H11L3MSR2-M - Fairchild Semiconductor

PACKAGE SCHEMATIC

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OPTOISOLATORS LOGIC OUTPUT

3/24/03

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H11L1M H11L2M H11L3M

DESCRIPTION

The H11LXM series has a high speed integrated circuit detector optically

coupled to a gallium-arsenide infrared emitting diode. The output incorpo-

rates a Schmitt trigger, which provides hysteresis for noise immunity and

pulse shaping. The detector circuit is optimized for simplicity of operation

and utilizes an open collector output for maximum application ﬂexibility.

FEATURES

• High data rate, 1 MHz typical (NRZ)

•Free from latch up and oscilliation throughout voltage and temperature

ranges.

• Microprocessor compatible drive

• Logic compatible output sinks 16 mA at 0.4 V maximum

• Guaranteed on/off threshold hysteresis

• Wide supply voltage capability, compatible with all popular logic systems

• Underwriters Laboratory (UL) recognized—ﬁle #E90700, Volume 2

• VDE recognized – File#102497 – Add option V (e.g., H11LIVM)

APPLICATIONS

• Logic to logic isolator

• Programmable current level sensor

• Line receiver—eliminate noise and transient problems

• A.C. to TTL conversion—square wave shaping

• Digital programming of power supplies

• Interfaces computers with peripherals

6

1

6

1

2

6

5GND

4VO

VCC

ANODE

CATHODE

3

Truth Table

Input Output

HL

LH

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OPTOISOLATORS LOGIC OUTPUT

H11L1M H11L2M H11L3M

ABSOLUTE MAXIMUM RATINGS

Parameters Symbol Device Value Units

TOTAL DEVICE

Storage Temperature T

STG

All -55 to +150 °C

Operating Temperature T

OPR

All -40 to +85 °C

Lead Solder Temperature T

SOL

All 260 for 10 sec °C

Total Device Power Dissipation @ 25°C P

D

All 250 mW

Derate Above 25°C 2.94 mW/°C

EMITTER

Continuous Forward Current I

F

All 60 mA

Reverse Voltage V

R

All 6 V

Forward Current - Peak (1 µs pulse, 300 pps) I

F

(pk) All 3.0 A

LED Power Dissipation 25°C Ambient P

D

All 120 mW

Derate Linearly From 25°C 1.41 mW/°C

DETECTOR

Detector Power Dissipation @ 25°C P

D

All 150 mW

Derate Linearly from 25°C 2.0 mW/°C

V

45

Allowed Range V

O

All 0 to 16 V

V

65

Allowed Range V

CC

All 3 to 16 V

I

4

Output Current I

O

All 50 mA

ELECTRICAL CHARACTERISTICS

(T

A

= 25°C Unless otherwise speciﬁed.)

INDIVIDUAL COMPONENT CHARACTERISTICS

Parameters Test Conditions Symbol Device Min Typ Max Units

EMITTER

Input Forward Voltage

I

F

= 10 mA V

F

All 1.2 1.5 V

I

F

= 0.3 mA 0.75 1.0

Reverse Current V

R

= 3 V I

R

All 10 µA

Capacitance V = 0, f = 1.0 MHz C

J

All 100 pF

DETECTOR

Operating Voltage Range V

CC

All 3 15 V

Supply Current I

F

= 0, V

CC

= 5V I

CC(off)

All 1.6 5.0 mA

Output Current, High I

F

= 0, V

CC

= V

O

= 15V I

OH

All 100 µA

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OPTOISOLATORS LOGIC OUTPUT

H11L1M H11L2M H11L3M

NOTE:

*Maximum I

F(ON)

is the maximum current required to trigger the output. For example, a 1.6mA maximum trigger current would

require the LED to be driven at a current greater than 1.6mA to guarantee the device will turn on. A 10% guard band is recom-

mended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 60mA.

ISOLATION CHARACTERISTICS

Parameters Test Conditions Symbol Min Typ Max Units

Input-Output Isolation Voltage t =1 sec. V

ISO

7500 V

PEAK

Isolation Capacitance V

I-O

= 0V, f = 1 MHz C

ISO

0.4 0.6 pF

Isolation Resistance V

I-O

= ±500 VDC R

ISO

10

11

Ω

TRANSFER CHARACTERISTICS

DC Characteristics Test Conditions Symbol Device Min Typ Max Units

Supply Current I

F

= 10mA, V

CC

= 5V I

CC(on)

All 1.6 5.0 mA

Output Voltage, low R

L

=270

Ω

,V

CC

=5V, I

F

=I

F(on)

max. V

OL

All 0.2 0.4 V

Tu r n-On Threshold Current R

L

=270

Ω

, V

CC

= 5V I

F(on)

*

H11L1M 1.6

mAH11L2M 10.0

H11L3M 5.0

Tu r n-Off Threshold Current R

L

=270

Ω

, V

CC

= 5V I

F(off)

All 0.3 1.0 mA

Hysteresis Ratio R

L

=270

Ω

, V

CC

= 5V I

F(off)

/I

F(on)

All 0.50 0.75 0.90

AC Characteristics Test Conditions Symbol Device Min Typ Max Units

SWITCHING SPEED

Tu r n-On time R

L

=270

Ω

, V

CC

= 5V, I

F

=I

F(on)

,

T

A

=25°C t

on

All

1.0

µs0.65

4

Fall Time R

L

=270

Ω

, V

CC

= 5V, I

F

=I

F(on)

,

T

A

=25°C t

f

All

0.1

µs.05

0.1

Tu r n-Off Time R

L

=270

Ω

, V

CC

= 5V, I

F

=I

F(on)

,

T

A

=25°C t

off

All

2.0

µs1.2

4

Rise time R

L

=270

Ω

, V

CC

= 5V, I

F

=I

F(on)

,

T

A

=25°C t

r

All

0.1

µs0.07

0.1

Data Rate All 1.0 MHz

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H11L1M H11L2M H11L3M

C

RERL

VIN 5V

VO

90%

ton

tr

tf

10%

50%

toff

Figure 1. Switching Test Circuit and Waveforms

IF

1

2

H11L1

VIN

tr = tf = 0.01µS

Z = 50Ω

270Ω

I65V

VO

5

6

4

0

Figure 3. Threshold Current vs. Supply Voltage

Figure 2. Transfer Characteristics

VCC - SUPPLY VOLTAGE (V)

0246810121416

I

F

- THRESHOLD CURRENT (NORMALIZED)

0.4

0.6

0.8

1.0

1.2

1.4

1.6

F NORMALIZED TO :

IF(ON) AT VCC = 5V

TA = 25oC

I

Figure 4. Threshold Current vs. Supply Temperature

TA - TEMPERATURE ( oC)

-50 -25 0 25 50 75 100

I

F(On)

, I

F(Off)

- THRESHOLD CURRENT (NORMALIZED)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

NORMALIZED TO :

VCC = 5V

TA = 25oC

Figure 5. Output Voltage, Low vs. Load Current

IO - LOAD CURRENT (mA)

110100

VOL - OUTPUT VOLTAGE, LOW (V)

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

2

0.1

1

Ω

TURN ON THRESHOLD

TURN OFF THRESHOLD

IF = IF(ON)

VCC = 5V

RL = 270

IF

- INPUT CURRENT (mA)

0123

V

O - OUTPUT VOLTAGE (V)

0

1

2

3

4

5

6

VOH

VOL

IF( OF F) IF(ON)

VCC

= 5V

RL = 270Ω

TA

= 25°C

TYPICAL PERFORMANCE CURVES

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H11L1M H11L2M H11L3M

Figure 6. Supply Current vs. Supply Voltage Figure 7. LED Forward Voltage vs. Forward Current

VCC - SUPPLY VOLTAGE (V)

0246810121416

I

C

- SUPPLY CURRENT (mA)

0

1

2

3

4

5

6

IF = 5mA

TA = 0

25

70

°C

IF = 0mA

TA = 0 70

25

IF - LED FORWARD CURRENT (mA)

VF - FORWARD VOLTAGE (V)

110100

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

T

A

= 25°C

T

A

= 55°C

T

A

= 100°C

°C°C°C

TYPICAL PERFORMANCE CURVES

3/24/03

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H11L1M H11L2M H11L3M

NOTE

All dimensions are in inches (millimeters)

Package Dimensions (Through Hole) Package Dimensions (Surface Mount)

Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for

Surface Mount Leadform

0.350 (8.89)

0.320 (8.13)

0.260 (6.60)

0.240 (6.10)

0.320 (8.13)

0.070 (1.77)

0.040 (1.02) 0.014 (0.36)

0.010 (0.25)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41) 0.100 (2.54) 15°

0.012 (0.30)

0.350 (8.89)

0.320 (8.13)

0.260 (6.60)

0.240 (6.10)

0.390 (9.90)

0.332 (8.43)

0.070 (1.77)

0.040 (1.02)

0.014 (0.36)

0.010 (0.25)

0.320 (8.13)

0.035 (0.88)

0.006 (0.16)

0.012 (0.30)

0.008 (0.20)

0.200 (5.08)

0.115 (2.93)

0.025 (0.63)

0.020 (0.51)

0.020 (0.50)

0.016 (0.41)

0.100 [2.54]

0.350 (8.89)

0.320 (8.13)

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02) 0.014 (0.36)

0.010 (0.25)

0.200 (5.08)

0.115 (2.93)

0.020 (0.50)

0.016 (0.41)

0.100 [2.54]

0.100 (2.54)

0.015 (0.38)

0.012 (0.30)

0.008 (0.21)

0.425 (10.80)

0.400 (10.16)

0.070

(

1.78

)

0.060

(

1.52

)

0.030

(

0.76

)

0.100

(

2.54

)

0.305

(

7.75

)

0.425

(

10.79

)

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H11L1M H11L2M H11L3M

ORDERING INFORMATION

MARKING INFORMATION

Option/Order Entry Identiﬁer Description

S Surface Mount Lead Bend

SR2 Surface Mount; Tape and reel

T 0.4" Lead Spacing

V VDE 0884

TV VDE 0884, 0.4" Lead Spacing

SV VDE 0884, Surface Mount

SR2V VDE 0884, Surface Mount, Tape & Reel

H11L1

V X YY Q

1

2

6

43 5

*Note – ‘V’ option parts marked with date code ‘325’ or earlier are marked in portrait format.

Deﬁnitions

1Fairchild logo

2Device number

3VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

4 One digit year code, e.g., ‘3’

5Two digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

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H11L1M H11L2M H11L3M

NOTE

All dimensions are in inches (millimeters)

Reﬂow Proﬁle

Carrier Tape Specifications

4.0 ± 0.1

Ø1.5 MIN

User Direction of Feed

2.0 ± 0.05

1.75 ± 0.10

11.5 ± 1.0

24.0 ± 0.3

12.0 ± 0.1

0.30 ± 0.05

21.0 ± 0.1

4.5 ± 0.20

0.1 MAX 10.1 ± 0.20

9.1 ± 0.20

Ø1.5 ± 0.1/-0

Ramp up = 2–10°C/sec • Peak reflow temperature: 245°C (package surface temperature)

• Time of temperature higher than 183°C for 120–180 seconds

• One time soldering reflow is recommended

230°C, 10–30 s

Time (Minute)

0

300

250

200

150

100

50

0

0.5 1 1.5 2 2.5 3 3.5 4 4.5

Temperature (°C)

Time above 183°C, 120–180 sec

245°C peak

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES

OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR

CORPORATION. As used herein:

1. Life support devices or systems are devices or systems

which, (a) are intended for surgical implant into the body, or

(b) support or sustain life, and (c) whose failure to perform

when properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to

result in a significant injury of the user.

2. A critical component in any component of a life support

device or system whose failure to perform can be

reasonably expected to cause the failure of the life support

device or system, or to affect its safety or effectiveness.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO

ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME

ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;

NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

3/24/03

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H11L1M H11L2M H11L3M