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08
Press-in
technology
D-Sub PCB press-fit version Technical characteristics
Current carrying capacity
The current carrying capacity is limited by maximum temperature
of materials for inserts and contacts including terminals.
The current capacity-curve is valid for continuous, not interrupted
current-loaded contacts of connectors when simultaneous power
on all contacts is given, without exceeding the maximum tempera-
ture.
Control and test procedures according to DIN IEC 60 512.
Contact arrangement View from termination side
Mating conditions as per DIN 41 652
M = Male connector
F = Female connector
Working current
Ambient temperature
Example: 25 way connector
ÀStamped contacts
Number of contacts 9, 15, 25, 37, 50
UL recognized
Working current
see current carrying capacity chart
Stamped contacts 6.5 A max.
Test voltage Ur.m.s. 1 kV
Clearance and creepage ≥1.0 mm
Contact resistance ≤10 mΩ
Insulation resistance ≥1010 Ω
Temperature range -55 OC … + 125 OC
The higher temperature limit includes the local ambient and
heating effect of the contacts under load
Terminations Recommended PCB through holes
Materials
Mouldings and hoods
Liquid Crystal Polymer (LCP)
UL 94-V0
Contacts Copper alloy
Contact surface1)
Contact zone: selectively gold-
plated acc. to performance level
1)
Termination zone: Ni
Metal shell Tinned steel
Insertion and withdrawal force
Connector on P.C.B.
Press-in without grounding pins
– insertion max. per contact:
≤120 N
– withdrawal min. per contact:
≤20 N
Press-in with grounding pins
– insertion max. per grounding pin:
≤250 N
– withdrawal min. per grounding pin
:≤30 N
Mating force 9 way ≤30 N
15 way ≤50 N
25 way ≤83 N
37 way ≤123 N
50 way ≤167 N
1) Performance level 3 as per DIN 41 652, part 2, ≥50 mating cycles, no gas test
Performance level 2 as per DIN 41 652, part 2, ≥200 mating cycles, 4 days gas test using 10 ppm SO2
Other performance levels on request
Press-in pin Grounding pin
Tin-lead plated PCB
Hole 1.15-0.03 3.15±0.025
Cu 25-75 µm 25-75 µm
Sn 5-15 µm 4-10 µm
Plated hole 0.94-1.09 mm 3.0-3.15 mm
Chemical
Hole 1.15-0.03 3.15±0.025
tin-plated PCB
Sn 25-50 µm 25-50 µm
Plated hole 1.00-1.10 mm 3.0-3.15 mm
Au / Ni plated PCB
Hole 1.15-0.03 3.15±0.025
Cu 25-50 µm 25-50 µm
Ni 3-7 µm 4-7 µm
Au 0.05-0.12 µm 0.05-0.12 µm
Plated hole 1.00-1.10 mm 3.0-3.15 mm
Silver plated PCB
Hole 1.15-0.03 3.15±0.025
Cu 25-50 µm 25-50 µm
Ag 0.1-0.3 µm 0.1-0.3 µm
Plated hole 1.00-1.10 mm 3.0-3.15 mm
OSP
Hole 1.15-0.03 3.15±0.025
copper plated PCB
Cu 25-50 µm 25-50 µm
Plated hole 1.00-1.10 mm 3.0-3.15 mm
PCB board thickness: 1.6- 3.2 mm
37 way 50 way
9 way
15 way
25 way