2.50mm (0.098") PITCH CONNECTOR DIP type) Wire-to-Board Wafer 1.6 C204 4.7_| P=2.5%1 21.0 o Iv PCB LAYOUT "E+ |. SVT TITS = THR PCB ASS'Y Material SMW250-NND Series TOM 050 1), T= MATERIAL 1 WAFER PA66, UL94 V Grade DIP 2 PIN SMW250-NND | ras & Tin-Plated Straight Available Pin ues DIM. A ) DIM. C SMW250-02D 7.45 5.80 2.5 SMW250-03D 9.95 8.30 5.0 SMW250-04D 12.45 10.80 75 SMW250-05D 14.95 13.30 10.0 SMW250-06D 17.45 15.80 12.5 SMW250-07D 19.95 18.30 15.0 SMW250-08D 22.45 20.80 17.5 SMW250-09D 24.95 23.30 20.0 SMW250-10D 27.45 25.80 22.5 SMW250-11D 29.95 28.30 25.0 SMW250-12D 32.45 30.80 27.5 SMW250-13D 34.95 33.30 30.0 SMW250-14D 37.45 35.80 32.5 SMW250-15D 39.95 38.30 35.0 0.905 Ni N Ni IN \ N N N N N N Specification -a rr l / ITEM SPEC y Y Voltage Rating ACIDC 250V Y ) Current Rating ACIDC 3A Y WY) Operating Temperature -25C~+85C NY) Contact Resistance 30mQ MAX NA 5 Withstanding Voltage AC1000V/4 min NN Insulation Resistance 41000MQ MIN \ Applicable Wire - N Applicable P.C.B 4.2~1.6mm N Applicable FPC/FFC - N Solder Height - G = Crimp Tensile Strength - PCB Ye UL FILE NO E108706