MCT6, MCT61, MCT62 Dual Phototransistor Optocouplers Features Description Two isolated channels per package The MCT6X Optocouplers have two channels for density applications. For four channel applications, two-packages fit into a standard 16-pin DIP socket. Each channel is an NPN silicon planar phototransistor optically coupled to a gallium arsenide infrared emitting diode. Two packages fit into a 16 lead DIP socket Choice of three current transfer ratios Underwriters Laboratory (U.L.) recognized File E90700 VDE approved for IEC60747-5-2 Applications AC line/digital logic - isolate high voltage transients Digital logic/digital logic - eliminate spurious grounds Digital logic/AC triac control - isolate high voltage transients Twisted pair line receiver - eliminate ground loop feedthrough Telephone/telegraph line receiver - isolate high voltage transients High frequency power supply feedback control - maintain floating grounds and transients Relay contact monitor - isolate floating grounds and transients Power supply monitor - isolate transients Schematic Package Outlines ANODE 1 8 EMITTER 8 1 CATHODE 2 7 COLLECTOR CATHODE 3 6 COLLECTOR 8 8 1 ANODE 4 5 EMITTER 1 Equivalent Circuit (c)2006 Fairchild Semiconductor Corporation MCT6, MCT61, MCT62 Rev. 1.0.5 www.fairchildsemi.com MCT6, MCT61, MCT62 -- Dual Phototransistor Optocouplers February 2010 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Rating Value Unit Storage Temperature -55 to +150 C TOPR Operating Temperature -55 to +100 C TSOL Lead Solder Temperature (Refer to Reflow Temperature Profile) 260 for 10 sec C 400 mW 5.33 mW/C Forward Current - Continuous 60 mA Forward Current - Peak (PW = 1s, 300pps) 3 A Reverse Voltage 3.0 V LED Power Dissipation @ TA = 25C 100 mW Derate above 25C (Total Input) 1.3 mW/C Collector Current - Continuous 30 mA Detector Power Dissipation @ TA = 25C 150 mW 2.0 mW/C TOTAL DEVICE TSTG PD Total Device Power Dissipation @ TA = 25C Derate above 25C EMITTER (Each channel) IF IF(pk) VR PD DETECTOR (Each channel) IC PD Derate above 25C (c)2006 Fairchild Semiconductor Corporation MCT6, MCT61, MCT62 Rev. 1.0.5 www.fairchildsemi.com 2 MCT6, MCT61, MCT62 -- Dual Phototransistor Optocouplers Absolute Maximum Ratings Individual Component Characteristics Symbol Parameter Test Conditions Min. Typ.* Max. Units 1.2 1.5 V 10 A EMITTER VF Input Forward Voltage IF = 20mA VR Reverse Voltage IR = 10A IR Reverse Current VR = 5V CJ Junction Capacitance VF = 0V, f = 1MHz 3.0 25 V 0.001 50 pF DETECTOR BVCEO Collector-Emitter Breakdown Voltage IC = 1.0mA, IF = 0 30 85 V BVECO Emitter-Collector Breakdown Voltage IE = 100A, IF = 0 6 13 V ICEO Collector-Emitter Dark Current VCE = 10V, IF = 0 5 CCE Capacitance VCE = 0V, f = 1MHz 8 100 nA pF Transfer Characteristics Symbol Characteristic Test Conditions Min. Typ.* Max. Units SWITCHING CHARACTERISTICS (AC) ton Non-Saturated Turn-on Time toff Non-Saturated Turn-off Time RL = 100, IC = 2mA, VCC = 10V 2.4 s 2.4 s CURRENT TRANSFER RATIO, COLLECTOR-EMITTER (DC) CTR MCT6 IF = 10mA, VCE = 10V 20 MCT61 IF = 5mA, VCE = 5V 50 MCT62 VCE(sat) Saturation Voltage % 100 IF = 16mA, IC = 2mA 0.15 0.40 V Isolation Characteristics Symbol VISO Characteristic Input-Output Isolation Voltage Test Conditions Min. Typ.* Max. Units II-O 10A, t = 1min. 5000 Vac(rms) 1011 RISO Isolation Resistance VI-O = 500VDC CISO Isolation Capacitance f = 1MHz 0.5 pF *All typicals at TA = 25C (c)2006 Fairchild Semiconductor Corporation MCT6, MCT61, MCT62 Rev. 1.0.5 www.fairchildsemi.com 3 MCT6, MCT61, MCT62 -- Dual Phototransistor Optocouplers Electrical Characteristics (TA = 25C unless otherwise specified) MCT6, MCT61, MCT62 -- Dual Phototransistor Optocouplers Typical Performance Curves Fig. 2 Normalized CTR vs. Ambient Temperature Fig. 1 Normalized CTR vs. Forward Current 1.6 1.4 VCE = 5.0V TA = 25C 1.4 1.0 NORMALIZED CTR NORMALIZED CTR 1.2 Normalized to IF = 10mA 0.8 0.6 0.4 IF = 5mA 1.2 1.0 IF = 10mA 0.8 0.6 0.2 0.0 0 5 10 15 IF - FORWARD CURRENT (mA) Normalized to IF = 10mA TA = 25C 0.4 -75 20 -50 -25 0 25 50 75 100 TA - AMBIENT TEMPERATURE (C) IF = 10mA VCC = 10V TA = 25C VCE = 10V SWITCHING SPEED (s) ICEO - COLLECTOR-EMITTER DARK CURRENT (A) 1000 1 10 0 10 -1 10 -2 10 -3 10 -4 10 125 Fig. 4 Switching Speed vs. Load Resistor Fig. 3 Dark Current vs. Ambient Temperature 10 IF = 20mA 100 Toff Tf 10 Ton 1 Tr -5 10 -6 0 25 50 75 100 0.1 125 0.1 1 10 R - LOAD RESISTOR (k) TA - AMBIENT TEMPERATURE (C) 100 Fig. 6 Collector-Emitter Saturation Voltage vs. Collector Current Fig. 5 LED Forward Voltage vs. Forward Current 1.8 100 TA = 25C VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) VF - FORWARD VOLTATGE (V) 1.7 1.6 1.5 1.4 TA = 55C 1.3 TA = 25C 1.2 10 1 IF = 2.5mA 0.1 IF = 20mA 0.01 IF = 10mA 1.1 IF = 5mA TA = 100C 1.0 1 10 IF - LED FORWARD CURRENT (mA) (c)2006 Fairchild Semiconductor Corporation MCT6, MCT61, MCT62 Rev. 1.0.5 0.001 0.01 100 0.1 1 10 IC - COLLECTOR CURRENT (mA) www.fairchildsemi.com 4 Through Hole Surface Mount 9.18~10.18 (0.405) 9.18~10.18 (0.405) Pin 1 Pin 1 6.00~7.00 6.00~7.00 3.00~4.00 1.15~1.35 3.00~4.00 4.50 (Typ.) 1.15~1.35 0.35 Typ. 1.00 (Typ.) 2.30~3.30 3.85 Typ. 0.26 Typ. 2.29~2.79 0.40~0.60 7.62 (Typ.) 0.40~0.60 15 (Max.) 2.29~2.79 0.75~1.25 (Both sides 8.15 (Typ.) 9.86~10.46 0.26 (Typ.) 0.4" Lead Spacing Recommend Pad Layout for Surface Mount Leadform 9.18~10.18 (0.405) Pin 1 (1.50) (2.54) 6.00~7.00 (1.30) (10.50) (7.90) 3.00~4.00 1.15~1.35 4.60 (Typ.) (1.04) 15 (Max.) 1.10 (Typ.) 2.30~3.30 2.29~2.79 0.40~0.60 10.16 (Typ.) 0.26 (Typ.) Note: All dimensions are in millimeters. (c)2006 Fairchild Semiconductor Corporation MCT6, MCT61, MCT62 Rev. 1.0.5 www.fairchildsemi.com 5 MCT6, MCT61, MCT62 -- Dual Phototransistor Optocouplers Package Dimensions Option Example Part Number No Option MTC6 S MTC6S Description Standard Through Hole Surface Mount Lead Bend SD MTC6SD Surface Mount; Tape and Reel 300 MCT6300 VDE Approved 3S MCT63S Surface Mount Lead Bend; VDE Approved 3SD MCT63SD 300W MTC6300W Surface Mount; Tape and Reel; VDE Approved 0.4" Lead Spacing; VDE Approved Marking Information 1 V 3 MCT6 2 XX YY T1 6 4 5 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) 4 Two digit year code, e.g., `03' 5 Two digit work week ranging from `01' to `53' 6 Assembly package code (c)2006 Fairchild Semiconductor Corporation MCT6, MCT61, MCT62 Rev. 1.0.5 www.fairchildsemi.com 6 MCT6, MCT61, MCT62 -- Dual Phototransistor Optocouplers Ordering Information 12.0 0.1 4.90 0.20 0.30 0.05 4.0 0.1 4.0 0.1 O1.55 0.05 1.75 0.10 7.5 0.1 13.2 0.2 10.30 0.20 0.1 MAX 10.30 0.20 16.0 0.3 O1.6 0.1 User Direction of Feed Note: All dimensions are in inches (millimeters) (c)2006 Fairchild Semiconductor Corporation MCT6, MCT61, MCT62 Rev. 1.0.5 www.fairchildsemi.com 7 MCT6, MCT61, MCT62 -- Dual Phototransistor Optocouplers Carrier Tape Specifications MCT6, MCT61, MCT62 -- Dual Phototransistor Optocouplers Reflow Profile Temperature (C) TP 260 240 TL 220 200 180 160 140 120 100 80 60 40 20 0 Max. Ramp-up Rate = 3C/S Max. Ramp-down Rate = 6C/S tP Tsmax tL Preheat Area Tsmin ts 120 240 360 Time 25C to Peak Time (seconds) Profile Feature Pb-Free Assembly Profile Temperature Min. (Tsmin) 150C Temperature Max. (Tsmax) 200C Time (tS) from (Tsmin to Tsmax) 60-120 seconds Ramp-up Rate (tL to tP) 3C/second max. Liquidous Temperature (TL) 217C Time (tL) Maintained Above (TL) 60-150 seconds Peak Body Package Temperature 260C +0C / -5C Time (tP) within 5C of 260C 30 seconds Ramp-down Rate (TP to TL) 6C/second max. Time 25C to Peak Temperature (c)2006 Fairchild Semiconductor Corporation MCT6, MCT61, MCT62 Rev. 1.0.5 8 minutes max. www.fairchildsemi.com 8 AccuPower Auto-SPM Build it Now CorePLUS CorePOWER CROSSVOLT CTL Current Transfer Logic DEUXPEED(R) Dual CoolTM EcoSPARK(R) EfficientMax (R) Fairchild(R) Fairchild Semiconductor(R) FACT Quiet Series FACT(R) (R) FAST FastvCore FETBench FlashWriter(R)* FPS F-PFS (R) FRFET SM Global Power Resource Green FPS Green FPS e-Series Gmax GTO IntelliMAX ISOPLANAR MegaBuck MICROCOUPLER MicroFET MicroPak MicroPak2 MillerDrive MotionMax Motion-SPM OptoHiTTM OPTOLOGIC(R) OPTOPLANAR(R) (R) PDP SPMTM Power-SPM PowerTrench(R) PowerXSTM Programmable Active Droop (R) QFET QS Quiet Series RapidConfigure Saving our world, 1mW/W/kW at a timeTM SignalWise SmartMax SMART START SPM(R) STEALTH SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SupreMOS SyncFET Sync-LockTM (R) * The Power Franchise (R) TinyBoost TinyBuck TinyCalc TinyLogic(R) TINYOPTO TinyPower TinyPWM TinyWire TriFault Detect TRUECURRENT * SerDes (R) UHC Ultra FRFET UniFET VCX VisualMax XSTM * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 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Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I47 (c)2006 Fairchild Semiconductor Corporation MCT6, MCT61, MCT62 Rev. 1.0.5 www.fairchildsemi.com 9 MCT6, MCT61, MCT62 -- Dual Phototransistor Optocouplers TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.