GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
Document Number 88612 www.vishay.com
13-Feb-02 1
Glass Passivated Single-Phase
Bridge Rectifier Reverse Voltage 50 and 1000V
Forward Current 12 to 35A
Mechanical Data
Case: Molded plastic with heatsink integrally mounted in
the bridge encapsulation
Terminals: Either plated 0.25” (6.35mm) Faston lugs or
plated copper leads 0.040” (1.02mm) diameter. Suffix letter
“W” added to indicate wire leads (e.g. GBPC12005W)
Mounting Position: See NOTE 2
Polarity: Polarity symbols molded on body
Mounting Torque: 20 in. - lb. max.
Weight: 0.53 ounce, 15 grams
Packaging codes/options:
1/100 EA. per Bulk Box
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• This series is UL listed under the Recognized
Component Index, file number E54214
• Integrally molded heatsink provides very low thermal
resistance for maximum heat dissipation
• Universal 3-way terminals; snap-on, wire wrap-around,
or P.C.B. mounting
• High forward surge current capability
• Glass passivated chip junctions
• Typical IRless than 0.3µA
• High temperature soldering guaranteed:
260°C/10 seconds at 5lbs. (2.3kg) tension
1.135 (28.8)
1.115 (28.3)
0.732 (18.6)
0.692 (17.6)
0.470 (11.9)
0.430 (10.9)
0.042 (1.07)
0.038 (0.97)
DIA.
0.310 (7.62)
0.290 (7.36)
1.25
(31.8)
MIN.
1.135 (28.8)
1.115 (28.3) 0.732 (18.6)
0.692 (17.6)
Hole for
#10 Screw
0.220 (5.59)
0.200 (5.08)DIA. 0.24 (6.0)
0.18 (4.6)
0.50 (12.7)
0.44 (11.7)
0.24 (6.0)
0.18 (4.6)
GBPC-W
1.135 (28.8)
1.115 (28.3)
0.672 (17.1)
0.632 (16.1)
0.732 (18.6)
0.692 (17.6)
0.094 (2.4)
DIA.
0.034 (0.86)
0.030 (0.76)
0.25
(6.35)
AC
0.840 (21.3)
0.740 (18.8)
0.582 (14.8)
0.542 (13.8)
0.672 (17.1)
0.632 (16.1)
1.135 (28.8)
1.115 (28.3)
Hole for
#10 Screw
0.220 (5.59)
0.200 (5.08)DIA.
0.310 (7.62)
0.290 (7.36)
GBPC
Dimensions in inches and (millimeters)
GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com Document Number 88612
213-Feb-02
Maximum Ratings and Thermal Characteristics(TA= 25°C unless otherwise noted)
GBPC12, 15, 25, 35
Symbols 005 01 02 04 06 08 10 Units
Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V
Maximum average forward GBPC12 12
rectified output current GBPC15 IF(AV) 15 A
(See Fig.1) GBPC25 25
GBPC35 35
Peak forward surge current single GBPC12 200
sine-wave superimposed on GBPC15 IFSM 300 A
rated load (JEDEC Method) GBPC25 300
GBPC35 400
Rating (non-repetitive, for t GBPC12 160
greater than 1ms and less GBPC15 I2t375 A2 sec
than 8.3ms) for fusing GBPC25 375
GBPC35 660
RMS isolation voltage from case to leads VISO 2500 V
Typical thermal resistance per leg (1) GBPC12-25 RΘJC 1.9 °C/W
GBPC35 1.4
Operating junction storage temperature range TJ, TSTG -55 to +150 °C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
GBPC12, 15, 25, 35
Symbols 005 01 02 04 06 08 10 Units
Maximum instantaneous GBPC12 IF=6.0A
forward voltage drop per GBPC15 IF=7.5A VF1.1 V
leg at GBPC25 IF=12.5A
GBPC35 IF=17.5A
Maximum reverse DC current at rated TA=25°C 5.0
DC blocking voltage per leg TA=125°CIR500 µA
Typical junction capacitance per leg at 4V, 1MHZCJ300 pF
Notes:
(1) Thermal resistance from junction to case per leg
(2) Bolt down on heatsink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with #10 screw
GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
Document Number 88612 www.vishay.com
13-Feb-02 3
Ratings and
Characteristic Curves(TA= 25°C unless otherwise noted)
Case Temperature (°C)
Fig. 1 — Maximum Output
Rectified Current
Average Forward Current (A)
Fig. 3 — Maximum Power Dissipation
Average Output Current (A)
Average Power Dissipation of Bridge (W)
Number of Cycles at 60 HZ
Peak Forward Surge Current (A)
Fig. 4 — Maximum Non-Repetitive
Peak Forward Surge Current Per Leg
Ambient Temperature (°C)
Fig. 2 — Maximum Output
Rectified Current
Average Forward Current (A)
025 50 75 100 125 150 175 200
0
5
10
15
20
25
30
35
40
Bridges Mounted on
9.5 x 3.5 x 4.6"
(22.9 x 8.9 x 11.7cm)
AL. Finned Plate
5 x 6 x 4.9"
AL, Finned Plate
5 x 4 x 3"
AL. Finned Plate
6 x 2.2 x 2.2"
AL. Finned Plate
010 20 30 40 50 60 70 80 90 100
0
5
10
15
20
25
30
35
40
60 HZ Resistive or
Inductive Load
GBPC35
RthS-A = 0.5°C/W
GBPC25
RthS-A = 0.5°C/W
GBPC15
RthS-A = 1.0°C/W
GBPC12
RthS-A = 1.0°C/W
010 20 30 40
0
10
20
30
40
50
60
70
80
Capacitive Load
TJ = TJ max.
Resistive or
Inductive Load
110 100
100
500
1.0 Cycle
GBPC35
TJ = TJ max.
0.5 Single Sine-Wave
(JEDEC Method)
GBPC15
GBPC25
GBPC12
60 HZ Resistive or
Inductive Load
GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com Document Number 88612
413-Feb-02
Ratings and
Characteristic Curves(TA= 25°C unless otherwise noted)
Fig. 5 — Typical Instantaneous
Forward Characteristics Per Leg
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Percent of Rated Peak Reverse Voltage (V)
Instantaneous Reverse Leakage
Current (µA)
Fig. 6 — Typical Reverse Leakage
Characteristics Per Leg
Fig. 8 — Typical Transient
Thermal Impedance Per Leg
t, Heating Time, sec.
Reverse Voltage (V)
Junction Capacitance (pF)
Transient Thermal Impedance (°CW)
Fig. 7 — Typical Junction
Capacitance Per Leg
0.01 0.1 110 100
1
10
100
1,000
0.4 0.6 0.8 11.2 1.4 1.6
0.01
0.1
1
10
100
TJ = 25°C
Pulse Width = 300µs
1% Duty Cycle
020 40 60 80 100
0.01
0.1
1
10
100
50 - 400V
600 - 1000V
110 100
50
100
600
TJ = 25°C
f = 1.0MHZ
Vsig = 50MVp-p
TJ = 25°C
f = 1.0MHZ
Vsig = 50MVp-p
TJ = 150°C
TJ = 125°C
TJ = 25°C
