperature drift, Rsel = 4, DCO = 3,
MOD = 0 (see Note 1) VCC = 5 V −0.33 −0.38 −0.43
%/
°
C
DVDrift with VCC variation, Rsel = 4, DCO = 3,
MOD = 0 (see Note 1) VCC = 3 V to 5 V 0 5 10 %/V
NOTE 1: These parameters are not production tested.
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
35
VCC
Max
Min
Max
Min
f(DCOx7)
f(DCOx0)
Frequency Variance
01234567
DCO Steps
1
fDCOCLK
Figure 5. DCO Characteristics
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
19
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
main DCO characteristics
DIndividual devices have a minimum and maximum operation frequency. The specified parameters for
f(DCOx0) to f(DCOx7) are valid for all devices.
DAll ranges selected by Rsel(n) overlap with Rsel(n+1): Rsel0 overlaps Rsel1, ... Rsel6 overlaps Rsel7.
DDCO control bits DCO0, DCO1, and DCO2 have a step size as defined by parameter SDCO.
DModulation control bits MOD0 to MOD4 select how often f(DCO+1) is used within the period of 32 DCOCLK
cycles. The frequency f(DCO) is used for the remaining cycles. The frequency is an average equal to:
faverage +32 f(DCO) f(DCO)1)
MOD f(DCO))(32*MOD) f(DCO)1)
crystal oscillator, XIN, XOUT
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
CXIN Capacitance at input VCC = 3 V/5 V 12 pF
CXOUT Capacitance at output VCC = 3 V/5 V 12 pF
VIL
Input levels at XIN
VCC = 3 V/5 V (see Note 2)
VSS 0.2×VCC
V
VIH
Input levels at XIN
V
CC
= 3 V/5 V (see Note 2)
0.8×VCC VCC
V
NOTES: 1. The oscillator needs capacitors at both terminals, with values specified by the crystal manufacturer.
2. Applies only when using an external logic-level clock source. Not applicable when using a crystal or resonator.
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
20 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
EPROM Memory, P- and E- versions only (see Note 1)
PARAMETER TEST
CONDITIONS VCC MIN NOM MAX UNIT
V(PP) Programming voltage, applied to TEST/VPP 12 12.5 13 V
I(PP) Current from programming voltage source 70 mA
t(pps) Programming time, single pulse 5 ms
t(ppf) Programming time, fast algorithm 100 µs
P(n) Number of pulses for successful programming 4 100 Pulse
t(erase)
Erase time:
Wave length 2537 Å at 15 Ws/cm2
(UV lamp of 12 mW/ cm2)30 min
t(erase)
Write/erase cycles 1000 cycles
Data retention Tj < 55°C 10 Year
NOTES: 1. Refer to the Recommended Operating Conditions for the correct VCC during programming.
JTAG Interface
PARAMETER TEST
CONDITIONS VCC MIN NOM MAX UNIT
fTCK
TCK input frequency
see Note 1
3 V DC 5
MHz
fTCK TCK input frequency see Note 1 5 V DC 10 MHz
NOTES: 1. fTCK may be restricted to meet the timing requirements of the module selected.
JTAG Fuse (see Note 1)
PARAMETER TEST
CONDITIONS VCC MIN NOM MAX UNIT
VFB
Fuse blow voltage, C versions (see Note 2) 3 V/ 5 V 5.5 6
V
VFB Fuse blow voltage, E/P versions (see Note 2) 3 V/ 5 V 11 13 V
IFB Supply current into TEST/VPP during fuse blow 100 mA
tFB Time to blow fuse 1 ms
NOTES: 1. Once the fuse is blown, no further access to the MSP430 J TAG/Test and emulation features is possible. The JTAG block is switched
to bypass mode.
2. The fuse blow voltage is applied to the TEST/VPP pin.
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
21
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
input/output schematic
Port P1, P1.0 to P1.3, input/output with Schmitt-trigger
EN
D
(See Note 1)
(See Note 2)
(See Note 2)
(See Note 1)
GND
V
CC
P1.0 − P1.3
0
1
0
1
Interrupt
Edge
Select
EN
Set
Q
P1IE.x
P1IFG.x
P1IRQ.x
Interrupt
Flag P1IES.x
P1SEL.x
Module X IN
P1IN.x
P1OUT.x
Module X OUT
Direction Control
From Module
P1DIR.x
P1SEL.x
Pad Logic
NOTE: x = Bit Identifier, 0 to 3 For Port P1
PnSel.x PnDIR.x Dir. Control
from module PnOUT.x Module X
OUT PnIN.x Module X
IN PnIE.x PnIFG.x PnIES.x
P1Sel.0 P1DIR.0 P1DIR.0 P1OUT.0 VSS P1IN.0 TACLK†P1IE.0 P1IFG.0 P1IES.0
P1Sel.1 P1DIR.1 P1DIR.1 P1OUT.1 Out0 signal†P1IN.1 CCI0A†P1IE.1 P1IFG.1 P1IES.1
P1Sel.2 P1DIR.2 P1DIR.2 P1OUT.2 Out1 signal†P1IN.2 CCI1A†P1IE.2 P1IFG.2 P1IES.2
P1Sel.3 P1DIR.3 P1DIR.3 P1OUT.3 Out2 signal†P1IN.3 CCI2A†P1IE.3 P1IFG.3 P1IES.3
†Signal from or to Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions.
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory.
CMOS INPUT (RST/NMI)
VCC
(see Note 1)
(see Note 1)
GND
(see Note 2)
(see Note 2)
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
22 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
input/output schematic (continued)
Port P1, P1.4 to P1.7, input/output with Schmitt-trigger and in-system access features
EN
D
See Note 1
See Note 2
See Note 2
See Note 1
GND
VCC
P1.4−P1.7
0
1
0
1
Interrupt
Edge
Select
EN
Set
Q
P1IE.x
P1IFG.x
P1IRQ.x
Interrupt
Flag P1IES.x
P1SEL.x
Module X IN
P1IN.x
P1OUT.x
Module X OUT
Direction Control
From Module
P1DIR.x
P1SEL.x
Pad Logic
Bus Keeper
TST
Fuse 60 kΩ
Fuse
Blow
Control
VPP_Internal
Control By JTAG
0
1
TDO
Controlled By JTAG
P1.x
TDI P1.x
TST
TST
TMS TST
TCK TST
Controlled by JTAG
TS
T
P1.x
P1.x
P1.7/TDI/TDO
P1.6/TDI
P1.5/TMS
P1.4/TCK
Typical
TEST/VPP
GND
N
OTES:The test pin should be protected from potential EMI and
ESD voltage spikes. This may require a smaller
external pulldown resistor in some applications.
x = Bit identifier, 4 to 7 for port P1
During programming activity and during blowing the
fuse, the pin TDO/TDI is used to apply the test input
for JTAG circuitry.
PnSel.x PnDIR.x Dir. Control
from module PnOUT.x Module X
OUT PnIN.x Module X
IN PnIE.x PnIFG.x PnIES.x
P1Sel.4 P1DIR.4 P1DIR.4 P1OUT.4 SMCLK P1IN.4 unused P1IE.4 P1IFG.4 P1IES.4
P1Sel.5 P1DIR.5 P1DIR.5 P1OUT.5 Out0 signal†P1IN.5 unused P1IE.5 P1IFG.5 P1IES.5
P1Sel.6 P1DIR.6 P1DIR.6 P1OUT.6 Out1 signal†P1IN.6 unused P1IE.6 P1IFG.6 P1IES.6
P1Sel.7 P1DIR.7 P1DIR.7 P1OUT.7 Out2 signal†P1IN.7 unused P1IE.7 P1IFG.7 P1IES.7
†Signal from or to Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions.
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory.
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
23
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
input/output schematic (continued)
Port P2, P2.0 to P2.4, input/output with Schmitt-trigger
EN
D
See Note 1
See Note 2
See Note 2
See Note 1
GND
V
CC
P2.0 − P2.4
0
1
0
1
Interrupt
Edge
Select
EN
Set
Q
P2IE.x
P2IFG.x
P2IRQ.x
Interrupt
Flag P2IES.x
P2SEL.x
Module X IN
P2IN.x
P2OUT.x
Module X OUT
Direction Control
From Module
P2DIR.x
P2SEL.x
Pad Logic
NOTE: x = Bit Identifier, 0 to 4 For Port P2
0: Input
1: Output
PnSel.x PnDIR.x Dir. Control
from module PnOUT.x Module X
OUT PnIN.x Module X
IN PnIE.x PnIFG.x PnIES.x
P2Sel.0 P2DIR.0 P2DIR.0 P2OUT.0 ACLK P2IN.0 unused P2IE.0 P2IFG.0 P1IES.0
P2Sel.1 P2DIR.1 P2DIR.1 P2OUT.1 VSS P2IN.1 INCLK†P2IE.1 P2IFG.1 P1IES.1
P2Sel.2 P2DIR.2 P2DIR.2 P2OUT.2 Out0 signal†P2IN.2 CCI0B†P2IE.2 P2IFG.2 P1IES.2
P2Sel.3 P2DIR.3 P2DIR.3 P2OUT.3 Out1 signal†P2IN.3 CCI1B†P2IE.3 P2IFG.3 P1IES.3
P2Sel.4 P2DIR.4 P2DIR.4 P2OUT.4 Out2 signal†P2IN.4 unused P2IE.4 P2IFG.4 P1IES.4
†Signal from or to Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions.
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory.
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
24 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
input/output schematic (continued)
Port P2, P2.5, input/output with Schmitt-trigger and ROSC function for the Basic Clock module
EN
D
See Note 1
See Note 2
See Note 2
See Note 1
GND
VCC
P2.5
0
1
0
1
Interrupt
Edge
Select
EN
Set
Q
P2IE.5
P2IFG.5
P2IRQ.5
Interrupt
Flag P2IES.5
P2SEL.5
Module X IN
P2IN.5
P2OUT.5
Module X OUT
Direction Control
From Module
P2DIR.5
P2SEL.5 Pad Logic
NOTE: DCOR: Control bit from basic clock module if it is set, P2.5 is disconnected from P2.5 pad
Bus Keeper
0
1
01
VCC
Internal to
Basic Clock
Module
DCOR DC
Generator
0: Input
1: Output
PnSel.x PnDIR.x Director
Control from
module PnOUT.x Module X
OUT PnIN.x Module X
IN PnIE.x PnIFG.x PnIES.x
P2Sel.5 P2DIR.5 P2DIR.5 P2OUT.5 VSS P2IN.5 unused P2IE.5 P2IFG.5 P2IES.5
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions.
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory.
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
25
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
input/output schematic (continued)
Port P2, un-bonded bits P2.6 and P2.7
EN
D
0
1
0
1
Interrupt
Edge
Select
EN
Set
Q
P2IE.x
P2IFG.x
P2IRQ.x
Interrupt
Flag P2IES.x
P2SEL.x
Module X IN
P2IN.x
P2OUT.x
Module X OUT
Direction Control
From Module
P2DIR.x
P2SEL.x
Bus Keeper
0
1
0: Input
1: Output
Node Is Reset With PUC
PUC
NOTE: x = Bit identifier, 6 to 7 for Port P2 without external pins
P2Sel.x P2DIR.x Dir. Control
from module P2OUT.x Module X
OUT P2IN.x Module X
IN P2IE.x P2IFG.x P2IES.x
P2Sel.6 P2DIR.6 P2DIR.6 P2OUT.6 VSS P2IN.6 unused P2IE.6 P2IFG.6 P2IES.6
P2Sel.7 P2DIR.7 P2DIR.7 P2OUT.7 VSS P2IN.7 unused P2IE.7 P2IFG.7 P2IES.7
NOTE: A good use of the unbonded bits 6 and 7 of port P2 is to use the interrupt flags. The interrupt flags can not be influenced from any signal
other than from software. They work then as soft interrupt.
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
26 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
JTAG fuse check mode
MSP430 devices that have the fuse on the TEST terminal have a fuse check mode that tests the continuity of
the fuse the first time the JTAG port is accessed after a power-on reset (POR). When activated, a fuse check
current, ITF, of 1 mA at 3 V, 2.5 mA at 5 V can flow from the TEST pin to ground if the fuse is not burned. Care
must be taken to avoid accidentally activating the fuse check mode and increasing overall system power
consumption.
When the TEST pin is taken back low after a test or programming session, the fuse check mode and sense
currents are terminated.
Activation of the fuse check mode occurs with the first negative edge on the TMS pin after power up or if TMS
is being held low during power up. The second positive edge on the TMS pin deactivates the fuse check mode.
After deactivation, the fuse check mode remains inactive until another POR occurs. After each POR the fuse
check mode has the potential to be activated.
The fuse check current will only flow when the fuse check mode is active and the TMS pin is in a low state (see
Figure 6). Therefore, the additional current flow can be prevented by holding the TMS pin high (default
condition).
Time TMS Goes Low After POR
TMS
ITF
ITEST
Figure 6. Fuse Check Mode Current, MSP430x11x
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
27
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
16 PIN SHOWN
4040000/D 02/98
Seating Plane
0.400 (10,15)
0.419 (10,65)
0.104 (2,65) MAX
1
0.012 (0,30)
0.004 (0,10)
A
8
16
0.020 (0,51)
0.014 (0,35)
0.293 (7,45)
0.299 (7,59)
9
0.010 (0,25)
0.050 (1,27)
0.016 (0,40)
(15,24)
(15,49)
PINS **
0.010 (0,25) NOM
A MAX
DIM
A MIN
Gage Plane
20
0.500
(12,70)
(12,95)
0.510
(10,16)
(10,41)
0.400
0.410
16
0.600
24
0.610
0.004 (0,10)
M
0.010 (0,25)
0.050 (1,27)
0°−ā8°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-013
SLAS196D− DECEMBER 1998 − REVISED SEPTEMBER 2004
28 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MSP430C111IDW, MSP430C112IDW, MSP430P112IDW pin out
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
TEST/VPP
VCC
P2.5/ROSC
VSS
XOUT/TCLK
XIN
RST/NMI
P2.0/ACLK
P2.1/INCLK
P2.2/TA0
P1.7/TA2/TDO/TDI
P1.6/TA1/TDI
P1.5/TA0/TMS
P1.4/SMCLK/TCK
P1.3/TA2
P1.2/TA1
P1.1/TA0
P1.0/TACLK
P2.4/TA2
P2.3/TA1
DW PACKAGE
(TOP VIEW)
PMS430E112 pin out
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
TEST/VPP
VCC
P2.5/ROSC
VSS
XOUT/TCLK
XIN
RST/NMI
P2.0/ACLK
P2.1/INCLK
P2.2/TA0
P1.7/TA2/TDO/TDI
P1.6/TA1/TDI
P1.5/TA0/PMS
P1.4/SMCLK/TCK
P1.3/TA2
P1.2/TA1
P1.1/TA0
P1.0/TACLK
P2.4/TA2
P2.3/TA1
JL PACKAGE
(TOP VIEW)
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MSP-EVK430A110 OBSOLETE 0 TBD Call TI Call TI
MSP430C111IDW OBSOLETE SOIC DW 20 TBD Call TI Call TI
MSP430P112AY OBSOLETE DIESALE Y 0 TBD Call TI Call TI
MSP430P112IDW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PMS430E112JL OBSOLETE CDIP JL 20 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 4-May-2009
Addendum-Page 1
MECHANICAL DATA
MCER003A – JANUARY 1997
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JL (R-GDIP-T20) CERAMIC DUAL-IN-LINE PACKAGE
0.200 (5,08) MAX
0.310 (7,87)
0.290 (7,37)
0.130 (3,30) MIN
0.008 (0,20)
0.014 (0,36)
Seating Plane
4040109/C 08/96
11
0.020 (0,51) MIN
Window
10
0.015 (0,38)
0.050 (1,27)
0.050 (1,27)
0.015 (0,38)
0.975 (24,76)
0.930 (23,62)
20
1
0.023 (0,58)
0.015 (0,38)
0.245 (6,22)
0.300 (7,62)
0.100 (2,54) 0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification only on press ceramic glass frit seal only
E. Falls within MIL-STD-1835 GDIP1-T20
IMPORTANT NOTICE
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