INSULATED GATE BIPOLAR TRANSISTOR
11/18/04
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IRGB4B60KPbF
IRGS4B60KPbF
IRGSL4B60KPbF
VCES = 600V
IC = 6.8A, TC=100°C
tsc > 10µs, TJ=150°C
VCE(on) typ. = 2.1V
Features
• Low VCE (on) Non Punch Through IGBT Technology.
• 10µs Short Circuit Capability.
• Square RBSOA.
• Positive VCE (on) Temperature Coefficient.
• Maximum Junction Temperature rated at 175°C.
• Lead-Free.
Benefits
• Benchmark Efficiency for Motor Control.
• Rugged Transient Performance.
• Low EMI.
• Excellent Current Sharing in Parallel Operation.
D2Pak
IRGS4B60KPbF TO-262
IRGSL4B60KPbF
TO-220
IRGB4B60KPbF
E
C
G
n-channel
Absolute Maximum Ratings
Parameter Max. Units
V
CES
Collec to r-to- Emi tt er Volt age 600 V
I
C
@ T
C
= 25 °C Cont inuo us Col lecto r Current 12
I
C
@ T
C
= 100°C Continuous Collector Current 6.8 A
I
CM
Pulse Collector Current (Ref.Fig.C.T.5) 24
I
LM
Cla m ped Indu c tiv e Load cu r r en t
c
24
V
GE
Gate-to-Emitter Voltage ±20 V
P
D
@ T
C
= 25 °C Maximum Power Dissipation 63 W
P
D
@ T
C
= 100°C Maximum Power Dissipation 31
T
J
Operating Junction and -55 to +175
T
STG
Storage Temperature Range °C
So ldering Tem peratu r e, for 10 se c. 300 ( 0.06 3 i n . ( 1.6m m ) fr o m ca se)
Thermal / Mechanical Characteristics
Parameter Min. Typ. Max. Units
RθJC Junction-to-Case- IGBT ––– ––– 2.4 °C/W
RθCS Case-to-Sin k, fl at, grease d surface ––– 0.50 –––
RθJA Junction-to-Ambient ––– –– 62
RθJA Junction-to-Ambient (PCB Mount, steady state)
d
––– –– 40
Wt Weight –– 1.44 ––– g
PD - 95643A
IRGB/S/SL4B60KPbF
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Note to are on page 16
Electrical Characteristics @ T
= 25°C (unless otherwise specified)
P arameter M in. Typ. Ma x. U nits C on d itions Ref.Fig.
V(BR)CES Collector-to-Emitter Breakdown Voltage 600 V VGE = 0V, IC = 500µA
V(BR)CES/TJ
Tempera ture C o eff. o f Br ea kdo w n V o ltage
—0.28V/°C
VGE = 0V , IC = 1mA (2C-150°C)
—2.12.5 IC = 4.0A, V GE = 15V, TJ = 25°C 5,6,7
VCE(on) Collector-to- Emitte r Voltage 2.5 2 .8 V IC = 4.0 A, VGE = 15V, TJ = 150°C 9,10,11
—2.62.8 IC = 4.0A, V GE = 15V, TJ = 17C
VGE(th) G ate T h r esh o l d Vo l ta g e 3 .5 4. 5 5 . 5 V VCE = V GE, IC = 250µA 9,10,11
VGE(th)/
TJThreshold Voltage temp. coefficient -8.1
mV/°C
VCE = V GE, IC = 1mA (25°C-150°C) 12
gfe Forward Transconductance 1.7 S VCE = 5 0V, IC = 4.0A, PW = 80µs
—1.0150 VGE = 0V , VCE = 600V
ICES Zero Gate Voltage Collector Current 54 300 µA VGE = 0V , VCE = 600V, TJ = 150°C
—300800 VGE = 0V , VCE = 600V, TJ = 175°C
IGES Gate-to-Emitter Leakage Current ±100 nA VGE = ±20V
S w itching C ha rac teristic s @ T
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions Ref.Fig.
QgTotal Gate Ch ar ge (turn-on) 12 IC = 4.0A 23
Qge Gate-to-Emitter Charge (turn-on) 1.7 nC VCC = 400V CT1
Qgc Gate-to-Collector Charge (turn-on) 6.5 VGE = 15V
Eon Tu rn -On S w itch ing Lo ss 73 80
IC = 4.0 A, V CC = 400V CT4
Eoff Tu rn -Off Sw itch ing L os s 47 53 µ J VGE = 15V , RG = 100, L = 2.5mH
Etot T o tal S w i tc hin g L oss 120 1 3 0 TJ = 25°C
e
td(on) Turn -On de lay tim e 22 28
IC = 4.0 A, V CC = 400V
trRise time 18 23 ns VGE = 15 V, RG = 100, L = 2.5mH CT4
td(off) Turn-Off delay time 100 110 TJ = 25°C
tfF a ll t ime 66 8 0
Eon Turn-On Switching Loss 130 150 IC = 4.0 A, V CC = 400V CT4
Eoff Turn -Off S witching Loss 83 140 µJ VGE = 15 V, RG = 100, L = 2.5mH 13,15
Etot To tal S w i tc hing L o s s 220 2 8 0 TJ = 150°C
e
WF1,WF
2
td(on) Turn -On de lay tim e 22 27
IC = 4.0 A, V CC = 400V 14,16
trRise time 18 22 ns VGE = 15 V, RG = 100, L = 2.5mH CT4
td(off) Turn-Off delay time 120 130 TJ = 150°C WF1
tfF a ll t ime 79 8 9 WF2
Cies In p ut C ap ac it a nc e 190 VGE = 0V
Coes Output Capacitance 25 pF VCC = 30V 22
Cres Reverse Transfer Capacitance 6.2 f = 1.0MHz
RBSOA Reverse Bias Sa fe Oper ating Area FULL SQUARE TJ = 150°C, IC = 24A, Vp = 600V 4
VCC=500V,VGE = +1 5V to 0V ,R G = 100 CT2
SCSOA Short Circuit Safe Operating Area 10 µs TJ = 150°C, Vp = 600V, RG = 100 CT3
VCC=360V,VGE = +1 5V to 0V WF3
IRGB/S/SL4B60KPbF
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Fig. 1 - Maximum DC Collector Current vs.
Case Temperature Fig. 2 - Power Dissipation vs. Case
Temperature
Fig. 3 - Forward SOA
TC = 25°C; TJ 150°C Fig. 4 - Reverse Bias SOA
TJ = 150°C; VGE =15V
0 20 40 60 80 100 120 140 160 180
TC (°C)
0
10
20
30
40
50
60
70
Ptot (W)
0 20 40 60 80 100 120 140 160 180
TC (°C)
0
2
4
6
8
10
12
IC (A)
10 100 1000
VCE (V)
0
1
10
100
IC A)
0 1 10 100 1000 10000
VCE (V)
0.01
0.1
1
10
100
IC (A)
10ms
DC
1ms
100µs
IRGB/S/SL4B60KPbF
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Fig. 7 - Typ. IGBT Output Characteristics
TJ = 150°C; tp = 80µs
Fig. 6 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 80µs
Fig. 5 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 80µs
0246810 12
VCE (V)
0
5
10
15
20
25
30
ICE (A)
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
0246810 12
VCE (V)
0
5
10
15
20
25
30
ICE (A)
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
0246810 12
VCE (V)
0
5
10
15
20
25
ICE (A)
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
IRGB/S/SL4B60KPbF
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Fig. 9 - Typical VCE vs. VGE
TJ = 25°C
Fig. 8 - Typical VCE vs. VGE
TJ = -40°C
Fig. 11 - Typ. Transfer Characteristics
VCE = 360V; tp = 10µs
Fig. 10 - Typical VCE vs. VGE
TJ = 150°C
5 101520
VGE (V)
0
2
4
6
8
10
12
14
16
18
20
VCE (V)
ICE = 2. 0A
ICE = 4.0A
ICE = 8.0A
5 101520
VGE (V)
0
2
4
6
8
10
12
14
16
18
20
VCE (V)
ICE = 2. 0A
ICE = 4.0A
ICE = 8.0A
5101520
VGE (V)
0
2
4
6
8
10
12
14
16
18
20
VCE (V)
ICE = 2. 0A
ICE = 4. 0A
ICE = 8. 0A
0 5 10 15 20
VGS, G ate-to- Source Voltage (V )
0
5
10
15
20
25
30
ID, Drain-to-Source Current (Α)
TJ = 25°C
TJ = 150°C
IRGB/S/SL4B60KPbF
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Fig. 13 - Typ. Switching Time vs. I C
TJ = 150°C; L=2.5mH; VCE= 400V
RG= 100; VGE= 15V
Fig. 12 - Typ. Energy Loss vs. IC
TJ = 150°C; L=2.5mH; V CE= 400V,
RG= 100; VGE= 15V
Fig. 15 - Typ. Switching Time vs. R G
TJ = 150°C; L=2.5mH; VCE= 400V
ICE= 4.0A; VGE= 15V
Fig. 14 - Typ. Energy Loss vs. RG
TJ = 150°C; L=2.5mH; VCE= 400V
ICE= 4.0A; VGE= 15V
12345678910
IC (A)
0
50
100
150
200
250
300
350
Energy (µJ)
EOFF
EON
0100 200 300 400 500
RG ()
0
50
100
150
200
250
300
350
Energy (µJ)
EON
EOFF
0246810
IC (A)
1
10
100
1000
Swiching Time (ns)
tR
tdOFF
tF
tdON
0100 200 300 400 500
RG ()
10
100
1000
Swiching Time (ns)
tR
tdOFF
tF
tdON
IRGB/S/SL4B60KPbF
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Fig. 16 - Typ. Capacitance vs. VCE
VGE= 0V; f = 1MHz Fig. 17 - Typical Gate Charge vs. VGE
ICE = 4.0A; L = 3150µH
02468101214
Q G, Total Gate Charge (nC)
0
2
4
6
8
10
12
14
16
VGE (V)
300V
400V
020 40 60 80 100
VCE (V)
1
10
100
1000
Capacitance (pF)
Cies
Coes
Cres
Fig 18. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
1E-006 1E-005 0.0001 0.001 0.01 0.1 1
t1 , Rectangular Pul s e Durati on (sec)
0.001
0.01
0.1
1
10
Thermal Response ( Z thJC )
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE ) Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
Ri (°C/W) τi (sec)
0.0429 0.000001
1.3417 0.000178
1.0154 0.000627
τJ
τJ
τ1
τ1τ2
τ2τ3
τ3
R1
R1R2
R2R3
R3
τ
τ
C
Ci= i/Ri
Ci= τi/Ri
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Fig.C.T.1 - Gate Charge Circuit (turn-off) Fig.C.T.2 - RBSOA Circuit
1K
VCC
DUT
0
L
Fig.C.T.3 - S.C.SOA Circuit Fig.C.T.4 - Switching Loss Circuit
Fig.C.T.5 - Resistive Load Circuit
L
Rg
VCC
diode cl amp /
DUT
DUT /
DRIVER
- 5V
Rg
VCC
DUT
R =
V
CC
I
CM
L
Rg
80 V DUT
480V
+
-
DC
Driver
DUT
360V
IRGB/S/SL4B60KPbF
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Fig. WF3- Typ. S.C Waveform
@ T C = 150°C using Fig. CT.3
Fig. WF1- Typ. Turn-off Loss Waveform
@ TJ = 150°C using Fig. CT.4 Fig. WF2- Typ. Turn-on Loss Waveform
@ TJ = 150°C using Fig. CT.4
-100
0
100
200
300
400
500
600
700
0.4 0.6 0.8 1 1.2
Ti me (uS)
Vce (V)
-2
0
2
4
6
8
10
12
14
Ice (A)
tf
Eoff Loss
90% Ice
5% Vce
5% Ice
Vce
Ice
-100
0
100
200
300
400
500
600
700
0.35 0.45 0.55 0.65
Ti me (uS)
Vce (V)
-2
0
2
4
6
8
10
12
14
Ice (A)
Eon
Loss
tr
90% I ce
10% Ice
5% Vce
Vce
Ice
-50
0
50
100
150
200
250
300
350
400
30 40 50 60 70
Time (uS)
-5
0
5
10
15
20
25
30
35
40
I (A)
Vce
Ice
ICE (A)
VCE (V)
IRGB/S/SL4B60KPbF
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TO-220AB Part Marking Information
EXAMPLE:
IN THE ASSEMBLY LIN E "C"
THIS IS AN IRF1010
LOT CODE 1789
ASSEMBLED ON WW 19, 1997 PART NUMBE
R
AS S EMBLY
LOT CODE
DATE CODE
YEAR 7 = 1997
LINE C
WEEK 1 9
LOGO
RECTIFIER
INTERNATIONAL
Note: "P" in assembly line
position indicates "Lead- Free"
TO-220AB Package Outline
Dimensions are shown in millimeters (inches)
IRGB/S/SL4B60KPbF
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D2Pak Part Marking Information
D2Pak Package Outline
Dimensions are shown in millimeters (inches)
Note: "P" in assembly line
pos ition indicates "Lead-F ree"
F530S
THIS IS AN IRF530S WITH
LOT CODE 8024
ASSEMBLED ON WW 02, 2000
IN THE ASSEMBLY LINE "L"
ASSEMBLY
LOT CODE
INTERNATIONAL
RECTIFIER
LOGO
PART NUMBER
DATE CODE
YEAR 0 = 2000
WEEK 02
LINE L
OR
F530S
A = ASSEMBLY SITE CODE
WEEK 02
P = DES IGNATE S LE AD-F R EE
PRODUCT (OPTIONAL)
RECTIFIER
INTERNATIONAL
LOGO
LOT CODE
AS S EMB LY YEAR 0 = 2000
DATE CODE
PART NUMBER
IRGB/S/SL4B60KPbF
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TO-262 Part Marking Information
TO-262 Package Outline
Dimensions are shown in millimeters (inches)
AS S EMBLY
LOT COD E
RECTIFIER
INTERNATIONAL
AS SEMBLED ON WW 19 , 1997
Note: "P" in assembly li ne
p o s ition ind icates "L ead-Free "
IN T HE ASS EMBLY LINE "C" LOGO
THIS IS AN IRL310 3L
LOT CODE 1789
EXAMPLE:
LI NE C
DATE CODE
WEEK 19
YEAR 7 = 1997
PART NUMBER
PAR T NU MBER
LOGO
LOT CODE
AS S EMB LY
INTERNATIONAL
RECTIFIER
PRODUCT (OP TIONAL)
P = DES IGNAT ES LEAD-FREE
A = AS S E MBL Y S ITE CODE
WEEK 19
Y EAR 7 = 1 997
DATE CODE
OR
IRGB/S/SL4B60KPbF
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IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 11/04
Data and specifications subject to change without notice.
This product has been designed and qualified for Industrial market.
Qualification Standards can be found on IR’s Web site.
TO-220AB package is not recommended for Surface Mount Application.
Notes:
VCC = 80% (VCES), VGE = 20V, L = 100µH, RG = 50Ω.
When mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques
refer to application note #AN-994.
Energy losses include "tail" and diode reverse recovery, using Diode FD059H06A5.
D2Pak Tape & Reel Information
Dimensions are shown in millimeters (inches)
3
4
4
TRR
F
EED DIRECTIO N
1.85 (.073)
1.65 (.065)
1.60 (.063)
1.50 (.059)
4.10 (.161)
3.90 (.153)
TRL
F
EED DIRECTION
10.90 (.429)
10.70 (.421) 16.10 (.634)
15.90 (.626)
1.75 (.069)
1.25 (.049)
11.60 (.457)
11.40 (.449) 15.42 (.609)
15.22 (.601)
4.72 (.136)
4.52 (.178)
24.30 (.957
)
23.90 (.941
)
0.368 (.0145)
0.342 (.0135)
1.60 (.063)
1.50 (.059)
13.50 (.532)
12.80 (.504)
330.00
(14.173)
MAX.
27.40 (1. 079)
23.90 (.9 41)
60.00 (2.362
)
MIN.
30.40 (1 .19 7)
MAX.
26.40 (1.039)
24.40 (.961)
NOTES :
1. C OMF OR M S T O EIA- 418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
Note: For the most current drawings please refer to the IR website at:
http://www.irf.com/package/